TW200419307A - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

Info

Publication number
TW200419307A
TW200419307A TW092133008A TW92133008A TW200419307A TW 200419307 A TW200419307 A TW 200419307A TW 092133008 A TW092133008 A TW 092133008A TW 92133008 A TW92133008 A TW 92133008A TW 200419307 A TW200419307 A TW 200419307A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
mass
meth
acrylic acid
Prior art date
Application number
TW092133008A
Other languages
Chinese (zh)
Other versions
TWI285298B (en
Inventor
Koji Ichikawa
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200419307A publication Critical patent/TW200419307A/en
Application granted granted Critical
Publication of TWI285298B publication Critical patent/TWI285298B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)

Abstract

This invention provides a photosensitive resin composition which can be used for making a pixel having an excellent planar characteristic with less residue remaining in the portion of a layer that is removed in a developing process. The photosensitive resin composition contains a binder resin having a construction unit derived from a (metha) acrylic acid and a (metha) acrylic acid, wherein the content of the (metha) acrylic acid in the solid component of the photosensitive resin composition is from 0.010 to 0.16% mass.

Description

200419307 ί久、發明說明 【發明所屬之技術領域】 本發明為關於一種光敏性樹脂組成物。 【先前技術】 彩色液晶顯示裝置或攝像元件等中之彩色濾光片之製 成，一般是在玻璃基板或矽晶基板上形成紅、綠、及藍三 原色畫素（pixel)。同時，為了將此等畫素間遮光，一般則 設置黑色矩陣（black matrix)。為形成該各色畫素，須在形 成有黑色矩陣圖案之基板上，以旋鍍法（spin c〇ating)將含 各色所相當之顏料之光敏性樹脂組成物均勻地塗布，之後 再經加熱乾燥，該塗膜再曝光顯像，或再於必要時採取加 熱硬化方法，彩色濾光片所必要之各色經如此反複操作， 即可得到各色之圖像。 用於此用途之光敏性樹脂組成物已知之例可舉如顏 料、甲基丙烯酸苯甲酯/曱基丙烯酸/笨乙烯共聚物、感放 射線化合物、及含有機羧酸之組成物（參考專利文獻丨卜但 在使用該組成物時，在形成各色晝素或黑色矩陣時，會有 不顯像部份中餘留殘留物，造成畫素之平坦性不足之^ 題。 專利文獻1特開平第5-34363 1號公報 【發明内容】 本發明之目的在提供一種光敏性樹脂組成物，其不顯 像部份中之殘留物餘留少，可製成平坦性優良之晝素。‘‘ 本發明人等為發現可解決上述問題之光敏性樹脂組成 315272 5 200419307 物，經過研究及重複檢討之結果，#現含（甲基）丙稀酸所 -製成之構成單位之黏著樹脂（binder resin)與特定量之（甲 :基）丙#酸單體之光敏性樹脂組成物，可減少不顯像部份中 殘留物之殘留，因此可製成平坦性優良之畫素，而完成本 發明。 亦即本發明提供一種光敏性樹脂組成物，其特徵為光 敏性樹脂組成物中含構成單位製自（甲基)丙烯酸之黏著樹 脂與（甲基）丙烯酸，該光敏性樹脂組成物固形物中（甲基） 丙烯酸之含量為〇·010至〇16質量％。 【實施方式】 以下詳細說明本發明。 本發明之光敏性樹脂組成物為含構成單位製自（甲基） 丙烯酸之黏著樹脂與（甲基）丙烯酸之組成物，該組成物為 固形物中（甲基）丙烯酸之含量為〇 〇1〇至〇16質量％之組 成物。 黏著樹脂之例可舉如含構成單位製自（甲基）丙烯酸之 (甲基）丙烯酸系聚合物。其中（甲基）丙烯酸指丙烯酸或甲基 丙稀酸者。 在（甲基）丙烯酸中，可例舉如：不飽和單羧酸或不飽 和二羧酸等不飽和多元羧酸等之分子中，亦可包含構成單 位為來自於分子中至少含丨個具羧基之不飽和羧酸等之含 羧基之單體者。 其中之不飽和單羧酸可例舉如丁烯酸、α '氣丙烯酸、 肉桂酸等。 315272 6 200419307 不飽和二羧酸之例可舉如 衣康酸、順式甲基丁稀1、士反丁細二酸、 岬一®夂、甲基富馬酸等。 元=亦可例舉如其酸酐，其具艘例可舉如 針、衣康酸肝、順式甲基丁歸二酸奸等。不飽 彳夕兀魏酸亦可例舉如豆單 0 /、早（2·甲基丙烯醯氧基烷基）酯，200419307 Long description of the invention [Technical field to which the invention belongs] The present invention relates to a photosensitive resin composition. [Prior art] In the manufacture of color filters in color liquid crystal display devices or image pickup devices, the red, green, and blue primary pixels are generally formed on a glass substrate or a silicon substrate. At the same time, in order to block these pixels, a black matrix is generally set. In order to form the pixels of each color, a photosensitive resin composition containing a pigment equivalent to each color must be uniformly coated on a substrate on which a black matrix pattern is formed, and then dried by heating. After the coating film is exposed and developed, or if necessary, a heating and hardening method is adopted, each color necessary for the color filter is repeatedly operated in this manner to obtain an image of each color. Known examples of the photosensitive resin composition used for this purpose include pigments, benzyl methacrylate / fluorenyl acrylic acid / benzyl ethylene copolymers, radiation-sensitive compounds, and compositions containing organic carboxylic acids (refer to Patent Documents)丨 However, when using this composition, when forming a color matrix or a black matrix of various colors, there will be residual residue in the non-developed part, which causes the problem of insufficient flatness of the pixel. Patent Document 1 Japanese Patent Application Laid-Open No. 5-34363 Publication No. 1 [Summary of the Invention] The object of the present invention is to provide a photosensitive resin composition which has less residue in the non-developed portion and can be made into a daylight with excellent flatness. The inventors found that the photosensitive resin composition that can solve the above problems was 315272 5 200419307. After research and repeated review results, #now contains (meth) acrylic acid-the binder resin made of the constituent unit (binder resin) ) And a specific amount of (methyl: yl) acrylic acid monomer, a photosensitive resin composition, which can reduce the residue of the residue in the undeveloped part, so it can be made into a pixel with excellent flatness, and completed the present invention ... that is The invention provides a photosensitive resin composition, characterized in that the photosensitive resin composition contains an adhesive resin made of (meth) acrylic acid and (meth) acrylic acid, and the solid resin (meth) The content of acrylic acid is from 0.010 to 0. 16% by mass. [Embodiment] The present invention will be described in detail below. The photosensitive resin composition of the present invention is an adhesive resin containing (meth) acrylic acid and (meth) ) A composition of acrylic acid, which is a composition in which the content of (meth) acrylic acid in the solid is 0.001 to 016% by mass. Examples of the adhesive resin include a constituent unit made of (meth) (Meth) acrylic polymers of acrylic acid, where (meth) acrylic acid refers to acrylic acid or methacrylic acid. In (meth) acrylic acid, examples include unsaturated monocarboxylic acids or unsaturated dicarboxylic acids. Unsaturated polycarboxylic acids, such as acids, can also include molecules containing carboxyl-containing monomers derived from molecules containing at least one unsaturated carboxylic acid with a carboxyl group in the molecule. Monocarboxylic acids can be exemplified by butenoic acid, α 'acrylic acid, cinnamic acid, etc. 315272 6 200419307 Examples of unsaturated dicarboxylic acids can be exemplified by itaconic acid, cis methylbutane 1, and stilbene Acid, Misaki® Rhenium, methyl fumaric acid, etc. Yuan = can also be exemplified by its anhydride, its examples can be needles, itaconic acid liver, cis-methyl succinic acid, etc. Nitric acid can also be exemplified by doudan 0 /, early (2. methacryloxyalkyl) esters,

例如琥轴酸單（2-丙稀醯氧基乙酿）、號 U 醯氧基乙酯）、苯-酸呈“早(2甲基丙烯 丰一S夂早（2_丙烯醯氧基乙 甲基丙烯醯氧基乙酿）等。不^> 本一敲早（2- 端含人 ㈣亦可例舉如其兩 获| I 早（甲基）丙烯酸酯，其例可舉如ω_ 羧基斌己内酯單丙烯酸酯、 ^ pi 夂^ 竣基聚己内酯單甲基丙烯酸 用曰寺。此寺含幾基之單體可單獨或以其2種以上混合使 物中構St為製自(甲基)丙烯酸之(甲基)丙烯酸系聚合 物中，亦可含製自其他可共聚之單體之構成單 之例可舉如笨乙烯、褒早體 甲贫< α_甲基本乙烯、〇-乙烯甲苯、m-乙烯 T本、P_氯苯乙烯、〇-曱氧基笨乙烯、m-甲 虱土本乙~卜甲氧基苯乙烯、。_乙烯笨甲基甲醚、 烯苯甲基曱醚、乙、擒# ⑽、“烯笨甲苯甲基環氧丙 _ 基％虱丙醚、〇-乙烯笨甲基環氧丙醚、茚 寺芳族乙稀化合物； 丙&曱sa ψ基丙㈣甲_、丙稀酸乙醋、甲基丙稀酸 乙酿、丙烯酸正丙s旨、f基丙稀酸正丙s|、丙稀酸異丙酿、 甲基丙浠酸異㈣、丙稀酸正ys旨、甲基丙稀酸正丁醋、 丙烯U S曰、甲基丙烯酸異丁酯、丙烯酸第二-丁酯、曱 315272 7 200419307 基丙烯酸第二-丁酯、丙烯酸第三-丁酯、甲基丙烯酸第三_ '丁酯、丙烯酸-2-羥基乙酯、甲基丙烯酸-2_羥基乙酯、丙烯 :酸-2-羥基丙酯、甲基丙烯酸_2_羥基丙酯、丙烯酸羥基 丙酯、甲基丙烯酸-3 -經基丙酯、丙浠酸_ 2 -經基丁酯、甲基 丙烯酸-2-羥基丁酯、丙烯酸-3-羥基丁酯、甲基丙烯酸-3-羥基丁酯、丙烯酸-4-羥基丁酯、甲基丙烯酸_4_經基丁酯、 丙烯酸烯丙酯、甲基丙烯酸烯丙酯、丙烯酸苯甲醋、甲基 籲丙烯酸苯曱酯、丙烯酸環己酯、曱基丙烯酸環己酯、丙烯 酸苯酯、甲基丙烯酸苯酯、丙烯酸-2-甲氧基乙酯、甲基丙 烯酸-2-甲氧基乙酯、丙烯酸-2-苯氧基乙酯、甲基丙烯酸-2-苯氧基乙酯、丙稀酸甲氧基二乙二醇酯、曱基丙烯酸甲 氧基一^乙'一 曰、丙細酸甲氧基三乙二醇g旨、甲基丙稀酸 甲氧基三乙二醇酯、丙烯酸曱氧基丙二醇酯、曱基丙烯酸 甲氧基丙二醇酯、丙烯酸甲氧基二丙二醇酯、曱基丙烯酸 甲氧基二丙二醇酯、丙烯酸異冰片酯、甲基丙烯酸異冰片 ®酯、丙烯酸二環戊二烯酯、甲基丙烯酸二環戊二烯酯、丙 烯酸-2-羥基-3-苯氧基丙酯、甲基丙烯酸-2-羥基-3-笨氧基 丙S旨、單丙稀酸丙三醇S旨、單曱基丙稀酸丙三醇酿等不飽 和叛酸酯類； 丙烯酸-2-胺基乙酯、甲基丙烯酸-2-胺基乙酯、丙烯酸-2-二曱基胺基乙酯、曱基丙烯酸-2-二甲基胺基乙酯、丙烯酸 -2-胺基丙酯、曱基丙烯酸-2-胺基丙酯、丙浠酸-2-二甲基 胺基丙酯、甲基丙烯酸-2-二甲基胺基丙酯、丙稀酸-3-胺基 丙酯、甲基丙烯酸-3-胺基丙酯、丙烯酸-3-二甲基胺基丙 8 315272 200419307 酉曰、甲基丙烯酉夂-3-二甲基胺基丙酯等不飽和羧酸胺基烷基 酯類； 丙稀fee環氧丙S日、甲基丙稀酸環氧丙g旨等不飽和叛酸環氧 丙酯類； 乙酸乙烯酯、丙酸乙烯酯、丁酸乙烯酯、I甲酸乙烯酯等 羧酸乙烯酯類； 乙烯曱醚、乙烯乙醚、烯丙基環氧丙醚等不飽和醚類； 丙烯腈、甲基丙稀腈、α -氯化丙烯腈、氰化伸乙烯等氰乙 烯化合物； 丙烯醯胺、甲基丙烯醯胺、α _氯化丙烯醯胺、Ν_2_羥基乙 基丙..烯醯胺、Ν-2-羥基乙基甲基丙烯醯胺等不飽和醯胺 類； 馬來酸酐縮亞胺、Ν-苯基馬來酸酐縮亞胺、環己基馬來 酸酐縮亞胺等不飽和亞胺類； 1，3-丁二烯、異戊二烯、氯戊二烯等不飽和脂族共軛二烯 類； 聚苯乙烯、聚丙烯酸曱酯 '聚曱基丙烯酸甲酯、聚丙烯酸 正丁酯、聚曱基丙烯酸正丁酯、聚矽氧烷之聚合物分子鏈 之末端上含單丙烯醯基或單甲基丙烯醯基之巨聚單體類 等。 此專早體可以各自早獨或以其2種以上組合使用。 前述（曱基）丙烯酸系聚合物中含有來自含羧基之單體之構 成單位時，其含量一般以10至5〇質量％為宜，15至4〇 質量％更佳，25至40質量％又更佳。其含量在1〇至5〇質 9 315272 200419307 量％時，其對顯像液之溶解性佳，顯像時可形成正確之圖 '像，因此較佳。 ·· 别述（甲基）丙烯酸系聚合物之例可舉如（甲基）丙稀酸/ 甲基（甲基）丙稀酸酯共聚物、（甲基）丙烯酸/苯曱基（甲基） 丙烯酸酯共聚物、（甲基）丙烯酸/2 —羥乙基（甲基）丙烯酸酯/ 苯甲基（曱基）丙烯酸醋共聚物、（甲基）丙烯酸/甲基（甲基） 丙細fee S曰/聚本乙細巨聚單體共聚物、（甲基）丙稀酸/甲基 馨（曱基）丙稀酸酯/聚甲基（曱基）丙烯酸酯巨單體共聚物、（甲 基）丙烯酸/苯甲基（甲基）丙烯酸酯/聚苯乙埽巨單體共聚 物、（甲基）丙稀酸/苯甲基（曱基）丙稀酸酯/聚甲基（甲基）丙 烯酸酯巨單體共聚物、（甲基）丙烯酸/2 -經乙基（甲基）丙烯 酸酯/苯曱基（甲基）丙烯酸酯/聚苯乙烯巨單體共聚物、（甲 基）丙烯酸/2-羥乙基（曱基）丙烯酸酯/苯曱基（甲基）丙烯酸 酯/聚甲基（甲基）丙烯酸酯巨單體共聚物、（甲基）丙烯酸7苯 乙稀/苯甲基（甲基）丙稀酸酯/N-笨基馬來酸酐縮亞胺共聚 鲁物、（甲基）丙烯酸/琥珀酸單（2-丙烯醯氧基乙基苯乙烯/ 苯甲基（曱基）丙稀酸酯/N-苯基馬來酸酐縮亞胺共聚物、（甲 基）丙烯酸/琥珀酸單（2-丙烯醯氧基乙基）/苯乙烯/烯丙基 (甲基）丙烯酸酯/N-苯基馬來酸酐縮亞胺共聚物（甲基）丙稀 酸/苯甲基（甲基）丙烯酸酯/N-苯基馬來酸酐縮亞胺/苯乙烯 /甘油醇單（甲基）丙烯酸酯共聚物等。其中之（甲基）丙烯酸 酯指丙烯酸酯或曱基丙烯酸酯。 其中以（甲基）丙烯酸/苯甲基（甲基）丙烯酸酯共聚物、 (甲基）丙烯酸/苯甲基（甲基）丙稀酸酯/苯乙烯共聚物、（甲 10 315272 200419307 基）丙烯酸/曱基（甲基）丙烯酸共聚物、（甲基）丙烯酸/甲 基（甲基）丙稀酸酯/苯乙稀共聚物等為佳。 前述（甲基）丙烯酸系聚合物可以以構成成份（甲基）丙 烯酸系聚合物溶解於丙二醇單丙醚乙酸酯等溶劑中，加入 偶氮雙異丁腈等聚合起始劑，在7〇至9〇〇c、空氣下保溫2 至5小時，再降溫至室溫（15至35Χ;)下終止反應之方法等 而製成。 * 刖述（曱基）丙烯酸系聚合物之製造 第2000-9 8606號公報、特開第2〇〇〇 194132號公報中。 v f述（甲基）丙烯酸系聚合物換算聚苯乙烯之重量平均 子里般以5,〇〇〇至5〇,〇〇〇者為佳，或8 〇〇〇至紙嶋 更佳，10,000至35 00(1 V宙从 ’ ，_又更佳。分子量為5,000至5M〇〇 日守，可增加其塗膜之硬度、 n 又联餘邊率柃尚、未曝光部份對 、j之溶解性佳’可提高其像解析度，因此較佳。 料（甲基）丙烯酸系聚合物之酸值，—般以 者為宜，60至M〇更佳 150 5〇至150時τ描 135又更佳。前述酸值為 易於溶解，且Μ声古在=:夜之浴解性，使未曝光部份 加膜餘留率，因此較佳。知之圖像會餘留增 此處所指之酸值Α丨 物所必須之氫氧化 用之氨氧化鉀水溶液量。 般可以求其較時所使 感光丨生树脂組成物之總HJ形物Φ ^ β -般以5至9"“一 占著樹脂之含量 貝置％者為宜1至質量。更佳。勒著 315272For example, succinic acid mono (2-propenyloxyethyl), No. U ethoxyethyl), and benzene-acid are "early (2 methacrylic acid-S 夂 early (2-propenyloxyethyl)" Methacrylic acid ethoxylate) etc. Not ^ > This one knocks early (the 2-terminal containing human ㈣ can also be exemplified as the two gains | I early (meth) acrylate, the example can be ω_ carboxyl Bincaprolactone monoacrylate, ^ pi 夂 ^ Junji polycaprolactone monomethacrylic acid is used as a temple. This temple can contain several groups of monomers alone or by mixing two or more kinds to make the structure St. Examples of (meth) acrylic polymers derived from (meth) acrylic acid may also include constituent monomers made from other copolymerizable monomers, such as stupid ethylene, premature hypothyroidism < α-methylbenzyl Ethylene, 0-vinyltoluene, m-vinyl T-benzyl, P-chlorostyrene, 0-methyloxybenzyl ethylene, m-methylbenzylbenzyl-methylmethoxystyrene, ._ethylenebenzylmethyl methyl ether , Allyl benzyl ether, ethyl, hydrazine, "benzyl toluene methyl glycidyl epoxide-methyl propyl ether, 0-ethylene benzyl methyl glycidyl ether, indense aromatic ethylene compounds; C & 曱 sa ψpropylpropanoate_, acrylic acid Vinegar, ethyl methacrylate, n-propyl acrylate, n-propyl acrylate | isopropyl acrylate, isopropyl methacrylate, isopropyl methacrylate, n-ysyl acrylate, methyl N-butyl acrylate, propylene US, isobutyl methacrylate, second butyl acrylate, 曱 315272 7 200419307 second butyl acrylate, third butyl acrylate, third methacrylate 'Butyl ester, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, propylene: 2-hydroxypropyl acid, 2-hydroxypropyl methacrylate, hydroxypropyl acrylate, methacrylic acid -3 -Ethyl propyl ester, propanoic acid _ 2 -Ethyl butyl ester, 2-hydroxybutyl methacrylate, 3-hydroxybutyl acrylate, 3-hydroxybutyl methacrylate, -4 -Hydroxybutyl ester, 4-methacrylic acid butyl ester, allyl acrylate, allyl methacrylate, benzoic acid acrylate, phenyl methacrylate, cyclohexyl acrylate, fluorenyl acrylate ring Hexyl ester, phenyl acrylate, phenyl methacrylate, 2-methoxyethyl acrylate, 2-methoxyethyl methacrylate, 2-phenoxyethyl acrylate 2-phenoxyethyl methacrylate, methoxy diethylene glycol acrylate, methoxy 1-ethyl methacrylate, methoxy triethylene glycol glycol, Methoxytriethylene glycol methacrylate, methoxypropyl propylene glycol acrylate, methoxypropyl propylene glycol acrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol acrylate, isopropyl acrylate Bornyl ester, isobornyl methacrylate, dicyclopentadiene acrylate, dicyclopentadiene methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy methacrylate Unsaturated acid esters such as -3-benzyloxypropane S, glycerol monopropionate, glycerol monomethylpropionate, etc .; 2-aminoethyl acrylate, methacrylic acid 2-Aminoethyl, 2-Diamidoaminoethyl Acrylate, 2-Dimethylaminoethyl Acrylate, 2-Aminopropyl Acrylate, 2-Amine Acrylate Propyl propyl ester, 2-dimethylamino propyl propionate, 2-dimethylaminopropyl methacrylate, 3-aminopropyl acrylate, 3-amine methacrylate Propyl ester, acrylic acid Methylaminopropyl 8 315272 200419307 Unsaturated carboxylic acid amino alkyl esters such as methacrylic acid 3-dimethylaminopropyl esters; propylene fee glycerol S, methyl propylene Dilute acid propylene oxide g and other unsaturated propylene acid propylene oxides; vinyl acetate, vinyl propionate, vinyl butyrate, vinyl formate, and other carboxylic acid vinyl esters; vinyl ether, vinyl ether, Unsaturated ethers such as allyl glycidyl ether; Acrylonitrile, methacrylonitrile, α-chlorinated acrylonitrile, and cyanide ethylene; cyanide compounds; acrylamide, methacrylamide, α _ Unsaturated fluorene amines such as allylamine chloride, N_2_hydroxyethylpropane, ketamine, N-2-hydroxyethylmethacrylamide; maleic anhydride imine, N-phenyl maleate Unsaturated imines such as acid imide and cyclohexyl maleic anhydride imine; unsaturated aliphatic conjugated diene such as 1,3-butadiene, isoprene, chloroprene, etc .; polybenzene Polyethylene methacrylate'Polymethyl methyl acrylate, Poly n-butyl acrylate, Poly n-butyl acrylate, Polysiloxane Bing Xixi monomethyl Bing Xixi yl group or giant comonomer like. This specialized early body can be used alone or in combination of two or more kinds thereof. When the (fluorenyl) acrylic polymer contains a constituent unit derived from a carboxyl group-containing monomer, its content is generally preferably 10 to 50% by mass, more preferably 15 to 40% by mass, and 25 to 40% by mass. Better. When its content is 10 to 50 mass 9 315272 200419307% by mass, its solubility in the developing solution is good, and a correct image can be formed during development, so it is preferable. Examples of (meth) acrylic polymers include (meth) acrylic acid / meth (meth) acrylic acid ester copolymers, (meth) acrylic acid / phenylhydrazine (methyl) ) Acrylate copolymer, (meth) acrylic acid / 2-hydroxyethyl (meth) acrylate / benzyl (fluorenyl) acrylic ester copolymer, (meth) acrylic acid / methyl (meth) acrylic fee S / polyethylene macromonomer copolymer, (meth) acrylic acid / methacrylic acid (fluorenyl) acrylic acid ester / polymethyl (fluorenyl) acrylate macromonomer copolymer, (Meth) acrylic acid / benzyl (meth) acrylate / poly (phenylene fluorene) macromonomer copolymer, (meth) acrylic acid / benzyl (fluorenyl) acrylic acid ester / polymethyl ( (Meth) acrylate macromonomer copolymer, (meth) acrylic acid / 2-ethyl (meth) acrylate / phenylfluorenyl (meth) acrylate / polystyrene macromonomer copolymer, (a Base) acrylic acid / 2-hydroxyethyl (fluorenyl) acrylate / phenylfluorenyl (meth) acrylate / polymeth (meth) acrylate macromonomer copolymer, (meth) acrylic acid 7 Phenyl ethylene / benzyl (meth) acrylic acid ester / N-benzylmaleic anhydride imine copolymer, (meth) acrylic acid / succinic acid mono (2-propenyloxyethylbenzene) Ethylene / benzyl (fluorenyl) acrylic acid ester / N-phenylmaleic anhydride imine copolymer, (meth) acrylic acid / succinic acid mono (2-propenyloxyethyl) / styrene / Allyl (meth) acrylate / N-phenylmaleic anhydride imine copolymer (meth) acrylic acid / benzyl (meth) acrylate / N-phenylmaleic anhydride imine / Styrene / glycerol mono (meth) acrylate copolymer, etc. Among them, (meth) acrylate refers to acrylate or fluorenyl acrylate. Among them, (meth) acrylic acid / benzyl (meth) acrylic acid Ester copolymer, (meth) acrylic acid / benzyl (meth) acrylic acid / styrene copolymer, (methyl 10 315272 200419307 based) acrylic acid / fluorenyl (meth) acrylic copolymer, (meth) Acrylic acid / meth (meth) acrylic acid ester / styrene copolymer is preferred. The (meth) acrylic polymer may include (meth) acrylic acid as a constituent component. The enoic acid polymer is dissolved in a solvent such as propylene glycol monopropyl ether acetate, a polymerization initiator such as azobisisobutyronitrile is added, and the temperature is maintained at 70 to 900 ° C for 2 to 5 hours in the air, and then the temperature is lowered. It is prepared by a method or the like for terminating the reaction at room temperature (15 to 35 ×;). * Introducing the production of (fluorenyl) acrylic polymer No. 2000-9 8606, JP No. 2000194132 V. The weight average of polystyrene (meth) acrylic polymer-based polystyrene is preferably 5,000 to 50,000, or more preferably 8,000 to paper. 10,000 to 35 00 (1 V Zhou Cong ', _ is even better. The molecular weight is 5,000 to 5 MW, which can increase the hardness of the coating film, n is combined with the marginal margin, the unexposed portion, and j 'Good solubility' can improve its image resolution, so it is better. The acid value of the (meth) acrylic polymer is generally preferred, 60 to M0 is more preferably 150 to 50 and 150, and τ is 135 to be more preferable. The aforementioned acid value is easy to dissolve, and the sonic strength is good at night: the bathability of the night, so that the unexposed portion is added with the film residual rate, so it is preferable. The known image will remain the amount of potassium ammonium hydroxide aqueous solution necessary for the acid value A 丨 here referred to the necessary hydroxide. Generally, you can find the total HJ shape of the photosensitive resin composition Φ ^ β-generally from 5 to 9 " " 1% of the resin content is better. Quality is better. Le 315272

