200424832 玖、發明說明： 【發明所屬之技術領域】 本發明係屬於一種散熱裝置，以用來降低各類電機、 電子、電腦CPU或透過蒸發與冷卻過程之冷凍發生器的各 種需要之溫度冷卻裝置，尤指一種可裝設於電腦内晶片上 並針對該晶片進行散熱的混元式導熱管散熱裝置。 【先前技術】 電月匈產業發展迅速，電腦相關零件如中央處理器、顯 示卡專，彺在於短短一兩年内更替一個世代。 乂中央處理器為例，其包含有一晶片，晶片内含有數 里達數千萬甚至上億的電晶體，通常晶片内的電晶體數量 越尚，則晶片所產生的熱能越高。然而為了更高的效能， 新世代的中央處理器晶片所含電晶體數目不斷提昇，導致 曰曰片運作時溫度不斷升高，過高的溫度可導致中央處理器 無法正常運作，甚至使得晶片損毀。因此，現今的中央處 理為晶片，甚至顯示卡上的晶片上通常會加裝一散熱 以避务、 / e片因向熱而失效或是損毁而使昂貴的電腦零件報 卡習用的散熱裝置可安裝於一電路板如主機板或是顯方 一之上，並與一位於電路板上的晶片緊密接觸，其包含孝 、或鋼製的散熱板，該散熱板的底面可與晶片的 岔接觸，1 ^ ;政熱板頂面形成有數片沿垂直方向延伸的鮮 ’相鄰缺y郎 曰 風屢。，間具有間隙，又於各鰭片上方固設一風扇，言3 羽可外接一電源而朝向散熱板頂面送風，以進行強制黄 200424832 熱。 山由於鋁或銅製散熱板的散熱係數高於晶片的散熱係數 、’當晶片通電而產生熱量時，熱量可經由晶片頂面迅速傳 遞至散熱板|面，I經由散熱板底面傳遞至各鱗#，而風 羽朝政熱板送風’冑空氣吹入鰭片間的間隙並帶走散熱板 及鰭片上的熱能。 然而習用的散熱裝置具有幾個缺點：200424832 (1) Description of the invention: [Technical field to which the invention belongs] The present invention belongs to a type of heat dissipation device, which is used to reduce the various cooling requirements of various types of motors, electronics, computer CPUs or refrigeration generators through evaporation and cooling processes In particular, it is a mixed-element heat pipe heat dissipation device that can be mounted on a chip in a computer and dissipates heat from the chip. [Previous Technology] The Hungarian industry has been developing rapidly. Computer-related parts such as central processing units and graphics cards are dedicated to replacing a generation in just one or two years.乂 Central processing unit, for example, contains a chip, which contains tens of millions or even hundreds of millions of transistors. Generally, the higher the number of transistors in a chip, the higher the thermal energy generated by the chip. However, for higher performance, the number of transistors contained in new-generation CPU chips has continued to increase, causing the temperature of the chip to continue to increase during operation. Excessive temperatures can cause the CPU to fail to operate properly and even cause chip damage. . Therefore, at present, the central processing is a chip, and even the chip on the display card is usually equipped with a heat sink to avoid work, and the e-chip fails or is damaged due to the heat, so that expensive computer parts can be used as a heat sink. It is mounted on a circuit board such as a motherboard or a display board and is in close contact with a chip located on the circuit board. It contains a heat sink made of steel or steel. The bottom surface of the heat sink can be in contact with the fork of the chip. , 1 ^; the top surface of the political hot plate is formed with several pieces of fresh 'adjacent short-term, long-term extension extending in the vertical direction. There is a gap between them, and a fan is fixed above each fin. The 3 feathers can be connected to a power supply and send air to the top surface of the heat sink for forced yellow 200424832 heat. Because the heat dissipation coefficient of the aluminum or copper heat sink is higher than the heat dissipation coefficient of the chip, when the chip is energized to generate heat, the heat can be quickly transferred to the heat sink through the top surface of the wafer, and to the scales through the bottom surface of the heat sink However, the wind feather blows air toward the hot plate of the government, and the air blows into the gap between the fins and takes away the heat energy on the heat sink and the fins. However, the conventional heat sink has several disadvantages:
