TW200414461A - QFN type image sensing device packaging method and its structure - Google Patents

QFN type image sensing device packaging method and its structure Download PDF

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Publication number
TW200414461A
TW200414461A TW092101543A TW92101543A TW200414461A TW 200414461 A TW200414461 A TW 200414461A TW 092101543 A TW092101543 A TW 092101543A TW 92101543 A TW92101543 A TW 92101543A TW 200414461 A TW200414461 A TW 200414461A
Authority
TW
Taiwan
Prior art keywords
carrier
wafer
image sensing
pad
sensing element
Prior art date
Application number
TW092101543A
Other languages
English (en)
Chinese (zh)
Other versions
TWI308380B (https=
Inventor
Zheng-Han Xu
yi-hua Zhang
Original Assignee
Taiwan Ic Packaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Ic Packaging Corp filed Critical Taiwan Ic Packaging Corp
Priority to TW092101543A priority Critical patent/TW200414461A/zh
Publication of TW200414461A publication Critical patent/TW200414461A/zh
Application granted granted Critical
Publication of TWI308380B publication Critical patent/TWI308380B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
TW092101543A 2003-01-24 2003-01-24 QFN type image sensing device packaging method and its structure TW200414461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092101543A TW200414461A (en) 2003-01-24 2003-01-24 QFN type image sensing device packaging method and its structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092101543A TW200414461A (en) 2003-01-24 2003-01-24 QFN type image sensing device packaging method and its structure

Publications (2)

Publication Number Publication Date
TW200414461A true TW200414461A (en) 2004-08-01
TWI308380B TWI308380B (https=) 2009-04-01

Family

ID=45071817

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092101543A TW200414461A (en) 2003-01-24 2003-01-24 QFN type image sensing device packaging method and its structure

Country Status (1)

Country Link
TW (1) TW200414461A (https=)

Also Published As

Publication number Publication date
TWI308380B (https=) 2009-04-01

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MM4A Annulment or lapse of patent due to non-payment of fees