II 200419307 旨，含量為5至90質量％時，其對顯像液之溶解性完 - …、旦素邛伤之基板上顯像時不易產生殘留物，且苴顯 :像時曝光部份之晝素部份膜不易減損，無晝素部份之脫除 性好，因此較佳。 本發明之感光性樹脂組成物中含有前述黏著樹脂及 (甲基）丙烯酸，其感光性樹脂組成物中（甲基）丙烯酸之含量 須在〇別質量％以上G.16質量％以下，在Q•㈣質量％以 上〇·ΐ5質量％以下更佳，或〇 〇2質量％以上〇12質量％以II 200419307 Purpose, when the content is 5 to 90% by mass, its solubility in the developing solution is finished-..., residues are not easy to be generated when developing on a substrate that has been scratched, and the display is: The daily vegetative part membrane is not easy to be damaged, and the non-day vegetative part has good removability, so it is better. The photosensitive resin composition of the present invention contains the aforementioned adhesive resin and (meth) acrylic acid, and the content of the (meth) acrylic acid in the photosensitive resin composition must be not less than 0% by mass and not more than G. 16% by mass, and Q • more than 5% by mass and more preferably less than 5% by mass, or more than 0.02% by mass and less than 12% by mass

下又更佳。（甲基）丙烯酸之含量在〇 〇1〇質量％以上〇· W 質量％以下時，可減少塗膜熱處理步驟時加熱爐内之污 木，且可減少不顯像部之殘留物，因此可製成平坦性佳之 晝素。另一方面，（甲基）丙烯酸之含量在不足0010質量％ 時，顯像時會有殘留物附著，超過016質量％時，畫素之 平坦性會變差。 該感光性樹脂組成物中（曱基）丙烯酸之含量可以以以 下（1)或（2)中所示之方法加以調整。 (1) 將以前述方法等所得到具有來自（曱基）丙烯酸之構成單 位之黏著樹脂溶於庚烷等溶劑中，以調整溶劑之量或洗淨 次數調節感光性樹脂組成物中（甲基）丙烯酸含量成〇〇1質 量％以上0.1 6質量％以下之方法。 (2) 在製成以前述方法等所得到具有來自（甲基）丙烯酸之構 成單位之黏著樹脂後，再以溶劑洗淨餘留黏著樹脂中未反 應之黏著樹脂構成成份（其中含（曱基）丙烯酸），或必要時再 沉澱等而精製黏著樹脂，一度大致去除其全部未反應之原 12 315272 200419307 什到知衣之接著樹脂後，再在使用其調製光敏性樹脂 組成物時重新加入（甲基）丙烯酸之方法。 方法⑴或（2)中，洗淨所使用溶劑之種類只要為可溶解 黏者樹脂中餘留之（甲基）丙稀酸者即可，並無特別限定， 其例可舉如甲醇、己烧、庚烧等碳原子數UH)之脂族經， 壞己烷、環庚烷等碳原子數1至1〇之脂環經等，其中以使 用己燒、庚垸較佳，使用庚烧更佳。溶劑之使用量，一般 以對黏著樹脂質量之2至2〇倍程度為宜，3至1〇倍更佳， =淨次數，-般以i至6次為宜，2至4次更佳。洗淨溫 度只要未達溶劑之彿點者料，並無特別限定，但在經濟 性、洗淨效果之觀點等上，一般以4〇t以下為宜， 更佳。 在此可舉例如將在丙二醇單甲醚乙酸S旨（PGMA)中反 朗得到之黏著樹脂PGMA溶液，以庚烧之溶劑洗淨時 庚烷之使用量一般以以對黏著樹脂質量2至20倍程度為 宜’ 3至10倍更佳，洗淨溫度一般以室溫⑽。c至 為佳。 在PGMA中反應所得到之黏著樹脂，以在庚院中再沉 殿者為佳’再沉殿後過渡並經庚烧清洗3 :欠，即大致可將 黏著樹脂中餘留未反應之原料完全去除。 中亦可含著色劑，在不含 隔層膜等，含著色劑時， 本發明之光敏性樹脂組成物 著色劑時，可使用以形成保護膜、 可使用以形成濾色膜等。 無 著色劑以顏料者為佳，顏料之例可舉如有機顏料 315272 200419307 機顏料。 無機顏料可例舉如金屬氧化物或金屬配位化合物之金 屬化合物，其具體例可舉如鐵、鈷、鋁、鎘、鉛、銅、鈦、 鎂、鉻、鋅、銻等金屬之氧化物或複合金屬氧化物。 有機顏料之具體例可舉如色料分類表（Color ex’The S〇clety 〇f Dyers and c〇i〇urists 出版）中分類為 顏料（Pigment)之化合物。其更具體之例可舉如以下色料分 類（C.I·)編號之化合物，但並不限定於此。 色料分類（The Society of Dyers and c〇1〇uHsts 出版） 中分類為顏料（Pigment)之化合物，具體之例可舉如C.L黃 色肩料1 C.I.百色顏料、CI·黃色顏料_12、黃色顏 料C.I·黃色顏料_14、C I•黃色顏料]5、c i•黃色顏料 、廿c.i.黃色顏料]7、C I•黃色顏料鲁c i•黃色顏料】、 黃色顏料-1 3 8 黃色顏料-148 黃色顏料-1 5 4 黃色顏料-194 *色顏料·3卜C.I.黃色顏料_53、c.I·黃色顏料_83、CI· 、色顏料_86、C.I.黃色顏料_93、C.I·黃色顏料-94、CJ•黃 ，顏料_109、C.I·黃色顏料]1〇、C I.黃色顏料_117、。丄 黃色顏料]25、CU•黃色顏料_128、CI•黃色顏料·η?、c丄 C.I·黃色顏料-139、C.I·黃色顏料_147、c丄 c.i·黃色顏料-iso、c.i.黃色顏料_153、C I· C.I·黃色顏料-166、C.I·黃色顏料_173、C I. c.i.黃色顏料_2丨4等黃色顏料；C I•橙色顏 料13 C.I·板色顏^31、CI•橙色顏料_36、c丄撥色顏料 •38、C.I.橙色顏l4〇、c·!•橙色顏料_42、〇丄撥色顏料^、 C.I·橙色顏料-51、αι•橙色顏料_55、。·橙色顏料魯c丄 315272 14 200419307It's even better. When the content of (meth) acrylic acid is greater than or equal to 0.001% by mass and less than or equal to ·· W% by mass, it is possible to reduce the number of stained wood in the heating furnace during the heat treatment step of the coating film, and to reduce residues in the non-developed area. It is made into a good day flatness. On the other hand, when the content of (meth) acrylic acid is less than 0,010% by mass, residues are attached during development, and when it exceeds 016% by mass, the flatness of the pixels is deteriorated. The content of (fluorenyl) acrylic acid in the photosensitive resin composition can be adjusted by the method shown in (1) or (2) below. (1) The adhesive resin having a constituent unit derived from (fluorenyl) acrylic acid obtained by the aforementioned method is dissolved in a solvent such as heptane, and the photosensitive resin composition (methyl group is adjusted by adjusting the amount of the solvent or the number of washing times). ) A method in which the acrylic acid content is 0.001% by mass or more and 0.16% by mass or less. (2) After the adhesive resin having a constituent unit derived from (meth) acrylic acid obtained by the aforementioned method or the like is prepared, the remaining unreacted adhesive resin constituents in the adhesive resin (including the ) Acrylic acid), or re-precipitate the adhesive resin if necessary, and remove all its unreacted raw materials at once. 12 315272 200419307 Even after the resin is adhered to the resin, add it again when using it to prepare the photosensitive resin composition ( (Meth) acrylic acid. In the method (2) or (2), the type of the solvent used for the washing is not particularly limited as long as it is the (meth) acrylic acid remaining in the viscous resin, and examples thereof include methanol and hexane. Alicyclic meridian with 1 to 10 carbon atoms, such as bad hexane, cycloheptane, etc., among which hexamethylene and heptane are preferred, heptane is used Better. The amount of solvent used is generally about 2 to 20 times the quality of the adhesive resin, more preferably 3 to 10 times, = net number of times,-generally i to 6 times is preferred, and 2 to 4 times is more preferred. The washing temperature is not particularly limited as long as it does not reach the Buddha's point of the solvent, but in terms of economy, washing effect, etc., it is generally preferable to be 40 t or less, more preferably. For example, the adhesive resin PGMA solution obtained in propylene glycol monomethyl ether acetic acid S purpose (PGMA) can be reversed. The amount of heptane used when washing with a heptane solvent is generally 2 to 20 for the adhesive resin mass. The degree is preferably 3 to 10 times, and the washing temperature is generally at room temperature. c to better. The adhesive resin obtained by the reaction in PGMA is better to re-sink the palace in Geng Yuan '. After the re-sinking of the palace, it is transitioned and cleaned by Geng burning. 3: Under, that is, the remaining unreacted raw materials in the adhesive resin can be completely removed. . It may contain a coloring agent. When the coloring agent is not included in the case of a barrier film or the like, the coloring agent of the photosensitive resin composition of the present invention may be used to form a protective film, and may be used to form a color filter film. Pigments without colorants are preferred. Examples of pigments include organic pigments 315272 200419307 organic pigments. Examples of the inorganic pigment include metal compounds such as metal oxides or metal complexes, and specific examples thereof include oxides of metals such as iron, cobalt, aluminum, cadmium, lead, copper, titanium, magnesium, chromium, zinc, and antimony. Or composite metal oxide. Specific examples of the organic pigment include compounds classified as pigments in a coloring material classification table (published by Color ex 'The Socletyfy Dyers and Courists). More specific examples thereof include compounds with the following colorant classification (C.I ·) numbers, but are not limited thereto. Pigment classification (published by The Society of Dyers and co. 100uHsts). Specific examples include CL Yellow Shoulder 1 CI Baise Pigment, CI · Yellow Pigment_12, Yellow Pigment. CI · yellow pigment_14, CI • yellow pigment] 5, ci • yellow pigment, 廿 ci yellow pigment] 7, CI • yellow pigment Luci • yellow pigment], yellow pigment-1 3 8 yellow pigment-148 yellow pigment- 1 5 4 Yellow pigment-194 * color pigment · 3 CI yellow pigment_53, cI · yellow pigment_83, CI ·, color pigment_86, CI yellow pigment_93, CI · yellow pigment-94, CJ · yellow , Pigment_109, CI · Yellow Pigment] 10, C I. Yellow Pigment_117 ,.丄 yellow pigment] 25, CU • yellow pigment_128, CI • yellow pigment · η ?, c 丄 CI · yellow pigment-139, CI · yellow pigment_147, c 丄 ci · yellow pigment-iso, ci yellow pigment_ 153, CI · CI · Yellow Pigment-166, CI · Yellow Pigment_173, C I. ci Yellow Pigment_2 丨 4 and other yellow pigments; CI • Orange Pigment 13 CI · Board Color ^ 31, CI • Orange Pigment_ 36, c 丄 color pigment • 38, CI orange color 140, c ·! • orange pigment_42, 〇color color pigment ^, CI · orange pigment-51, αι · orange pigment_55 ,. Orange pigment Lu C 丄 315272 14 200419307