1放熱板上鰭片的總面積越大，與空氣熱交換的效 率越好而有利於晶片的散熱，故錯片延伸越長則韓片總面 ，越大’❿電腦機箱内各電路板的間距不大，散熱裝置的 厚度需有-定限制方能順利安裝於電路板上而不抵觸到其 他電路板。而散熱板上的籍片沿垂直方向延伸，因散熱率 及製程長寬比直接影響散熱裝置的高纟，故_片的長度受 到限制，並使得鰭片總面積難以增加。 X 扣2風扇係由鰭片上方向散熱板頂面送風，所吹入的 空氣到達散熱板頂面即被阻擋而無法順利排至他處，被阻 擋的空氣因溫度升高及短循環並與吹入之冷空氣混合溫昇 ’進而降低後續與散熱板及W的熱交換效率。 【發明内容】 因此，本發明人根據習用散熱裝置散熱效率 二改良其缺失與不足，進而設計出一種混元式導k 官散熱裝置。 J … ::明主要目的係提供—種混元式導熱管散熱裝置， 十子或多重十字組合導熱管、特殊設計的鰭片及橫吹 200424832 勺風扇可迅速傳遞晶片上的熱量並迅速散熱之功效。 為達上述目的，本發明提供一種混元式導熱管散熱裝 置’其包含有： 一金屬製均熱底板； 、一设置於均熱底板上的金屬製散熱器，其兩端分別形 $有一開口，並於内部形成有一分別與開口相連通的容置 二間，於散熱器内壁形成有數片鰭片而成一包覆熱通道 用； 设置散熱器外並同時與均熱底板接觸的金屬製外導 熱g ，其係呈中空狀，其内形成的容置空間係供容納一液 態物質； 一设置於散熱器内的金屬製内導熱管，其係呈中空狀 ，其内形成的容置空間係供容納一液態物質，其一端與均 熱底板接觸，另端與散熱器内的鰭片軸心接觸。 藉由上述技術手段，本發明混元式導熱管散熱裝置增 進下列功效： 1·内/外導熱管可接收來自於均熱底板的高熱而以 超導及相變方式分別迅速傳遞熱量至散熱器，讓整個散熱 器成一均熱體，再分別以向外/向内輻射方式傳導至散熱 益内設的鰭片，藉由熱量快速分佈來提高導熱效率。 2 ·鰭片可朝散熱器長度方向增加其散熱面積，如此 可達到增加散熱裝置與空氣的熱交換流程及熱傳量。 3 ·可藉由另設置一風扇而將空氣自散熱器包覆熱通 道一端開口吹入並由散熱器另端開口排出並迅速逸散，來 200424832 取得最大通風量，因進入開口之冷空氣與鰭片存有最大溫 度差，如此可達到維持散熱器内外的熱傳量，增加散熱Z 置與空氣的良好熱交換效率。 註··混元式係指異相同質之功能，於本文中係指以金1 The larger the total area of the fins on the heat radiation plate, the better the efficiency of heat exchange with the air, which is beneficial to the heat dissipation of the chip. Therefore, the longer the wrong piece is extended, the larger the total surface of the Korean piece. The distance is not large, and the thickness of the heat sink needs to be limited to be smoothly installed on the circuit board without touching other circuit boards. The fins on the heat sink extend in the vertical direction. Because the heat dissipation rate and the aspect ratio of the process directly affect the height of the heat sink, the length of the fins is limited and it is difficult to increase the total area of the fins. The X buckle 2 fan sends air from the top of the fins to the top surface of the heat sink. The air that is blown reaches the top surface of the heat sink and is blocked and cannot be smoothly discharged to other places. The temperature rise of the mixed cold air will further reduce the subsequent heat exchange efficiency with the heat sink and W. [Summary of the Invention] Therefore, the inventor improved a deficiency and deficiency of the conventional heat sink according to the heat dissipation efficiency of the conventional heat sink, and then designed a hybrid element-guided heat sink. J… :: Ming's main purpose is to provide a kind of mixed element heat pipe heat sink, ten or multiple cross combination heat pipes, specially designed fins and cross-blow 200424832 spoon fans can quickly transfer the heat on the chip and quickly dissipate heat. efficacy. In order to achieve the above object, the present invention provides a mixed-element heat pipe heat sink device including: a metal soaking base plate; and a metal heat sink provided on the soaking base plate, each of which has an opening at each end. Two accommodating chambers are formed in the interior to communicate with the openings, and several fins are formed on the inner wall of the radiator to form a heat tunnel; a metal-made external heat-conducting device is arranged outside the radiator and is in contact with the soaking base plate at the same time. g, which is hollow, and the accommodating space formed therein is for accommodating a liquid substance; a metal inner heat pipe arranged in the radiator is hollow, and the accommodating space formed therein is for A liquid substance is contained, one