TWM445761U - Chip pickup device - Google Patents

Description

Wafer collection device

The present invention is to provide a collecting device, especially a collecting device for a wafer.

Referring to the first figure, a general wafer type resistor is formed on a sheet substrate 1, and vertical and horizontal creases 11 are obliquely cut on the substrate 1 to form a plurality of lattice wafers. 12; Referring to the second figure, the lattice wafer 12 is then automatically stripped out of a strip of elongated resistive strips 13, and the elongated strips 13 are collected and stacked into a complete group, and then the entire stack is completed. The strip 13 is sent to the next process for dicing the wafer 12 into a unit; such a technique for stripping and stacking the sheet-like substrate 1 forming the wafer-type resistor, such as CN2566426 "wafer resistor stripping" The strip arranging machine mainly uses a conveying device to place the wafer substrate into the conveying belt, and enters the two pressure roller groups driven by the two cylinders, and strips the stripping device in the upper and lower directions. The work, the strip of strips that complete the stripping operation is then transferred via the conveyor belt to the collecting device to be collected by the stack.

The above-mentioned prior art peels off the sheet-shaped substrate of the wafer type resistor, and inserts the wafer into the transport belt to enter the two pressure roller groups driven by the two cylinders, and the upper and lower directions are concavely folded. Because the roller pressing force of the upper and lower pressing wheels does not correspond to the crease line, the crystal The quality of the peeling of the sheet on the conveyor belt is also not satisfactory, and the peeling operation of the smaller wafer resistor is not applicable. Therefore, the applicant has developed a stripping method in which the strips are bent one by one, and then the stripped strip is removed. The resistor strip is transferred to a collection device via a transfer device for extraction to place the resistor strip into a frame in a stacking device to form a complete wafer stack assembly so that the entire wafer stack assembly can be moved to the next process. Folding work.

SUMMARY OF THE INVENTION An object of the present invention is to provide a collecting device capable of extracting a strip of electric resistance which has been conveyed by a conveying device after being peeled off and placing it in a stacking device for stacking.

According to the purpose of the present invention, the collecting device of the novel wafer comprises: a feeding mechanism and a feeding mechanism on a carrier; the reclaiming mechanism is provided with a slider that can slide on a sliding seat, and a slider A take-up member is connected by a connecting member, and the take-out member is provided with a take-up arm; the feeding mechanism is provided with a slider which can slide on a sliding seat, and the slider is connected with a placing seat by a connecting member. The placing seat is provided with a suction needle provided with a negative pressure; the material extracted by the take-up arm of the take-up mechanism is placed and stacked by suction of the suction needle of the feeding mechanism.

The advantages achieved by the present invention are that the resistive strips transmitted by the transfer device during the corresponding wafer resistance stripping process can be extracted and placed one by one in the frame of the stacking device, except that the artificial extraction and placement are completely replaced. The operation, and the precise and automatic one-by-one operation steps, make the extraction operation not miss, and the stacking operation is also accurate and perfect, which can save a lot of labor and reduce operating costs.

Referring to the third and fourth figures, the substrate 2 on which the chip resistance is provided is stripped in such a manner that one end of the substrate 2 is embedded in a recess 311 of a transfer device 3.

Referring to the fifth embodiment, in the present embodiment, the peeling device 4 carrying the substrate 2 is subjected to a bending operation which is deflected to one side so that the resistive strip 21 to be folded by the substrate 2 is peeled off.

Referring to the sixth figure, the stripped resistive strip 21 is embedded in the recess 311 of the transport device 3, rotated 180 degrees to the other side via the transport device 3, and is extracted by the collecting device 5 of the present embodiment and placed in the stack. The device 6 is stacked; wherein the stripping device 4, the transport device 3, and the stacking device 6 are not features of the present invention, and only the collecting device 5 claimed in the new embodiment will be described in detail below.

Referring to the seventh figure, the collecting device 5 of the present embodiment includes a carrier 51 on which a reclaiming mechanism 52 and a receiving mechanism 54 are disposed.

Referring to the eighth figure, the side of the carrier 51 is pivoted by the pivoting member 511 and the fixing base 512 so that it can be lifted relative to the fixing base 512; the carrier 51 is provided with a hollow operation section 513.

Referring to the eighth and ninth drawings, the reclaiming mechanism 52 is fixed on the carrier 51 by a fixing base 521, and a sliding seat 523 on which the slider 522 is disposed is fixed on one side of the fixing base 521, and the slider 522 is disposed. The first and second sensing elements 525 and 526 are disposed on the sliding block 523. The slider 522 is connected to the removing member 528 fixed to the lower side of the connecting member 527 by a connecting member 527. The take-up member 528 can be accommodated in the operation section 513 and provided with a hollow second operation section 529; please refer to the ninth and tenth A take-up arm 530 is disposed on each side of the second operation section 529, and a buckle groove 531 having an opening rearward is disposed below the front end of the two take-up arms 530.