橙色顏料-61、C.I.橙色顏料—64、（：丄橙色_ M 痛枓、65、c.I·橙 色顏料-71、C.I_橙色顏料_73等橙色顏料；c丨έ a 、、工色顏料-9、 C.I.紅色顏料-97、C.I·紅色顏料-105、C.I红态含 ·、、、巴顏料-122、 C.I·紅色顏料-123、C.I·紅色顏料-144、C.I έ工耷含 •、工巴顏料_149、 C.I·紅色顏料-166、C.I.紅色顏料-168、C.I.红多紅， 、、巴顏料-176、 C.I·紅色顏料-177、C.I.紅色顏料-1 80、C.I.红辛細^ 、巴顏料-192、 C.I·紅色顏料-209、C.I·紅色顏料-215、C.I·紅色顏料216、 C.I.紅色顏料-224、C.I·紅色顏料-242、C.I·紅色顏料254、 C.I·紅色顏料-2 64、C.I·紅色顏料-265等紅色顏料；c工誃 色顏料-15、C.I.藍色顏料-15:3、C I•藍色顏料_15:4、。工 藍色顏料-15:6、C.I.藍色顏料-6〇等藍色顏料；ci•紫色顏 料-1、C · I ·紫色顏料_19、ρτ也匕名拓此'丄ο 〇 。 、 、 ^ y 〇丄各色顏枓_23、C.I.紫色顏料- 29、C.I·紫色顏料_32、C I•紫色顏料_36、^丄 :紫色顏…綠色顏料―一:= 料’ C.I.才示色顏料一23、c I g洛声g祖9 ς#么今 •1 ί不色顏料-2 5荨;f示色顏料；c. I. 黑色顏料-1、C 了里$ & ,,Orange pigment-61, CI orange pigment—64, (: 丄 orange_M pain, 65, cI · orange pigment-71, C.I_orange pigment_73 and other orange pigments; c 丨 a ,, color pigments -9, CI Red Pigment-97, CI · Red Pigment-105, CI Red State Contains ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 000, a cis red pigment-122, CI red pigment-123, CI red pigment-144 Guba Pigment _149, CI · Red Pigment-166, CI Red Pigment-168, CI Red Multi-Red, ,, Ba Pigment-176, CI · Red Pigment-177, CI Red Pigment-1 80, CI Red Fine ^ , Ba Pigment-192, CI · Red Pigment-209, CI · Red Pigment-215, CI · Red Pigment 216, CI Red Pigment-224, CI · Red Pigment-242, CI · Red Pigment 254, CI · Red Pigment- 2 64, CI · Red Pigment-265 and other red pigments; c Industrial pigments-15, CI Blue pigments -15: 3, CI • Blue pigments _15: 4, Industrial blue pigments -15: 6, CI blue pigment-6〇 and other blue pigments; ci • purple pigment-1, C · I · purple pigment _19, ρτ are also given the name '丄 ο 〇.,, ^ Y 〇 丄 色 色 丄 _23 , CI purple pigment- 29. CI · purple pigment _32, CI • purple pigment _36, ^ 丄: purple color ... green pigment ― a: = material 'CI only color pigment -23, c I g Luo sound g zu 9 ς # 么 今• 1 ίcolorless pigment-2 5 net; f color display pigment; c. I. black pigment-1, C 里 里 $ & ,,,

廿 ......色顏料等黑色顏料等；其中以含C.L 汽色顏料-138、C 了主念令 •汽色顏料-1 3 9、C · I ·黃色顏料-1 5 〇、C · I · 、、工色顏料-177、C.I么丁 &女 此 · ·、'、色顏料- 209、C.I·紅色顏料- 254、C.I. 糸色顏料- 23、Cl &含 • .i巴顯料-15··6、C.I.綠色顏料-36中選擇 之至少1種顏料者為佳。 在匕# | γ ,Μ 夂 , ^ ,, σ自單獨或以其2種以上混合使用。 光敏性樹脂組成物她 ^ Θ 成物〜固形物中著色劑之含量一般以0至60 質量％為宜，或 - 主55質量％更佳。著色劑之含量在0 至6 0質量。/〇時，絮 凤/#膜之畫素色彩濃度充份，且不會降 15 315272 200419307 低顯像時非晝素部份之脫除性，不易產生殘留物，因此較 —佳。 : 本發明之光敏性樹脂組成物中亦可含光聚合性化合 物。光聚合性化合物為可經光及後述之光聚合起始劑聚合 之化合物，其例如單官能單體、2官能單體、或其他多官 能單體。 單官能單體之具體例可舉如壬基苯基卡必醇丙烯酸 > S曰、2-搜基-3-苯氧基丙基丙烯酸酯、2_乙基己基卡必醇丙 烯3文S曰、2-—基乙基丙烯酸酯、N-乙稀σ比嘻烧_等。 2官能單體之具體例可舉如〗，6_己烷二醇二（甲基）丙 稀I S曰、乙一醇一（甲基）丙烯酸酯、新戊二醇二（甲基）丙烯 曰一乙一醇一（甲基）丙烯酸酯、聯齡A之雙（丙稀醯氧 基乙基）醚、3-曱基戊二醇二（甲基）丙烯酸酯等。 其他多官能單體之具體例可舉如三羥甲基丙烷三（甲 丨基）丙烯酸酷、季戊四醇三（曱基）丙烯酸酿、季戊四醇四（甲 基）丙烯酸酯、二季戊四醇五（甲基）丙稀酸醋、二季戊四醇 六（曱基）丙稀酸醋等。其中以使用2官能以上之多官能 體為佳。 前述之光聚合性化合物，以對黏著樹脂與光聚合性化 合物總量100份’以質量i至60份質量者為宜以5至 5〇份質量為更佳。光聚合性化合物含量為i至6〇份質量 柃’其晝素部份之強度或平滑性有變好傾肖，目此較佳。 本發明之光敏性樹脂組成物中亦可含光聚合起始劑。 光聚合起始劑以其中至少含i種選自三。丫嘻化合物、乙醒 315272 16 200419307 苯化合物、及雙咪唑化合物之群中之化合物及多官能硫醇 化合物者為宜，含二咪唑化合物及多官能硫醇化合物者更 佳。含前述光聚合起始劑之光敏性樹脂組成物，可增加其 靈敏度，使用此等所形成之膜，其畫素部份之強度或表面 平滑性會更佳。更且，併用光聚合起始輔劑所得到之光敏 性樹脂組成物，因可更增加其靈敏度，使用其形成濾色膜 時亦可提高其生產性，因此較佳。 其中之三吖嗪化合物可例舉如2,4-雙（三氯甲基）-6_ (4-甲氧基笨基）-1，3,5-三吖嗪、2,4-雙（三氯甲基）-6_(4-甲氧 基萘基）-1，3,5-三吖嗪、2,4-雙（三氣甲基）-6_胡椒基-1，3,5-三吖嗪、2,4-雙（三氣甲基）-6-(4-甲氧基苯乙烯基）-i，3,5-三 吖嗪、2,4-雙（三氣甲基）-6-〔 2-(5-甲基呋喃-2-基）乙烯基〕 -1，3,5-三吖嗪、2,4-雙（三氯甲基）-6-〔 2-(呋喃-2-基）乙烯基〕 -1，3,5-三吖嗪、2,4-雙（三氯甲基）-6-〔2-(4-二乙基胺基-2-甲基苯基）乙烯基〕-1，3,5-三吖嗪、2,4-雙（三氯甲基）-6-〔2-(3,4-二甲氧基苯基）乙稀基〕_1，3,5-三17丫。秦等。 乙醯苯化合物可例舉如二乙氧基乙醯苯、2 -經基-2 -甲 基-1 -苯基丙烷-1 -酮、苯甲基二甲縮酮、2-羥基-1 -〔 4-(2-羥基乙氧基）苯基〕-2-甲基丙烷-1-酮、1-羥基環己基苯基 酉同、2 -曱基-1-(4 -甲基硫代苯基）_2_嗎琳丙烧-1-1同、2 -苯甲 基-2-二甲基胺基-1-(4-嗎琳代苯基）丁烷-1-酮、2-輕基- 2-曱基- l-〔 4-(1-甲基乙烯基）苯基〕丙烷酮之低聚物等。 雙咪唑化合物可例舉如2,2，_雙（2-氯苯基）-4,4，，5,5，-四 苯基雙咪唑、2,2’-雙（2,3-二氯苯基）-4,4’，5,5’-四苯基雙咪 17 315272 200419307 唾（參考例如特開平第6-75372號公報及特開平第6_75373 '號公報等。）、2,2’_雙（2-氯苯基）-4,4丨，5,5，-四苯基雙，米。坐、 :2,2’·雙（2-氯笨基）-4,4，，5,5，_四（烷氧基苯基）雙咪唑、2,2，_ 雙（2-氯苯基）-4,4’，5,5’-四（二烷氧基苯基）雙咪唑、2,2，_雙 (2-氯苯基）-4,4，，5,5，-四（三烷氧基苯基）雙咪唑（參考例如特 公昭第48-3 8403號公報及特公昭第48_384〇3號公報 等。）、4,4’，5,5，-位之笨基為碳化烷氧基取代之咪唑化合物 1 (參考例如特開平第7-i 0913號公報等。）等，其中以使用 2,2’-雙（2-氯苯基）_4,4’，5,5，-四苯基雙咪唑、2,2，_雙（2,3-二 氯苯基）-4,4’，5,5’-四苯基雙咪唑較佳。 多官能硫醇化合物為分子中含2個以上硫醇基之化合 物，特別以脂族羥基上含複數硫醇基之脂族烴多官能硫醇 化合物為佳。 脂知烴多官能硫醇化合物可例舉如己烷二硫醇、壬烷 一硫醇、1，4_二甲硫基苯、丁烷二醇雙硫代丙酸酯、丁烷 二醇雙硫代乙醇酸酯、乙二醇雙硫代乙醇酸酯、三羥曱基 丙烷參硫代乙醇酸酯、丁烷二醇雙硫代丙酸酯、三羥甲基 丙烷參硫代丙酸S旨、三經甲基丙烧參硫代乙醇酸醋、季= 四醇肆硫代丙酸酯、季戊四醇肆硫代乙醇酸酯、參羥基乙 基參硫代丙酸醋、多元經基化合物之硫代乙醇酸醋、：代 丙酸酿等，其中以使用三經甲基丙烧參硫代丙酸醋、三經 甲基丙燒參硫代乙醇酸醋、季戊四醇肆硫代丙酸醋等為工 佳，使用季戊四醇肆硫化丙酸酯更佳。 前述之光聚合起始劑中亦可以并用在該範疇中一般所 315272 18 200419307 使用之光聚合起始劑，其例可舉如苯偶因 ^ 噻嘲酮系、蒽系之起始劑等 ''m同系、 合物，此等可單獨或以其2種 豆例可舉如以下之化 z種以上組合使用。 ⑴苯偶因系可例舉如苯偶因、苯偶因甲° 苯偶因異丙醚、苯偶因異丁醚等， '、本偶因乙醚、 ⑴）二苯甲酮系可例舉如-贫 苯某-…J 笨酸笨甲酸甲醋、心 本基一本甲，、硫化_4_苯甲基_4,·甲基 四（第二丁基過氧化羰基）二 土 5 等， T j ，4,6·二甲基二苯甲酮 剛仙系可例舉如2_異丙基嗔仙、4-異丙基㈣ 酮、2,4-一乙基噻噸，、2,4_二氯噻噸 噸酮等， 虱-4-丙虱基噻 ㈣葱系可例舉如9，10_二甲氧基葱、 蒽、9，10-二乙氧基蒽、 ，1〇 一甲乳基 乙基-9，10-一乙氧基蒽等， :’、可例舉如氧化_2,4,6_三甲基苯甲醯 雙(。'氯苯基 化。丫啶酮、2_乙基蒽醌 土 1 + T吞 Vυ '非®昆、樟腦艇、分 基乙酸酸甲酿、二茂鈦化合物等。 早“比本 光κ 口起釔劑可單獨或以其複數種組合使用。 光水合起始劑中亦可再組合使用光聚 光聚合起始輔劑可你丨與Λ 1雜輔月丨丨〇 H了例舉如胺系化合物、烷氧基葱系化合 物、噻噸酮系化合物等。 匕口 月女糸化合物可你|與 丙醇胺、4-二曱美胺：三乙醇胺、f基二乙醇胺、三異 土月女本曱酸甲酯、4_二曱基胺笨甲酸乙酯、 315272 19 200419307 4-二甲基胺苯甲酸異戊醋、苯甲酸_2_二甲基胺基乙醋、4_ '-甲基胺笨甲酸_2_乙基己醋、N，N_二甲基對甲苯胺、4，[ ，又（甲基胺基）一苯甲酮（通稱為米蚩酮（Michier,s Μ·))、M’·雙（二乙基胺基）二苯甲酮、4,4，-雙（乙基甲基 胺基）二笨甲酉同箄，直φ 、/、中 ，4 _雙（二乙基胺基）二笨甲酮較 佳0 絲基蒽系化合物可例舉如9,10-二甲氧基蒽、2_乙基 ，10 —甲氧基恩、、9,10-二乙氧基蒽、2_乙基_9,1〇_二乙氧 ； 基蒽等。 酮系化合物可例舉如2_異丙基㈣嗣、4_異丙基 "基噸_、2,4-二乙基嗔嘲嗣、2,4_二氯嗟嘲嗣、卜氯_4_丙氧 基噻噸酮等。 光聚合起始輔劑亦可使用市售者’市售之光聚合起始廿 ... color pigments and other black pigments; among them, CL vapor-color pigments-138, C are included in the main idea • vapor pigment-1 3 9, C · I · yellow pigment-1 5 〇, C · · ·, Color pigment -177, CI Modin & women · ·, ', color pigment-209, CI · red pigment-254, CI black pigment-23, Cl & containing It is better to use at least one pigment selected from Expansion Material -15 ·· 6 and CI Green Pigment-36. The dagger # | γ, Μ 夂, ^ ,, σ can be used alone or as a mixture of two or more of them. The content of the photosensitive resin composition ^ Θ is generally from 0 to 60% by mass, or-the main content is more preferably 55% by mass. The content of the colorant is from 0 to 60 mass. / 〇 时, Su Feng / # film of the pixel color concentration is sufficient, and will not fall 15 315272 200419307 low-light development of non-days part of the removal, not easy to produce residues, so it is better. : The photosensitive resin composition of the present invention may contain a photopolymerizable compound. The photopolymerizable compound is a compound that can be polymerized by light and a photopolymerization initiator described later, and is, for example, a monofunctional monomer, a bifunctional monomer, or another multifunctional monomer. Specific examples of the monofunctional monomer include nonylphenyl carbitol acrylic acid, S, 2-synyl-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol propylene, etc. Namely, 2--ethyl ethyl acrylate, N-ethyl sigma ratio, etc. Specific examples of the bifunctional monomer include, for example, 6-hexanediol di (meth) propylene IS, ethylene glycol mono (meth) acrylate, and neopentyl glycol di (meth) propylene. Glycol mono (meth) acrylate, bis (acryloxyethyl) ether of Linkage A, 3-fluorenylpentanediol di (meth) acrylate, etc. Specific examples of other polyfunctional monomers include trimethylolpropane tri (methyl) acrylic acid, pentaerythritol tri (fluorenyl) acrylic acid, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (methyl) Acrylic acid vinegar, dipentaerythritol hexa (fluorenyl) acrylic acid etc. Among them, it is preferable to use a bifunctional or more polyfunctional body. The aforementioned photopolymerizable compound is more preferably 5 to 50 parts by mass with respect to 100 parts by weight of the total amount of the adhesive resin and the photopolymerizable compound 'and 1 to 60 parts by mass. The content of the photopolymerizable compound is from i to 60 parts by mass. It is preferable that the strength or smoothness of the daylight portion is improved. The photosensitive resin composition of the present invention may contain a photopolymerization initiator. The photopolymerization initiator is selected from the group consisting of at least i kinds thereof. Yaki compounds, etoxane 315272 16 200419307 benzene compounds, and bisimidazole compounds and polyfunctional thiol compounds are preferred, and diimidazole and polyfunctional thiol compounds are more preferred. The photosensitive resin composition containing the aforementioned photopolymerization initiator can increase its sensitivity. By using the formed film, the strength of the pixel portion or the surface smoothness will be better. Furthermore, a photosensitive resin composition obtained by using a photopolymerization initiation adjuvant is preferred because its sensitivity can be further increased and its productivity can be improved when a color filter film is formed by using it. Examples of the triazine compound include 2,4-bis (trichloromethyl) -6_ (4-methoxybenzyl) -1,3,5-triazine, 2,4-bis (tri Chloromethyl) -6_ (4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trifluoromethyl) -6_piperidyl-1,3,5-tri Azazine, 2,4-bis (trifluoromethyl) -6- (4-methoxystyryl) -i, 3,5-triazine, 2,4-bis (trifluoromethyl)- 6- [2- (5-methylfuran-2-yl) vinyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan- 2-yl) vinyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino-2-methylphenyl) ) Vinyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (3,4-dimethoxyphenyl) ethenyl] _1, 3,5-three 17 ah. Qin et al. The acetophenone compound may be exemplified by diethoxyacetophenone, 2-acryl-2-methyl-1 -phenylpropane-1-one, benzyldimethylketal, 2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl] -2-methylpropane-1-one, 1-hydroxycyclohexylphenyl isopropyl, 2-fluorenyl-1- (4-methylthiobenzene ) _2_Morylpropanone-1-1 iso, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butane-1-one, 2-light -2-fluorenyl-l- [4- (1-methylvinyl) phenyl] propanone oligomers, etc. The bisimidazole compound may be exemplified by 2,2, _bis (2-chlorophenyl) -4,4,5,5,5-tetraphenylbisimidazole, 2,2'-bis (2,3-dichloro Phenyl) -4,4 ', 5,5'-tetraphenylbisimide 17 315272 200419307 (refer to, for example, Japanese Unexamined Patent Publication No. 6-75372 and Japanese Unexamined Patent Publication No. 6_75373', etc.), 2,2 ' _Bis (2-chlorophenyl) -4,4 丨, 5,5, -tetraphenylbis, rice. Sit,: 2,2 '· bis (2-chlorobenzyl) -4,4,5,5, _tetra (alkoxyphenyl) bisimidazole, 2,2, _bis (2-chlorophenyl) ) -4,4 ', 5,5'-tetrakis (dialkoxyphenyl) bisimidazole, 2,2, _bis (2-chlorophenyl) -4,4,5,5, -tetra ( Trialkoxyphenyl) bisimidazole (refer to, for example, Japanese Patent Publication No. 48-3 8403 and Japanese Patent Publication No. 48-384403, etc.), and 4,4 ', 5,5, -positions are carbonized Alkoxy-substituted imidazole compound 1 (refer to, for example, Japanese Patent Application Laid-Open No. 7-i 0913, etc.) and the like, in which 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5, -Tetraphenylbisimidazole, 2,2, -bis (2,3-dichlorophenyl) -4,4 ', 5,5'-tetraphenylbisimidazole is preferred. The polyfunctional thiol compound is a compound containing two or more thiol groups in the molecule, and an aliphatic hydrocarbon polyfunctional thiol compound containing a plurality of thiol groups on an aliphatic hydroxyl group is particularly preferred. Aliphatic hydrocarbon polyfunctional thiol compounds can be exemplified by hexanedithiol, nonane-thiol, 1,4-dimethylthiobenzene, butanediol dithiopropionate, butanediol bis Thioglycolate, ethylene glycol dithioglycolate, trishydroxypropylpropane ginsenothioate, butanediol dithiopropionate, trimethylolpropane thiopropionate S Purpose, trimethylmethanine thioglycolate, quaternary = tetraol thiopropionate, pentaerythritol thioglycolate, ginsyl ethyl thiopropionate, polybasic compounds Thioglycolic acid vinegar, acetic acid, etc. Among them, three times methyl propane ginseng thiopropionate vinegar, three times methyl propylene ginseng thioglycolic acid vinegar, pentaerythritol thiopropionate vinegar, etc. For better work, pentaerythritol is used to cure propionate. The aforementioned photopolymerization initiators can also be used in combination in this category. The photopolymerization initiators commonly used in this field 315272 18 200419307, for example, such as benzoin ^ thimetone series, anthracene series initiators, etc. ' 'm homologs, compounds, these can be used alone or in combination of two kinds of beans, such as the following z z or more combinations. ⑴ Benzoin can be exemplified such as benzoin, benzoin methyl ° Benzoin isopropyl ether, benzoin isobutyl ether, etc., ', Benzoin diethyl ether, ⑴) Benzophenone can be exemplified Such as-benzene-depleted -... J methyl benzyl benzate, benzyl benzyl acid, methyl benzyl, sulfide_4_benzyl_4, · methyltetrakis (second butylperoxycarbonyl) dioxide 5 etc. , T j, 4,6 · Dimethylbenzophenone androxanthine can be exemplified by 2-isopropylhydrazone, 4-isopropylfluorenone, 2,4-monoethylthioxanthine, 2 , 4-dichlorothioxanthone, etc., and the lice-4-propanylthiocarbamate onion series can be exemplified by 9,10_dimethoxyallium, anthracene, 9,10-diethoxyanthracene,, 1 〇-methyl lactylethyl-9,10-ethoxyanthracene and the like: ', can be exemplified such as oxidized _2,4,6_trimethylbenzidine bis (.' Chlorophenylation. Ya Pyridone, 2-Ethyl anthraquinone 1 + T-Tun Vυ 'non-Kun, camphor boat, acetic acid methyl ester, titanocene compound, etc. As early as "Yikou can be used alone or with yttrium It can be used in combination of several kinds. The photo-hydration initiator can be used in combination with the photo-polymerization photo-polymerization starting adjuvant. Compounds, alkoxy allium compounds, thioxanthone compounds, etc. The compound of dagger mouth can be you | with propanolamine, 4-dimethanamine: triethanolamine, f-based diethanolamine, triisoduridine Benzoic acid methyl ester, 4-Dimethylaminobenzyl ethyl carboxylate, 315272 19 200419307 4-dimethylaminobenzoic acid isoamyl vinegar, benzoic acid 2-dimethylaminoethyl acetic acid, 4 _'- methyl Amine stearic acid_2_ethylhexyl acetate, N, N_dimethyl-p-toluidine, 4, [, and (methylamino) -benzophenone (commonly known as Michier, sM ·) ), M '· bis (diethylamino) benzophenone, 4,4, -bis (ethylmethylamino) dibenzidine, φ, straight φ, /, medium, 4_bis ( Diethylamino) dibenzyl ketone is preferably 0. The seryl anthracene compound can be exemplified by 9,10-dimethoxyanthracene, 2-ethyl, 10-methoxyen, 9,10-di Ethoxyanthracene, 2-ethyl-9,1〇_diethoxy; anthracene, etc. Ketone compounds can be exemplified by 2-isopropylfluorene, 4_isopropyl " , 4-Diethylpyridine, 2,4-dichloropyridine, dichloro-4-propoxythioxanthone, etc. Photopolymerization starting adjuvants can also be used Marketer ’Commercial Photopolymerization Start

