200411303 玖、發明說明： 【發明所屬之技術領域】 本务明關於液晶頭示裝置’特別係關於能防止為了連接在 基板上安裝的驅動ic與可撓性印刷配線基板而形成在上述 基板上的連接用多線遭到電解腐蝕的液晶顯示裝置。 【先前技術】200411303 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a liquid crystal display device, in particular, to prevent a driver IC and a flexible printed wiring board formed on the substrate from being connected to the substrate to connect the driver IC and the flexible printed wiring board mounted on the substrate. A liquid crystal display device in which multiple wires for connection are electrolytically corroded. [Prior art]
為了適應最近的電子裝置的小型化、低成本化，採用了將 STN型（Super-Twisted Nematic :超扭曲向列）的液晶顯示裝置 的驅動1C從2個歸納為1個的結構。即，將分別連接到習知共 同（common)側和區段（segment)側的各透明電極的2個驅動IC 集中於面板的一個側面一側，將該2個驅動IC置換為i個驅動 1C來驅動。 圖8示出了用1個驅動ic進行驅動的方式的習知液晶顯示 裝置的結構。 在該液晶顯示裝置中，利用COG(玻璃上的晶片）安裝等在 夾住液晶層的一對基板1〇1、1〇2中的單側的基板上安裝 了驅動IC 1 03。必須將共同側的透明電極i 〇4和區段側的透 明電極105連接到該驅動IC 103上，藉由利用銦錫氧化物 (ιτο)等的透明導電性材料形成引出配線1〇4^1〇5&進行了驅 動1C 103與透明電極104、105的連接。在驅動1〇 1〇3與引出 配線104a的連接和驅動IC 103與引出配線1〇5a的連接中使用 了 ACF膜（Anisotropic conductive film :各向異性導電膜）。 此外，必須將對該驅動1C 1〇3供給驅動信號的可撓性印 刷配線基板（FPC) 106連接到該驅動ic 1〇3上，以彳φ』门a a 1工如圖9 8594l.doc 200411303 和圖ίο中所示，利用上述透明導電材料在基板1〇2上形成連 接用配線104b，將驅動1C 103連接到該連接用配線104b的 一方的端部（内側的端部）上，藉由在該連接用配線104b的另 一方的端邵（基板的外周附近的端部）與FPC 1 06之間夾住 ACF膜（各向異性導電膜）1〇7並進行加熱加壓，經上述acf 膜中的的導電粒子對連接用配線丨〇4b與FPC 1 〇6中的配線 106a進行了導電性的連接。 上述的結構的習知液晶顯示裝置中使用的Fpc ι〇6的一方 的端部被配置在與驅動IC 1〇3鄰接的位置上並覆蓋了連接 用配線104b和ACF膜107，FPC 106的另一方的端部從基板 102起朝向外邵伸出。此外，雖然FpC 1〇6中的配線1〇以被 开j成在ACF膜107上方的位置上，但未被形成在驅動IC 1〇3 的附近的位置上。 (發明要解決的課題） 惟，在上述的結構的習知液晶顯示裝置中，雖然在驅動Ic 103與ACF膜107之間的連接用配線104b上存在Fpc 1〇6，但 由於在驅動1C 103與ACF膜107之間開出了間隙110，故在驅 動1C 103與ACF膜107之間使連接用配線104b露出了，從而 存在由於空氣等中包含的水分的緣故而受到腐蝕的情況。 為了解決此種問題，在間隙110中充填防止腐蝕用的UV樹 脂來保護連接用配線104b即可，但由於在間隙u 〇上形成了 FPC 106，故難以充填UV樹脂，容易形成不完全的充填部， 由於在該部分中發生了電解腐蝕，故難以保護連接用配線 104b 〇 85941 200411303 【發明内容】 本發明係鑒於上述情況而進行的，其目的在於提供能防 止為了連接在基板上安裝的驅動IC與可撓性印刷配線基板 而在上述基板上形成的連接用配線的電解腐蝕的液晶顯示 裝置。 (解決課題的手段） 為了達到上述的目的，本發明中採用了以下的結構。 本發明的液晶顯示裝置係具備夹住液晶層而對置的一對 基板，在各基板的液晶層一側的面上分別設置了一方和另 一方的電極的液晶顯示裝置，其特徵在於··在上述一對基 板的某一方或兩方上形成將上述一方和另一方的電極引出 到上述一對基板的一個側面一側用的一方和另一方的引出 配線，在上述一方和另一方的基板上安裝驅動Ic並使其與 上述一方和另一方的引出配線電性連接，在被安裝了上述 驅動ic的基板上形成電性連接上述驅動1(:與可撓性印刷配 線基板用的連接用配線，在該連接用配線的一方的端部上 電性連接上述驅動1C，在上述連接用配線上並在上述驅動IC 的附近配置ACF膜，經上述ACF膜電性連接上述連接用配線 與上述可撓性印刷配線基板，在上述驅動IC的附近形成上 述可撓性印刷配線基板中的配線圖形的一方的端部，電性 連接了上述驅動1C可撓性印刷配線基板。 按照前述的液晶顯示裝置，藉由將在上述連接用配線上 形成的ACF膜的形成位置定為接近於上述驅動IC的位置、 也在接近於上述驅動1C的位置上形成了可撓性印刷配線基 85941 200411303 板中的配線圖形的一方的端部，由於與習知液晶顯示裝置 相比可減小驅動1(：與八以膜之間的間隙，故可減少上述連 接用配線的露出部，上述連接用配線難以暴露於空氣等中 =含的水分中，能防止連接用配線的電解腐蝕，能構成可 靠性高的液晶顯示裝置。 此外，本發明的液晶顯示裝置係前面前述的液晶顯示装 置在上述驅動IC與上述ACF膜的間隙中充填了防止電解 腐蝕用樹脂這一點在增加連接用配線的保護效果、可進一 步楗同防止電解腐蝕的效果的方面係較為理想的。 _ 此外，本發明的液晶顯示裝置係於前述的液晶顯示裝置 中，使上述驅動IC與上述ACF膜的間隙的距離為〇·2 mm以 ^至2 mm以下這一點在下述的幾個方面係較為理想的，即， 可減少連接用配線的露出部，此外，在該間隙中充填防止 電解腐姓用樹脂時，容易利用毛細管現象來充填防止電解 ^ ^ 可笔揉遺漏地在上述間隙中充填防止電解腐 餘用樹脂，可提高連接用配線的保護效果。 【實施方式】 眷 以下，參照附圖，說明本發明的實施方式。 異在圖1中不出作為本發明的實施方式的單純矩陣型的液晶 Γ裝置的刀解立體圖’在圖2中示出本實施方式的液晶顯 ”裝置一的4分剖面結構的示意圖。此外，在圖3中示出構成 I 一丁出的液晶顯π裝置的一方的基板的俯視圖，在圖4 中示出構成圖i中千+ %十曰w 、 出的硬曰日顯示裝置的另一方的基板的俯 ?見圖。有，产 圖3中省略了可撓性印刷配線基板和acf膜 85941 -9- 200411303 的圖示。 如圖1和圖2中所示，太余、a、， 本貝他万式的液晶顯示裝置1具備夾 住液晶層3G而對置的第1基板（―方的基板）1G和第2基板（另 方的基板）2G而構成，在各基板1()、⑼的液晶層％一侧的 面上分別設置了一方的透明電極(一㈣電極)15和另一方的 透明電極（另一方的電極）25。士从—々甘t 此外，在各基板1〇、2〇之間以 裒狀元成了由包3導電粒子的樹脂（各向異性導電樹脂）構成 的山封材料40，藉由在該密封材料4〇的内側配置液晶層π 而使其在各基板1〇、20之間被夾持。 如圖i和圖2中所示，在第丨基板1〇(一方的基板）的液晶層％ 一側按下述順序層積形成了為了驅動液晶層3〇而在圖中¥方 向上延伸的透明電極15(一方的電極）、在保護透明電極15的 並且使由该透明電極1 5引起的凹凸平坦化用的塗膜丨4和控 制構成液晶層30的液晶分子的定向用的定向膜丨6。此外， 在第2基板（另一方的基板）2〇的液晶層3 〇 一側按下述順序層 積形成了反射體3 7、進行彩色顯示用的滤色器丨3、在保護 並覆盍反射體3 7的並且使由反射體3 7或濾色器丨3引起的凹 凸平坦化用的塗膜24、為了驅動液晶層30而在圖中X方向上 延伸的透明電極25(另一方的電極）和控制構成液晶層30的液 晶分子的定向用的定向膜26。再有，在透明電極25與定向 膜26之間也形成了塗膜（省略圖示）。 反射體3 7由有機膜11和在該有機膜丨丨上形成的金屬反射 膜12形成。 再者，在與第2基板20的液晶層30—側相反的一側設置了 85941 -10- 200411303 相位差片17和偏振片18，在與第！基板1〇的液晶層3〇一側相 反的一側按下述順序層積了相位差片27和偏振片28。偏振 片28的外側面成為顯示面丨a。此外，在偏振片丨8的外側配 置了作為在液晶顯示裝置1中進行透射顯示用的光源的背照 光源5。 透明電極1 5、25係整齊地排列形成了多個由IT〇(錮錫氧 化物）等的透明導電膜構成的長條狀的平面形狀的電極，透 明私極1 5、25分別連接到驅動ic 50上，係為了驅動構成液 晶層30的液晶分子而形成的。此外，以互相在俯視圖上成 直角的方式來配置透明電極15、25，使上述的液晶顯示裝 置1成為被動矩陣型的液晶顯示裝置。 如圖1中所示，使第2基板20的寬度方向（圖中X方向）的長 度與第1基板10的寘度方向（圖中X方向）的長度相同，此外， 使第2基板20的縱方向（圖中γ方向）的長度比第i基板1〇的縱 方向（圖中Y方向）的長度短。因此，在重疊結合各基板1〇、 2 0時，使第1基板1 〇的液晶層3 〇 一側的面的一部分（端子 部）l〇a露出。在該端子部i〇a上利用c〇G(玻璃上的晶片）安 裝等的面朝下的安裝來安裝驅動IC(驅動器1(： )5〇。該驅動1(： 5 0例如可使用烊錫球構成端子5 1 a的b G A(球柵格陣列）型半 導體元件或沿驅動1C的外形周邊部配置了凸點電極的半導 體元件等。 此外’如圖1、圖3和圖6中所示，在第1基板1〇上形成了 將一方的透明電極1 5引出到端子部！ 