Referring to FIG. 11 , the loading mechanism 54 is fixed to the carrier 51 in the eighth figure by a fixing base 541 , and a sliding seat 543 on which the slider 542 is disposed is fixed on one side of the fixing base 541 . The block 542 is provided with a sensing portion 544 protruding from one side, and the third and fourth sensing elements 545 and 546 are respectively disposed on the upper and lower sides of the sliding frame 543. The slider 542 is fixedly connected by a connecting member 547. a mounting seat 548 is disposed on the connecting member 547, and the receiving seat 548 is provided with two suction needles 549 which are disposed on both sides and are provided with a negative pressure; the fixing base 541 is simultaneously connected with a fixing member 550 and a convex portion on both sides of the front end. A retaining member 552 of the abutting portion 551 is provided.

Referring to FIG. 12, the collecting device 5 of the present embodiment is used to extract the strips 21 which have been stripped in the sixth drawing and put them into a frame 61 in the stacking device 6, the stacking device. 6 and the structure of the material frame 61 is not described in this new feature! However, the following description of the frame 6 is made below the collecting device 5 shown in Fig. 12.

Referring to the thirteenth figure, in the extraction operation of the resistor bar 21, the reclaiming mechanism 52 is driven to slide the slider 522 forward relative to the sliding block 523 to interlock the connecting member 527, the removing member 528, and the reclaiming material. The arm 530 is moved forward until the sensing portion 524 on the slider 522 is stopped by the first sensing element 525 located in front of the slider 523, at which time the conveyor 3 of the sixth figure will transfer the resistance bar 21 to the removal member. The take-up arm 530 of the 528 is hooked by the buckle groove 531 before the opening of the groove 531 is opened.

Referring to FIG. 14 , the take-up arm 530 of the take-up mechanism 52 is buckled. After the 531 hook retrieves the resistance bar 21, it will return to the position; during the return stroke, when the resistance bar 21 abuts against the second blocking abutment portion 551 protruding from the blocking member 552, the slider 522 will also cause the second sensing element 526 to simultaneously It is sensed that the take-up arm 530 of the take-up mechanism 52 is stopped there.

Referring to the fifteenth figure, while the resistive strip 21 is stopped against the abutting portion 551, the second suction pin 549 of the receiving mechanism 54 which is provided with the negative pressure will also be activated to simultaneously attract the resistive strip 21, The take-up arm 530 of the take-up mechanism 52 will be driven forward again for the next take-up, and the take-up arm 530 on the take-up arm 530 will also be disengaged from the resistive strip 21 due to the advancement of the take-up arm 530. Restricted.

Referring to the sixteenth embodiment, the loading mechanism 54 is sucked by the two suction needles 549 provided with the negative pressure to hold the resistance bar 21, and the slider 542 is driven to slide relative to the slider 543, and the resistive strip is sucked. 21 is placed downward in the feeding frame 61 until the sensing portion 544 protruding from the slider 542 to one side is stopped by the sensing of the fourth sensing element 546, and the second suction needle 549 stops the negative pressure after the completion of the loading. And releasing the resistive strip 21, and causing the loading mechanism 54 to raise the needle 549 back to the position until the slider 542 is sensed by the third sensing element 545; according to the thirteenth to tenth The operation of the six figures can smoothly complete the taking and placing operations of the novel embodiment.

The collecting device of the wafer of the present invention can be extracted and placed one by one in the material frame 61 of the stacking device 6 in the corresponding process of the wafer resistance stripping process, except for completely replacing the artificial The extraction and placement operations, and precise and automated one-by-one operation steps, so that the extraction operation is not missed, and the stacking operations are also accurate. Perfect, can save a lot of labor and reduce operating costs.

However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent.