輔劑可例舉如商&么「F Δ R F 牛戈冏口口名eab-f」（保土谷化學工業（株）製造） 等。 • A聚合起始劑及光聚合起始輔劑之組合可例舉如二乙 ’氧基乙酿苯/4,4，-雙（二乙基胺基）二苯甲酮、2_甲基-2-嗎淋 代-1-(4-曱基硫苯基）丙烷_κ_/4,4，_雙（二乙基胺基）二苯 甲酮、2-羥基-2-甲基-1-苯基丙烷]同/4,4，_雙（二乙基胺基） 二笨曱酮、苯曱基二甲縮酮/4,4，_雙（二乙基胺基）二苯曱 酉同、2-經基-2-甲基-1·〔 4-(2-經基乙氧基）苯基〕丙烧+酮 /4,4’-雙（二乙基胺基）二苯甲酮、1_羥基環己基苯基酮/4,4·— 雙（二乙基胺基）二苯甲酮、2-羥基_2_曱基_ι_〔4·(1-曱基乙 稀基）本基〕丙：):完-1-酮之低聚物/4,4，·雙（二乙基胺基）二苯 315272 20 200419307 甲酮、2-苯甲基-2-二甲基胺基- 嗎啉代苯基）丁烷 酮/4,4、雙（二乙基胺基）二苯甲_等，其中以2_甲基_2_嗎啉 代1 (4 _甲基硫本基）丙少元同/4,4’-雙（二乙基胺基）二笨 曱酮較佳。 光聚合起始劑一般以對黏著樹脂及光聚合性化合物總 計100質量份為0.1至40質量份為佳，i至3〇質量份更 佳。光聚合起始輔劑一般以對黏著樹脂及光聚合性化合物 、、’心计100質量份為〇·丨至50質量份為佳，i至4〇質量份 更佳。光聚合起始劑含量為O.i至4〇質量份時，會傾向於 增加光敏性樹脂組成物之靈敏度、使用前述光敏性樹脂組 成物形成晝素部份之強度、或增加前述畫素之表面之平滑 性’因而較佳。 人、，此外，光聚合起始輔劑為〇· 1至50質量份時，會傾向 方、杧加光敏性樹脂組成物之靈敏度，提高前述光敏性樹脂 、、且成物所形成濾色膜之生產性，因此較佳。 &明之光敏性樹脂組成物中亦可含溶劑。 一 >二'合^之例可舉如乙二醇單甲醚、乙二醇單乙醚、乙 丙&|、A乙二醇單丁_之乙二醇單燒基醚類；二乙 一醇一甲醚、二乙二醇二乙醚、二乙二醇二丙醚、及二乙 二醇二丁_夕- 之一乙二醇二烷基醚類；甲基乙酸纖酯、及乙 基乙酸纖防+， -曰 二醉烧基醚乙酸酯類；丙二醇單甲醚乙酸Examples of the adjuvant include "Should be" F Δ R F Niu Gekou mouth name eab-f "(manufactured by Hodogaya Chemical Industry Co., Ltd.). • The combination of A polymerization initiator and photopolymerization initiator can be exemplified by diethyl'oxyethyl benzene / 4,4, -bis (diethylamino) benzophenone, 2-methyl -2-morphino-1- (4-fluorenylthiophenyl) propane_κ_ / 4,4, _bis (diethylamino) benzophenone, 2-hydroxy-2-methyl-1- Phenylpropane] Same as / 4,4, _bis (diethylamino) dibenzone, phenylfluorenyl dimethylketal / 4,4, _bis (diethylamino) diphenylfluorene 2, 2-Ethyl-2-methyl-1 · [4- (2-Ethylethoxy) phenyl] propane + ketone / 4,4'-bis (diethylamino) benzophenone , 1-hydroxycyclohexylphenyl ketone / 4,4 · —bis (diethylamino) benzophenone, 2-hydroxy_2_fluorenyl_ι_ [4 · (1-fluorenylethenyl) The base] C :): oligomers of end-1-one / 4,4, · bis (diethylamino) diphenyl 315272 20 200419307 methylone, 2-benzyl-2-dimethylamine -Morpholinophenyl) butanone / 4,4, bis (diethylamino) benzophenone, etc., in which 2-methyl-2-morpholino 1 (4-methylthiobenzyl The group) propylene is preferably the same as / 4,4'-bis (diethylamino) dibenzirone. The photopolymerization initiator is generally preferably 0.1 to 40 parts by mass with respect to 100 parts by mass of the total of the adhesive resin and the photopolymerizable compound, and more preferably i to 30 parts by mass. The photopolymerization starting adjuvant is generally preferably from 50 to 50 parts by mass with respect to 100 parts by mass of the adhesive resin and the photopolymerizable compound, and more preferably from i to 40 parts by mass. When the content of the photopolymerization initiator is Oi to 40 parts by mass, it tends to increase the sensitivity of the photosensitive resin composition, use the aforementioned photosensitive resin composition to form the intensity of the daylight moiety, or increase the surface of the aforementioned pixels. 'Smoothness' is therefore better. In addition, when the photopolymerization starting adjuvant is from 0.1 to 50 parts by mass, the sensitivity of the photosensitive resin composition is increased, and the photosensitive resin is improved, and the color filter film formed by the product is improved. The productivity is therefore better. & The light-sensitive photosensitive resin composition may contain a solvent. Examples of di > di's are ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene propylene & |, A ethylene glycol monobutyl ether, ethylene glycol monoalkyl ethers; diethylene glycol Alcohol monomethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, and diethylene glycol dibutyl ether-one of ethylene glycol dialkyl ethers; cellulose acetate methyl ester, and ethyl Acetic acid fiber +,-Dioxanyl ether acetates; Propylene glycol monomethyl ether acetate

Sq 、丙二 〇〇 · •早乙醚乙酸酯、丙二醇單丙醚乙酸酯、甲氧基 丁基乙酸醋、 孔卷 f箱·# 及甲虱基戊基乙酸酯之烷基二醇烷基醚乙酸 自曰#貝，本、田纪 _ , 甲本、二甲本、及均三甲苯等芳族烴類；丁酮、 315272 21 200419307 丙酮、甲基正戊基甲酮、曱基異丁酮、及環己酮等_類； 乙醇、丙醇、丁醇、己醇、環己醇、乙二醇、及丙三醇等 醇類；3-乙氧基丙酸乙酯、及3_甲氧基丙酸甲酯等酯類； r - 丁内酯等環酯類等。 其中以使用丙二醇單甲醚乙酸酯為佳。 此等溶劑可以各自單獨或以其2種以上組合使用。 光敏性樹脂組成物中溶劑之含量，以6〇至9〇質量％ 為佳，70至85質量％更佳。溶劑之含量為6〇至9〇貝質；二 時，傾向於塗布性佳，因此較佳。 、里0 本發明之光敏性樹脂組成物中，在必要時亦可再含填 劑、其他之高分子化合物、顏料分散劑、密著促進劑、抗 氧化劑、紫外線吸收劑、抗凝結劑等添加劑。 几 填劑之具體例可舉如玻璃、石夕膠、氧：紹等；其他之 南分:化合物之具體例可舉如聚乙埽醇、$丙烯酸、聚乙 二醇單烷基醚、聚氟烷基丙烯酸酯等。 顏料分散劑可使用-般市售之顏料分散劑，其例可舉 如石夕系、西旨系、陽離子系、陰離子系、非離子系、 兩性等界面活性劑等，此莖可蛋彳 d寻此4可早獨或以其2種以上組合使 用0 上述界面活性劑之例可舉如聚環氧乙烧烧基鍵類、聚 環氧乙烧烧基苯基醚類、聚k醇二自旨類、山梨糖醇針脂 肪酸S旨類、脂肪酸變…降_ _ 2 一 馱又〖生來S日類、3級胺變性聚胺旨類、聚 乙 '一亞月女類寺’及其他商σ么二j· U冏口口名κρ (包越化學工業（株）製 造）、聚福樂（共榮化學（株㈣止^、g夕 子、怀 J 衣 Xe)鼠多普（T〇KEM pr〇ducts 315272 22 200419307 公司製造）、美加福斯（大曰本油墨化學工業（株）製造）、福 樂多（住友3M(株）製造）、旭加德、撒佛隆（以上為旭玻璃（株）Sq, propylene · • Early ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate, pore volume box #, and alkyl glycol of pentylpentyl acetate Alkyl ether acetic acid from # 贝, 本, 田 纪 _, aromatics such as methyl, dimethyl, and mesitylene; methyl ethyl ketone, 315272 21 200419307 acetone, methyl n-pentyl ketone, fluorenyl Isobutanone and cyclohexanone; alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, and glycerol; ethyl 3-ethoxypropionate, and Esters such as methyl 3-methoxypropionate; cyclic esters such as r-butyrolactone. Among them, propylene glycol monomethyl ether acetate is preferably used. These solvents can be used individually or in combination of 2 or more types. The content of the solvent in the photosensitive resin composition is preferably 60 to 90% by mass, and more preferably 70 to 85% by mass. The content of the solvent is 60 to 90 shellfish; at the same time, it tends to have good coatability and is therefore preferred. In the photosensitive resin composition of the present invention, additives such as fillers, other polymer compounds, pigment dispersants, adhesion promoters, antioxidants, ultraviolet absorbers, anticoagulants, and the like may be further contained when necessary. . Specific examples of fillers include glass, stone gum, oxygen: Shao, etc. Other specific examples of compounds: compounds such as polyethylene glycol, acrylic acid, polyethylene glycol monoalkyl ether, poly Fluoroalkyl acrylate and the like. As the pigment dispersant, a commercially available pigment dispersant can be used, and examples thereof include surfactants such as stone xi series, western series, cationic systems, anionic systems, nonionic systems, and amphoteric surfactants. The stem can be crusted. Looking for this 4 can be used alone or in combination of two or more of them. 0 Examples of the above-mentioned surfactants include polyethylene oxide-based bonds, polyethylene oxide-based phenyl ethers, and polyalkylene glycols. Purpose category, sorbitol needle fatty acid S category, fatty acid change ... _ _ 2 驮 驮 Born S day category, Grade 3 amine denatured polyamine category, Polyethylene 'Ayayue Women's Temple' and Other sigma sigma j. U 冏 mouth name κρ (manufactured by Bao Yue Chemical Industry Co., Ltd.), Jufulo (Gong Rong Chemical Co., Ltd., Xi Xizi, Huai J Yi Xe) rat dop (T 〇KEM pr〇ducts 315272 22 200419307 company), Megaplus (manufactured by Daiyoshi Ink Chemical Industry Co., Ltd.), Fudo (manufactured by Sumitomo 3M Co., Ltd.), Asahi Kad, Safulon (above are Asahi Glass Co., Ltd.