0a上的引出配線6。將 引出配線6的一端連接到透明電極1 5上，將另一端連接到驅 85941 -11 - 200411303 動IC 50的端子51a上。 此外，如圖1、圖3、圖6和圖7中所示，在第}基板1〇上形 成了電性連接對驅動1C 50供給驅動信號用的可撓性印刷配 線基板66與驅動1C 50用的連接用配線6b，將驅動IC 5〇的端 子51a電性連接到連接用配線讣的一方的端部上。連接用配 線6b的另一方的端部與在第i基板丨〇的外周邊相比處於基板 的内側被形成，連接用配線6b的上述一方的端部與上述另 一方的端部相比在基板1 〇的内侧被形成。 上述引出配線6或連接用配線6b與上述透明電極1 5同樣地 由ITO(銦錫氧化物）等的透明導電膜構成。 又’圖6係示出經密封材料4〇貼合了圖1的液晶顯示裝置 的第1和第2基板（一對基板）ι〇、2〇時（組裝圖}的液晶顯示裝 置時）的與驅動1C 50連接的連接用配線6|3與1^(：： 66的連接部 分的剖面示意圖，圖7係示出組裝圖丨的液晶顯示裝置時的 與驅動1C 50連接的連接用配線化與171>(： 66的連接部分的俯 視圖。 如圖6和圖7中所示，在連接用配線讣上（與基板1〇一側相 反一側的表面上）以接近於驅動IC 5〇的方式形成Acf膜67， 藉由經该ACF膜67電性連接了連接用配線6b與可撓性印刷 配線基板（FPC)66，電性連接了驅動IC 5〇與1^(： 66。 在FPC 66中’在同時具有絕緣性和可彎曲性的薄的膜的 表面上形成了多條由導電性材料構成的配線圖形66a。Fpc 66中的各配線圖形66的一方的端部以接近於驅動IC 5〇的方 式來形成。14些配線圖形66的一方的端部一側經ACj^^67、 85941 -12- 200411303 連接用配線6b連接到驅動IC 50的端子50a上。FPC 66中的 各配線圖形66的另一方的端部連接到省略圖示的連接器咬 端子、購件等上。 ACF膜67係在黏接劑中分散了焊錫、鎳等的金屬粒子或 進行了金屬電鍍的塑膠球等的導電粒子的膜，藉由在連接 用配線6b與FPC 66之間夾住ACF膜67進行加熱加壓，經上 述導電粒子電性連接連接用配線6b與對應於連接用配線6b 的配線圖形66a，利用上述黏接劑固定並保持在連接用配線 6b與 FPC 66 間。 在本實施方式的液晶顯示裝置中，由於如上前述使在連In order to adapt to the recent miniaturization and cost reduction of electronic devices, a structure in which a driver 1C of a STN type (Super-Twisted Nematic) liquid crystal display device is reduced from two to one is adopted. That is, two driving ICs connected to the transparent electrodes of the common and segment sides are collectively concentrated on one side of the panel, and the two driving ICs are replaced with i driving 1Cs. To drive. Fig. 8 shows a structure of a conventional liquid crystal display device driven by one driving IC. In this liquid crystal display device, a driver IC 103 is mounted on one side of a pair of substrates 101 and 102 that sandwich a liquid crystal layer by COG (wafer on glass) mounting or the like. It is necessary to connect the common-side transparent electrode i 04 and the segment-side transparent electrode 105 to the driver IC 103, and to form the lead-out wiring 104 by using a transparent conductive material such as indium tin oxide (ιτο). 〇 5 & The drive 1C 103 and the transparent electrodes 104 and 105 were connected. An ACF film (Anisotropic conductive film) is used for the connection between the drive 1010 and the lead-out wiring 104a and the connection between the drive IC 103 and the lead-out wiring 105a. In addition, a flexible printed wiring board (FPC) 106 that supplies a driving signal to the driver 1C 103 must be connected to the driver ic 103, and the gate aa 1 works as shown in Figure 9 8594l.doc 200411303 As shown in FIG. Ο, the connection wiring 104b is formed on the substrate 102 using the transparent conductive material, and the driver 1C 103 is connected to one end (the inner end) of the connection wiring 104b. The ACF film (anisotropic conductive film) 107 is sandwiched between the other end of the connection wiring 104b (the end near the outer periphery of the substrate) and FPC 106, and heated and pressurized. The conductive particles in the film electrically connect the connection wiring 104b to the wiring 106a in the FPC 106. One end of the Fpc 06 used in the conventional liquid crystal display device having the above-mentioned structure is disposed at a position adjacent to the driving IC 103 and covers the connection wiring 104b and the ACF film 107, and the other of the FPC 106. One end portion extends from the base plate 102 toward the outside. In addition, although the wiring 10 in the FpC 106 is opened at a position above the ACF film 107, it is not formed at a position near the driving IC 103. (Problems to be Solved by the Invention) In the conventional liquid crystal display device having the above-mentioned structure, although Fpc 106 is present on the connection wiring 104b between the driving IC 103 and the ACF film 107, the driving of the 1C 103 A gap 110 is opened between the ACF film 107 and the connection wiring 104b is exposed between the drive 1C 103 and the ACF film 107, which may cause corrosion due to moisture contained in the air or the like. In order to solve such a problem, it is sufficient to fill the gap 110 with a UV resin for preventing corrosion to protect the connection wiring 104b. However, since the FPC 106 is formed on the gap u, it is difficult to fill the UV resin, and it is easy to form an incomplete filling. It is difficult to protect the connection wiring 104b because electrolytic corrosion has occurred in this part. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a driver that can prevent mounting on a substrate for connection. An electrolytically etched liquid crystal display device of IC and a flexible printed wiring substrate and connection wiring formed on the substrate. (Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention employs the following configuration. The liquid crystal display device of the present invention is a liquid crystal display device including a pair of substrates facing each other with a liquid crystal layer interposed therebetween, and one and the other electrodes are provided on one surface of the liquid crystal layer on each substrate. On one or both of the pair of substrates, one and the other lead wires for drawing the one and the other electrodes to one side of the pair of substrates are formed, and the one and the other substrates are formed on the pair of substrates. The driver Ic is mounted on the driver IC and electrically connected to the one and the other lead wires, and the driver IC is electrically connected to the substrate on which the driver IC is mounted. The driver 1 (: is used for connection to a flexible printed wiring board. Wiring, electrically connect the driver 1C to one end of the connection wiring, arrange an ACF film on the connection wiring and near the driver IC, and electrically connect the connection wiring and the above via the ACF film The flexible printed wiring board is formed with one end portion of one of the wiring patterns in the flexible printed wiring board in the vicinity of the drive IC, and the driver is electrically connected. 1C flexible printed wiring board. According to the aforementioned liquid crystal display device, the formation position of the ACF film formed on the connection wiring is determined to be close to the position of the driving IC and also to be close to the position of the driving 1C. One end of the wiring pattern in the flexible printed wiring base 85941 200411303 board is formed, and the drive 1 (: and the gap between the film and the film can be reduced compared to the conventional liquid crystal display device, so it can be reduced. The exposed part of the connection wiring, the connection wiring is hardly exposed to air or other moisture, can prevent electrolytic corrosion of the connection wiring, and can constitute a highly reliable liquid crystal display device. In addition, the liquid crystal display of the present invention Device: The aforementioned liquid crystal display device is filled with a resin for preventing electrolytic corrosion in the gap between the driver IC and the ACF film, which increases the protection effect of the connection wiring and further enhances the effect of preventing electrolytic corrosion. Ideal. _ In addition, the liquid crystal display device of the present invention is based on the aforementioned liquid crystal display device, The distance between the gaps of the ACF film is from 0.2 mm to 2 mm or less. It is desirable to reduce the exposed portion of the connection wiring and fill the gap to prevent electrolysis. In the case of resins, it is easy to use the capillary phenomenon to fill the anti-electrolysis ^ ^ You can fill in the gap to fill the gap with the resin to prevent electrolytic corrosion, which can improve the protection effect of the connection wiring. [Embodiment] Please refer to the following, refer to The drawings illustrate embodiments of the present invention. Fig. 1 is a cutaway perspective view of a simple matrix-type liquid crystal Γ device as an embodiment of the present invention. Fig. 2 shows a liquid crystal display device of the present embodiment. A schematic diagram of a 4-point cross-sectional structure of FIG. 1. In addition, FIG. 3 shows a plan view of one substrate constituting a liquid crystal display device of I-D, and FIG. See the top view of the other substrate of the hard day display device. Yes, the illustration of the flexible printed wiring board and the acf film 85941 -9- 200411303 is omitted in FIG. 3. As shown in FIGS. 1 and 2, the Taiyu, a, and Bembetan-type liquid crystal display device 1 includes a first substrate (a square substrate) 1G and a second substrate that are opposed to each other with a liquid crystal layer 3G interposed therebetween. (The other substrate) is composed of 2G, and one transparent electrode (a single electrode) 15 and the other transparent electrode (the other Electrode) 25.