TW200426927A - Method for stripping and picking of semiconductor device - Google Patents

Abstract

The present invention relates to a method for stripping and picking of semiconductor device, which includes the following steps: adhering a layer of glue tape on the bottom of semiconductor device before dicing; moving the glue tape with the surface attached with a plurality of diced semiconductor devices on a table with a chamfer; using the chamfer of the table to stretch and fold the glue tape to gradually strip the semiconductor devices attached on the upper surface and move to the connection table; after reducing the adhering area of semiconductor devices, using a sucking mechanism to suck the semiconductor device and release from the glue tape for the operation of the next workstation; thus, employing the mechanism to change the adhering area of devices for easy stripping and picking.

Description

200426927 V. Description of the invention (1) [Technical Field] The present invention particularly refers to peeling off the bottom surface of the semiconductor tape from the semiconductor element in a mechanical manner after the semiconductor element has been cut, and it is effective for the suction mechanism to move to the next workstation for suction. Shorten manufacturing costs and reduce costs. [Previous technology] According to the general semiconductor device, such as wa fe, the latter stage of the process is to cut (Die Saw) the wafer into wafers (Die Sor ei ng) ) After the test, suck the good wafer onto the lead frame for die bonding operation (Die Bon d), then wire bonding (Wire B ο nd), baking (cure), and then seal (ηι ο 1 d) and test, and finally printing (丨 丨 iark) and cutting forming (T ri η / Form), that is, the post-process of the semiconductor element is completed, but in order to avoid the wafer during the dicing process During dicing, movement occurs, and a layer of adhesive tape 2 is adhered to the bottom surface of wafer 1 to provide a fixed effect (as shown in Figure 1). However, when the suction mechanism needs to suck wafer 3 after cutting, the suction force is not sufficient. The wafer peeling tape 2 (as shown in FIG. 2), that is, the adhesive force of the tape 2 is greater than the adsorption force of the suction mechanism. In order to facilitate the wafer to detach from the tape 2, the tape 2 must use a special u-V tape. U — V tape is finished After cutting, the light can be irradiated to release the adhesiveness of the shoulder tape, so that the 2 pick-up mechanism can easily suck the release tape. Since the U-V tape is a special high unit price material, it is suitable for cutting and peeling of wafers. Economic benefits, only when it is applied to low unit price components such as LEDs, it seems too costly and cannot be used. Please refer to Figure 3. At present, LED 5 series adopts a Z tape 6 to fix and cut. , That is, inspection of defective products ^ and

P03-025.ptd

Page 4 200426 ^ 27 / Description of meals (2) Sorting, and then loading in a manual container 7, and then take it through the whole machine 8 to the next workstation to enter the book, but it also increases the number of components required. The cost of making 裎 is mainly because of the stickiness of the direction of the hand, but the alcohol will affect the LED because of the content of the invention. [Content of the invention] The present invention provides a semiconductor device cutting tape. Turning, because of the sticky body, the platform cannot be glued with the glue, and the tape will make the suction mechanism suck the release tape. The adhesive force of the mechanism can be used. The cost of the material for the suction tape is another way of the present invention. £ During the concentration, the whole set of regulations was tested in 1J. 'This process, and the whole is different to improve this situation. Alcohol or warming contains water', so it is still D5. The replacement of the machine, due to the shape, the purpose of the method is to overcome the line of the tape in the king, and then supply, although the supply is also increased, the origin of the system is still to be studied 6 and focused on the release, so it must be sucked 9 institutions sucked into consideration the material and as a rule, are located less hurt Tim wood materials up to lift the general tape ^ overcome the force. This type of semiconductor component is attached to a tape, so that the element will be pulled forward * under the bottom of the tape, and it will be attached to the tape. The tape will be turned, due to peeling, and moved to the bottom when the picking force is greater. The wafers are sucked by each mechanism, and the purpose is to provide gradual peeling adhesion, which is an instable work. A semi-remove material layer with a generally angled tape piece does not gradually reduce the adhesion. Suction station: I occupy The method for ensuring the separation of the eye conductor element is as follows. The surface of the glue used on the surface is the same as the tape. The same tape can be moved to another area. The mechanism can do this. Low unit price. Pieces of material

P〇3-〇25.ptcl 5f 20Q426927

/ V. Description of the invention (3) Method 'It uses the automatic peeling of the mechanism, which not only can automatically avoid manual operations, but also keeps the regular arrangement of components during the peeling process', which can be directly sucked and transferred by the suction mechanism, and There is no need to go through the whole machine, so the process can be greatly reduced, and the processing operation can be carried out quickly and continuously. * Muben ί: Another purpose is to provide a guide for semiconductor component peeling and reclaiming: Lee: Mechanism automatic :: off method, applicable to different types of machines. When different types of components are used, soil exchange is different. The supply body and fixture can greatly reduce the design cost. [Embodiment] Please refer to FIG. 4. The present invention sticks the components 10 arranged in the sense of cutting, meaning the general method of using the technique 'positioning, to prevent component displacement during cutting' I 1 in the overall cutting pattern , Depending on the need, for each order_: after two or two into the 'component body, the surface of the tape 1 1 is slightly cut, Ϊ 2 rows are plural and the surface is adhered to the cut component 1 Q 7 two overall strips' The Ming Department cut the tape ii together with the adhesive tape i〇: 丨: See Figure 5, the image of the initial appearance of this episode, and then move to peeling; push the surface first: the action of removing and reclaiming, and the suction machine 様Progressive inspection operations are carried out. Please refer to Figure 6 == 'Go straight ahead-the second with a downwardly bent corner end ": the stripped table top corner end 1 2 i is connected with _ gap w to connect two = table top 2 fold graph, tape 1 i Move to the heart together with the component i 〇. The front end of 凊 mai read through the gap w and follow the table; ② 2, tape 1 1 丄 “的 角 角 121 下

Page 6 200426927 V. Description of the invention (4) The square extension is designed to pull down the adhesive tape 1 1 with a stretching mechanism 14 and the rear end of the other tape 11 is designed to press a tape 15 on the table surface. Please refer to FIG. 8, when the adhesive tape 11 is pulled down at the corner 12 of the table 1 2, the adhered component 10 will gradually peel off and move forward to the connecting platform 13. Please refer to FIG. 9, when the component 10 gradually peels off and reduces its adhesion area, it will reduce the adhesion force with the adhesive tape 11. When the adhesion force is less than the suction force of the nozzle of the suction mechanism 16, the suction mechanism 16 is It can be moved above the component 10 and directly suck the component 10, because the component 10 is still in a regular arrangement when sucking, and can be directly transferred from the suction mechanism 16 to the next workstation without going through the entire row, as the next step Various inspection operations, or according to the records at the time of the inspection, remove the defective products elsewhere for classification. The invention uses a mechanism to gradually reduce the adhesion area between the component and the tape, thereby further reducing the adhesive force of the tape. The suction supply mechanism directly sucks and transfers, which can not only reduce the cost of the tape material, but also after automatic stripping and reclaiming operations, The next operation can be performed directly, so that in consideration of the cost of materials used, the automated operation can still be performed with the most simplified process, thereby reducing the cost of the process.

P03-025.ptd Page 7 200426927 Brief description of drawings Figure 1: Schematic diagram of conventional wafers before cutting. Figure 2: Schematic diagram of a conventional wafer after dicing. Figure 3: Schematic diagram of the rear-end process of the conventional LED device. Figure 4: Schematic diagram of the components of the present invention after cutting. Figure 5 ... Schematic diagram of the process of the present invention. Fig. 6 is a schematic view of a peeling table according to the present invention. Figure 7: Schematic diagram (1) of the peeling of the component of the present invention. FIG. 8 is a schematic diagram (2) of peeling of the component of the present invention. Figure 9: Schematic drawing of the components of the present invention. [Element number] Custom part: 1 wafer 2 tape 3 wafer 4 suction mechanism 5 LED 6 tape 7 container 8 complete machine 9 suction mechanism part of the invention: 10: component 1 1: tape 12: table surface 12 1: corner End 1 3 I Linking platform 14: Stretching mechanism 15: Pressing mechanism 16: Suction mechanism

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Claims (1)

200426927 VI. Application for Patent Scope 1. A method for peeling and reclaiming semiconductor components, including: A. Before the component is cut, attach a layer of tape on the bottom surface; B. After cutting, the surface is adhered with a plurality of cut pieces The tape of the component is transferred to a table with a corner; C. The back end of the tape is pressed against by a pressing mechanism, while the front end of the tape is turned down along the corner of the table and pulled by a stretching mechanism; D 1. The components on the tape are gradually peeled off and moved forward to a joint platform; E. The components are sucked off by the suction mechanism and transferred to the next station; by this means, the component adhesion area is changed in a mechanical way, 俾Facilitate the peeling and taking of components. 2. According to the method for peeling and picking up semiconductor components according to item 1 of the scope of patent application, wherein the adhesive tape attached to the bottom surface of the component is a commonly used adhesive tape. 3. According to the method for peeling and picking up semiconductor components according to item 1 of the scope of the patent application, the cut components can be transferred for image inspection of the initial appearance first, and the initial defective products can be removed when the peeling mechanism sucks and peels off. Classified elsewhere. 4. The method for peeling and taking out semiconductor components according to item 1 of the scope of the patent application, wherein the table surface with folded corners is connected with a joint plane with a gap, and the gap is passed by the front end of the tape and extended downward. P03.025.ptd Page 9