製造）、沙巴思（Astra Zeneca(株）製造）、EFKA(EFKA CHEMICALS公司製造）、PB821(味之素（株）製造）等。 密著促進劑之具體例可舉如乙烯三曱氧基矽烷、乙烯 三乙氧基矽烷、乙烯三（2-甲氧基乙氧基）矽烷、n_(2_胺基 乙基）-3-胺基丙基甲基二甲氧基矽烷、N_(孓胺基乙基）_3_ 胺基丙基三甲氧基矽烷、3_胺基丙基三乙氧基矽烷、3_環 氧丙氧基丙基二甲氧基石夕烧、3 -環氧丙氧基丙基甲基二甲 氧基石夕:)：兀2-(3,4 -環氧基環己基）乙基三曱氧基石夕烧、3_氯 丙基曱基二甲氧基矽烷、3_氯丙基三甲氧基矽烷、弘甲基 丙烯醯氧基丙基三甲氧基矽烷、氫硫基丙基三甲氧基矽 烷等。 抗氧化劑之具體例可舉如2,2、硫代雙（4_甲基_6_第三-丁基S分）、2,6-二-第三-丁基_4-甲基酚等。 紫外線吸收劑之具體例可舉如、2-(3_第三-丁基_2_羥 基-5-曱基苯基）_5_氯化苯并三唑、烷氧基二苯曱酮等。 抗破結劑之具體例可舉如聚丙烯酸鈉等。 本發明之光敏性樹脂組成物可以例如如下調製。即先 將著色劑與溶劑混合’再以球磨機分散使著色劑成為平均 粒徑〇·2心以下程度。此時，依其須要亦可再使用顏料 刀政劑，含（甲基）丙烯酸之黏著樹脂可全部或部份配合。 再於得到之分散液(以下亦可稱之為磨散主劑。）中加入其 餘之含（曱基）丙烯酸之黏著樹脂、光聚合性化合物及光聚 315272 23 200419307 合起始劑，或再於必要時加入添加劑，再必要時再追加溶 劑添加至達所要之濃度，即可得到光敏性樹脂組成物。 如此調製成之光敏性樹脂組成物再塗布於基板上，去 除溶劑等揮發性成份即形成層，前述層再隔光罩曝光、顯 像’即形成圖案（pattern)。 其中之基板可例舉如玻璃基板、石夕基板、聚碳酸酯基 板、聚酯基板、芳族聚醯胺基板、聚醯胺亞胺基板、聚亞 胺基板、A1基板、GaAs基板等表面平坦之基板等。 此等基板亦可再經矽烷偶合劑等藥品之藥品處理、電 漿處理、離子塗層處理、濺鍍處理、氣相反應處理、真空 蒸鍍（沈積）處理等前處理。 此專基板上亦可再形成其他之著色圖像。 基板在使用矽基板之情形時，矽基板之表面亦可再形 成電荷耦合元件（CCD)、薄膜電晶體（TFT)等。 將光敏性樹脂組成物塗布於前述基板（包含已形成其 他著色圖案之基板）上，最好以一般之旋鍍機或省液鍍機或 無軸式鍍機塗布於前述基板等上，其次再將溶劑等揮發成 分經加熱乾燥（預加熱）。加熱操作一般為在約4〇它至12〇 °C下進行1至5分鐘左右。 經如此操作後，光敏性樹脂組成物固形物即可在基板 或已形成其他著色圖案之基板上形成平坦性良好之層。 該形成之層再隔光罩曝光、顯像。 曝光可使用i光（波長365nm)、h光、g光等，以使用 1光（波長365nm)為佳。i光（波長365nm)使用之光源以超 315272 24 200419307 高壓水銀燈（Ushio電機（株）製造；HB-75 1 05AA 〇Pl)等為 佳’曝光量一般為50至400mJ/cm2程度。 顯像一般使用後述含鹼性化合物及界面活性劑之顯像 液0 曝光、顯像後必要時亦可再在15〇〇c至23(rc下進行 1 0至60分鐘程度之加熱硬化（後加熱）。 具體地，即將光敏性樹脂組成物如下塗布在基材上， 再經曝光（光硬化）及顯像，即可形成黑色矩陣或著色畫 等。 旦’、 即先將光敏性樹脂組成物旋鍍在基板（一般為玻璃） 上’再經預加熱去除溶劑，即得平滑之塗膜。此時，塗膜 厚約為1至3 // m程度。 如此操作得到之塗膜， 素’須再隔遮蓋光罩照射紫 體能均勻地照到平行光，且 上，隶好使用光罩定位器等 之後，再使硬化完成之 部份’再經顯像，即可得到 後即可再依其必要，在！ 5 〇 t 之加熱硬化（後加熱）。 為得到其目的之黑色矩陣或畫 外線。此時，為使曝光部份整 使光罩與基板能在正確之位置 裝置。 塗膜接觸稀鹼溶液溶解未曝光 目的之黑色矩陣或晝素。顯像 至230C下10至60分鐘程度 曝光後顯像使用之_ #、六 .,.^ Λ 之頋像液一般使用含鹼性化合物與界 面活性劑之水溶液。給料儿人 、 生化6物热機或有機之鹼性化合物 均可。 無機鹼性化合物之具體 例可舉如氫氧化納、氫氧化 315272 25 200419307 鉀、磷酸氫二鈉、磷酸二氫鈉、磷酸氫二銨、磷酸二氫銨、 〜填酸二氫鉀、矽酸鈉、矽酸鉀、碳酸鈉、碳酸鉀、碳酸氫 •鈉、破酸氫鉀、獨酸鈉、棚酸鉀、氨水等。 有機驗性化合物之具體例可舉如氫氧化四曱基銨、氫 氧化-2-經基乙基三甲基銨、單甲基胺、二曱基胺、三曱基 胺、單乙基胺、二乙基胺'三乙基胺、單異丙基胺、二異 丙基胺、乙醇胺等。 > 此等無機及有機鹼性化合物可單獨或以其2種以上組 合使用。 顯像液中驗性化合物之濃度以0 01至1〇質量％為 佳’ 0.03至5質量％更佳。 鹼性顯像液中之界面活性劑可任意為非離子界面活性 劑、陰離子界面活性劑、陽離子界面活性劑均可。 非離子界面活性劑之具體例可舉如聚環氧乙烷烷基 喊、聚環氧乙烷芳基醚、聚環氧 ^ ^ ^凡烷基芳基醚、其他之 聚環氧乙烧衍生物、環氢乙焓/进# 衣乳乙虱丙烷聚絮聚合物、山梨 糖醇酐脂肪酸酯、聚璟氢？、ρ . 水％乳乙烷山梨糖醇酐脂肪酸酯、聚環 氧乙烷山梨糖醇脂肪酸酯、丙二 一酉子月日肪酸酯、聚環氧乙烷 月曰肪魷S曰、聚環氧乙烷烷基胺等。 陰離子界面活性劑之具體例 ,,^ ^, j J舉如月桂醇硫酸酯鈉或 油知石爪酉夂酉日鈉之高級醇硫酸鹽 ^ ^ 月桂基硫酸鈉或月桂某 、&L銨之烷基硫酸鹽類，十 石*妒細> Pi朴 烷基本磺酸鈉或十二烷基萘 尹、酉义鈉之烷基方基磺酸鹽類等。 陽離子界面活性劑之具體 J舉如硬脂醯胺鹽酸鹽或 315272 26 200419307 月桂基三甲基氯化銨之胺鹽或4級銨鹽等。 ，等界面活性劑可單獨或以其2種以上組合使用。 群員像液中界面活性劑之澧声 片〗辰度般以0.01至10質量0/〇Manufacturing), Sabasi (manufactured by Astra Zeneca Co., Ltd.), EFKA (manufactured by EFKA CHEMICALS), PB821 (manufactured by Ajinomoto Co., Ltd.), etc. Specific examples of the adhesion promoter include ethylenetrimethoxysilane, ethylenetriethoxysilane, ethylenetri (2-methoxyethoxy) silane, and n_ (2-aminoethyl) -3- Aminopropylmethyldimethoxysilane, N_ (fluorenaminoethyl) _3_aminopropyltrimethoxysilane, 3_aminopropyltriethoxysilane, 3_glycidoxypropyl Dimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane :): 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-chloropropylfluorenyldimethoxysilane, 3-chloropropyltrimethoxysilane, methacrylicmethyloxypropyltrimethoxysilane, hydrothiopropyltrimethoxysilane, and the like. Specific examples of the antioxidant include 2,2, thiobis (4-methyl-6-tert-butyl S), 2,6-di-tertiary-butyl_4-methylphenol, and the like . Specific examples of the ultraviolet absorber include 2- (3_third-butyl_2_hydroxy-5-fluorenylphenyl) _5-chlorobenzotriazole, alkoxybenzophenone, and the like. Specific examples of the anti-caking agent include sodium polyacrylate. The photosensitive resin composition of the present invention can be prepared, for example, as follows. That is, the colorant is first mixed with a solvent 'and dispersed in a ball mill so that the colorant has an average particle diameter of about 0.2 or less. At this time, pigment knives can be used as needed. Adhesive resins containing (meth) acrylic acid can be mixed in whole or in part. Then add the remaining (fluorenyl) acrylic-containing adhesive resin, photopolymerizable compound, and photopolymerization 315272 23 200419307 initiator to the obtained dispersion (hereinafter also referred to as the main dispersing agent), or Adding an additive when necessary, and then adding a solvent to a desired concentration when necessary, can obtain a photosensitive resin composition. The photosensitive resin composition prepared in this way is then coated on a substrate, and a layer is formed by removing volatile components such as a solvent, and the layer is patterned by exposure and development through a photomask. The substrate can be exemplified by a glass substrate, a stone substrate, a polycarbonate substrate, a polyester substrate, an aromatic polyimide substrate, a polyimide substrate, a polyimide substrate, an A1 substrate, or a GaAs substrate. Substrates, etc. These substrates may also be subjected to pretreatments such as pharmaceutical treatment of pharmaceuticals such as silane coupling agents, plasma treatment, ion coating treatment, sputtering treatment, gas phase reaction treatment, and vacuum evaporation (deposition) treatment. Other colored images can be formed on this special substrate. When a silicon substrate is used as the substrate, the surface of the silicon substrate may be further formed with a charge coupled device (CCD), a thin film transistor (TFT), and the like. The photosensitive resin composition is coated on the aforementioned substrate (including a substrate on which other colored patterns have been formed), and is preferably coated on the aforementioned substrate or the like by a general spin plating machine or a liquid-saving plating machine or a shaftless plating machine, followed by Volatile components such as solvents are dried by heating (preheating). The heating operation is generally performed at about 40 to 120 ° C for about 1 to 5 minutes. After doing so, the solid part of the photosensitive resin composition can form a layer with good flatness on a substrate or a substrate on which another colored pattern has been formed. The formed layer is exposed and developed through a photomask. For exposure, i-light (wavelength 365nm), h-light, g-light, etc., and 1-light (wavelength 365nm) is preferred. The light source for i-light (wavelength: 365 nm) is preferably a super-315272 24 200419307 high-pressure mercury lamp (manufactured by Ushio Electric Co., Ltd .; HB-75 1 05AA 0Pl), etc. 'The exposure is generally about 50 to 400 mJ / cm2. The imaging is generally performed by using a developing solution containing a basic compound and a surfactant described later. 0 After exposure, if necessary, it can be further heated and hardened at 150 ° C to 23 ° C for 10 to 60 minutes (after Heating). Specifically, the photosensitive resin composition is coated on a substrate as follows, and then exposed (light-hardened) and developed to form a black matrix or a coloring picture. Once the photosensitive resin composition is formed, Spin coating on the substrate (usually glass) and then remove the solvent by preheating to obtain a smooth coating film. At this time, the coating film thickness is about 1 to 3 // m. The coating film obtained in this way is 'Must be covered with a mask to illuminate the purple body to illuminate the parallel light evenly, and after using the mask positioner, etc., then the hardened part will be displayed again, and it can be re-used after it is obtained. If necessary, it is hardened by heating at 50 ℃ (post-heating). In order to obtain the black matrix or the outer line for its purpose. At this time, the photomask and the substrate can be installed at the correct position in order to adjust the exposure part. Membrane contact with dilute alkali solution to dissolve unexposed objects Color matrix or day element. When developing to 230 ° C for 10 to 60 minutes after exposure, the _ # 、 六.,. ^ Λ imaging solution generally uses an aqueous solution containing a basic compound and a surfactant. Feeder Human, biochemical, biochemical or organic basic compounds can be used. Specific examples of the inorganic basic compounds include sodium hydroxide, 315272 25 200419307 potassium, disodium hydrogen phosphate, sodium dihydrogen phosphate, and dihydrogen phosphate. Ammonium, ammonium dihydrogen phosphate, ~ potassium dihydrogen dibasic acid, sodium silicate, potassium silicate, sodium carbonate, potassium carbonate, sodium bicarbonate, sodium bipotate, sodium monosodium, potassium shed, ammonia, etc. Organic Specific examples of the test compound include tetramethylammonium hydroxide, 2-mercaptoethyltrimethylammonium hydroxide, monomethylamine, difluorenylamine, trimethylamine, monoethylamine, Diethylamine'triethylamine, monoisopropylamine, diisopropylamine, ethanolamine, etc. > These inorganic and organic basic compounds can be used alone or in combination of two or more kinds thereof. In the developing solution The concentration of the test compound is preferably from 0.01 to 10% by mass, and more preferably from 0.03 to 5% by mass. Any of the surfactants may be a nonionic surfactant, an anionic surfactant, or a cationic surfactant. Specific examples of the nonionic surfactant include polyethylene oxide alkyl, polyethylene oxide, and the like. Alkyl aryl ethers, polyepoxy ^ ^ ^ alkyl aryl ethers, other polyethylene oxide derivatives, cyclic hydrogen enthalpy / injection # Ethyl acetate propylene polymer flocculant, sorbitan fat Acid ester, polyfluorene hydrogen ?, ρ. Water% lactose sorbitan fatty acid ester, polyethylene oxide sorbitol fatty acid ester, propylene glycol deciduous fatty acid ester, polyethylene oxide Alkyl sulfate, polyethylene oxide alkylamine, etc. Specific examples of anionic surfactants, such as sodium lauryl sulfate or sodium oleracenate sodium Higher alcohol sulfates ^ ^ Sodium lauryl sulfate or laurate, & L ammonium alkyl sulfates, ten stone * jean fine > Pi pakyl sodium sulfonate or dodecyl naphthalene, sodium glutamate Alkyl square sulfonates and the like. Specific examples of cationic surfactants include stearylamine hydrochloride or 315272 26 200419307 amine salt of lauryltrimethylammonium chloride or a grade 4 ammonium salt. , And other surfactants can be used alone or in combination of two or more of them. The group members like the snoring of surfactants in the liquid. The degree is 0.01 to 10 mass 0 / 〇

為宜，或0_05至8質量％更佳，〇】S 又1土 0·1至5質量〇/〇又更佳。 如上光敏性樹脂組成物經塗布、乾燥，所得It is more suitable, or more preferably from 0 to 05 to 8% by mass, and 0] S to 0.1 to 5% by mass. The photosensitive resin composition is coated and dried as described above.