士 从 —々 甘 t In addition, a mountain seal material 40 made of a resin (anisotropic conductive resin) containing 3 conductive particles is formed between the substrates 10 and 20 in a 裒 -shaped element. A liquid crystal layer π is arranged on the inner side of 40 to be sandwiched between the substrates 10 and 20. As shown in FIG. I and FIG. 2, the liquid crystal layer% side of the first substrate 10 (one substrate) is laminated in the following order to form a liquid crystal layer extending in the ¥ direction in order to drive the liquid crystal layer 30. The transparent electrode 15 (one electrode), the coating film for protecting the transparent electrode 15 and flattening the unevenness caused by the transparent electrode 15 and the alignment film for controlling the alignment of liquid crystal molecules constituting the liquid crystal layer 30 6. In addition, a reflector 37 is laminated on the liquid crystal layer 30 on the second substrate (the other substrate) 20 in the following order. 7. A color filter for color display. 3. Protects and covers. Reflector 37, coating film 24 for flattening unevenness caused by reflector 37 or color filter 3, transparent electrode 25 (the other one) extending in the X direction in the figure in order to drive liquid crystal layer 30 Electrode) and an alignment film 26 for controlling the alignment of liquid crystal molecules constituting the liquid crystal layer 30. A coating film (not shown) is also formed between the transparent electrode 25 and the alignment film 26. The reflector 37 is formed of an organic film 11 and a metal reflective film 12 formed on the organic film 11. Furthermore, 85941 -10- 200411303 retardation plate 17 and polarizing plate 18 are provided on the side opposite to the liquid crystal layer 30-side of the second substrate 20, and the first and second sides! On the opposite side of the liquid crystal layer 30 of the substrate 10, a retardation film 27 and a polarizing film 28 are laminated in the following order. The outer surface of the polarizing plate 28 becomes a display surface. Further, a back-illuminated light source 5 as a light source for transmissive display in the liquid crystal display device 1 is arranged on the outside of the polarizing plate 8. The transparent electrodes 15 and 25 are arranged neatly to form a plurality of strip-shaped flat electrodes made of a transparent conductive film such as IT0 (锢 tin oxide). The transparent private electrodes 15 and 25 are connected to the driver, respectively. The ic 50 is formed to drive liquid crystal molecules constituting the liquid crystal layer 30. Further, the transparent electrodes 15, 25 are arranged at right angles to each other in a plan view, so that the above-mentioned liquid crystal display device 1 is a passive matrix type liquid crystal display device. As shown in FIG. 1, the length in the width direction (X direction in the figure) of the second substrate 20 is made the same as the length in the placement direction (X direction in the figure) of the first substrate 10. The length in the longitudinal direction (γ direction in the figure) is shorter than the length in the longitudinal direction (Y direction in the figure) of the i-th substrate 10. Therefore, when the substrates 10 and 20 are superposed and bonded, a part (terminal portion) 10a of the surface on the liquid crystal layer 30 side of the first substrate 10 is exposed. A driver IC (driver 1 (:) 50) is mounted on the terminal portion i0a by face-down mounting such as cog (wafer on glass) mounting. The driver 1 (: 50 can be used, for example, 烊A solder ball constitutes a b GA (ball grid array) type semiconductor element of the terminal 5 1 a or a semiconductor element having bump electrodes disposed along the periphery of the outline of the drive 1C. In addition, 'as shown in Fig. 1, Fig. 3 and Fig. 6 It is shown that a first transparent electrode 15 is drawn to the terminal portion on the first substrate 10! A lead-out wiring 6 on 0a is connected. One end of the lead-out wiring 6 is connected to the transparent electrode 15 and the other end is connected to the driver. 