end of which is in contact with the soaking bottom plate, and the other end is in contact with the fin shaft inside the radiator. With the above-mentioned technical means, the mixed-element heat-conducting pipe heat dissipation device of the present invention improves the following effects: 1. The inner / outer heat-conducting pipe can receive high heat from the soaking plate and quickly transfer heat to the heat sink in a superconducting and phase-changing manner, respectively. In order to make the entire heat sink into a homogenizing body, and then conduct the outward / inward radiation to the fins built in the heat sink, the heat dissipation efficiency is improved by the rapid heat distribution. 2 · The fin can increase its heat dissipation area towards the length of the heat sink, so as to increase the heat exchange process and heat transfer capacity of the heat sink and air. 3 · An additional fan can be used to blow air from the opening at one end of the radiator-covered hot aisle and exhaust it from the opening at the other end of the radiator and quickly dissipate. The maximum ventilation volume is obtained by 200424832. The fins have a maximum temperature difference, which can maintain the heat transfer volume inside and outside the radiator, and increase the good heat exchange efficiency between the heat sink Z and the air. Note ·· Mixed element type refers to the functions of different homogeneity, and in this article refers to gold
屬傳導熱能及以冷媒相變傳導熱能等兩種不同的方式而同 時進行單一性質的熱傳導。 "P 【實施方式】 本發明混元式導熱管散熱裝置可安裝於一電路板上， 並與電路板上的晶片緊密結合。 請參照第一圖，本發明混元式導熱管散熱裝置包含有 一均熱底板（1 〇 ) ，·一散熱器（2 〇 ) ，一 C形外導熱 管（30)，一熱傳箍具（40) ，一U形内導熱管（5 0)及一風扇（60)等。其中·· 該均熱底才反（1 〇 )可以鋁或銅等金屬製造，而銅的 熱傳導係數高於鋁而能提供較佳的熱傳效率，該均熱底板 (1 0 )底面可貼緊晶片頂面並帶走晶片的熱能，其頂面 形成有-橫槽（i 3 )及一與橫才曹（i 3 )垂直交叉並相 互連通的長槽（15)。 該散熱器（2 0 )呈圓筒狀而設置於均熱底板（工〇 )上並可以螺检等固定件固設，又散熱器（2 0 )可以銘 或銅等金屬製造，其底部呈平坦狀而與均熱絲（丄〇 ) 頂面相貼合，於散熱器（2 0 )兩端形分別形成有一開口 ，並於内部形成有一分別與前述開口相連通的容置空間， 其内壁沿軸向方向形成有數片呈徑向方向分佈的鰭“2 u ’該韓片（21)可為㈣或銅製，其容置空門中 處設置有-與部分錯片（21)末端相結 " 筒（22),，該抽心筒（W)可為紹製或銅製m 、C形外導熱管（3 〇 )係環繞散熱器（2 〇 )外周緣 上並且與均熱底板（i 〇 )頂面接觸，外導熱管（、） 可以銅或其他相當於鋼而具高熱傳導係數的金屬製造，盆 表面可設計成具有微米或奈米結構之快速導 了 於外㈣（30)底部形成有二長直末段（31“' 長直末段（3 1 )設置於均熱底板（丄Q )之橫槽< )内，=外導熱管（3〇)可為中空狀，其形成的容置空 間可供密封有-液態物f，該液態物f可為—冷媒或θ 2 他易揮發的物質並可香敎而吝&知_ μ 、 尺八 ^ 貝熱而產生㈣’若密封物質為冷媒 ，該冷媒可為一單純冷媒成份或以多成份之共沸冷媒。 ,'^進步參照第二圖及第三圖，該熱傳箍具（4 〇 ) 係設置於散熱器（2 0 )外壁，其環繞在外導熱管（3 〇 =外並固定該外導熱管（3 〇 )，並可以銘或鋼等金屬 衣這又熱傳箍具（4〇)包含有一圍繞在散熱器（2〇 ^ =壁上的内箍環（4 2 )，於内箍環（4 2 )相對外導 熱& (30)的一端周緣上形成有一包覆外導熱管（3〇 )^内環形凹緣（4 2丄），又外㈣（4丄）相對外導 熱& ( 3 0 )的一端上形成有一卡制在前述内環形凹緣（ 4 2 1 )外側的外環形凹緣（4 1 1 )。 请參照第一、第四及第五圖，該金屬製U形内導熱管 〇 )係以銅或其他相當於銅而具高熱傳導係數的金屬 200424832 製造，其表面可設計成具有微米或奈米結構之快速導敎特 性材料，X内導熱管（5 〇 )上形成有二長柄（5丄）（ 5 2 ) ’其中—長柄（5工）設置於散熱器（2 〇 )底部 與均熱底( i 〇 )頂面之間並位於均熱底板（丄〇 )的 長槽（1 5 ) Μ ’另-長柄（5 2 )設置於軸心筒（2 2 )内’該内導熱管（5 0)可為中空管狀，其内部形成的 容置空間可供密封有一液態物質’該液態物質可為一冷媒 或是其他易揮發的物質並可受熱而產生相冑，若密封物質 為冷媒’該冷媒可為—單純冷媒成份或以多成份之共沸冷 媒。 收來自於晶片頂面的 3 0)的長直末段（ 52) ’内外導熱管 物質受熱後藉由毛細現象或是相變’將熱量迅速擴散至整 個内導熱f (5〇)及外導熱管（3〇)。請細第八及 第九圖，#中外導熱管（30)的熱量 40)，並藉由熱傳箍具（40)將埶…具（ 了热里擴散傳遞至散熱 請參照第一及第四圖， 器（20)上相對内導熱管 以螺栓或扣具等固定件固設 (2 0 )内部所設的鰭片（ 請參照第六及第七圖， 熱底板（1 0 )吸 傳遞給外導熱管（ (5 0 )的長柄（ 該風扇（6 〇 )係設置於散熱 (5 〇 )的另端開口處，並可 ，該風扇（β 〇 )可朝散熱器 21)送風。 當晶片運作而散發高熱時，均 高熱，並且將熱能 3 1 )及内導熱管 (3 〇 )内的液態 器（2 0 )外表面，而散熱器（2 〇 )外矣品& ^外表面的熱量藉由 向内輻射方式迅速向軸心筒（2 2 )方—作、洛^ 向傳遞予鰭片（2 200424832 丄）。又内導熱管（5 〇 )的熱量係由軸心筒（2 2 )以 向外輻射方式迅速傳導予與轴心筒（2 2 )相結合的鰭片 (2 1 )。此時風扇（6 〇 )以對應散熱器（2 〇 )的軸 心方向在其一端進行送風，吹送的空氣自散熱器（2 〇 ) 一端開口進入，與其内部的鰭片（2 1 )進行熱交換後由 散熱器（2 0 )另端排出，排出的熱空氣不受阻礙而可迅 速逸散。 