=圖：形成)經曝光以顯像之各操作，即可形成晝J 再反複嶋“必須之顏色數之操作即可製 二色膜一般是由黑色矩陣及紅、綠及藍之三原色畫素 配置在基板上所形成，因此 ’、 人一“ ⑨u此以本發明之光敏性樹脂組成物 s —顏色所相當之著色材料經 夕w 、 竹工如上之刼作，即可形成該色 之…色矩陣或畫素，其他所要 旻之顏色再以本發明之光敏性 树脂組成物含其所相當之著舍 以者色材枓同樣操作，gp可將黑色 矩陣或二原色畫素配置在基板 上田然，本發明之光敏性 树月曰組成物亦適用於只含黑色矩陣或三原色中任一色、二 色、或三色者。遮光層之黑色矩陣亦可例如在鉻層等形成。 以本發明之光敏性樹脂組成物製成之濾色片’可縮小 面内之膜厚差，例如在1 $ q 、， 至之膜中，面内膜厚之 差在0.15心以下，甚至可達〇〇5#m以下。因此，所得 到之渡色膜有優良之平滑性及透明性，且以其裝置於彩色 液日日綠員不裝置中，可以I；乂古制；、方糾 一 夏γ j以以同製成率製成品質優良之液晶顯 不面板。 本發明之光敏性樹脂組成物，可廣泛利用紫外線硬化 型油墨或光阻劑等，因此適於使用於彩色液晶顯示裝置或 315272 27 200419307 影像元件中形成晝素（著色圖像）。 -實施例： • 上述中已說明本發明之實施形態，但上述中所揭示本 發明之實施形態亦僅為例示，本發明之範圍並不限定於此 等實施形態。本發明之範圍如在申請專利範圍中所示，同 時亦包含與申請專利範圍意義及範圍内相等之所有變更。 以下再以實施例詳細說明本發明，但本發明並不限定於此 會等實施例。以下之含量及使用量中所指之％及份，未特別 指明時均為質量基準。 本實施例中所使用之成份如下，以下亦有簡略表示 者。 一 (a-l)C.I·紅色顏料-254 (a-2)C.I.黃色顏料-139 (a-3)C.I·綠色顏料_36 (a-4)C.I·黃色顏料-15〇 馨（b-1)黏著樹脂：甲基丙烯酸與苯甲基甲基丙烯酸酯之共聚 物〔甲基丙烯酸單位與苯甲基甲基丙烯酸酯單位之比例為 夤1比（莫爾比）〕30:70，酸值為U3，換算聚苯乙烯之重 量平均分子量為25,〇〇〇，黏著樹脂中所含甲基丙烯酸之 ® ’對黏著樹脂之質量分率為〇 〇8%。） (b-2)黏著樹脂：甲基丙烯酸與苯甲基甲基丙烯酸酯之共聚 物〔甲基丙稀酸單位與苯甲基甲基丙烯酸醋單位之比例為 ^量比（莫爾比）〕30:70 ’酸值為113，換算聚苯乙稀之重 里平均/刀子$為25,〇〇〇，黏著樹脂中所含甲基丙烯酸之 28 315272 200419307 里，對黏著樹脂之質量分率為〇·28%。） ㈤）黏著樹脂··甲基丙烯酸與笨甲基甲基丙稀酸醋之共聚 =甲基丙稀酸單位與笨甲基甲基丙稀酸酯單位之比例為 f量比（莫爾比）〕30:70，酸值為113,換算聚苯乙稀之重 曰平句刀子里為25，0〇〇，黏著樹脂中所含甲基丙烯酸之 1，對黏著樹脂之質量分率為〇·45%。） (b_4)黏著樹脂··甲基丙烯酸與苯甲基甲基丙烯酸酯之共聚 :曰〔甲基丙烯酸單位與苯甲基甲基丙稀酸S旨單位之比例為 f量比（莫爾比）〕30:70，酸值為113,換算聚苯乙烯之重 :平均刀子里4 25，〇〇〇’黏著樹脂中所含甲基丙烯酸之 里，對黏著樹脂之質量分率為〇·68%。） (Μ)黏著樹脂：甲基丙烯酸與苯甲基甲基丙稀酸醋之共聚 2〔曱基丙烯酸單位與苯甲基甲基丙烯酸酯單位之比例為 Ζ比（莫爾比）〕30:70，酸值為113，換算聚苯乙烯之重 量平均分子量為25，_，黏著樹脂中不含甲基丙烯酸。） ⑽）黏著樹脂··甲基丙稀酸與苯甲基甲基丙稀酸醋之共聚 2〔甲基丙烯酸單位與苯曱基甲基丙烯酸酯單位之比例為 =!比（莫爾比）〕30:70，酸值為113，換算聚苯乙烯之重 里平均分子量為35,〇〇〇，黏著樹脂中不含曱基丙烯酸。） (bj)黏著樹脂：甲基丙烯酸與苯甲基甲基丙烯酸酯之共聚 物〔曱基丙烯酸單位與苯甲基甲基丙烯酸酯單位之比例為 :1比（莫爾比）〕30:70，酸值為113，換算聚苯乙烯之重 里平均分子量為35,〇〇〇，黏著樹脂中所含甲基丙烯酸之 里’對黏著樹脂之質量分率為〇·39%。） 29 315272 )419307 )黏者树月曰·甲基丙稀酸盥 Λ, Γ ^ ^ 一本T基甲基丙；％酸酯之共聚= Figure: Formation) After exposure to each operation for development, the daytime J can be formed. Then repeat the operation of "the necessary number of colors to make a two-color film. Generally it consists of the black matrix and the three primary color pixels of red, green and blue. It is formed by disposing on a substrate, so ', Renyi', you can use the photosensitive resin composition s of the present invention, the coloring material equivalent to the color, and make the color ... Matrix or pixels, and other colors to be used in the same way, the photosensitive resin composition of the present invention contains the equivalent of the color material, the same operation, gp can arrange the black matrix or two primary pixels on the substrate. The photosensitivity tree moon composition of the present invention is also applicable to those containing only one of the black matrix or the three primary colors, two colors, or three colors. The black matrix of the light-shielding layer may be formed, for example, on a chromium layer. The color filter made of the photosensitive resin composition of the present invention can reduce the in-plane film thickness difference. For example, in a film with a thickness of 1 $ q or less, the difference in in-plane film thickness is less than 0.15 centimeters. Up to 〇05 # m. Therefore, the obtained color film has excellent smoothness and transparency, and it is installed in the color liquid daily green and green equipment, which can be I; ancient system; and square correction one summer γ j to the same system The yield is made into a high-quality liquid crystal display panel. The photosensitive resin composition of the present invention can be widely used in UV-curable inks, photoresists, etc., and is therefore suitable for use in color liquid crystal display devices or 315272 27 200419307 image elements to form daylight (colored images). -Examples: • The embodiments of the present invention have been described above, but the embodiments of the present invention disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. The scope of the present invention is as shown in the scope of patent application, and also includes all changes equivalent to the meaning and scope of the scope of patent application. Hereinafter, the present invention will be described in detail with examples, but the present invention is not limited to these examples. The contents and percentages in the following contents and percentages are based on quality unless otherwise specified. The components used in this embodiment are as follows, which are also shown briefly below. One (al) CI · Red Pigment-254 (a-2) CI Yellow Pigment-139 (a-3) CI · Green Pigment_36 (a-4) CI · Yellow Pigment-15〇 (b-1) Adhesion Resin: Copolymer of methacrylic acid and benzyl methacrylate [the ratio of methacrylic acid unit to benzyl methacrylate unit is 夤 1 ratio (mole ratio)] 30:70, acid value is U3 The weight average molecular weight of polystyrene is 25, 000, and the mass fraction of methacrylic acid contained in the adhesive resin to the adhesive resin is 0.8%. ) (B-2) Adhesive resin: copolymer of methacrylic acid and benzyl methacrylate [the ratio of methacrylic acid unit to benzyl methacrylic acid vinegar unit is ^ amount ratio (Moore ratio) ] 30:70 'Acid value is 113, the average weight of converted polystyrene is $ 25,00, and the methacrylic acid contained in the adhesive resin is 28 315272 200419307. The mass fraction of the adhesive resin is 〇 28%. ) ㈤) Adhesive resin ·· Copolymerization of methacrylic acid and stupid methyl methacrylic acid ester = ratio of methacrylic acid unit to stupid methyl methacrylic acid ester unit is f ratio (mol ratio )] 30:70, acid value 113, the weight of polystyrene is 25, 000 in the flat sentence knife, 1 of methacrylic acid contained in the adhesive resin, the mass fraction of the adhesive resin is 0. 45%. ) (B_4) Adhesive resin ·· Copolymerization of methacrylic acid and benzyl methacrylate: [The ratio of methacrylic acid unit to benzyl methyl acrylic acid S unit is f ratio (Mohr ratio )] 30:70, acid value 113, converted to polystyrene weight: the average knife is 4 25,000 'methacrylic acid contained in the adhesive resin, the mass fraction of the adhesive resin is 0.68 %. ) (Μ) Adhesive resin: copolymerization of methacrylic acid and benzyl methyl acrylic acid 2 [the ratio of the fluorenyl acrylic acid unit to the benzyl methacrylic acid ester unit is Zr ratio (mole ratio)] 30: 70, the acid value is 113, the weight average molecular weight of the converted polystyrene is 25, _, and the adhesive resin does not contain methacrylic acid. ) ⑽) Adhesive resin ·· Copolymerization of methyl acrylic acid and benzyl methyl acrylic acid 2 [The ratio of methacrylic acid units to phenylmethyl methacrylate units is =! Ratio (Moore ratio) ] 30:70, the acid value is 113, the average molecular weight in terms of polystyrene is 35,000, and the acrylic resin is not contained in the adhesive resin. ) (Bj) Adhesive resin: a copolymer of methacrylic acid and benzyl methacrylate [the ratio of fluorenyl acrylic units to benzyl methacrylate units is: 1 ratio (mole ratio)] 30:70 The acid value is 113, the average molecular weight of polystyrene is 35,000, and the mass ratio of methacrylic acid contained in the adhesive resin to the adhesive resin is 0.39%. ) 29 315272) 419307) Sticky Tree Moon Moon · Methyl Acrylic Acid Λ, Γ ^ ^ A T-based methyl propylene; copolymerization of% acid ester

物〔甲基丙烯酸單位愈！甲I w曰 〃本甲基甲基丙烯酸酯單位之比例為 、貝置比（莫爾比）〕27:73，酸佶A ^ • 0文值為8 3，換鼻聚苯乙烯之重量 平均分子量為25,〇〇〇，點荽抖匕 點者樹脂中不含甲基丙烯酸。） (b 9)黏者樹脂：甲基丙煤酿 ’布^與本甲基甲基丙烯酸酯之共聚 物〔甲基丙烯酸單位與苯甲基甲基丙稀酸醋單位之比例為 質量比（莫爾比）〕27:73,酸值為83,換算聚苯乙稀之重量 平均分子量為2 5，0 〇 〇，多]：：&技l 丄 』者树脂中所含甲基丙烯酸之量， 對黏著樹脂之質量分率為〇 41%。） (b-10)黏著聚合物：曱基丙烯酸與笨甲基甲基丙稀酸醋之共 來物〔曱基丙烯酸單位與苯甲基甲基丙烯酸酯單位之比例 為貝里比（莫爾比）〕35:65，酸值為135，換算聚苯乙烯之 重ϊ平均分子量為28,0〇〇，黏著樹脂中所含甲基丙烯酸之 量，對黏著樹脂之質量分率為〇·丨〇%。） (b-11)黏著樹脂：曱基丙烯酸與苯甲基甲基丙烯酸酯之共聚 物〔曱基丙烯酸單位與苯甲基甲基丙烯酸酯單位之比例為 貝置比（莫爾比）〕30··70，酸值為丨13，換算聚苯乙烯之重 量平均分子量為25,000，黏著樹脂中所含甲基丙烯酸之 里’對黏著樹脂之質量分率為〇·。） 1)光聚合性化合物：二季戊四醇六丙烯酸酯（日本化藥 (株）製造，KAYARAD DPHA) (d-1)光聚合起始劑：2-甲基-2-嗎琳代-1 -(4-甲基硫代苯基） 丙烧-1 -酉同 (d-2)光聚合起始劑：2,4-雙（三氯甲基）_6-胡椒基-l，3,5-三吖 30 315272 200419307 嗪 (d-3)光聚合起始劑：2_苯曱基_2_二曱基胺基β1_(4_嗎啉代 本基）丁纟完-1 -酉同 (e-Ι)光聚合起始輔劑：2,4-二乙基噻噸酮 (e-2)光聚合起始輔劑：4,4，_雙（二乙基胺基）二笨甲酮 (f) 溶劑：丙二醇單曱醚乙酸酯 (g) 環氧化合物〔鄰甲酚酚醛清漆型環氧樹脂，「811]\41-EPOXY ESCN-195xl_8〇」（住友化學工業（株）製造）〕 實施例1 及樹脂溶液1之調製〕 5.36 質 量 份 1.34 質 量 份 2.54 質 量 份 5.04 質 量 份 3.36 質 量 份 0.50 質 量 份 0.50 質 量 份 0.50 質 量 份 79.91 質 量 份 0.84 質 量 份 。光敏性樹脂組成物1中 〔光敏性樹脂組成物 (a-1) (a-2) 來S旨糸顏料分散劑 (b-1) (c-1) (d-1) (d-2) (e -1) (0 (g) 混合後即得光敏性樹脂組成物 甲基丙烯酸之含量對光敏性樹脂組成物固形物之質量比為 0.02% 〇 以及 315272 31 200419307 V ) 5.00質量份 - (f) 45.00 質量份 *混合後即得樹脂溶液1。 取康争公司製造之5英吋方形#丨73 7玻璃基板，依序 以中性洗劑、水及醇洗淨後乾燥。再將上述光敏性樹脂組 成物1旋鍍在該玻璃基板上，其次在加熱箱中於1〇〇。〇下 預加熱3分鐘去除揮發成份。再經冷卻後，再於在大氣條 •件下經Ushio電機（株）製造之超高壓水銀燈以i5〇mj/⑽2 曝光量照射，即得塗膜A。 另外，以樹脂溶液1取代光敏性樹脂組成物丨，如同 上述操作，即得塗膜B。 再另外取在中段階段預加熱後所得到塗膜A之基板，不經 曝光而反，貝灰含〇· 12%之非離子界面活性劑與〇 〇4%之氫 氧化鉀之水性顯像液中，在23t：下顯像8〇秒，再經水洗、 乾燥後即得基板C。 ❿（評定） 上述塗膜A在大氣條件下經22〇它加熱6〇分鐘，塗膜 A之失重比例為8.5%。其減少部份並未完全去除而污染加 熱箱，但該加熱箱内之污染物再自内壁落下附著於塗膜上 因此改善其製成率。 塗膜B經上述相同之處理，其失重比例為1 5 ·3%。 ^上述基板c之透光率為1〇〇%，殘留物中無光敏性樹 脂組成物。以膜厚計（DEKTAK3 ((株）ULVAC製造》測定面 内膜厚之差為18A。 315272 200419307 實施例2 〔光敏性樹脂組成物G之調製〕 (a-3) 4.574 質量份 (a-4) 1 ·960 質量份 聚酯系顏料分散劑 1.502質量份 (b-10) 4.722 質量份 (c-1) 3.863 質量份 (d-3) 1.030 質量份 (e-2) 〇·343 質量份 (0 81.960質量份 混合後即得光敏性樹脂組成物G。 取玻璃基板〔康寧公司製造，#1 737〕，以旋鲈、i &丄 心在塗布光 敏性樹脂組成物G，再於1 0 〇 °C預加熱3分鐘數、卜品 祀坏去除揮 發成份，即得光敏性樹脂組成物層。 該光敏性樹脂組成物層經冷卻後，不隔井I · u早从1光〔波 長365nm〕照射。i光之光源使用超高壓水銀燈， 嗓光量 為150mJ/cm2。其次再將曝光後之玻璃基板（其 / 、 田上已形 成著色光敏性樹脂組成物層）浸於顯像液（即含質量分率各 為氫氧化鉀0.05%、丁基萘磺酸鈉〇 2%之水溶液）中顯像， 以純水洗淨。再於大氣條件下經22〇它加熱2〇分鐘，即形 成透明圖像。得到之該圖像上並無殘留物。 ^ 再於前述已形成綠晝素之基板上，以旋鑛法塗布光敏 性樹脂組成物丨’再於刚。c下乾燥3分鐘去除揮發成份， 即形成光敏性樹脂組成物層。其次再將玻璃基板浸於顯像 Λ Λ 315272 200419307 液（即含質量分率各為氯氧化卸〇.05%、丁基萘石黃酸鈉〇·2% 之水溶液）中顯像，以純水洗淨。再於大氣條件下經22〇。〇 加熱20分鐘，即形成透明圖像。測定在塗布光敏性樹脂組 成物1形成塗膜前後綠晝素部份明度值之變化（以〇sp_ SP200(〇lympus光學（株）製造）測定。）為〇·99。 實施例3 〔光敏性樹脂組成物2及樹脂溶液2之調製〕 除變更（b-Ι)為（b-2)外，以實施例丨同樣操作，即得光 敏性樹脂組成物2及樹脂溶液2。光敏性樹脂組成物2中 甲基丙烯酸之含量對光敏性樹脂組成物固形物之質量比為 0.07%。 (評定） 除使用光敏性樹脂組成物2及樹脂溶液2外，相同於 實施例1在大氣條件下經22(rc加熱6〇分鐘，測定其失重 比例，光敏性樹脂組成物2為9·1%、樹脂溶液2為21.4%。 籲其減少部份並未完全去除而污染加熱箱，但加熱箱内之污 染物再自内壁落下附著於塗膜上因此改善其製成率。基板 之透光率為1 00%，殘留物中無光敏性樹脂組成物。面内 膜厚之差為22Α。 除變更光敏性樹脂組成物1為光敏性樹脂組成物2 外，相同於實施例1之操作，測定其綠晝素部份明度值之 變化為1.22。 實施例4 〔光敏性樹脂組成物之調製〕 315272 200419307 除變更（b-l)為（b-3)外，相同於實施例丨之操作，即得 光敏性樹脂組成物3及樹脂溶液3。光敏性樹脂組成物3 中甲基丙烯酸之含量對光敏性樹脂組成物固形物之質量比 為 0.11 % 〇 (評定） 除使用光敏性樹脂組成物3及樹脂溶液3外，相同於 實施例1之搡作，在大氣條件下經22〇°c加熱60分鐘測定 其失重比例，光敏性樹脂組成物3為9.6%、樹脂溶液3為 26.4%。其減少部份並未完全去除而污染加熱箱内，但加 熱箱内之污染物再自内壁落下附著於塗膜上因此改善其製 成率。基板之透光率為100%，殘留物中無光敏性樹脂組 成物。面内膜厚之差為24A。 在實施例2中除了變更光敏性樹脂組成物1為光敏性 樹脂組成物3以外，其他相同於實施例2之操作，測定綠 晝素部份明度值之變化為0.87。 貫施例5 〔光敏性樹脂組成物之調製〕 除變更（b-Ι)為（b-7)外，相同於實施例1之操作，即得 光敏性樹脂組成物4及樹脂溶液4。光敏性樹脂組成物4 中甲基丙烯酸之含量對光敏性樹脂組成物固形物之質量比 為 0 · 1 0 % 〇 (評定） 除使用光敏性樹脂組成物4及樹脂溶液4外，相同於 貫施例1之操作，在大氣條件下經22〇。(：加熱60分鐘測定 35 315272 200419307 其失重比例’光敏性樹脂組成物4炎β A。/ 人q 4為8·60/〇、樹脂溶液4為 -2 4 · 2 %。其減少部份並未完全去哈 • 个兀方|示而巧染加熱箱，但加埶 :箱内之污染物再自内后土辛落下附著於塗膜上因此改善豆繁成 率。基板之透光率為100%，殘留物中無光敏性樹脂組成 物。面内膜厚之差為23Α。 在實施例2中除變更光敏性樹脂組成物i為光敏性樹 脂組成物4外，相同於實施例2之操作，測定綠晝素部份 •明度值之變化為1.1 9。 實施例 6 〔光敏性樹脂組成物5及樹脂溶液5之調製〕 除變更（b-Ι)為（b-9)外，相同於實施例丨之操作，即得 光敏性樹脂組成物5及樹脂溶液5。光敏性樹脂組成物7 中甲基丙烯酸之含量對光敏性樹脂組成物固形物之質量比 為 0· 10% 〇 ' (評定）物 [More units of methacrylic acid! The ratio of methacrylic acid methyl ester units is I, the ratio of benzyl methacrylate is 27:73, the acid 0A ^ • 0 text value is 8 3, the average weight of polystyrene is changed. The molecular weight is 25,000, and the resin is free of methacrylic acid. ) (B 9) Adhesive resin: a copolymer of methyl propylene coal and cloth methacrylate [the ratio of methacrylic acid units to benzyl methyl acrylic acid units is mass ratio ( Moore ratio]] 27:73, acid value 83, weight average molecular weight of polystyrene is 25,000, and more] :: & technical The mass fraction of the adhesive resin was 0.41%. ) (B-10) Adhesive polymer: a co-product of methacrylic acid and styryl methyl methacrylate [the ratio of methacrylic acid units to benzyl methacrylic acid units is Bailey ratio (Moore (Ratio)] 35:65, acid value 135, the average molecular weight of polystyrene equivalent weight is 28,00, the amount of methacrylic acid contained in the adhesive resin, and the mass fraction of the adhesive resin is 0 · 丨〇%. ) (B-11) Adhesive resin: copolymer of fluorenyl acrylic acid and benzyl methacrylate [the ratio of fluorenyl acrylic acid unit to benzyl methacrylic acid ester unit is Bezier ratio (Mohr ratio)] 30 · 70, acid value 丨 13, weight average molecular weight of converted polystyrene is 25,000, and the mass fraction of methacrylic acid contained in the adhesive resin to the adhesive resin is 0 ·. ) 1) Photopolymerizable compound: dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD DPHA) (d-1) photopolymerization initiator: 2-methyl-2-morpholino-1-( 4-methylthiophenyl) propane-1-iso (d-2) photopolymerization initiator: 2,4-bis (trichloromethyl) _6-piperidyl-l, 3,5-tri Acridine 30 315272 200419307 Photopolymerization initiator for azine (d-3): 2_phenylfluorenyl_2_difluorenylamino β1_ (4_morpholinobenzyl) butanone-1-酉 same (e- Ι) Photopolymerization initiation adjuvant: 2,4-diethylthioxanthone (e-2) Photopolymerization initiation adjuvant: 4,4, _bis (diethylamino) dibenzone (f ) Solvent: propylene glycol monomethyl ether acetate (g) epoxy compound [o-cresol novolac epoxy resin, "811] \ 41-EPOXY ESCN-195xl_8〇" (manufactured by Sumitomo Chemical Industries, Ltd.)] Implementation Example 1 and preparation of resin solution 1] 5.36 parts by mass 1.34 parts by mass 2.54 parts by mass 5.04 parts by mass 3.36 parts by mass 0.50 parts by mass 0.50 parts by mass 0.50 parts by mass 79.91 parts by mass 0.84 parts by mass. Photosensitive resin composition 1 [Photosensitive resin composition (a-1) (a-2) Lysine pigment dispersant (b-1) (c-1) (d-1) (d-2) (e -1) (0 (g) The mass ratio of the content of the methacrylic acid of the photosensitive resin composition to the solid content of the photosensitive resin composition after mixing is 0.02% and 315272 31 200419307 V) 5.00 parts by mass-( f) 45.00 parts by mass * resin solution 1 is obtained after mixing. Take a 5-inch square # 丨 73 7 glass substrate manufactured by Kangzheng Company, wash it with neutral detergent, water and alcohol in order and dry. The above-mentioned photosensitive resin composition 1 was further spin-coated on the glass substrate, and then in a heating box at 100. Preheat for 3 minutes to remove volatile components. After cooling down, it was irradiated with an ultra-high-pressure mercury lamp manufactured by Ushio Electric Co., Ltd. under atmospheric conditions at an exposure of i50mj / ⑽2 to obtain coating film A. In addition, the resin solution 1 was used in place of the photosensitive resin composition, and the coating film B was obtained as described above. In addition, the substrate of the coating film A obtained after the pre-heating in the middle stage was taken without exposure. The shell ash aqueous solution containing 0.12% non-ionic surfactant and 0.4% potassium hydroxide was developed. The substrate C was developed at 23 t: 80 seconds, washed with water, and dried to obtain the substrate C. (Evaluation) The above coating film A was heated for 60 minutes at 22 ° C under atmospheric conditions, and the weight loss ratio of the coating film A was 8.5%. The reduced portion is not completely removed to pollute the heating box, but the pollutants in the heating box fall from the inner wall and adhere to the coating film, thereby improving the production rate. The coating B was subjected to the same treatment as described above, and its weight loss ratio was 15 · 3%. ^ The light transmittance of the substrate c is 100%, and there is no photosensitive resin composition in the residue. The difference in in-plane film thickness measured by film thickness (DEKTAK3 (manufactured by ULVAC Co., Ltd.) was 18 A. 315272 200419307 Example 2 [Modification of Photosensitive Resin Composition G] (a-3) 4.574 parts by mass (a-4 ) 1.960 parts by mass of polyester pigment dispersant 1.502 parts by mass (b-10) 4.722 parts by mass (c-1) 3.863 parts by mass (d-3) 1.030 parts by mass (e-2) 0.343 parts by mass ( 0 81.960 parts by mass was mixed to obtain photosensitive resin composition G. A glass substrate [manufactured by Corning Corporation, # 1 737] was taken, and photosensitive resin composition G was coated with spinach, i & core, and then 10 〇 ° C preheat for 3 minutes, remove the volatile components, and obtain a photosensitive resin composition layer. After the photosensitive resin composition layer is cooled, it does not separate from the well I · u from 1 light [wavelength 365nm] ] Irradiation. The light source of i-light uses an ultra-high pressure mercury lamp with a voice volume of 150mJ / cm2. Secondly, the exposed glass substrate (the / where a colored photosensitive resin composition layer has been formed on the field) is immersed in a developing solution (that is, containing The mass fractions were each developed in an aqueous solution of 0.05% potassium hydroxide and 0.2% sodium butylnaphthalene sulfonate. Wash with water. Then heat it at 22 ° C for 20 minutes under atmospheric conditions to form a transparent image. There is no residue on the obtained image. ^ Then on the substrate on which chlorophyll has been formed, spin it. The photosensitive resin composition is coated by mineral method and then dried immediately. C is dried for 3 minutes to remove the volatile components to form a photosensitive resin composition layer. Next, the glass substrate is immersed in a developing film Λ Λ 315272 200419307 liquid (ie containing mass The fractions were each developed in an aqueous solution of oxidized chlorine (0.05%, sodium butyl naphthalene xanthate, 0.2%), washed with pure water, and heated at 22.0 ° C for 20 minutes under atmospheric conditions. That is, a transparent image was formed. The change in the lightness value of the chlorophyll part before and after the formation of the coating film of the photosensitive resin composition 1 was measured (measured by 0sp_SP200 (manufactured by Olympus Optical Co., Ltd.)) as 0.99. Example 3 [Preparation of photosensitive resin composition 2 and resin solution 2] Except that (b-1) was changed to (b-2), the same operation as in Example 丨 was performed to obtain the photosensitive resin composition 2 and the resin solution. 2. Content of methacrylic acid in photosensitive resin composition 2 The mass ratio of the solid content of the composition was 0.07%. (Evaluation) Except that the photosensitive resin composition 2 and the resin solution 2 were used, it was the same as in Example 1 and heated at 22 ° C for 60 minutes under atmospheric conditions to measure the weight loss ratio. The photosensitive resin composition 2 is 9.1%, and the resin solution 2 is 21.4%. The reduction part is not completely removed and pollutes the heating box, but the pollutants in the heating box fall from the inner wall and adhere to the coating film. Therefore, the production rate is improved. The light transmittance of the substrate was 100%, and there was no photosensitive resin composition in the residue. The difference in in-plane film thickness was 22A. Except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 2, the same operation as in Example 1 was performed, and the change in the lightness value of the chlorophyll part was measured to be 1.22. Example 4 [Preparation of photosensitive resin composition] 315272 200419307 Except that (b-1) was changed to (b-3), the same operation as in Example 丨 was performed to obtain photosensitive resin composition 3 and resin solution 3. The mass ratio of the content of methacrylic acid in the photosensitive resin composition 3 to the solid content of the photosensitive resin composition was 0.11%. (Evaluation) The same as in Example 1 except that the photosensitive resin composition 3 and the resin solution 3 were used. The weight loss ratio was measured by heating at 22 ° C for 60 minutes under atmospheric conditions. The photosensitive resin composition 3 was 9.6% and the resin solution 3 was 26.4%. The reduction is not completely removed and contaminates the heating box, but the pollutants in the heating box fall from the inner wall and adhere to the coating film, thereby improving its production rate. The light transmittance of the substrate was 100%, and there was no photosensitive resin composition in the residue. The difference in in-plane film thickness was 24A. Except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 3 in Example 2, the same operation as in Example 2 was performed, and the change in the lightness value of the green pigment was measured to be 0.87. Example 5 [Preparation of photosensitive resin composition] Except changing (b-1) to (b-7), the same operation as in Example 1 was performed to obtain a photosensitive resin composition 4 and a resin solution 4. The mass ratio of the content of methacrylic acid in the photosensitive resin composition 4 to the solid content of the photosensitive resin composition is 0. 10%. (Evaluation) The same as that except that the photosensitive resin composition 4 and the resin solution 4 are used. The operation of Example 1 was conducted at 22 ° C under atmospheric conditions. (: Heated for 60 minutes to measure 35 315272 200419307 weight loss ratio 'photosensitive resin composition 4 inflammation β A. / human q 4 is 8.60 / 〇, resin solution 4 is -2 4 · 2%. The reduction and It ’s not completely gone. • It ’s a good idea to dye the heating box, but add: the pollutants in the box fall from the inside and attach to the coating film, so the bean growth rate is improved. The light transmittance of the substrate 100%, there is no photosensitive resin composition in the residue. The difference in in-plane film thickness is 23A. In Example 2, it is the same as in Example 2 except that the photosensitive resin composition i is changed to the photosensitive resin composition 4. The measurement was performed to measure the chlorophyll fraction. The change in lightness value was 1.19. Example 6 [Preparation of photosensitive resin composition 5 and resin solution 5] The same except that (b-1) was changed to (b-9) In the operation of Example 丨, a photosensitive resin composition 5 and a resin solution 5 were obtained. The mass ratio of the content of methacrylic acid in the photosensitive resin composition 7 to the solid content of the photosensitive resin composition was 0 · 10% 〇 ' (assessment)