85941 -11-200411303 on the terminal 51a of the moving IC 50. In addition, as shown in Fig. 1, Fig. 3, Fig. 6 and Fig. 7, an electrical connection is formed on the first substrate 10 to supply a driving signal to the driving 1C 50. The flexible printed wiring board 66 and the connection wiring 6b for driving the 1C 50 are used to electrically connect the terminal 51a of the driving IC 50 to one end of the connection wiring 讣. The other of the connection wiring 6b The end portion is formed on the inner side of the substrate than the outer periphery of the i-th substrate, and the connection wiring is formed. The one end portion of 6b is formed on the inner side of the substrate 10 than the other end portion. The lead-out wiring 6 or the connection wiring 6b is made of ITO (indium tin oxide) similarly to the transparent electrode 15. Fig. 6 shows the first and second substrates (a pair of substrates) of the liquid crystal display device of Fig. 1 bonded to each other via a sealing material 40, and at 20 and 20 (assembly drawing). In the case of a liquid crystal display device), the connection wirings 6 | 3 and 1 ^ (:: 66) connected to the driver 1C 50 are cross-sectional schematic diagrams. FIG. 7 shows the driver 1C and the driver 1C when the liquid crystal display device is assembled 50-connection connection wiring and 171 >: a plan view of the connection portion of 66. As shown in FIGS. 6 and 7, on the connection wiring 讣 (on the surface opposite to the substrate 10 side), The Acf film 67 is formed close to the driver IC 50. The connection wiring 6b and the flexible printed wiring board (FPC) 66 are electrically connected through the ACF film 67, and the driver ICs 50 and 1 are electrically connected. ^ (: 66. In FPC 66 'on the surface of a thin film that has both insulation and bendability A plurality of wiring patterns 66a made of a conductive material are formed. One end portion of each of the wiring patterns 66 in the Fpc 66 is formed close to the driver IC 50. One end of one of the wiring patterns 66 is The side is connected to the terminal 50a of the driver IC 50 via ACj ^ 67, 85941 -12- 200411303 connection wiring 6b. The other end of each wiring pattern 66 in the FPC 66 is connected to a connector bit (not shown) The ACF film 67 is a film in which conductive particles such as metal particles such as solder and nickel or metal balls that have been plated with metal are dispersed in an adhesive, and is used for connecting the wiring 6b and the FPC 66. The ACF film 67 is sandwiched between them for heating and pressing, and the connection wiring 6b and the wiring pattern 66a corresponding to the connection wiring 6b are electrically connected through the conductive particles, and are fixed and held on the connection wiring 6b and the FPC 66 by the adhesive. between. In the liquid crystal display device of this embodiment, since
接用配線6b上形成的ACF膜67的形成位置為接近於驅動IC 50的位置，故減小了驅動IC 5〇與acf膜67之間的間隙。由 於儘管上述間隙很小但連接用配線6b的一部分還是露出 了，故最好藉由利用毛細管現象在該間隙中充填紫外線硬 化型樹脂或矽樹脂等的防止電解腐蝕用樹脂8〇來保護連接 用配線6b。上述間隙的距離l最好為〇·2 mm以上至2 mm以 下。如果上述間隙的距離L超過2 mm，則在利用毛細管現 象在該間隙中充填防止電解腐蝕用樹脂8〇時充填變得困 難’如果距離L不到〇·2 mm，則組裝性就成為問題了。 其次，如圖1和圖4中所示，在第2基板2〇上形成了沿X方 向的另一方的透明電極（另一方的電極）25。該透明電極25的 一端25a延長到處於定向膜26的形成區域的外側的密封材料 40的位置上。 此外’如圖3中所示，在第1基板丨〇上除了另外的引出配 85941 -13- 200411303 線7。該引出配線7的一端10a的一側與驅動lc 5〇的端子51& 連接，在被密封材料40包圍的内部（顯示區域）中大致沿丫方 向延伸，在中途在圖中X方向的相反方向上折彎，再者，其 前端（另一端7b)與密封材料40交叉。然後，在夾住液晶層3〇 貼合了第1 '第2基板1〇、20時，以彼此重疊的方式配置了 透明電極25的一端2 5 a和引出配線7.的另一端7b。 在圖5中tf出沿圖3和圖4的V-V線的剖面圖。如圖5中所 不，藉由在第1基板10上形成引出配線7，形成使引出配線7 的剖面成為凸部的凹凸面，此外，藉由在第2基板2〇上形成 透明電極25,形成使透明電極25的剖面成為凸部的凹凸面。 “後，使透明電極25的一端25a與引出配線7的另一端7b、 即凸部彼此間相對，經該密封材料4〇導電性地結合。密封 材料40由用金屬等構成的導電性粒子4〇a和黏合劑樹脂4仙 構成，藉由在一端25a與另一端7b相對的部分中夾入導電性 粒子4〇a，確保了透明電極乃與引出配線7的導電性的連接。 此外，如圖5中所tf，引出配線7由在第}基板丨〇上形成的 導電性防止反射層7c和在導電性防止反射層八上被層積的 透月導电層7d構成。再者，導電性防止反射層&由在第工基 板1 0側形成的低反射性金屬氧化物膜7c 1和在低反射性金 屬氧化物膜乃丨上形成的金屬膜7c2構成。 透明導電層7d例如與透明電極15、25同樣地由IT〇（銦錫 氧化物）等的透明導電性材料構成。此外，導電性防止反射 層7C與透明導電層7d一起對引出配線7賦予導電性，並且藉 人透月導私層7d相比位於顯示面丨a一側來減少引出配線7 85941 200411303 本身的反射率，減少了朝向顯示面1 a 一側的反射光量。即， 構成導電性防止反射層7c的金屬膜7c2對引出配線7賦予導 電性’低反射性金屬氧化物膜7c丨減少了引出配線7本身的 反射率。如果更詳細地敘述，則藉由在透明導電層7d上層 積金屬膜7c2 ’提高了引出配線7的導電性，再者，藉由在 金屬膜7c2的一側形成低反射性金屬氧化物膜7c 1，與只是 金屬膜7c2的情況相比，使引出配線7的反射率減少了。此 外’為了減少在顯示面1 a —側的引出配線7的反射率，必須 在最接近於基板10—側形成低反射性金屬氧化物膜7cl。 此外，最好使用例如Cr作為金屬膜7c2，最好使用例如氧 化鉻作為低反射性金屬氧化物膜7cl。 金屬膜7c2的膜厚在130 nm以上至220 nm以下的範圍内係 較為理想的’在150 nm以上至180 nm以下的範圍内則更為 理想。此外，低反射性金屬氧化物膜7cl的膜厚在30 nm以 上至80 nm以下的範圍内係較為理想的，在4〇 nm以上至60 nm以下的範圍内則更為理想。再者，透明導電層7d的膜厚 在1 00 nm以上至3 00 nm以下的範圍内係較為理想的，在丨5〇 nm以上至250 nm以下的範圍内則更為理想。 如果構成引出配線7的各層7c 1、7c2、7d的膜厚為上述的 範圍，則可使引出配線7的反射率為3%以上至5%以下的範 圍内，此外，可使引出配線7本身的電阻為4 Ω以下、較為 理想的係1·5 Ω以上至3 Ω以下的範圍内。 此外，在圖5中示出了用2層構成了導電性防止反射層7c 的例子，但本發明不限於此，也可用1層構成導電性防止反 85941 -15- 200411303 射層7c。此時，最好用NiCu類合金、Ni類合金等的低反射 性金屬膜來構成導電性防止反射層7c。由於該低反射性金 屬膜同時具備高的導電性和低的反射率，故用單獨的膜可 提鬲引出配線7的導電性，並且可減少反射率。 此外，關於引出配線6，可作成與引出配線7同樣的結構， 也可只由1丁0等的透明導電性材料形成。由於引出配線6與 引出配線7相比其線路長度短，因此電壓下降的程度比引出 配線7少’故可只由ITO等的透明導電性材料來形成。因而， 在本貝施方式中，將引出配線6、7的全部或一部分作成導 電性防止反射層與透明導電層的層積結構即可。 如以上所說明，按照上述的實施方式的液晶顯示裝置1， 藉由將在第1基板1 〇上形成的連接用配線6b上形成的ACF膜 6 7的形成位置足為接近於驅動I c 5 0的位置、也在接近於驅 動1C 50的位置上形成FPC. 66中的配線圖形66a的一方的端 邵’由於與習知液晶顯示裝置相比減小了驅動IC與Acf膜 之間的間隙，故可減少連接用配線6b的露出部，連接用配 線6b難以暴露於空氣等中包含的水分中，能防止連接用配 線6b的電解腐蝕，能構成可靠性高的液晶顯示裝置。此外， 由於在驅動1C 50與ACF膜67的間隙中充填了防止電解腐蝕 用樹脂80，故增加了連接用配線6b的保護效果、可進一步 提高防止電解腐蝕的效果。 此外，在本實施方式的液晶顯示裝置1中，藉由經由各向 異性導電樹脂構成的密封材料40將處於在第1基板1〇一側的 引出配線7連接到處於第2基板2 0 —側的透明電極2 5上，可 85941 -16- 200411303 經引出配線7將透明電極25引出到第1基板1 〇的—個側面— 侧，由此，可將驅動IC 50歸納為1個。 又，在上述的實施方式的液晶顯示裝置中具備的Fpc的配 線圖形不限於圖6或圖7中示出的圖形形狀，可以為其他的 形狀，在驅動1C的附近形成此時的Fpc的配線圖形的_方的 端部（經ACF膜連接到驅動1(：上的一侧的端部）即可。 (發明效果） 如以上所詳細說明，按照本發明的液晶顯示裝置，可防 止為了連接在一方或另一方的基板上安裝的驅動Ic與可撓 性印刷配線基板而形成在上述基板上的連接用配線遭到電 解腐蚀’可構成可靠性高的液晶顯示裝置。 【圖式簡單說明】 圖1係不出作為本發明的實施方式的液晶顯示裝置的分解 亙體圖。 圖2係作為本發明的實施方式的液晶顯示裝置的部分剖面 結構的TF意圖。 圖3係構成圖1中示出的液晶顯示裝置的一方的基板的俯 視圖。 圖4係構成圖1中示出的液晶顯示裝置的另一方的基板的 俯視圖。 圖5係與圖3和圖4的V-V線對應的剖面示意圖。 圖6係示出組裝圖1的液晶顯示裝置時的與驅動IC連接的 連接用配線與FPC的連接部分的剖面示意圖。 圖7係示出組裝圖1的液晶顯示裝置時的與驅動1C連接的 85941 -17- 200411303 連接用配線與F P C的連接邵分的俯視圖。 圖8係示出用1個驅動ic進行驅動的方式的習知液晶顯示 裝置的結構例的立體圖。 圖9係與圖8的IX-IX線對應的剖面示意圖。 圖10係示出與圖8的習知液晶顯示裝置的驅動I c連接的連 接用配線與FPC的連接部分的俯視圖。 【圖式代表符號說明】 1 ·液晶顯示裝置 1 a 顯示面 6 一方的引出配線 6b連接用配線 7 另一方的引出配線 7 c導電性防止反射層（低反射性金屬膜） 7c 1低反射性金屬氧化物膜 7c2金屬膜 7d透明導電層 10 一第1基板（一方的基板） 1 〇a端子部（基板的某一方的液晶層一側的面） b透明電極（一方的電極） 20 一第2基板（另一方的基板） 25透明電極（另一方的電極） 3 〇液晶層 4〇密封材料（向異性導電樹脂） 50 驅動ic 85941 -18-The formation position of the ACF film 67 formed on the connection wiring 6b is close to the position of the driving IC 50, so the gap between the driving IC 50 and the acf film 67 is reduced. Although a part of the connection wiring 6b is exposed in spite of the small gap described above, it is desirable to protect the connection for protection by using a capillary phenomenon to fill the gap with ultraviolet curing resin or silicone resin 80 for preventing electrolytic corrosion. Wiring 6b. The distance l of the gap is preferably 0.2 mm or more and 2 mm or less. If the distance L of the gap is more than 2 mm, it becomes difficult to fill the gap with a resin for preventing electrolytic corrosion 80 by using a capillary phenomenon. If the distance L is less than 0.2 mm, assembly is a problem. . Next, as shown in FIGS. 1 and 4, the other transparent electrode (the other electrode) 25 is formed on the second substrate 20 in the X direction. One end 25a of the transparent electrode 25 is extended to a position of the sealing material 40 outside the formation region of the alignment film 26. In addition, as shown in FIG. 3, 85941 -13-200411303 line 7 is provided on the first substrate in addition to the other lead wires. One side of the one end 10a of the lead-out wiring 7 is connected to the terminal 51 & The upper end is bent, and its front end (the other end 7b) crosses the sealing material 40. Then, when the 1 ', 2nd substrates 10, 20 are bonded to each other with the liquid crystal layer 30 sandwiched therebetween, one end 25a of the transparent electrode 25 and the other end 7b of the lead-out wiring 7 are arranged so as to overlap each other. A cross-sectional view taken along line V-V of FIGS. 3 and 4 is shown at tf in FIG. 5. As shown in FIG. 5, by forming the lead-out wiring 7 on the first substrate 10, a concave-convex surface having a cross-section of the lead-out wiring 7 as a convex portion is formed, and by forming a transparent electrode 25 on the second substrate 20, An uneven surface is formed in which the cross section of the transparent electrode 25 is a convex portion. "After that, one end 25a of the transparent electrode 25 and the other end 7b of the lead-out wiring 7, that is, the convex portions are opposed to each other, and are electrically conductively connected via this sealing material 40. The sealing material 40 is made of conductive particles 4 made of metal or the like 〇a and adhesive resin 4 cents, sandwiching the conductive particles 40a in the part of one end 25a and the other end 7b, to ensure that the transparent electrode is conductively connected to the lead-out wiring 7. In addition, if As shown in FIG. 5, the lead-out wiring 7 is composed of a conductive anti-reflection layer 7c formed on the} th substrate and a meniscus conductive layer 7d laminated on the conductive anti-reflection layer 8. Furthermore, conductive The anti-reflection layer & is composed of a low-reflection metal oxide film 7c 1 formed on the first substrate 10 side and a metal film 7c2 formed on the low-reflection metal oxide film. The transparent conductive layer 7d is, for example, formed with The transparent electrodes 15, 25 are similarly made of a transparent conductive material such as IT0 (indium tin oxide). In addition, the conductive anti-reflection layer 7C and the transparent conductive layer 7d impart conductivity to the lead-out wiring 7 and are transparent to people. Compared with 7d Surface 丨 a side to reduce the lead-out wiring 7 85941 200411303 itself, reducing the amount of reflected light toward the display surface 1 a side. That is, the metal film 7c2 constituting the conductive anti-reflection layer 7c imparts conductivity to the lead-out wiring 7 'The low-reflection metal oxide film 7c 丨 reduces the reflectance of the lead-out wiring 7 itself. If it is described in more detail, by laminating the metal film 7c2 on the transparent conductive layer 7d, the conductivity of the lead-out wiring 7 is improved, and In addition, by forming the low-reflection metal oxide film 7c 1 on one side of the metal film 7c2, the reflectance of the lead-out wiring 7 is reduced compared to the case where the metal film 7c2 is only used. In addition, 'to reduce the display surface 1 The reflectance of the lead wiring 7 on the a side must be formed with a low reflectivity metal oxide film 7cl closest to the substrate 10 side. In addition, it is preferable to use, for example, Cr as the metal film 7c2, and it is preferable to use, for example, chromium oxide as the low Reflective metal oxide film 7cl. The film thickness of the metal film 7c2 is preferably in the range of 130 nm to 220 nm, and more preferably in the range of 150 nm to 180 nm. This In addition, the thickness of the low-reflective metal oxide film 7cl is preferably in a range of 30 nm to 80 nm, and more preferably in a range of 40 nm to 60 nm. Furthermore, it is transparent The thickness of the conductive layer 7d is preferably in a range of 100 nm to 300 nm, and more preferably in a range of 50 nm to 250 nm. Each layer 7c constituting the lead-out wiring 7 When the film thickness of 1, 7c2, and 7d is in the above range, the reflectance of the lead-out wiring 7 can be within a range of 3% to 5%, and the resistance of the lead-out wiring 7 itself can be 4 Ω or less. The ideal range is from 1 · 5 Ω to 3 Ω. Although an example in which the conductive anti-reflection layer 7c is formed by two layers is shown in FIG. 5, the present invention is not limited to this, and the conductive anti-reflection layer 7c may be formed by one layer. In this case, it is preferable to form a conductive anti-reflection layer 7c with a low-reflection metal film such as a NiCu-based alloy or a Ni-based alloy. Since this low-reflection metal film has both high conductivity and low reflectance, the conductivity of the lead-out wiring 7 can be improved by using a separate film, and the reflectance can be reduced. The lead-out wiring 6 may have the same structure as that of the lead-out wiring 7 or may be formed of only a transparent conductive material such as 1 to 0. The lead length of the lead-out wiring 6 is shorter than that of the lead-out wiring 7 because the line length is shorter than that of the lead-out wiring 7 '. Therefore, it can be formed of only a transparent conductive material such as ITO. Therefore, in this embodiment, all or a part of the lead-out wirings 6, 7 may be formed as a laminated structure of a conductive antireflection layer and a transparent conductive layer. As described above, according to the liquid crystal display device 1 of the above-mentioned embodiment, the formation position of the ACF film 67 formed on the connection wiring 6b formed on the first substrate 10 is sufficiently close to the driving I c 5 The FPC is formed at a position close to 0 and a position close to the drive 1C 50. One end of the wiring pattern 66a in 66 is reduced in the gap between the driver IC and the Acf film compared to a conventional liquid crystal display device. Therefore, the exposed portion of the connection wiring 6b can be reduced, the connection wiring 6b is hardly exposed to moisture contained in air, etc., and electrolytic corrosion of the connection wiring 6b can be prevented, and a highly reliable liquid crystal display device can be constructed. In addition, since the gap between the driving 1C 50 and the ACF film 67 is filled with a resin 80 for preventing electrolytic corrosion, the protective effect of the connection wiring 6b is increased, and the effect of preventing electrolytic corrosion can be further improved. In addition, in the liquid crystal display device 1 of the present embodiment, the lead-out wiring 7 on the first substrate 10 side is connected to the second substrate 20-side by a sealing material 40 made of an anisotropic conductive resin. On the transparent electrode 25, the transparent electrode 25 can be led to 85141 -16-200411303 through the lead-out wiring 7 to one side surface of the first substrate 10, so that the driving IC 50 can be grouped into one. In addition, the wiring pattern of the Fpc provided in the liquid crystal display device of the above embodiment is not limited to the shape shown in FIG. 6 or FIG. 7, and may be other shapes. The wiring of the Fpc at this time is formed near the drive 1C. The _ square end of the figure (connected to the driver 1 (: upper end) via the ACF film) is sufficient. (Inventive effect) As explained in detail above, the liquid crystal display device according to the present invention can prevent The connection wiring formed on the above-mentioned driver IC and the flexible printed wiring substrate mounted on one or the other substrate is electrolytically corroded, and a highly reliable liquid crystal display device can be constructed. [Schematic description] FIG. 1 is an exploded perspective view of a liquid crystal display device as an embodiment of the present invention. FIG. 2 is a TF schematic diagram of a partial cross-sectional structure of a liquid crystal display device as an embodiment of the present invention. FIG. 4 is a plan view of the other substrate constituting the liquid crystal display device shown in FIG. 1. FIG. 5 is a pair of VV lines of FIGS. 3 and 4. 6 is a schematic cross-sectional view of a connection portion between the connection wiring connected to the driver IC and the FPC when the liquid crystal display device of FIG. 1 is assembled. Top view of the connection of 85941 -17- 200411303 driving 1C connection to the FPC connection. Fig. 8 is a perspective view showing a structural example of a conventional liquid crystal display device driven by one driving IC. Fig. 9 8 is a schematic cross-sectional view corresponding to the line IX-IX in FIG. 8. FIG. 10 is a plan view showing a connection portion between the connection wiring and the FPC connected to the drive IC of the conventional liquid crystal display device of FIG. ] 1 · Liquid crystal display device 1 a Display surface 6 One lead-out wiring 6b connection wiring 7 The other lead-out wiring 7 c Conductive anti-reflection layer (low-reflection metal film) 7c 1 low-reflection metal oxide film 7c2 metal Film 7d Transparent conductive layer 10 First substrate (one substrate) 1 〇a Terminal portion (one side of the liquid crystal layer on the substrate) b Transparent electrode (one electrode) 20 Second substrate (the other Substrate) 25 transparent electrode (the other electrode) of the liquid crystal layer 3 billion 4〇 sealing material () 50 drives the anisotropic conductive resin ic 85941 -18-