Conventional technology number

1‧‧‧Substrate

11‧‧‧ crease

12‧‧‧ wafer

13‧‧‧Resistance strip

The figure of the new embodiment

2‧‧‧Substrate

21‧‧‧Resistance strip

3‧‧‧Transfer device

31‧‧‧Transport wheel

311‧‧‧ slotted

4‧‧‧ peeling device

5‧‧‧Collection device

51‧‧‧Hosting

511‧‧‧ pivoting components

512‧‧‧ fixed seat

513‧‧‧Operation interval

52‧‧‧Reclaiming agency

521‧‧‧ Fixed seat

522‧‧‧ Slider

523‧‧‧Slide

524‧‧‧Induction Department

525‧‧‧First sensing element

526‧‧‧Second sensing element

527‧‧‧Connecting parts

528‧‧‧Remove parts

529‧‧‧Second operating interval

530‧‧‧Retracting arm

531‧‧‧ buckle groove

54‧‧‧Feeding agency

541‧‧‧ Fixed seat

542‧‧‧ Slider

543‧‧ ‧ slide

544‧‧‧Induction Department

545‧‧‧ Third sensing element

546‧‧‧ Fourth sensing element

547‧‧‧Connecting parts

548‧‧‧Places

549‧‧ ‧needle

550‧‧‧Fixed parts

551‧‧‧Abutment

552‧‧‧Parts

6‧‧‧Stacking device

61‧‧‧ ‧ frame

The first figure is a schematic diagram of the structure of the general wafer resistor before stripping.

The second figure is a schematic diagram of the strip of resistance stripped by the general chip resistor.

The third figure is a process relationship diagram of wafer stripping and stacking of the novel embodiment.

The fourth figure is an enlarged schematic view of the wafer resistor substrate being pushed into the groove of the transfer device in the wafer stripping process of the novel embodiment.

The fifth figure is a schematic view of the operation of stripping the chip resistor substrate in the wafer stripping process of the novel embodiment.

The sixth figure is a schematic diagram of the process of transferring the stripped resistive strip to the novel collecting device by the conveying device in the wafer stripping process of the novel embodiment.

The seventh figure is a schematic view of the three-dimensional structure of the novel embodiment.

The eighth figure is a schematic view of the structure of the carrier in the novel embodiment.

The ninth drawing is a perspective view of the reclaiming mechanism in the new embodiment.

Figure 10 is an enlarged schematic view showing the structure of the portion A of the novel embodiment of the ninth embodiment.

The eleventh figure is a three-dimensional structure of the feeding mechanism in the novel embodiment Figure.

The twelfth figure is a schematic view showing the structure of the material frame in the stacking device in the novel embodiment.

The thirteenth drawing is a schematic structural view of the take-up arm of the take-up arm of the take-up mechanism in the novel embodiment.

The fourteenth figure is a structural diagram of the retaining mechanism of the take-off mechanism of the take-off mechanism of the pick-up mechanism after the take-up arm of the present invention is retracted.

The fifteenth figure is a structural schematic diagram of the take-up arm of the take-up mechanism moving forward for the next take-up after the suction mechanism of the feeding mechanism sucks the resistance strip in the new embodiment.

The sixteenth figure is a schematic structural view of the feeding mechanism of the feeding mechanism of the feeding mechanism for placing the adsorbed electric resistance strip into the material frame.

5‧‧‧Collection device

51‧‧‧Hosting

52‧‧‧Reclaiming agency

54‧‧‧Feeding agency

Claims (10)

A collecting device for a wafer, comprising: a feeding mechanism and a feeding mechanism on a carrier; the reclaiming mechanism is provided with a slider that can slide on a sliding seat, and the slider is connected by a connecting member a take-up member, the take-up member is provided with a take-up arm; the feeding mechanism is provided with a slider which can slide on a sliding seat, and the slider is connected with a placing seat by a connecting member, and the setting seat is provided with a negative Pressing the suction needle; the material extracted by the take-up arm of the take-up mechanism is placed and stacked by the suction of the suction mechanism of the feeding mechanism. The apparatus for collecting wafers according to claim 1, wherein the front end of the take-up arm is provided with a buckle groove having an opening facing downward. The collecting device of the wafer according to claim 1, wherein the reclaiming mechanism is fixed to a carrier by a fixing seat, and the sliding seat is disposed on one side of the fixing seat. The collecting device of the wafer according to claim 1, wherein the slider is provided with a sensing portion, and the sliding seat is provided with first and second sensing elements. The apparatus for collecting wafers according to claim 1, wherein the carrier is provided with an operation section. The apparatus for collecting wafers according to claim 1, wherein the side of the carrier is pivoted by the pivoting member and the fixing seat, so that a lifting operation can be performed with respect to the fixing seat. The collecting device of the wafer of claim 5, wherein the take-up member is accommodated in a carrier operating section, and the take-out member is provided with a hollow second operating section; the picking arm is disposed in the second Operating area Between the sides. The collecting device of the wafer according to claim 1, wherein the loading mechanism is fixed to a carrier by a fixing seat, and the sliding seat is fixed on one side of the fixing seat. The apparatus for collecting wafers according to claim 1, wherein the slider of the loading mechanism is provided with a sensing portion, and the third and fourth sensing elements are respectively disposed on the upper and lower sides of the sliding seat. The collecting device of the wafer according to claim 8, wherein the fixing mechanism of the receiving mechanism is simultaneously connected with a retaining member protruding from a front end portion of each of the front end portions by a fixing member.