CN1225673C - Liquid crystal display device - Google Patents
Liquid crystal display device Download PDFInfo
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- CN1225673C CN1225673C CNB031436552A CN03143655A CN1225673C CN 1225673 C CN1225673 C CN 1225673C CN B031436552 A CNB031436552 A CN B031436552A CN 03143655 A CN03143655 A CN 03143655A CN 1225673 C CN1225673 C CN 1225673C
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- liquid crystal
- wiring
- drive
- crystal indicator
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13456—Cell terminals located on one side of the display only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Abstract
Provided is a liquid crystal display in which electric corrosion of connecting wires formed on a substrate to connect a driving IC mounted on the substrate with an FPC is prevented. One and the other lead wires to lead one and the other electrodes to one side face of a pair of substrates (10, 20) are formed on either or both of the pair of substrates (10, 20). The driving IC (50) is mounted on one or the other substrate (10, 20) and electrically connected to one or the other lead wire. A connecting wire (6b) to electrically connect the IC (50) and the FPC (66) is formed on the substrate where the IC (50) is mounted. The IC (50) is electrically connected to one end of the wire (6b), and an ACF (anisotropic conductive film) (67) is formed near the IC (50) on the wire (6b) to electrically connect the wire (6b) with the FPC (66) through the ACF (67). One end of a wire pattern (66a) in the FPC (66) is formed near to the IC (50) to electrically connect the IC (50) with the FPC (66).
Description
Technical field
The present invention relates to liquid crystal indicator, particularly relate to the liquid crystal indicator of being connected that can prevent in order to be connected that drive ICs mounted forms on aforesaid substrate with flexible printing wiring substrate on the substrate with the electrolytic corrosion of wiring.
Background technology
For miniaturization, the cost degradation that adapts to nearest electronic installation, adopted drive IC with the liquid crystal indicator of STN type (Super-Twisted Nematic: supertwist to row) from 2 structures that reduce 1.That is, 2 drive IC that will be connected respectively to each transparency electrode of existing shared (common) side and segmentation (segment) side concentrate on side one side of panel, these 2 drive IC are replaced into 1 drive IC drive.
Fig. 8 shows the structure of the existing liquid crystal indicator of the mode that drives with 1 drive IC.
In this liquid crystal indicator, utilize COG (chip on glass) to install on the one-sided substrate 102 that waits in a pair of substrate 101,102 of clamping liquid crystal layer drive IC 103 has been installed.The transparency electrode 104 of a shared side and the transparency electrode 105 of segmentation one side must be connected on this drive IC 103, form lead-out wiring 104a, 105a by the transparent conductivity material that utilizes indium tin oxide (ITO) etc. and carried out being connected of drive IC 103 and transparency electrode 104,105.Drive IC 103 and lead-out wiring 104a be connected with being connected of drive IC 103 and lead-out wiring 105a in used ACF film (Anisotropic conductive film: anisotropic conductive film).
In addition, must the flexible printing wiring substrate (FPC) 106 that this drive IC 103 is supplied with drive signal be connected on this drive IC 103, in the past, as shown in Fig. 9 and Figure 10, utilize above-mentioned transparent conductive material on substrate 102, to form and connect with wiring 104b, drive IC 103 is connected on the end (inboard end) of this connection with the side of wiring 104b, by between this connection is with the opposing party's the end (near the end the periphery of substrate) of wiring 104b and FPC106, clamps ACF film (anisotropic conductive film) 107 and carry out heating and pressurizing, in above-mentioned ACF film conducting particles carried out being connected of electric conductivity to connecting with wiring 106a among the FPC106 with the 104b that connects up.
The side's of the FPC106 that uses in the existing liquid crystal indicator of above-mentioned structure end be configured in drive IC 103 adjoining positions on and covered and be connected with wiring 104b and ACF film 107, stretch out towards the outside from substrate 102 the opposing party's of FPC106 end.In addition, though the wiring 106a among the FPC106 is formed on the position of ACF film 107 tops, be not formed near the position of drive IC 103.
(problem that invention will solve)
But, in the existing liquid crystal indicator of above-mentioned structure, though being connected between drive IC 103 and ACF film 107 with having FPC106 on the wiring 104b, but owing between drive IC 103 and ACF film 107, left gap 110, exposed so between drive IC 103 and ACF film 107, make to be connected, thereby had the situation of being corroded owing to the cause of the moisture that comprises in the air etc. with wiring 104b.In order to solve such problem; the UV resin that filling prevents to corrode usefulness in gap 110 is protected to connect with wiring 104b and is got final product; but owing on gap 110, formed FPC106; so filling UV resin is difficult; form incomplete filling part easily; owing in this part electrolytic corrosion has taken place, the protection that connects with wiring 104b is difficult.
Summary of the invention
The present invention In view of the foregoing carries out, and its purpose is to provide and can prevents in order to be connected the liquid crystal indicator that is connected the electrolytic corrosion of using wiring that drive ICs mounted forms on aforesaid substrate with flexible printing wiring substrate on the substrate.
(solving the means of problem)
To achieve the above object, adopted following structure among the present invention.
Liquid crystal indicator of the present invention is to possess the liquid crystal layer of clamping and opposed a pair of substrate, on the face of liquid crystal layer one side of each substrate, be provided with the liquid crystal indicator of a side and the opposing party's electrode respectively, it is characterized in that: on a certain side of above-mentioned a pair of substrate or two sides, form side that side one side that electrode with an above-mentioned side and the opposing party is drawn out to above-mentioned a pair of substrate uses and the opposing party's lead-out wiring
Drive IC is installed on an above-mentioned side and the opposing party's substrate and it is connected with an above-mentioned side and the opposing party's lead-out wiring electric conductivity ground, on the substrate that has been mounted above-mentioned drive IC, form electric conductivity ground and connect above-mentioned drive IC and being connected that flexible printing wiring substrate is used with wiring, electric conductivity ground connects above-mentioned drive IC on this connects with a side's who connects up end, dispose the ACF film in above-mentioned connection with on connecting up, the distance in the gap of described drive IC and described ACF film is that 0.2mm is above to 2mm, connect above-mentioned connection through above-mentioned ACF film conductivity ground with connecting up and above-mentioned flexible printing wiring substrate, near one side's of the wiring figure above-mentioned drive IC in the above-mentioned flexible printing wiring substrate of formation end has connected to electric conductivity above-mentioned drive IC and flexible printing wiring substrate.
According to described liquid crystal indicator, formation position by the ACF film that will form on wiring in above-mentioned connection is decided to be the position of approaching above-mentioned drive IC, also on approaching the position of above-mentioned drive IC, formed a side's of the wiring figure in the flexible printing wiring substrate end, owing to compare the gap that can reduce between drive IC and the ACF film with existing liquid crystal indicator, so can reduce the exposed division of above-mentioned connection with wiring, above-mentioned connection is difficult to be exposed in the moisture that comprises in the air etc. with wiring, electrolytic corrosion can be prevented to connect, the high liquid crystal indicator of reliability can be constituted with wiring.
In addition; liquid crystal indicator of the present invention is foregoing liquid crystal indicator, in the gap of above-mentioned drive IC and above-mentioned ACF film filling prevent electrolytic corrosion with the resin this point increase is connected with the protection effect that connects up, can further improve the effect that prevents electrolytic corrosion aspect be comparatively desirable.
In addition; liquid crystal indicator of the present invention is foregoing liquid crystal indicator; the distance that makes the gap of above-mentioned drive IC and above-mentioned ACF film be 0.2mm above to the following this point of 2mm be comparatively desirable aspect the following stated several; promptly; can reduce the exposed division that connects with wiring; in addition; when filling prevents that electrolytic corrosion from using resin in this gap; utilize capillarity to come filling to prevent the electrolytic corrosion resin easily; can have no the filling in above-mentioned gap of the ground of omission and prevent the electrolytic corrosion resin, can improve the protection effect that connects with wiring.
Description of drawings
Fig. 1 is the exploded perspective view that illustrates as the liquid crystal indicator of embodiments of the present invention.
Fig. 2 is the synoptic diagram as the cut-away section structure of the liquid crystal indicator of embodiments of the present invention.
Fig. 3 is a side's of the liquid crystal indicator shown in the pie graph 1 the vertical view of substrate.
Fig. 4 is the opposing party's of the liquid crystal indicator shown in the pie graph 1 the vertical view of substrate.
Fig. 5 is the diagrammatic cross-section corresponding with the V-V line of Fig. 3 and Fig. 4.
Fig. 6 is that the connection that is connected with drive IC when the liquid crystal indicator of assembly drawing 1 is shown is with the diagrammatic cross-section of wiring with the coupling part of FPC.
Fig. 7 is that the connection that is connected with drive IC when the liquid crystal indicator of assembly drawing 1 is shown is with the vertical view of wiring with the coupling part of FPC.
Fig. 8 is the stereographic map of structure example that the existing liquid crystal indicator of the mode that drives with 1 drive IC is shown.
Fig. 9 is the diagrammatic cross-section corresponding with the IX-IX line of Fig. 8.
Figure 10 illustrates the connection that is connected with the drive IC of the existing liquid crystal indicator of Fig. 8 with the vertical view of wiring with the coupling part of FPC.
Symbol description
Liquid crystal indicator; The 1a-display surface; 6-one side's lead-out wiring; 6b-connects with wiring; 7-the opposing party's lead-out wiring; 7c-electric conductivity prevents the low reflective metal oxidation film of reflection horizon (low reflective metal film) 7c1-; The 7c2-metal film; The 7d-transparency conducting layer; 10-the 1st substrate (side substrate); 10a-portion of terminal (face of a certain side's of substrate liquid crystal layer one side); 15-transparency electrode (side electrode); 20-the 2nd substrate (the opposing party's substrate); 25-transparency electrode (the opposing party's electrode); The 30-liquid crystal layer; 40-encapsulant (anisotropy electroconductive resin); The 50-drive IC; The 51a-terminal; 66-flexible printed wiring (FPC); The 66a-wiring figure; The 67-ACF film; 80-prevents the electrolytic corrosion resin; The distance in the gap of L-drive IC and ACF film.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.
The exploded perspective view of the liquid crystal indicator of the simple matrix type as embodiments of the present invention shown in Figure 1, the synoptic diagram of the cut-away section structure of the liquid crystal indicator of present embodiment shown in Figure 2.In addition, the vertical view of a side's of the liquid crystal indicator shown in the pie graph 1 shown in Figure 3 substrate, the vertical view of the opposing party's of the liquid crystal indicator shown in the pie graph 1 shown in Figure 4 substrate.Have again, in Fig. 3, omitted the diagram of flexible printing wiring substrate and ACF film.
As shown in Fig. 1 and Fig. 2, the liquid crystal indicator 1 of present embodiment possesses clamps liquid crystal layer 30 and opposed the 1st substrate (side substrate) the 10 and the 2nd substrate (the opposing party's substrate) 20 and constituting, and is provided with a side transparency electrode (side electrode) 15 and the opposing party's transparency electrode (the opposing party's electrode) 25 respectively on the face of liquid crystal layer 30 1 sides of each substrate 10,20.In addition, between each substrate 10,20, formed the encapsulant 40 that constitutes by the resin that comprises conducting particles (anisotropic conductive resin), by it being held between each substrate 10,20 at the inboard of sealing material 40 configuration liquid crystal layer 30 with ring-type.
As shown in Fig. 1 and Fig. 2, formed in order to drive liquid crystal layer 30 the upwardly extending transparency electrode 15 in Y side (side electrode) in the drawings by following sequential cascade in liquid crystal layer 30 1 sides of the 1st substrate 10 (side substrate), make in protection transparency electrode 15 that the concavo-convex planarization that caused by this transparency electrode 15 uses film 14 and control constitute the alignment films 16 of orientation usefulness of the liquid crystal molecule of liquid crystal layer 30.In addition, liquid crystal layer 30 1 sides at the 2nd substrate (the opposing party's substrate) 20 formed reflecting body 37 by following sequential cascade, carried out colored showing the color filter 13 of usefulness, the alignment films 26 of the orientation usefulness of the liquid crystal molecule of the transparency electrode 25 (the opposing party's electrode) of filming 24, extending on the directions X in the drawings that makes in protection and when covering reflecting body 37 that the concavo-convex planarization that caused by reflecting body 37 or color filter 13 uses and control formation liquid crystal layer 30 in order to drive liquid crystal layer 30.Have again, between transparency electrode 25 and alignment films 26, also formed film (omitting diagram).
Reflecting body 37 is formed by organic membrane 11 and the metallic reflective coating 12 that forms on this organic membrane 11.
Moreover, be provided with phase difference film 17 and polaroid 18 in a side opposite with liquid crystal layer 30 1 sides of the 2nd substrate 20, a side opposite with liquid crystal layer 30 1 sides of the 1st substrate 10 by following sequential cascade phase difference film 27 and polaroid 28.The lateral surface of polaroid 28 becomes display surface 1a.In addition, dispose conduct in the outside of polaroid 18 and in liquid crystal indicator 1, carried out the back of the body irradiation source 5 that transmission shows the light source of usefulness.
Transparency electrode the 15, the 25th is fitly arranged the electrode of the flat shape that has formed a plurality of strips that are made of the nesa coating of ITO (indium tin oxide) etc., transparency electrode 15,25 is connected respectively on the drive IC 50, forms in order to drive the liquid crystal molecule that constitutes liquid crystal layer 30.In addition, with mutually on vertical view rectangular mode dispose transparency electrode 15,25, make above-mentioned liquid crystal indicator 1 become the liquid crystal indicator of passive matrix.
As shown in fig. 1, make the length of Width (directions X among the figure) of the 2nd substrate 20 identical with the length of the Width (directions X among the figure) of the 1st substrate 10, in addition, the length of the longitudinal direction (Y direction among the figure) of the 2nd substrate 20 is lacked than the length of the longitudinal direction (Y direction among the figure) of the 1st substrate 10.Therefore, in conjunction with each substrate 10,20 o'clock, a part (portion of terminal) 10a of face of liquid crystal layer 30 1 sides of the 1st substrate 10 is exposed overlapping.Drive IC (driver IC) 50 is installed in the ventricumbent installation that utilizes COG (chip on glass) to install etc. on this portion of terminal 10a.This drive IC 50 for example can be used solder ball to constitute BGA (ball grid array) the N-type semiconductor N element of terminal 51a or dispose the semiconductor element etc. of bump electrode along the profile periphery of drive IC.
In addition, as shown in Fig. 1, Fig. 3 and Fig. 6, on the 1st substrate 10, formed transparency electrode 15 with a side and be drawn out to lead-out wiring 6 on the portion of terminal 10a.One end of lead-out wiring 6 is connected on the transparency electrode 15, the other end is connected on the terminal 51a of drive IC 50.
In addition, as shown in Fig. 1, Fig. 3, Fig. 6 and Fig. 7, on the 1st substrate 10, formed electric conductivity ground and connected drive IC 50 is supplied with being connected with wiring 6b of flexible printing wiring substrate 66 that drive signals use and drive IC 50 usefulness, the terminal 51a electric conductivity ground of drive IC 50 has been connected on the end that connects a side who uses the 6b that connects up.Connect with the opposing party's of wiring 6b end with compare the inboard that is in substrate in the neighboring of the 1st substrate 10 and be formed, connect to compare in the inboard of substrate 10 with above-mentioned the opposing party's end and be formed with the above-mentioned side's of the 6b that connects up end.
Above-mentioned lead-out wiring 6 or connect with wiring 6b and above-mentioned transparency electrode 15 similarly by the nesa coating formation of ITO (indium tin oxide) etc.
Have again, Fig. 6 be illustrate through encapsulant 40 fitted Fig. 1 liquid crystal indicator the 1st with the connection that is connected with drive IC 50 of the 2nd substrate (a pair of substrate) 10, the 20 o'clock liquid crystal indicator of the assembly drawing 1 (time) with the diagrammatic cross-section of wiring 6b with the coupling part of FPC66, Fig. 7 is the vertical view of the coupling part of the connection that is connected with drive IC 50 usefulness wiring 6b when the liquid crystal indicator of assembly drawing 1 is shown and FPC66.
As shown in Fig. 6 and Fig. 7, (on the surface of the opposite side of substrate 10 1 sides) forms ACF film 67 in the mode that approaches drive IC 50 on connecting with the 6b that connects up, by having connected with wiring 6b and flexible printing wiring substrate (FPC) 66, drive IC 50 and FPC66 have been connected to electric conductivity through this ACF film 67 electric conductivity ground.
In FPC66, have at the same time on the surface of thin film of insulativity and flexible and formed many wiring figure 66a that constitute by conductive material.One side's of each wiring figure 66 among the FPC66 end forms in the mode that approaches drive IC 50.One side's of these wiring figures 66 end one side is connected on the terminal 50a of drive IC 50 with wiring 6b through ACF film 67, connection.The opposing party's of each wiring figure 66 among the FPC66 end is connected to omits on illustrated connector or terminal, the parts etc.
ACF film 67 is the films of conducting particles that disperseed the metallics of scolding tin, nickel etc. or carried out the baton round etc. of metal plating in bonding agent, carry out heating and pressurizing by between connecting, clamping ACF film 67 with wiring 6b and FPC66, connect through above-mentioned conducting particles electric conductivity ground with wiring 6b with corresponding to the wiring figure 66a that is connected with wiring 6b, utilize above-mentioned adhesive securement and remain on to connect to use and connect up between 6b and FPC66.
In the liquid crystal indicator of present embodiment, be the position of approaching drive IC 50 owing to make the formation position of the ACF film 67 that on connecting, forms as mentioned above, so reduced the gap between drive IC 50 and the ACF film 67 with wiring 6b.Although connection has still been exposed with the part of wiring 6b because above-mentioned gap is very little, so preferably by utilizing capillarity electrolytic corrosion that prevents of filling uv-hardening resin or silicone resin etc. in this gap to protect connection wiring 6b with resin 80.It is above to 2mm that the distance L in above-mentioned gap is preferably 0.2mm.If the distance L in above-mentioned gap surpasses 2mm, then filling becomes difficult when utilizing capillarity filling prevents electrolytic corrosion with resin 80 in this gap, if distance L less than 0.2mm, then assembleability has just become problem.
Secondly, as shown in figs. 1 and 4, on the 2nd substrate 20, formed transparency electrode (the opposing party's electrode) 25 along the opposing party of directions X.One end 25a of this transparency electrode 25 extends on the position of encapsulant 40 in the outside in the formation zone that is in alignment films 26.
In addition, as shown in Figure 3, on the 1st substrate 10 except other lead-out wiring 7.The side of one end 10a of this lead-out wiring 7 is connected with the terminal 51a of drive IC 50, in the inside (viewing area) that sealed material 40 surrounds, roughly extend along the Y direction, bending on the reverse direction of directions X in the drawings halfway, moreover its front end (other end 7b) intersects with encapsulant 40.Then, clamping fitted the 1st, the 2nd substrate 10,20 o'clock of liquid crystal layer 30, an end 25a of transparency electrode 25 and the other end 7b of lead-out wiring 7 have been disposed in the mode that overlaps each other.
The sectional view of the V-V line along Fig. 3 and Fig. 4 shown in Figure 5.As shown in Figure 5,, form the male and fomale(M﹠F) that the section that makes lead-out wiring 7 becomes protuberance, in addition,, form the male and fomale(M﹠F) that the section that makes transparency electrode 25 becomes protuberance by on the 2nd substrate 20, forming transparency electrode 25 by on the 1st substrate 10, forming lead-out wiring 7.Then, make an end 25a of transparency electrode 25 and lead-out wiring 7 other end 7b, be that protuberance is relative to each other, through the ground combination of sealing material 40 electric conductivity.Encapsulant 40 is made of the electroconductive particle 40a and the adhesive resin 40b that constitute with metal etc., by sandwiching electroconductive particle 40a in the part that at one end 25a is relative with other end 7b, guaranteed being connected of electric conductivity of transparency electrode 25 and lead-out wiring 7.
In addition, as shown in Figure 5, lead-out wiring 7 is prevented reflection horizon 7c and is prevented that in electric conductivity the folded transparency conducting layer 7d of reflection horizon 7c upper quilt layer from constituting by the electric conductivity that forms on the 1st substrate 10.Moreover electric conductivity prevents that reflection horizon 7c from being made of low reflective metal oxidation film 7c1 that forms in the 1st substrate 10 1 sides and the metal film 7c2 that forms on low reflective metal oxidation film 7c1.
Transparency conducting layer 7d for example similarly is made of the transparent conductivity material of ITO (indium tin oxide) etc. with transparency electrode 15,25.In addition, electric conductivity prevents that reflection horizon 7c from giving electric conductivity with transparency conducting layer 7d to lead-out wiring 7, be positioned at the reflectivity that display surface 1a one side reduces lead-out wiring 7 itself by comparing simultaneously, reduced reflection light quantity towards display surface 1a one side with transparency conducting layer 7d.That is, constitute electric conductivity and prevent that the metal film 7c2 of reflection horizon 7c from giving electric conductivity to lead-out wiring 7, low reflective metal oxidation film 7c1 has reduced the reflectivity of lead-out wiring 7 itself.If narration in more detail, then by stacked metal film 7c2 on transparency conducting layer 7d, improved the electric conductivity of lead-out wiring 7, moreover, form low reflective metal oxidation film 7c1 by a side at metal film 7c2, compare with the situation that is metal film 7c2, the reflectivity of lead-out wiring 7 has been reduced.In addition, in order to reduce reflectivity, must form low reflective metal oxidation film 7c1 approaching most substrate 10 1 sides at the lead-out wiring 7 of display surface 1a one side.
In addition, for example preferably using, Cr preferably uses for example low reflective metal oxidation film 7c1 of chromium oxide conduct as metal film 7c2.
The thickness of metal film 7c2 is comparatively desirable to the scope below the 220nm more than 130nm, and is then even more ideal to the scope below the 180nm more than 150nm.In addition, the thickness of low reflective metal oxidation film 7c1 is comparatively desirable to the scope below the 80nm more than 30nm, and is then even more ideal to the scope below the 60nm more than 40nm.Moreover the thickness of transparency conducting layer 7d is comparatively desirable to the scope below the 300nm more than 100nm, and is then even more ideal to the scope below the 250nm more than 150nm.
If each layer 7c1, the 7c2 of formation lead-out wiring 7, the thickness of 7d are above-mentioned scope, the reflectivity that then can make lead-out wiring 7 be more than 3% to the scope below 5%, in addition, can make the resistance of lead-out wiring 7 itself is that 4 Ω are following, comparatively to it is desirable to 1.5 Ω above to the scope below 3 Ω.
In addition, figure 5 illustrates and constituted electric conductivity with 2 layers and prevent the example of reflection horizon 7c, but the invention is not restricted to this, also available 1 layer constitutes electric conductivity and prevents reflection horizon 7c.At this moment, the low reflective metal film of the most handy NiCu class alloy, Ni class alloy etc. constitutes electric conductivity and prevents reflection horizon 7c.Owing to should possess high electric conductivity and low reflectivity simultaneously by low reflective metal film, so can improve the electric conductivity of lead-out wiring 7 with independent film, the while can reduce reflectivity.
In addition,, can make the structure same, also can be only form by the transparent conductivity material of ITO etc. with lead-out wiring 7 about lead-out wiring 6.Because lead-out wiring 6 is compared its line length with lead-out wiring 7 short, so the degree that voltage descends lack than lead-out wiring 7, so can form by a transparent conductivity material by ITO etc.Thereby, in the present embodiment, all or part of of lead-out wiring 6,7 made electric conductivity prevent that the stepped construction of reflection horizon and transparency conducting layer from getting final product.
As above illustrated, liquid crystal indicator 1 according to above-mentioned embodiment, formation position by the ACF film 67 that will form on the 6b that connects up in the connection that forms on the 1st substrate 10 is decided to be the position of approaching drive IC 50, also on the position of approaching drive IC 50, form the side's of the wiring diagram 66a among the FPC66 end, owing to compare the gap that has reduced between drive IC and the ACF film with existing liquid crystal indicator, so can reduce the exposed division that connects with wiring 6b, connect with the 6b that connects up and be difficult to be exposed in the moisture that comprises in the air etc., electrolytic corrosion can be prevented to connect, the high liquid crystal indicator of reliability can be constituted with wiring 6b.In addition and since in the gap of drive IC 50 and ACF film 67 filling prevent electrolytic corrosion with resin 80, so increased the protection effect that connects with the 6b that connects up, can further improve the effect that prevents electrolytic corrosion.
In addition, in the liquid crystal indicator 1 of present embodiment, the lead-out wiring 7 that will be in the 1st substrate 10 1 sides by the encapsulant 40 that constitutes via anisotropic conductive resin is connected on the transparency electrode 25 that is in the 2nd substrate 20 1 sides, can transparency electrode 25 be drawn out to side one side of the 1st substrate 10 through lead-out wiring 7, thus, drive IC 50 can be reduced 1.
Have again, the wiring figure of the FPC that possesses in the liquid crystal indicator of above-mentioned embodiment is not limited to the graphics shape shown in Fig. 6 or Fig. 7, can be other shape, get final product in the end (receiving the end of the side on the drive IC through the ACF symphysis) of a side of the wiring figure of the formation FPC at this moment drive IC near.
(invention effect)
As above explaining, according to liquid crystal indicator of the present invention, can prevent End drive IC and flexible printed wiring in order to install on the substrate that is connected a side or the opposing party Substrate and the connection that forms at aforesaid substrate can consist of reliability with the electrolytic etching of wiring High liquid crystal indicator.
Claims (3)
1. a liquid crystal indicator possesses the liquid crystal layer of clamping and opposed a pair of substrate, is provided with a side and the opposing party's electrode on the face of liquid crystal layer one side of each substrate respectively, it is characterized in that:
On a certain side of described a pair of substrate or two sides, form side that side one side that electrode with a described side and the opposing party is drawn out to described a pair of substrate uses and the opposing party's lead-out wiring,
Drive IC is installed on a described side and the opposing party's substrate and it is connected with a described side and the opposing party's lead-out wiring electric conductivity ground,
On the substrate that has been mounted described drive IC, form electric conductivity ground and connect described drive IC and being connected that flexible printing wiring substrate is used with wiring, electric conductivity ground connects described drive IC on this connects with a side's who connects up end, dispose the ACF film in described connection with on connecting up, the distance in the gap of described drive IC and described ACF film is that 0.2mm is above to 2mm, connect described connection through described ACF film conductivity ground with connecting up and described flexible printing wiring substrate, near one side's of the wiring figure described drive IC in the described flexible printing wiring substrate of formation end has connected to electric conductivity described drive IC and flexible printing wiring substrate.
2. according to the liquid crystal indicator described in the claim 1, it is characterized in that:
In the gap of described drive IC and described ACF film filling prevent the electrolytic corrosion resin.
3. according to the liquid crystal indicator described in the claim 2, it is characterized in that:
Prevent that the electrolytic corrosion resin from being uv-hardening resin or silicone resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002222049A JP2004061979A (en) | 2002-07-30 | 2002-07-30 | Liquid crystal display |
| JP2002222049 | 2002-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1475836A CN1475836A (en) | 2004-02-18 |
| CN1225673C true CN1225673C (en) | 2005-11-02 |
Family
ID=31492100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031436552A Expired - Fee Related CN1225673C (en) | 2002-07-30 | 2003-07-29 | Liquid crystal display device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2004061979A (en) |
| KR (1) | KR100557260B1 (en) |
| CN (1) | CN1225673C (en) |
| TW (1) | TWI307439B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005302999A (en) * | 2004-04-12 | 2005-10-27 | Kawasaki Microelectronics Kk | Semiconductor integrated circuit |
| JP2006066676A (en) * | 2004-08-27 | 2006-03-09 | Seiko Epson Corp | Electro-optical device and electronic machine |
| JP4649151B2 (en) * | 2004-09-09 | 2011-03-09 | シャープ株式会社 | Display device, method for manufacturing the display device, and liquid crystal display device |
| CN100452276C (en) * | 2005-03-14 | 2009-01-14 | 四川世纪双虹显示器件有限公司 | Method for mfg. plasma display |
| JP4575845B2 (en) * | 2005-06-06 | 2010-11-04 | アルプス電気株式会社 | Wiring connection structure and liquid crystal display device |
| JP5016850B2 (en) * | 2006-05-30 | 2012-09-05 | キヤノン株式会社 | Liquid crystal display device and liquid crystal projector device |
| CN101285972B (en) * | 2007-04-10 | 2012-08-22 | 奇美电子股份有限公司 | Joining method, display apparatus and display |
| CN103777385A (en) * | 2014-02-12 | 2014-05-07 | 苏州众显电子科技有限公司 | Connecting structure of FPC and LCD substrate |
| KR20210052798A (en) | 2019-10-31 | 2021-05-11 | 삼성디스플레이 주식회사 | Touch sensor and display device including the same |
-
2002
- 2002-07-30 JP JP2002222049A patent/JP2004061979A/en active Pending
-
2003
- 2003-07-02 KR KR1020030044642A patent/KR100557260B1/en not_active IP Right Cessation
- 2003-07-22 TW TW092119985A patent/TWI307439B/en not_active IP Right Cessation
- 2003-07-29 CN CNB031436552A patent/CN1225673C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100557260B1 (en) | 2006-03-07 |
| JP2004061979A (en) | 2004-02-26 |
| TWI307439B (en) | 2009-03-11 |
| CN1475836A (en) | 2004-02-18 |
| KR20040011353A (en) | 2004-02-05 |
| TW200411303A (en) | 2004-07-01 |
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