200425195 玖、發明說明： 【發明所屬之技術領域】 本發明係關於按鈕開關，更詳細地說係關於在行動電 話、遊戲機、各種音響設備等的基板上進行表面安裝的小 型、薄型按鈕開關。 【先前技術】 過去，订動電話和遊戲機、各種音響設備等所使用的操 作開關有例如採用專利文獻1所述的按鈕開關。此種按鈕開 關通常在用絕緣樹脂等形成的外殼上設置中央固定接點和 外側固定接點，在這些固定接點的上部設置圓頂狀可動接 點並使其能與外側固定接點相搭接。並且，各固定接點在 2側具有延長的連接片，在該連接片的兩端上設置向外部 路出的連接端子。該連接端子從連接片的兩端向下彎曲， 、月j端大致上與外设的下面相平行。並且，連接端子的端 部向上幫曲。 如 點， 生開 接點 進行 此構成的按鈕開關，通過從上方按壓圓頂狀可動接 來使可動接點與中央固定接點相接觸，形成導通，産 關作用。亚且’有時根據使用方式的不同，也在可動 的上u具有預定形狀的操作钮，使按㈣作容易 專利文獻1特開2001_110273號公報 此種按4丑開關，連接被工μ 逑接舄子的端部被固定在基板（印刷電路 板）上。固定時通常使用把煜 ^ 把斗錫杨末和助焊劑混合而製成的 焊錫膏。將按鈕開關在美柘 隹暴板上進仃固定時，在基板上的按 200425195 鈕開關的固定部分上塗敷焊錫膏薄層，通常的厚度爲 〇=〜〇二_左右’在其上面佈置按&開關，從上面按H b時固定，使其it過回流焊設備而進行焊接，如 ㈣的連接料的㈣與基《結合，從心按钮開關固 疋在基板上。 但是’近幾年隨著行動電話、遊戲機、便攜音響設備等 的小型化、薄型化，其中所使用的按紐開關正在小型化和 薄型化。當前，按紐開關能形成0·5職以下的厚度。作是， 該按姐開關如上所述，由於被按壓到焊錫膏上進行臨時固 定，焊錫膏也進入到連接端子的下面上’其結果使得設置 狀態的高度尺寸增大，該增加量相當於進入到該連接端子 下面上的谭錫膏的量（厚度）。如此，進入到連接端子下面上 的焊錫貧的厚度，其最大值成爲焊锡膏的塗敷厚度，並且， 如上所述，焊錫膏的塗敷厚度通常爲b咖左右， 所以’該厚度即使與按㈣_厚度相比也是不能忽略的。 旦並且，在連接端子部分上按鈕開關佈置在上方，向上的 量相當於進入到連接端子下面的焊錫膏的厚度，所以外殼 的下面不與基板相搭接，而是向上浮起，使按紐開關的設 置狀怨不穩定。因此’對按紐開關按廢操作時，按钮開關 的中央部產生彎曲’並且設置高度産生誤差。再者，也可 能在臨時固定時被按麼的焊錫膏進入到外殼的下面上，也 可能在基板上產生焊錫球飛散。 【發明内容】 本發明是鑒於以上問題而提出的，其目的在於提供一種 200425195 在固定到基板上時能使設 t _ 焊錫春 怨的鬲度尺寸增加量不會像 開關。 了此保持穩疋的設置狀態的按鈕 絕題，從結構上本發明的按-開關，在由 固定接點#、外戒内设置可動接點、固定接點以及與該 目料料接料1料料㈣連接端子固 面1 反上’該按叙開關，其特徵在於··在上述外殼的下 :仗上述連接端子的下面起向下突出的臺階，利用該 至白上4連接端子的下方形成悍錫膏收容部，並且使上 述外殼的下面成爲與上述基板的接觸面。 、，若採用本發明，職把焊錫f收容到焊錫膏收容部内， 並且，外殼的下面與基板相接觸。 並且，本發明，其特徵在^:上述外殼的臺階形成的尺 I大於連接端子固定時所使用的焊錫膏的粒徑、小於焊錫 貧的塗敷厚度。 、 右知用本發明，則能抑制外殼下面的浮起，同時能牢固 地焊接連接端子，並且能控制按鈕開關在基板上的設置狀 態下的高度尺寸在較低的程度。 再者，從結構上看，本發明，其特徵在於··上述外殼的 堂階形成爲0·03 mm以上〇.1〇 mm以下。 若採用本發明，則能更切實地抑制外殼下面的浮起，同 日寸此牛固地焊接連接端子，並且能將按鈕開關在基板上的 設置狀態下的高度尺寸控制在較小的程度。 【實施方式】200425195 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a push button switch, and more specifically to a small, thin push button switch that is surface-mounted on a substrate of a mobile phone, a game machine, various audio devices, and the like. [Prior Art] In the past, for example, a push switch described in Patent Document 1 has been used as an operation switch used in a subscription phone, a game machine, various audio equipment, and the like. This type of push button switch is usually provided with a central fixed contact and an outer fixed contact on a housing formed of an insulating resin or the like. A dome-shaped movable contact is provided on the upper part of these fixed contacts so that it can overlap with the outer fixed contact. Pick up. In addition, each fixed contact has an extended connection piece on both sides, and connection terminals that are externally routed are provided at both ends of the connection piece. The connection terminal is bent downward from both ends of the connection piece, and the j-side is substantially parallel to the lower surface of the peripheral device. Also, the ends of the connection terminals buckle upward. For example, the contacts are opened by pressing the dome-shaped movable contact from above to bring the movable contact into contact with the central fixed contact to form a conduction and switch function. As for the case, depending on the way of use, it can also be operated with a predetermined shape of the operation button to make it easier to press. Patent Document 1 JP 2001_110273 This type of switch is used to connect the work. The ends of the rafters are fixed on a substrate (printed circuit board). For fixing, a solder paste is usually used, which is made by mixing yu tin powder with flux. When the push button switch is fixed on the US board, a thin layer of solder paste is applied to the fixed part of the 200425195 push button switch on the substrate. The usual thickness is 〇 = ~ 〇 二 _ or so. & The switch is fixed when H b is pressed from above, so that it is soldered through a reflow soldering device. For example, ㈣ of the bonding material of ㈣ is combined with the base, and the push button switch is fixed on the substrate. However, in recent years, with the miniaturization and thinness of mobile phones, game consoles, and portable audio equipment, the button switches used therein are miniaturized and thinned. At present, the button switch can form a thickness of less than 0.5 positions. As described above, since the push switch is pressed on the solder paste for temporary fixing as described above, the solder paste also enters the lower surface of the connection terminal. As a result, the height dimension of the installation state is increased, and the increase amount is equivalent to the The amount (thickness) of Tan solder paste under the connection terminal. In this way, the maximum thickness of the solder paste entering the lower surface of the connection terminal becomes the coating thickness of the solder paste, and, as described above, the coating thickness of the solder paste is usually about b coffee, so 'this thickness even The ratio of ㈣_thickness cannot be ignored. Once the button switch is placed on the connection terminal part, the upward amount is equivalent to the thickness of the solder paste entering the lower part of the connection terminal. Therefore, the lower part of the housing does not overlap with the substrate, but floats upward to make the button The setting of the switch is not stable. Therefore, "when the button switch is pressed and discarded, the central portion of the button switch is bent" and the setting height is incorrect. Furthermore, the solder paste that was pressed during temporary fixing may enter the lower surface of the housing, and the solder balls may be scattered on the substrate. [Summary of the Invention] The present invention is made in view of the above problems, and an object thereof is to provide a 200425195 that can increase the size of the dimension of the t_solder spring when fixed to a substrate, unlike a switch. In order to solve this problem of keeping the button in a stable setting state, the push-switch of the present invention is structurally provided with a movable contact #, an outer ring, a fixed contact, and a contact with the material 1 The material is connected to the solid surface of the connection terminal 1 upside down. The switch is characterized by being under the housing: a step protruding downward from the bottom of the connection terminal, using the bottom of the connection terminal above the white 4 A solder paste accommodating portion is formed, and a lower surface of the casing is a contact surface with the substrate. According to the present invention, the solder f is stored in the solder paste storage portion, and the lower surface of the case is in contact with the substrate. In addition, the present invention is characterized in that the ruler I formed by the steps of the casing is larger than the particle diameter of the solder paste used when the connection terminal is fixed, and smaller than the solder-thin coating thickness. As shown in the figure, using the present invention can suppress the floating under the shell, and can firmly weld the connection terminals, and can control the height dimension of the push button switch on the substrate to a lower degree. Furthermore, from the structural point of view, the present invention is characterized in that the step of the housing is formed to be 0.03 mm or more and 0.10 mm or less. According to the present invention, it is possible to more reliably suppress the floating under the casing, solder the connection terminals on the same day, and control the height dimension of the push button switch on the substrate to a small degree. [Embodiment]
O:\88\88537.DOC 200425195 、下 > 附圖，详細說明本發明的實施方式。首先，說 广 也方式。圖1是本發明第1實施方式的按紐開關的俯 ^圖圖2、圖3分別是圖i的八_八斷面圖和B_B斷面圖，圖* 本毛月第1貝轭方式的按紐開關的後視圖，圖5是圖3的連 接端子周圍的放大圖’圖6是表示本發明第}實施方式的按 鈕開關在基板上的安裝狀態的圖。 匕本實施方式的按鈕開關卜如圖丨、圖2所示，在由絕緣樹 脂成形的上方開口凹狀的大致方形的外殼10内，設置了 ·· 金屬板制的中央固定接點21，其中具有被加工成凸狀的、 大致爲圓形的中央接觸部2丨a ;以及金屬板制的外側固定接 點22，其中具有在對前者進行夾持的對稱位置上，同樣地 被加工成凸狀的大致爲矩形的外側接觸部22a、22a。 並且，中央固定接點21、如圖1、圖3所示，具有：與中 央接觸部21 a相導通、向著外殼1〇的側面直線延伸的中央連 結部21b、以及與該中央連結、部21b大致直交並導通，向外 殼1 0的兩側方向直線延伸的連接片2丨c。同樣，外側固定接 點22具有與各外側接觸部22a、與22a相導通，向著與中央 連結部2 1 b相反的方向延伸的外側連結部22b、22b、以及與 外側連結部22b、22b相導通並向外殼1 〇的兩側方向直線延 伸的連接片22c。各連接片21c、22c設置成基本上互相平行 的狀態。而且’各固定接點21、22被鑲嵌成形並固定在外 设1 0的内底面上，使上述中央接觸部2 1 a、外側接觸部2 2 a 露出來。並且’在各連接片21c、22c的兩端分別設置從外 殼10的下面12的四角的角部11中突出的露出來的連接端子 200425195 。亥連接鳊子23從連接片2ic、22c的兩端向下彎曲，其 月，J端大致上與外殼10的下面12相平行，並且，連接端子U 的端部23a向上方彎曲。 亚且，外殼10的側面的連接端子23突出的部分，如圖玉 所不，形成缺口形狀，以便將連接端子23儘量佈置在内側。 如此，在用焊錫膏50來焊接連接端子23時，能把焊錫膏5〇 塗敷在更靠近内側，所以，能減小當按鈕開關i在基板6〇上 進行平面安裝時的專用面積，能提高在基板6〇上的安裝密 度。 而且’在本實施方式中，外殼1〇大致上呈方形。但是， 並非僅限於此，例如也可以是圓形等其他形狀。並且，連 接鳊子23的端部23a向上方彎曲，但不一定要如此彎曲，也 可以使端部23a保持直線形狀。 在此，外殼10如圖4、圖5所示，在下面12的角部11以外 的4为’即不與連接端子23相關連的連接片21c、22c的埋 设保持部分内，設置一種從連接端子23的下面23b向下突出 的臺階13。也就是說，形成了下面12的不與連接端子23相 連的部分，以使其在比連接端子23的下面23b更靠下方處有 一個面。而且’希望該臺階13形成〇〇3 mm以上〇1〇 下。並且，通過設置該臺階丨3而相對地在連接端子23的下 方形成焊錫膏收容部14。 在此’在本實施方式的按鈕開關1的安裝中，採用表面安 裝方法進行安裝，即在預定位置上預先塗敷了焊錫膏5〇的 基板60上，用焊錫膏5〇來臨時固定按鈕開關1，使其通過回 10 200425195 流焊接設備内，利用紅外線或熱風使焊錫膏5〇熔化凝固。 在進行此種表面安裝時，由於形成上述焊錫膏收容部 4如圖6A、B所不，把按鈕開關丨臨時固定在基板⑼上的 焊錫β 50上拎，在该焊錫貧收容部14内收容焊錫膏別，所 以，按钮開關1不會受焊錫膏5〇的景多響而被佈置在比預定位 置高的上方，同時外殼1〇的下面12與基板6〇相接觸，按鈕 開關1的佈置狀態穩定。並且，能牢靠地進行焊接，同時即 ，把按紐開，按壓到焊錫膏5〇上臨時固定，也能抑制焊錫 貧50進入至“匕焊錫膏收容部14更靠内側的外殼ι〇的下面 !2’或向周圍飛散；能防止回流焊時按㈣關丨的下面⑵足 基板60上浮起；也能抑制焊錫球的發生。 並且，由於具有該焊錫膏收容部14，所以，形成外殼1〇 ，下面12的氣體容易排出，能保持很高的轉印精度，能提 高下面12的精度。 在此，如上所述，把臺階0製作成0 03 mm以上〇 i〇 以下，是因爲一般焊錫膏内所含有的焊錫粉末粒徑爲〇 _〜0.03 mm ’如果臺階爲〇 〇3咖以下，那麼焊錫粉末的 粒徑大於臺階13，造成設置狀態不穩定。並且，考慮到焊 錫膏50通常塗敷的厚纟，如果臺階爲〇ι〇 _以上’那麼臺階13大於焊錫膏5〇的錄厚度，當把按鈕 開關1佈置在基板60上時，連接端子23的下面23b有可能不 與焊錫膏50相接觸。也就是說，通過把臺階13形成在_ mm以上0.10 mm以下，能切實防止外殼ι〇的下面i2浮起， 安裝後也能使基板60和下面12相接觸。同時能牢靠地焊接 200425195 連接端子23。並且，也能減小設置狀態下的高度尺寸。即 使在採用端部23a爲直線狀的連接端子23的情況下，也能同 樣地獲得上述效果。 但是，該臺階13的0.03 mm以上〇·10 mm以下的條件並非 僅限於此’也可以根據焊錫貧5 〇中所含有的粉末的粒徑和 焊錫貧5 0的塗敷厚度來自由地進行調整。 並且，外殼10如圖1、圖2所示具有金屬薄板制的圓頂狀 的彈性可動接點30，其佈置狀態是外周下端與外侧固定接 點22的外螂接觸部22a相搭接，再者，下面塗敷了粘合劑的 具有撓性的大致爲圓形的絕緣薄膜4〇被固定成對外殼丨〇的 上面開口部進行遮蓋的狀態，該絕緣薄膜4〇也固定在可動 接點30的中央頂點部3〇3上，把半圓球狀的可動接點3〇保持 在外殼10内的預定位置上，同時，防止粉塵、助焊劑等侵 入到開關接點部分上。X，本實施方式把可動接點3〇的形 狀設定爲圓形，但並非特別隈定爲此，例如也可以採用八 角形，方形等其他形狀。絕緣薄膜4〇亦同。 以下詳細說明本實施方式的按紐開①的動作。按紐開關 1利用焊錫膏50把連接端子23焊接在職的料部上，從而 固定在基板6G的預定位置上。在如此被固定在基㈣上的 按紐開關W，對絕緣薄㈣從大致與已焊接的基板6〇相垂 直的上方向下㈣，通過具錢性的絕緣薄刺向下按麼 圓頂狀的可動接點30的中央頂點部3〇a。並且，當該按壓力 達到-定值時，可動接點3G進行反轉動作，使其中央頂點 的裏面接觸到σ又置在外殼1〇内的中央固定接點U的 12 200425195 中央接觸部21a上。 如此’中央固定接點21和外側固定接點22通過圓頂狀可 動接點3 0進行導通，變成開關接通的狀態，與各個連接端 子23相連接的基板6〇的與定的佈線部之間導通。 然後’若去除對絕緣薄膜4〇的按壓力，則半圓球狀的可 動接點30依靠本身的彈性恢復力而恢復到原來狀態，返回 到開關斷開的狀態。 在本貝轭方式的按紐開關1中，雖如此從大致上與焊接的 基板60相_直的上方接受反復的按壓荷重，但因爲外殼1〇 的下面12與基板60相搭接，所以在按鈕開關1的中央部不會 産生有害的撓曲。 在此’ 5兒明了直接按壓絕緣薄膜4〇的情況。但也可以根 據使用方式的不同，爲便於進行按壓操作而在絕緣薄膜4〇 的上部設置具有預定形狀的操作鈕，通過該操作鈕和絕緣 薄膜4〇來按壓可動接點3〇。、 以下說明第2實施方式。圖7是本發明第2實施方式的按鈕 開關的俯視圖，圖8、圖9分別是圖7的A-A斷面圖和B-B斷 面圖；圖10是本發明第2實施方式的按鈕開關的後視圖；圖 11是圖9的連接端子周圍的放大圖；圖12是本發明第2實施 方式的按鈕開關在基板上的安裝狀態圖。 本實施方式的按鈕開關1，如圖7、圖8所示，在由絕緣樹 脂成形的上方開口凹狀的大致方形的外殼丨〇内，設置了： 金屬板制的中央固定接點21，其中具有加工成凸狀的、大 致爲圓形的中央接觸部2 1 a，以及金屬板制的外側固定接點 O:\88\88537.DOC -13- 200425195 22 ’其中具有在對前者進行夾持的對稱位置上，同樣地被 加工成凸狀的大致爲矩形的外側接觸部22a、22a。該等固 定接點21、22被鑲嵌成形並固定在外殼10的内底面上。 並且’中央固疋接點21，如圖1、圖3所示，具有：與中 央接觸部2 1 a相導通，向著外殼丨〇的側面直線延伸的中央連 結部21b、以及與該中央連結部2113大致直交並導通，向外 殼1 0的兩側方向直線延伸的連接片2丨c。同樣，外側固定接 點22具有與各外側接觸部22 a、22 a相導通，向著與中央連 結部21 b相乒的方向延伸的外側連結部22b、22b、以及與這 些外側連結部22b、22b相導通並向外殼1 〇的兩側方向直線 延伸的連接片22c。各連接片21c、22c設置成基本上互相平 行的狀態。並且，在各連接片21c、22c的兩端分別設置從 外殼10的下面12的四角的角部u中突出從而露出來的連接 端子23。 本貫施方式的連接端子23從連接片21c、22c的兩端起直 接形成直線狀，大致上與外殼1〇的下面12相平行，並且， 連接端子2 3的端部2 3 a向上方彎曲。 如此’即使是連接端子23從各連接片21c、22c的兩端起 没置成直線狀的按鈕開關1，也能適用本發明。即，本實施 方式的按鈕開關1，如圖1 〇、圖11所示，在下面丨2的角部工工 以外的部分，即不與連接端子23相關連的部分上，設置一 種從連接端子23的下面23b向下突出的臺階π。即，形成了 下面12的不與連接端子23相連的部分，並使其在比連接端 子23的下面23b更罪下方處有一個面。而且，希望該臺階η 14 200425195 與上述第1實施方式一樣，形成在〇 〇3 mm以上〇1〇㈤㈤以 下。 即使是連接端子23從各連接片21c、22c的兩端起設置成 直線狀的按鈕開關丨，也能通過設置此種臺階丨3，相對地在 連接端子23的下方形成焊錫膏收容部14，如圖UA、3所 不，能收容焊錫膏50。依此，按鈕開關丄不會受焊錫膏5〇的 影響而被設置在比預定位置高的上方，同時，外殼1〇的下 面12與基板60相接觸，使按鈕開關i的佈置狀態穩定。 亚且，却此即使是連接端子23從各連接片21c、22c的兩 端起設置成直線狀的按鈕開關丨也能整體厚度減薄。 再者，外殼10如圖7、圖8所示，具有金屬薄板制的圓頂 狀的可動接點30,並且，下面塗敷了枯合劑的具有撓性的 〇角形絕緣薄膜40被固定成對外殼1〇的上面開口部進行遮 盖的狀態。 而且，關於按鈕開關1的動作與上述第丨實施方式相同， 故在此其說明從略。 、，以上根據附圖說明了本發明的實施方式。但是，本發明 卫非僅限於上述實施方式所述的事項，而是能根據權利要 f書所述進行更改和改進。例如，上述實施方式中對連接 子k外/V又的角邛路出的按紐開關進行了說明，但對於從 其他部分、例如連接端子從外殼側方中間露出的按鈕開關 也能適用。 【發明的效果】 若採用上述本發日月’則在夕卜殼的下面設置從連接端子下 15 200425195 面向下大出的！階，利用該臺階在連接端子下方形成焊錫 膏收容部，同時把外殼的下面作爲與上述基板的接觸面， 所以’能把焊錫膏收容到該焊錫膏收容部内，目此，在連 接端子的位置上按㈣關也不會被佈置在尺寸量爲焊锡膏 塗敷厚度的上方位置上，同時，外殼的下面與基板相接觸^ 按紐開關的佈置狀態穩定。並且，能牢固地進行焊接，也 能抑制焊錫球的發生。 並且，若採用本發明，則能使形成的外殼的臺階大於連 接端子的同定所使用的焊錫膏的粒徑，小於焊錫膏塗敷層 的厚度，所以，焊錫膏的顆粒能被收容到焊錫膏收容部内， 能抑制外殼的下面浮起，同時能可靠地焊接連接端子。並 且，能將按鈕開關在基板上的設置狀態下的高度尺寸控制 在較小的程度。 再者，若採用本發明，則使外殼的臺階形成爲〇 〇3 mm以 上〇· 1 0 mm以下，所以能更可靠地抑制外殼下面的浮起，同 時能牢固地焊接連接端子，並且，能將按鈕開關在基板上 的設置狀態下的高度尺寸控制在較小的程度。 【圖式簡單說明】 圖1是本發明第1實施方式的按紐開關的俯視圖。 圖2是圖1的A-A斷面圖。 圖3是圖1的B-B斷面圖。 圖4是本發明第1實施方式的按鈕開關的後視圖。 圖5是圖3的連接端子周圍的放大圖。 圖6 A〜6B是表示本發明第1實施方式的按鈕開關在基板 O:\88\88537.DOC -16- 200425195 上的安裝狀態的圖。 圖7是本發明第2實施方式的按鈕開關的俯視圖。 圖8是圖6的C-C斷面圖。 圖9是圖6的D-D斷面圖。 圖10是本發明第2實施方式的按紐開關的後視圖。 圖11是圖9的連接端子周圍的放大圖。 圖12 A〜12B是表示本發明第2實施方式的按紐開關在美 板上的安裝狀態的圖。 【圖式代奉符號說明】 1 按鈕開關 10 外殼 11 角部 12 下面 13 臺階 14 焊錫膏收容部 21 中央固定接點 22 外側固定接點 23 連接端子 30 可動接點 40 絕緣薄膜 50 焊錫膏 60 基板O: \ 88 \ 88537.DOC 200425195, below > Figures, detail embodiments of the present invention. First, let ’s talk about the way. Fig. 1 is a top view of a button switch according to a first embodiment of the present invention. Figs. 2 and 3 are respectively an eight-eight cross-sectional view and a B_B cross-sectional view of Fig. I. A rear view of the push button switch. FIG. 5 is an enlarged view of the periphery of the connection terminal in FIG. 3. FIG. 6 is a diagram showing a state in which the push button switch according to the} th embodiment of the present invention is mounted on a substrate. As shown in FIGS. 丨 and 2, the push button switch according to the embodiment of the present invention is provided with a central fixing contact 21 made of a metal plate in a substantially square housing 10 having a concave upper opening formed by an insulating resin, wherein It has a central contact portion 2a which is processed into a convex shape and has a substantially circular shape; and an outer fixed contact 22 made of a metal plate, which is also processed into a convex shape at a symmetrical position for clamping the former. The substantially rectangular outer contact portions 22a, 22a. Further, as shown in FIGS. 1 and 3, the central fixed contact 21 includes a central connection portion 21b which is in communication with the central contact portion 21a and extends linearly toward the side surface of the housing 10, and the central connection portion 21b. The connecting pieces 2 丨 c extending substantially perpendicularly and conducting, extending linearly to both sides of the housing 10. Similarly, the outer fixed contact 22 has outer connection portions 22b and 22b which are in communication with the respective outer contact portions 22a and 22a, and extend in a direction opposite to the central connection portion 2 1b, and are in communication with the outer connection portions 22b and 22b. The connecting piece 22c extends linearly toward both sides of the housing 10. The connecting pieces 21c and 22c are arranged in a substantially parallel state. Further, each of the fixed contacts 21 and 22 is insert-molded and fixed to the inner bottom surface of the exterior 10, so that the central contact portion 2a and the outer contact portion 2a are exposed. And, at both ends of each of the connection pieces 21c and 22c, exposed connection terminals 200425195 protruding from corner portions 11 of the four corners of the lower surface 12 of the housing 10 are provided. The helical connecting rod 23 is bent downward from both ends of the connecting pieces 2ic and 22c, and the J end thereof is substantially parallel to the lower surface 12 of the housing 10, and the end portion 23a of the connecting terminal U is bent upward. Moreover, the protruding portion of the connection terminal 23 on the side of the casing 10 is formed in a notch shape as shown in FIG. 1 so as to arrange the connection terminal 23 on the inside as much as possible. In this way, when the connection terminal 23 is soldered with the solder paste 50, the solder paste 50 can be applied closer to the inside. Therefore, the dedicated area when the push button switch i is planarly mounted on the substrate 60 can be reduced. Increase the mounting density on the substrate 60. Furthermore, in this embodiment, the case 10 is substantially square. However, it is not limited to this, and other shapes, such as a circle, may be sufficient, for example. In addition, the end portion 23a of the connection rafter 23 is bent upward, but it is not necessary to be bent in this manner, and the end portion 23a may be kept in a straight shape. Here, as shown in FIG. 4 and FIG. 5, the housing 10 is provided with a portion other than the corner portion 11 of the lower surface 12, that is, the embedded holding portion of the connection pieces 21 c and 22 c not associated with the connection terminal 23. The lower surface 23b of the terminal 23 is a step 13 protruding downward. That is, a portion of the lower surface 12 that is not connected to the connection terminal 23 is formed so that it has a surface lower than the lower surface 23b of the connection terminal 23. Moreover, it is desirable that the step 13 is formed to be not less than 0.000 mm and not more than 100 mm. The step 3 is provided to form a solder paste storage portion 14 below the connection terminal 23 relatively. Here, in the mounting of the push button switch 1 of this embodiment, the surface mounting method is used for mounting, that is, the substrate 60 on which the solder paste 50 is applied in advance at a predetermined position, and the push switch 50 is temporarily fixed with the solder paste 50. 1. Pass it back to the 10 200425195 flow soldering equipment and use infrared or hot air to melt and solidify the solder paste 50. When such surface mounting is performed, as described above, the solder paste accommodating portion 4 is formed as shown in FIGS. 6A and 6B. The push button switch 丨 is temporarily fixed to the solder β 50 on the substrate 拎, and is accommodated in the solder poor accommodating portion 14. Because of the solder paste, the button switch 1 will not be placed above the predetermined position by the noise of the solder paste 50, and the lower surface 12 of the housing 10 will be in contact with the substrate 60. The arrangement of the button switch 1 The state is stable. In addition, soldering can be performed reliably, and at the same time, pressing the button and temporarily fixing it on the solder paste 50 can also prevent the solder lean 50 from entering the lower side of the outer shell ι of the solder paste accommodating portion 14. ! 2 'or scattered to the surroundings; it can prevent the bottom 60 of the substrate from being lifted when the reflow is pressed during reflow; it can also suppress the occurrence of solder balls. Also, since the solder paste containing portion 14 is provided, the casing 1 is formed. 〇, the lower 12 gas is easy to exhaust, can maintain a high transfer accuracy, can improve the accuracy of the bottom 12. Here, as described above, the step 0 is made to 0 03 mm or more 〇i〇 or less, because the general solder The particle size of the solder powder contained in the paste is 0 to 0.03 mm 'If the step is smaller than 0.003, the particle size of the solder powder is larger than the step 13 and the installation state is unstable. Considering that the solder paste 50 is usually applied, If the step thickness is greater than or equal to 0 mm, the step 13 is greater than the recording thickness of the solder paste 50. When the push button switch 1 is arranged on the substrate 60, the lower surface 23b of the connection terminal 23 may not be connected with the solder paste. 50 That is to say, by forming the step 13 from _ mm to 0.10 mm, the lower surface i2 of the casing ι0 can be reliably prevented from floating, and the substrate 60 can also contact the lower surface 12 after installation. At the same time, it can be reliably soldered 200425195 The connection terminal 23. Also, the height dimension in the installed state can be reduced. The above-mentioned effect can be obtained similarly even when the connection terminal 23 having a straight end portion 23a is used. However, 0.03 mm of the step 13 The above condition of 0.1 mm or less is not limited to this, and can be freely adjusted according to the particle diameter of the powder contained in the solder lean 50 and the coating thickness of the solder lean 50. Also, the housing 10 is shown in FIG. 1 2. The dome-shaped elastic movable contact 30 shown in FIG. 2 is arranged in a state in which the lower end of the outer periphery overlaps the outer beetle contact portion 22a of the outer fixed contact 22, and the lower surface is coated with adhesive. The flexible, substantially circular insulating film 40 of the mixture is fixed in a state that covers the upper opening of the casing, and the insulating film 40 is also fixed to the central vertex portion 3 of the movable contact 30. 3 on The semi-spherical movable contact 30 is held at a predetermined position in the housing 10, and at the same time, dust, flux, etc. are prevented from entering the switch contact portion. X, in this embodiment, the shape of the movable contact 30 is set It is circular, but it is not particularly fixed for this purpose. For example, other shapes such as octagon, square, etc. may be adopted. The same applies to the insulating film 40. The operation of the button opening ① of this embodiment will be described in detail below. The use of the button switch 1 The solder paste 50 solders the connection terminal 23 to the working material part, thereby fixing it to a predetermined position on the substrate 6G. At the button switch W thus fixed to the base plate, the insulation thin plate is roughly connected with the soldered substrate 6 〇 The upper part is perpendicular to the lower part, and the central vertex part 30a of the dome-shaped movable contact 30 is pushed down by a thin insulating thin thorn. In addition, when the pressing force reaches a fixed value, the movable contact 3G performs a reversing action so that the inside of the central vertex contacts the central fixed contact U of σ which is also placed in the housing 10 and the 2004 2004195195 central contact portion 21a on. In this way, the 'central fixed contact 21 and the outer fixed contact 22 are conducted through the dome-shaped movable contact 30, and the switch is turned on. The predetermined wiring portion of the substrate 60 connected to each connection terminal 23 Between conduction. Then, when the pressing force on the insulating film 40 is removed, the semi-spherical movable contact 30 is restored to its original state by its own elastic restoring force, and returns to the state where the switch is turned off. In the button switch 1 of this yoke method, although a repeated pressing load is received from directly above the soldered substrate 60, the lower surface 12 of the housing 10 is overlapped with the substrate 60, so The central portion of the push button switch 1 does not cause harmful deflection. Here, it is clear that the insulating film 40 is directly pressed. However, it is also possible to provide an operation button having a predetermined shape on the upper part of the insulating film 40 to facilitate pressing operation, and press the movable contact 30 by the operation button and the insulating film 40 according to different usage methods. The second embodiment will be described below. Fig. 7 is a plan view of a push button switch according to a second embodiment of the present invention, and Figs. 8 and 9 are respectively an AA sectional view and a BB sectional view of Fig. 7; Fig. 10 is a rear view of the push button switch according to the second embodiment of the present invention; FIG. 11 is an enlarged view around the connection terminal of FIG. 9; FIG. 12 is a diagram of a state where the push button switch according to the second embodiment of the present invention is mounted on a substrate. As shown in FIGS. 7 and 8, the push button switch 1 according to this embodiment is provided in a generally rectangular shell with a concave upper opening formed by an insulating resin, and is provided with a central fixed contact 21 made of a metal plate, in which It has a central contact portion 2 1 a which is processed into a convex shape and a substantially circular shape, and an outer fixed contact made of a metal plate. O: \ 88 \ 88537.DOC -13- 200425195 22 ' In the symmetrical position, the outer contact portions 22 a and 22 a having a substantially rectangular shape are similarly processed into a convex shape. The fixed contacts 21 and 22 are insert-molded and fixed on the inner bottom surface of the casing 10. In addition, as shown in FIGS. 1 and 3, the “central fixed contact 21” includes a central connection portion 21b that is in communication with the central contact portion 2a and extends linearly toward the side of the casing, and the central connection portion. 2113 is substantially orthogonal and conductive, and the connecting piece 2 丨 c extending linearly toward both sides of the housing 10. Similarly, the outer fixed contact 22 has outer connecting portions 22b, 22b which are in communication with the respective outer contact portions 22a, 22a, and extend in a direction pinging the central connecting portion 21b, and the outer connecting portions 22b, 22b. The connecting pieces 22c that are in phase conduction and extend linearly in the both sides of the casing 10. The connecting pieces 21c and 22c are arranged in a substantially parallel state. In addition, at both ends of each of the connection pieces 21c and 22c, connection terminals 23 protruding from corner portions u of the four corners of the lower surface 12 of the case 10 are exposed, respectively. The connection terminal 23 of this embodiment is formed in a straight line directly from both ends of the connection pieces 21c and 22c, and is substantially parallel to the lower surface 12 of the housing 10, and the end portion 2 3a of the connection terminal 23 is bent upward. . As described above, the present invention can be applied to the push button switch 1 in which the connection terminals 23 are not linearly formed from both ends of each of the connection pieces 21c and 22c. That is, as shown in FIG. 10 and FIG. 11, the push button switch 1 of this embodiment is provided with a slave connection terminal on a portion other than the corner portion of the lower surface 2, that is, a portion not connected to the connection terminal 23. The lower face 23b of step 23 protrudes downward. That is, the portion of the lower surface 12 which is not connected to the connection terminal 23 is formed so that it has a surface below the sinusoidal surface 23b of the connection terminal 23. Further, it is desirable that the step η 14 200425195 be formed to be equal to or greater than 0.03 mm and equal to or smaller than 100 mm as in the first embodiment. Even if the connection terminal 23 is provided with a linear push-button switch from both ends of each of the connection pieces 21c and 22c, such a step 3 can be provided to relatively form a solder paste containing portion 14 below the connection terminal 23. As shown in Figures UA and 3, solder paste 50 can be accommodated. According to this, the push button switch 丄 is not set higher than the predetermined position by the solder paste 50, and at the same time, the lower surface 12 of the housing 10 contacts the substrate 60, so that the arrangement state of the push button switch i is stable. However, even if the connection terminals 23 are linear switches from both ends of each of the connection pieces 21c and 22c, the overall thickness can be reduced. Furthermore, as shown in FIGS. 7 and 8, the casing 10 has a dome-shaped movable contact 30 made of a thin metal plate, and a flexible O-shaped insulating film 40 coated with a desiccant is fixed to a pair. The upper surface of the casing 10 is covered. The operation of the push button switch 1 is the same as that of the first embodiment described above, and therefore its description is omitted here. The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the matters described in the above embodiments, but can be modified and improved according to the claims. For example, in the above-mentioned embodiment, the push button switch with the corners outside the connector k / V is described, but it can also be applied to a push button switch exposed from other parts, such as the connection terminal from the middle of the side of the housing. [Effects of the Invention] If the above-mentioned sun and moon are used, then the bottom of the shell is set from the bottom of the connection terminal 15 200425195 to the bottom! Step, using this step to form a solder paste storage section under the connection terminal, and at the same time use the lower surface of the housing as the contact surface with the substrate, so 'the solder paste can be stored in the solder paste storage section, so at the position of the connection terminal The push button is not placed on the top of the solder paste coating, and the bottom of the shell is in contact with the substrate. The arrangement of the button switch is stable. In addition, soldering can be performed firmly and the occurrence of solder balls can be suppressed. In addition, if the present invention is adopted, the step of the formed shell can be made larger than the particle diameter of the solder paste used for the same connection terminal and smaller than the thickness of the solder paste coating layer, so that the particles of the solder paste can be contained in the solder paste. In the accommodating portion, the bottom surface of the housing can be suppressed from floating, and the connection terminals can be reliably soldered. In addition, it is possible to control the height and size of the push button switch on the substrate to a small extent. Furthermore, if the present invention is adopted, the steps of the case are formed to be greater than or equal to 0.03 mm and less than or equal to 10 mm, so that the floating under the case can be more reliably suppressed, and the connection terminals can be firmly welded. The height dimension of the push button switch on the substrate is controlled to a small extent. [Brief Description of the Drawings] FIG. 1 is a plan view of a button switch according to a first embodiment of the present invention. Fig. 2 is a sectional view taken along the line A-A in Fig. 1. Fig. 3 is a B-B sectional view of Fig. 1. Fig. 4 is a rear view of the push button switch according to the first embodiment of the present invention. FIG. 5 is an enlarged view around the connection terminal of FIG. 3. FIGS. 6A to 6B are diagrams showing a state in which the push button switch according to the first embodiment of the present invention is mounted on a substrate O: \ 88 \ 88537.DOC -16-200425195. 7 is a plan view of a push button switch according to a second embodiment of the present invention. Fig. 8 is a sectional view taken along the line C-C in Fig. 6. Fig. 9 is a sectional view taken along the line D-D in Fig. 6. FIG. 10 is a rear view of a button switch according to a second embodiment of the present invention. FIG. 11 is an enlarged view around the connection terminal of FIG. 9. 12A to 12B are diagrams showing a state in which a push button switch according to a second embodiment of the present invention is mounted on a US board. [Illustration of Symbols in the Drawings] 1 Push-button switch 10 Housing 11 Corner 12 Below 13 Step 14 Solder paste storage 21 Central fixed contact 22 Outside fixed contact 23 Connection terminal 30 Movable contact 40 Insulation film 50 Solder paste 60 Substrate
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