藉由上述技術手段’本發明混元式導熱管散熱裝置增 進下列功效： 1 ·内/外導熱管（5 〇 ) / ( 3 0 )内的液態物質 可接收來自於均熱底板（1〇)的高熱而產生相變並且透 過内、外導熱官（30) (5〇)另端將熱能迅速傳導至 政…、、器，讓整個散熱器成一均熱體，再分別以外/内輻射 方式傳導至散熱器内設的鰭片（2工），藉由熱量快速分 佈來提高導熱效率。 2 ·鱗片（2 1 )長度可沿著散熱器（2 〇 )軸心方 向延伸而不文限於散熱裝置的厚度限制，以有效增加其散 …、面積，如此可達到增加散熱裝置與空氣的熱交換流程及 熱傳量。 山3 ·風扇（6 〇 )所吹送的空氣自散熱器（2 〇 ) 一 1進入並由政熱為（2 0)另端排出並迅速逸散，來 取侍最大通風里，因進入開口之冷空氣與鰭片存有最大溫 度差’如此可達到維持散熱器（2 0 )内外的熱傳量，增 加散熱裝置與空氣的良好熱交換效率。 200424832 矣宇ι~ 一 述本發明就提升散熱器之工作效率而言，£ 著婵進j新的裝置’且相較於習用散熱器在功效上亦有 利:杜’故已具備顯著的實用性與進步性，並符合發明I 利要件’羞依法提起申請。 【圖式簡單說明】 (一）圖式部分 第圖係為本發明立體分解圖。 第二圖係為本發明頂視圖。There are two different methods: conductive heat energy and refrigerant phase change heat energy, which perform heat conduction of a single property at the same time. " P [Embodiment] The mixed-element heat pipe heat sink device of the present invention can be mounted on a circuit board and tightly combined with a chip on the circuit board. Please refer to the first figure. The mixed-element heat pipe heat sink of the present invention includes a soaking base plate (10), a heat sink (20), a C-shaped outer heat pipe (30), and a heat transfer hoop ( 40), a U-shaped inner heat pipe (50) and a fan (60). Among them, the soaking bottom can be made of metal such as aluminum or copper, and the thermal conductivity of copper is higher than that of aluminum to provide better heat transfer efficiency. The bottom surface of the soaking bottom plate (1 0) can be pasted. The top surface of the wafer is tightly taken away and the thermal energy of the wafer is taken away. The top surface of the wafer is formed with a horizontal groove (i 3) and a long groove (15) perpendicularly intersecting with the horizontal groove (i 3) and communicating with each other. The heat sink (20) is cylindrically arranged on the soaking base plate (work) and can be fixed by fixing parts such as screw inspection, and the heat sink (20) can be made of metal such as copper or copper, and the bottom is It is flat and fits on the top surface of the soaking wire (丄 〇). An opening is formed at each end of the radiator (20), and an accommodation space is formed in the interior, which communicates with the opening. Several pieces of fins distributed in the radial direction are formed in the axial direction. "2 u 'The Korean piece (21) may be made of cymbal or copper, and the hollow door is provided with a knot-which is bound to the end of some wrong pieces (21)" Tube (22), the core tube (W) may be made of copper or copper m, C-shaped outer heat pipe (30) surrounding the outer periphery of the radiator (20) and the soaking bottom plate (i) The top surface contact, the outer heat pipe (,) can be made of copper or other metal equivalent to steel with high thermal conductivity. The surface of the basin can be designed to have a micron or nano structure to quickly lead to the bottom of the outer shell (30). The second long straight end section (31 "'long straight end section (3 1) is set in the horizontal groove <) of the soaking floor (丄 Q), = out The heat transfer tube (30) may be hollow, and the containing space formed by it may be sealed with a liquid substance f, which may be a refrigerant or θ 2 and other volatile substances, which may be fragrant. It is known that μ, Shakuhachi ^ Bere heat generates ㈣ 'If the sealing substance is a refrigerant, the refrigerant may be a simple refrigerant component or an azeotropic refrigerant with multiple components. With reference to the second and third figures, the heat transfer hoop (40) is disposed on the outer wall of the heat sink (20), which surrounds the outer heat pipe (30 = outside and fixes the outer heat pipe ( 3 〇), and can be metal clothing such as steel or steel. This heat transfer hoop (40) contains an inner hoop (4 2) surrounding the radiator (2 0 ^ = wall), and the inner hoop (4 2) One end of the outer heat conduction & (30) is formed with a covered outer heat conduction pipe (30) ^ inner annular recessed edge (4 2 丄), and the outer heat conduction (4 丄) is relatively outer heat conduction & (3 0) An outer annular recessed edge (4 1 1) is formed on one end of the inner annular recessed edge (4 2 1). Please refer to the first, fourth and fifth figures. The heat conducting tube 〇) is made of copper or other metal equivalent to copper with a high thermal conductivity coefficient 200424832. Its surface can be designed as a material with fast conductivity of micron or nanometer structure. It is formed on the X inner heat conducting tube (50). There are two long handles (5 丄) (5 2) 'where—the long handle (5 workers) is located between the bottom of the heat sink (20) and the top surface of the soaking bottom (i), and is located in the soaking The long groove (1 5) of the plate (丄 〇) ′ 'Another-long handle (5 2) is arranged inside the shaft cylinder (2 2)' The inner heat conducting tube (50) can be a hollow tube with a capacity formed inside The space can be sealed with a liquid substance. 'The liquid substance can be a refrigerant or other volatile substances and can be heated to produce a phase. If the sealing substance is a refrigerant,' the refrigerant can be a simple refrigerant component or a multi-component refrigerant. Azeotropic refrigerant. A long straight end (52) collected from the top surface of the wafer (52) 'After the inner and outer heat transfer tube material is heated, the heat is quickly diffused to the entire inner heat conduction f (5o by capillary phenomenon or phase change'). ) And the outer heat pipe (30). Please detail the eighth and ninth pictures, # the heat of the Chinese and foreign heat pipes (30) 40), and the heat transfer device (40) to transfer the heat transfer device to the heat dissipation, please refer to the first and fourth In the figure, the fins (20) fixed on the device (20) are fixed to the inner heat pipe with bolts or fasteners (20) (refer to Figures 6 and 7, the hot bottom plate (1 0) is sucked and transferred to The long handle of the outer heat pipe ((50), the fan (60) is set at the opening of the other end of the heat sink (50), and the fan (β0) can send air to the radiator 21). When the chip When operating and radiating high heat, the heat is high, and the heat energy 3 1) and the outer surface of the liquid device (20) in the inner heat pipe (30), and the heat sink (20) outside the product & The heat is rapidly transmitted to the axial cylinder (2 2) by the inward radiation method. It is transferred to the fins (2 200424832 丄). The heat of the inner heat pipe (50) is transmitted by the axial cylinder (2). 2) The fins (2 1) combined with the shaft cylinder (2 2) are rapidly conducted in an outward radiation manner. At this time, the fan (60) is aligned with the axis direction of the radiator (20) at Air is supplied at one end, and the blown air enters from one end of the radiator (20). After heat exchange with the internal fins (21), it is discharged from the other end of the radiator (20). The hot air that is discharged is not obstructed. Can quickly dissipate. By the above technical means, the mixed element heat pipe heat dissipation device of the present invention improves the following effects: 1 · The liquid substance in the inner / outer heat pipe (50) / (30) can receive the heat from the soaking The high temperature of the bottom plate (10) causes a phase change and quickly transfers heat energy to the government through the inner and outer heat transfer officials (30) (50), so that the entire heat sink becomes a homogenizing body, and then separately / Internal radiation is conducted to the fins (two processes) built in the heat sink, which improves heat transfer efficiency by rapid heat distribution. 2 · The length of the scales (21) can extend along the axis of the heat sink (20). It is not limited to the thickness of the heat sink, so as to effectively increase its heat dissipation, area, etc., so as to increase the heat exchange process and heat transfer capacity of the heat sink and air. Shan 3 · The air blown by the fan (60) is from the heat sink (2 0) One 1 enters and is governed by politics It is discharged at the other end of (20) and quickly dissipated to serve the maximum ventilation. Because the cold air entering the opening has a maximum temperature difference with the fins, this can maintain the heat transfer volume inside and outside the radiator (20). To increase the good heat exchange efficiency between the heat sink and the air. 200424832 矣 宇 ι ~ In terms of improving the working efficiency of the radiator, the present invention is more efficient than conventional radiators in terms of efficiency. It is also beneficial: Du's already has significant practicability and progress, and meets the requirements of the invention I'm interested in filing an application in accordance with the law. [Brief description of the drawings] (I) Schematic part The figure is an exploded perspective view of the present invention. The second figure is a top view of the present invention.
弟一圖係為本發明側視圖。 第四圖係為本發明側面剖視圖。 第五圖係為本發明正面剖視圖。 第六圖係為本發明側面示意圖。 第七圖係為本發明頂面示意圖。 第八圖係為本發明側面剖視示意圖 弟九圖係為本發a月正面剖視示音圖 (二）元件代表符號 (1 3 )橫槽 (2 〇 )散熱器 (2 2 )轴心筒 (3 1 )長直末段 (4 1 )外箍環 (4 2 )内箍環The first figure is a side view of the present invention. The fourth figure is a side sectional view of the present invention. The fifth figure is a front sectional view of the present invention. The sixth figure is a schematic side view of the present invention. The seventh figure is a schematic top view of the present invention. The eighth figure is a schematic side sectional view of the present invention. The ninth figure is a frontal cross-sectional sound diagram of the present invention (two). The element represents the symbol (1 3), the horizontal groove (20), and the heat sink (2 2). Barrel (3 1) long straight end section (4 1) outer hoop (4 2) inner hoop
(1 0 )均熱底板 (15)長槽 (21)鰭片 (30)外導熱管 (4 0 )熱傳箍具 (4 1 1 )外環形凹緣 (4 2 1 )内環形凹緣（5 〇 )内熱導管 (51)長柄 (5 2 )長柄 12 200424832 (6 0 )風扇(1 0) Soaking bottom plate (15), long groove (21), fin (30), outer heat pipe (4 0), heat transfer hoop (4 1 1), outer annular recessed edge (4 2 1), inner annular recessed edge ( 5 〇) inner heat pipe (51) long handle (5 2) long handle 12 200424832 (60) fan
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