除使用光敏性樹脂組成物5及樹脂溶液5外，相同於 實施例1在大氣條件下經22(TC加熱60分鐘，測定其失重 比例’光敏性樹脂組成物5為9.5%、樹脂溶液5為27 9〇/〇。 其減少部份並未完全去除而污染加熱箱，但加熱箱内之污 染物再自内壁落下附著於塗膜上因此改善其製成率。美板 之透光率為1 00°/〇，殘留物中無光敏性樹脂組成物。面内 膜厚之差為19A。 在實施例2中除變更光敏性樹脂組成物1為光敏性樹 脂組成物5外，相同於實施例2之操作，測定綠書素邙广 315272 36 200419307 明度值之變化為1.42。 比較例1 〔光敏性樹脂組成物6及樹脂溶液6之調製〕 除變更（b-Ι)為（b_4)外，相同於實施例1之操作，即得 光敏性樹脂組成物6及樹脂溶液6。光敏性樹脂組成物6 中曱基丙烯酸之含量對光敏性樹脂組成物固形物之質量比 為 0.17%。 (評定） 除使用光敏性樹脂組成物6及樹脂溶液6外，相同於 實施例1在大氣條件下經220°C加熱60分鐘，測定其失重 比例，光敏性樹脂組成物6為10.6%、樹脂溶液6為37.1%。 其減少部份並未完全去除而污染加熱箱，加熱箱内之污染 物再自内壁落下附著於塗膜上減低其製成率。基板之透光 率為1 00°/〇 ’殘留物中無光敏性樹脂組成物。面内膜厚之 差為2 8 A。 在實施例2中除變更光敏性樹脂組成物丨為光敏性樹 脂組成物6外，相同於實施例2之操作，測定綠晝素部份 明度值之變化為1.7 2。 比較例2 〔光破性樹脂組成物7及樹脂溶液7之調製〕 除變更（b-Ι)為（b-5)外，相同於實施例丨之操作，即得 光敏性樹脂組成物7及樹脂溶液7。光敏性樹脂組成物7 中曱基丙烯酸之含量對光敏性樹脂組成物固形物之質量比 為 0%。 ' 315272 37 200419307 (評定） - 除使用光敏性樹脂組成物7及樹脂溶液7外，相同於 :貫施例1之操作，基板之透光率為97%，基板上餘留光敏 性樹脂組成物之殘留物。面内膜厚之差為32A。 在實施例2中除變更光敏性樹脂組成物丨為光敏性樹 脂組成物7外，相同於實施例2之操作，測: 明度值之變化為3.〇2。 h #比較例3 〔光敏性樹脂組成物8及樹脂溶液8之調製〕 除變更（b-Ι)為（b-6)外，相同於實施例丨之操作，即得 光敏性樹脂組成物8及樹脂溶液8。光敏性樹脂組成物8 中曱基丙烯酸之含量對光敏性樹脂組成物固形物之質量比 為 0%。 ' (評定） 除使用光敏性樹脂組成物8及樹脂溶液8外，相同於 實施例1之操作，基板之透光率為96%，基板上餘留光敏 性樹脂組成物之殘留物。面内膜厚之差為22A。 在實施例2中除變更光敏性樹脂組成物1為光敏性樹 脂組成物8外，相同於實施例2之操作，測定綠畫素部份 明度值之變化為2.89。 _比較例4 〔光敏性樹脂組成物9及樹脂溶液9之調製〕 除變更（b-Ι)為（b-8)外，相同於實施例1之操作，即得 光敏性樹脂組成物9及樹脂溶液9。光敏性樹脂組成物9 315272 38 200419307 中甲基丙稀酸之含量對光敏性樹脂組成物固形物之併旦 為〇%。 貝里比 (評定） 除使用光敏性樹脂組成物9及樹脂溶 一 1 不目同於 貫施例1之操作，基板之透光率為95%，基板上餘留光敏 性樹脂組成物之殘留物。面内膜厚之差為U A。 在實施例2中除變更光敏性樹脂組成物丨為光敏性樹 脂組成物9外，相同於實施例2之操作，測定綠晝素部^ 明度值之變化為5·89，因此不佳。 、^ 比較例5 〔光敏性樹脂組成物1 〇之調製〕 、交更（b-Ι)為（b-5)並加入〇·2質量份之丙二酸，其他則 相同於實施例1之操作，即得光敏性樹脂組成物1〇。光敏 性樹脂組成物10中曱基丙烯酸之含量對光敏性樹脂組成 物固形物之質量比為〇%，其中丙二酸之含量對光敏性樹 脂組成物固形物之質量比為1 〇0/〇。 (評定） 除使用光敏性樹脂組成物1 0外，相同於實施例1之操 作’基板之透光率為i 00%，基板上未餘留光敏性樹脂組 成物之殘留物。面内膜厚之差為88人，因此不佳。 在實施例2中除變更光敏性樹脂組成物1為光敏性樹 脂組成物1 0外，相同於實施例2之操作，測定綠晝素部份 明度值之變化為6.42，因此不佳。 比較例6 39 315272 200419307 〔光敏性樹脂組成物11之調製〕 變更（b-Ι)為（b-5)並加入0.2質量份之丙二酸，其他則 相同於實施例1之操作，即得光敏性樹脂組成物丨丨。光敏 性樹脂組成物1 1中甲基丙烯酸之含量對光敏性樹脂組成 物固形物之質量比為0%，其中丙二酸之含量對光敏性樹 脂組成物固形物之質量比為1 .〇%。 (評定） 除使用光敏性樹脂組成物1丨外，相同於實施例1之操 作’基板之透光率為1 〇〇%，基板上未餘留光敏性樹脂組 成物之殘留物。面内膜厚之差為82A，因此不佳。 在實施例2中除變更光敏性樹脂組成物丨為光敏性樹 脂組成物10外，相同於實施例2之操作，測定綠晝素部份 明度值之變化為6·44，因此不佳。 比較例7 〔光敏性樹脂組成物1 2之調製〕Except that the photosensitive resin composition 5 and the resin solution 5 were used, the weight loss ratio was measured in the same manner as in Example 1 after heating at 22 ° C. for 60 minutes under atmospheric conditions. The photosensitive resin composition 5 was 9.5%, and the resin solution 5 was 27 9〇 / 〇. The reduction is not completely removed and pollutes the heating box, but the pollutants in the heating box fall from the inner wall and adhere to the coating film, thereby improving its production rate. The transmittance of the US board is 1 00 ° / 〇, there is no photosensitive resin composition in the residue. The difference in the thickness of the in-plane film is 19A. In Example 2, except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 5, it was the same as the example. The operation of 2 was used to measure the change in lightness value of green book pigment 315272 36 200419307 to 1.42. Comparative Example 1 [Preparation of photosensitive resin composition 6 and resin solution 6] Except changing (b-1) to (b_4), The same operation as in Example 1 was performed to obtain a photosensitive resin composition 6 and a resin solution 6. The mass ratio of the content of fluorenyl acrylic acid in the photosensitive resin composition 6 to the solid content of the photosensitive resin composition was 0.17%. ) Except the use of photosensitive resin composition 6 and resin Except for solution 6, the same as in Example 1 was heated at 220 ° C for 60 minutes under atmospheric conditions, and the weight loss ratio was measured. The photosensitive resin composition 6 was 10.6% and the resin solution 6 was 37.1%. The reduction is not completely Remove and contaminate the heating box. The pollutants in the heating box fall from the inner wall and adhere to the coating film to reduce its production rate. The light transmittance of the substrate is 100 ° / 0 '. There is no photosensitive resin composition in the residue. Surface The difference in the thickness of the inner film was 2 8 A. In Example 2, except that the photosensitive resin composition was changed to the photosensitive resin composition 6, the same operation as in Example 2 was performed, and the change in the lightness value of the chlorophyll part was measured. 1.7 2. Comparative Example 2 [Preparation of photodegradable resin composition 7 and resin solution 7] Except changing (b-1) to (b-5), the same operation as in Example 丨 was performed to obtain a photosensitive resin Composition 7 and resin solution 7. The mass ratio of the content of fluorenyl acrylic acid in the photosensitive resin composition 7 to the solid content of the photosensitive resin composition is 0%. '315272 37 200419307 (Evaluation)-Except the use of the photosensitive resin composition Except 7 and resin solution 7, the operation is the same as in Example 1. The light transmittance of the board was 97%, and the residue of the photosensitive resin composition remained on the substrate. The difference in in-plane film thickness was 32 A. In Example 2, the photosensitive resin composition was changed except that the photosensitive resin composition was changed. Except 7, the operation was the same as that in Example 2. Measurement: The change in brightness value was 3.02. H #Comparative Example 3 [Preparation of photosensitive resin composition 8 and resin solution 8] Except for the change (b-1), (B-6) Except for the same operation as in Example 丨, a photosensitive resin composition 8 and a resin solution 8 were obtained. The content of fluorenyl acrylic acid in the photosensitive resin composition 8 was related to the mass of the solid content of the photosensitive resin composition. The ratio is 0%. '(Evaluation) Except that the photosensitive resin composition 8 and the resin solution 8 were used, the same operation as in Example 1 was performed. The light transmittance of the substrate was 96%, and the residue of the photosensitive resin composition remained on the substrate. The difference in in-plane film thickness was 22A. The same operation as in Example 2 was performed except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 8 in Example 2. The change in the brightness value of the green pixel portion was measured to be 2.89. _Comparative Example 4 [Preparation of photosensitive resin composition 9 and resin solution 9] Except changing (b-1) to (b-8), the same operation as in Example 1 was performed to obtain photosensitive resin composition 9 and Resin solution 9. The content of methacrylic acid in the photosensitive resin composition 9 315272 38 200419307 is 0% based on the solid content of the photosensitive resin composition. Berry ratio (evaluation) Except for the use of photosensitive resin composition 9 and resin solution 1 which is different from the operation of Example 1, the light transmittance of the substrate is 95%, and the residue of the photosensitive resin composition remains on the substrate Thing. The difference in in-plane film thickness is U A. Except that the photosensitive resin composition 丨 was changed to the photosensitive resin composition 9 in Example 2, the same operation as in Example 2 was performed, and the change in the lightness value of the chlorophyll fraction was measured to be 5.89, which was not good. Comparative Example 5 [Preparation of Photosensitive Resin Composition 1 〇], Change (b-1) to (b-5) and add 0.2 parts by mass of malonic acid, the other is the same as in Example 1 After operation, a photosensitive resin composition 10 was obtained. The mass ratio of the content of fluorenyl acrylic acid in the photosensitive resin composition 10 to the solid content of the photosensitive resin composition is 0%, and the mass ratio of the content of malonic acid to the solid content of the photosensitive resin composition is 100 / 〇. . (Evaluation) Except that the photosensitive resin composition 10 was used, the operation was the same as in Example 1 and the substrate had a light transmittance of i 00%, and no residue of the photosensitive resin composition remained on the substrate. The difference in in-plane film thickness was 88, so it was not good. In Example 2, except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 10, the same operation as in Example 2 was performed, and the change in the lightness value of the chlorophyll part was measured to be 6.42, which was not good. Comparative Example 6 39 315272 200419307 [Modulation of Photosensitive Resin Composition 11] Change (b-1) to (b-5) and add 0.2 parts by mass of malonic acid. The other operations are the same as in Example 1, and the obtained Photosensitive resin composition. The mass ratio of the content of methacrylic acid in the photosensitive resin composition 11 to the solid content of the photosensitive resin composition is 0%, and the mass ratio of the content of malonic acid to the solid content of the photosensitive resin composition is 1.0%. . (Evaluation) Except that the photosensitive resin composition 1 was used, the operation was the same as in Example 1 and the substrate had a light transmittance of 1000%, and no residue of the photosensitive resin composition remained on the substrate. The difference in in-plane film thickness was 82 A, so it was not good. Except that the photosensitive resin composition 丨 was changed to the photosensitive resin composition 10 in Example 2, the same operation as in Example 2 was performed, and the change in the lightness value of the chlorophyll part measured was 6.44, so it was not good. Comparative Example 7 [Preparation of photosensitive resin composition 12]

變更（b-1 )為（b-11)外其他相同於實施例丨之操作，即 得光敏性樹脂組成物12。光敏性樹脂組成物12中甲基丙 烯酸之含量對光敏性樹脂組成物固形物之質量比為 0.005% 〇 (評定） 除了使用光敏性樹脂組成物12，樹脂溶液12以外， 相同於實施例1之操作，基板之透光率為98%，基板上餘 留光敏性樹脂組成物之殘留物。面内膜厚之差為3 〇 A。 在實施例2中除變更光敏性樹脂組成物丨為光敏性樹 315272 40 200419307 脂組成物12外，相同於實施例2之操作，測定綠晝素部份 明度值之變化為3.00。By changing (b-1) to (b-11), the same operation as in Example 丨 was performed to obtain photosensitive resin composition 12. The mass ratio of the content of methacrylic acid in the photosensitive resin composition 12 to the solid content of the photosensitive resin composition was 0.005%. (Evaluation) The same as in Example 1 except that the photosensitive resin composition 12 and the resin solution 12 were used. During operation, the light transmittance of the substrate was 98%, and the residue of the photosensitive resin composition remained on the substrate. The difference in in-plane film thickness was 30 A. In Example 2, except that the photosensitive resin composition was changed to a photosensitive tree 315272 40 200419307 lipid composition 12, the same operation as in Example 2 was performed, and the change in the lightness value of the chlorophyll fraction was measured to be 3.00.

比較例R 〔光敏性樹脂組成物1 3之調製〕 變更（b-Ι)為（b-5)並加入〇·〇2質量份之丙二酸，其他 相同於實施例1之操作，即得光敏性樹脂組成物丨3。光敏 性樹脂組成物中曱基丙烯酸之含量對光敏性樹脂組成物固 形物之質量比為0%，其中丙二酸之含量對光敏性樹脂組 成物固形物之質量比為0· 1 %。 (評定） 除使用光敏性樹脂組成物1 3外，相同於實施例i之操 作，基板之透光率為98〇/〇，基板上餘留光敏性樹脂組成物 之殘留物。面内膜厚之差為52A，因此不佳。 t在實施例2中除變更光敏性樹脂組成物1為光敏性樹 脂組成物13外，相同於實施例2之操作，測定綠晝素部份 明度值之變化為4.62，因此不佳。 垃較例9 〔光敏性樹脂組成物丨4之調製〕 變更(b-i)為(b-5)並加入〇 〇2質量份之丙二酸，其他 相同方、κ施例1之知作，即得光敏性樹脂組成物14。光敏 性樹脂組成物14中甲基㈣酸之含量對光敏性樹脂组成 物固形物之質量比為〇0/ 廿+ ^ 。，八中丙二酸之含量對光敏性樹 脂組成物固形物之質量比為〇1%。 (評定） 315272 41 200419307 除使用光敏性樹脂組成物14外，相同於實施例1之操 作’基板之透光率為98%，基板上餘留光敏性樹脂組成物 :之殘留物。面内膜厚之差為54人，因此不佳。 在實施例2中除變更光敏性樹脂組成物1為光敏性樹 脂組成物14外’相同於實施例2之操作，測定綠晝素部份 明度值之變化為4 · 7 4，因此不佳。 依照本發明可以接彳it _ ^ Jik 你 . ^ I、種先破性樹脂組成物，其不顯 像部份中殘留物之餘留少， j I成千坦性優良之晝素。 卢此夕卜用本务明光敏性樹脂組成物，其後步弾之执 處理中因加熱箱污染之原因造 、後-驟之:、、 物之原因造成製成率之降低兩 U及顯像殘遠 可以高生處性製成高品質之渡色膜。“衡地解決，因此Comparative Example R [Preparation of Photosensitive Resin Composition 13] After changing (b-1) to (b-5) and adding 0.02 mass parts of malonic acid, the other operations were the same as those in Example 1 to obtain Photosensitive resin composition 丨 3. The mass ratio of the content of fluorenyl acrylic acid in the photosensitive resin composition to the solid content of the photosensitive resin composition was 0%, and the mass ratio of the content of malonic acid to the solid content of the photosensitive resin composition was 0.1%. (Evaluation) Except that the photosensitive resin composition 13 was used, the operation was the same as in Example i. The substrate had a light transmittance of 98/0, and the residue of the photosensitive resin composition remained on the substrate. The difference in in-plane film thickness was 52 A, so it was not good. t Except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 13 in Example 2, the same operation as in Example 2 was performed, and the change in the lightness value of the chlorophyll part was measured to be 4.62, so it was not good. Comparative Example 9 [Modification of Photosensitive Resin Composition 丨 4] Change (bi) to (b-5) and add 002 parts by mass of malonic acid. A photosensitive resin composition 14 was obtained. The mass ratio of the content of methyl gallic acid in the photosensitive resin composition 14 to the solid content of the photosensitive resin composition was 0 // + ^. The mass ratio of the content of malonic acid in the eight to the solid content of the photosensitive resin composition was 0.01%. (Evaluation) 315272 41 200419307 Except that the photosensitive resin composition 14 was used, the same operation as in Example 1 was used. The substrate had a light transmittance of 98%, and the photosensitive resin composition remained on the substrate. The difference in the in-plane film thickness was 54 people, so it was not good. In Example 2, the same operation as in Example 2 was performed except that the photosensitive resin composition 1 was changed to the photosensitive resin composition 14. The change in the lightness value of the chlorophyll fraction was measured as 4.74, which was not good. According to the present invention, it can be connected to _ ^ Jik you. ^ I, a kind of first-breaking resin composition, which has less residue in the non-imaging portion, and j I is a diurnal compound with excellent quality. Lu Xixibu used the photosensitive photosensitive resin composition, which was caused by the contamination of the heating box during the subsequent processing of the step, and the subsequent steps: the production rate was reduced by two U and The image can be made into high-quality color film with high quality. "A balanced solution, so

315272 42315272 42

Claims (1)

200419307 拾、申請專利範圍： 1 ·種光敏性樹脂組成物，其特徵為光敏性樹脂組成物中 έ構成單位為製自（甲基）丙烯酸之黏著樹脂及（甲基）丙 烯酉文，该光敏性樹脂組成物固形物中（甲基）丙烯酸之含 量為0·010至016質量％者。 2.如申請專利範圍帛1項之光敏性樹脂組成物，其中，光 敏性樹脂組成物固形物中黏著樹脂之含量為5至 量％者。 ' 3·如申請專利範圍第1或第2項之光敏性樹脂組成物，其 中’更含光聚合性化合物、光聚合起始劑、及溶劑者。 4 ·如申請專利範圍第1第 ^ 項中之光敏性樹脂 組成物，其中，更含著色劑者。 5. (二岭為使用如申請專利範圍第！至第4 項之任-項中之光敏性樹脂組成物形成者。 6. -為含如申請專利範圍第5項之。 7· —種液晶顯示裝置，為 色片所成者。 申“利範圍“項之濾 315272 43 200419307 柒、指定代表圖：本案無代表圖 (一） 本案指定代表圖為：第（ ）圖。 (二) 本代表圖之元件代表符號簡單說明： 捌、本案若有化學式時，請揭示最能顯示發明特徵的化學式： (本案無代表化學式） 4 315272200419307 Scope of patent application: 1. A photosensitive resin composition, characterized in that the constituent units in the photosensitive resin composition are an adhesive resin made from (meth) acrylic acid and a (meth) acrylic scripture. The content of (meth) acrylic acid in the solid resin composition solid is 0.010 to 016 mass%. 2. The photosensitive resin composition according to the scope of claim 1 of the patent application, wherein the content of the adhesive resin in the solid portion of the photosensitive resin composition is 5 to% by weight. '3. The photosensitive resin composition according to item 1 or 2 of the scope of patent application, wherein' 'further contains a photopolymerizable compound, a photopolymerization initiator, and a solvent. 4 · The photosensitive resin composition as described in the first item ^ of the patent application scope, in which the coloring agent is further contained. 5. (Erling is formed by using the photosensitive resin composition as described in any one of the items in the scope of patent application! To item 4. 6.-It is included in the application as in item 5 of the patent application scope. 7 · — a type of liquid crystal The display device is made of color film. Applying for the filter of the “benefit range” item 315272 43 200419307 柒. Designated representative map: No representative map in this case (1) The designated map in this case is: (). (II) The representative Brief description of the representative symbols of the elements in the figure: 捌 If there is a chemical formula in this case, please disclose the chemical formula that can best show the features of the invention: (This case has no representative chemical formula) 4 315272
TW092133008A 2003-01-14 2003-11-25 Photosensitive resin composition TWI285298B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003005392 2003-01-14

Publications (2)

Publication Number Publication Date
TW200419307A true TW200419307A (en) 2004-10-01
TWI285298B TWI285298B (en) 2007-08-11

Family

ID=34308275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092133008A TWI285298B (en) 2003-01-14 2003-11-25 Photosensitive resin composition

Country Status (3)

Country Link
KR (1) KR101066504B1 (en)
CN (1) CN1517795B (en)
TW (1) TWI285298B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395054B (en) * 2005-01-27 2013-05-01 Dongjin Semichem Co Ltd Photosensitive resin composition
TWI492979B (en) * 2009-10-14 2015-07-21 Denki Kagaku Kogyo Kk Resin composition and adhesive

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396042B (en) * 2004-09-29 2013-05-11 Sumitomo Chemical Co Colored photosensitive resin composition
KR100655045B1 (en) * 2005-12-30 2006-12-06 제일모직주식회사 Photosensitive resin composition and black matrix thereof
KR101313538B1 (en) * 2006-04-06 2013-10-01 주식회사 동진쎄미켐 Negative photosensitive resin composition
KR101727101B1 (en) * 2008-08-26 2017-04-14 타무라 카켄 코포레이션 Photopolymer composition, solder resist composition for print circuit boards and print circuit boards

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2554760B2 (en) * 1990-01-11 1996-11-13 東京応化工業株式会社 Positive photoresist composition
CN1205454A (en) * 1997-06-20 1999-01-20 智索股份有限公司 Photosensitive resin compsns. and display components using same
EP1012671B1 (en) * 1998-07-14 2003-09-24 Brewer Science, Inc. Photosensitive black matrix composition and process of making it
JP3940243B2 (en) * 1998-10-15 2007-07-04 三井化学株式会社 Copolymer, method for producing the same, and solution containing the same
JP2002022925A (en) * 2000-07-11 2002-01-23 Nippon Steel Chem Co Ltd Method for producing color filter and colored photosensitive resin composition
JP4050121B2 (en) * 2001-09-25 2008-02-20 大日本印刷株式会社 Maleimide-based alkali-soluble copolymer, ionizing radiation curing resin composition, color filter, and liquid crystal display device
JP3938896B2 (en) 2001-09-25 2007-06-27 大日本印刷株式会社 Maleimide-based alkali-soluble copolymer, ionizing radiation curing resin composition, color filter, and liquid crystal display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395054B (en) * 2005-01-27 2013-05-01 Dongjin Semichem Co Ltd Photosensitive resin composition
TWI492979B (en) * 2009-10-14 2015-07-21 Denki Kagaku Kogyo Kk Resin composition and adhesive

Also Published As

Publication number Publication date
CN1517795B (en) 2010-05-05
KR20040065163A (en) 2004-07-21
KR101066504B1 (en) 2011-09-21
CN1517795A (en) 2004-08-04
TWI285298B (en) 2007-08-11

Similar Documents

Publication Publication Date Title
TWI521306B (en) Photosensitive resin composition and light blocking layer using the same
TWI459133B (en) Radiation sensitive composition for formation of colouring layer, color filter and color liquid crystal display element
TWI579271B (en) A color photosensitive resin composition, color filter and display device comprising the same
TWI431036B (en) Photosensitive resin composition and light blocking layer using the same
TWI521305B (en) Method of manufacturing black column spacer, black column spacer, and color filter
TWI264564B (en) Radiation sensitive composition for color filter, color filter, manufacturing method of liquid crystal color display, and forming method of colored layer of color filter
TW200928582A (en) Radiation-sensitive composition for forming colored layer, color filter and liquid crystal display device
TW200540566A (en) Radiation sensitive composition for color filter, color filter, and color liquid crystal display
KR101961219B1 (en) A colored photosensitive resin composition
JP6315673B2 (en) Colored photosensitive resin composition
TW201701075A (en) Colored photosensitive resin composition, color filter, and image display apparatus comprising the same containing a colorant, an alkali soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent
CN101086619A (en) Color photosensitive resin compositions
TWI606296B (en) A colored photosensitive resin composition
TWI675254B (en) Blue photosensitive resin composition, blue color filter and display device having the same
TW201531513A (en) Color photosensitive resin composition, color filter and display device comprising the same
JP5705371B2 (en) Polymer compound containing dye and curable resin composition containing the same
TW200809405A (en) Radiation-sensitive composition for forming a colored layer, color filter and color liquid crystal display device
TW200923581A (en) Radiation-sensitive composition for forming colored layer, color filter and color liquid crystal display device
CN103969953A (en) Colored Photosensitive Resin Composition
TW201638669A (en) Colored photosensitive resin composition, color filter and liquid crystal display device including the color filter
JP2008249987A (en) Photosensitive resist composition and color filter
TW200839441A (en) Radiation sensitive composition for forming a colored layer, color filter and color liquid crystal display device
TWI414539B (en) Photosensitive resin composition and light blocking layer using the same
TWI485515B (en) Colored photosensitive resin composition and color filter using the same
TWI767904B (en) Colored photosensitive resin composition and color filter comprising the same

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent