200408457 玖、發明說明： 發明所屬之技術領域 本發明與2002.7.1 9美國專利申請第60/3 97,1 62號、已 准美國專利第 6,348,098 號之 ’’Fluid Flow Measuring and Proportional Fluid Flow Control Device(流量計測及比例 式流量控制裝置）相關，而本發明依2002.7.1 9美國申請之 第 60/397,053 號之，’Liquid Flow Controller and Precision Dispense Apparatus and System(流體流量控制器及精準分 配設備和系統）”要求優先權。 先前技術 在製造半導體時，諸如去離子化水、光阻、電介質上之 自旋劑（s p i η ο n d i e 1 e c t r i c s )、玻璃上之自旋劑（s p i η ο η glass)、聚亞醯胺、顯影劑、化學機械性拋光（CMP)漿體… 等各種不同之流體，必須精準的分配並沉積於擬處理之基 板上。例如，以傳統式所應用之裝置而言，擬作加工之晶 片係置設在一適當之噴嘴下方，之後以噴嘴分配噴灑預定 量之液體或漿體於晶片上，對晶片作被覆或處理。該預定 量非僅以沉積於晶片上之液體的絕對量或物質量爲前提， 尙依泵浦之循環數、配管管徑或流體周遭環境之其他特性 等而定。典型的是，之後即把晶片轉動，以令所沉積之液 體完全分配於整個晶片之表面。可立即淸楚得知的是，分 配之比率及所沉積之液體量等均已達臨界點，極易導致問 題。 當流經噴嘴之流體停止時，例如在兩個晶片處理過程之 •6- 200408457 間停止時，則噴嘴上因存在有壓差（Potential)，故乃形成液 滴（droplet)，並滴落於噴嘴下方之晶片上。此時破壞晶片 上所形成之圖型，則晶片必須重新處理或拋棄。爲了防止 在噴嘴上形成有害之液滴，一般係使用吸回或停止/吸回閥 爲之。後者之閥，典型的爲一種雙氣動式控制閥對，其中 一只閥係用以停止流動至噴嘴之液體，另一只閥則係用以 把噴嘴之分配端或出口之液體予以吸回。此種作法，不僅 可有助於防止噴嘴口形成液滴及滴落，並可有助於防止液 體暴露面之乾固，避免噴嘴之阻塞致使出口之流體含量減φ 少〇 對於大型晶片（例如直徑3 00mm以上）之被覆亦有問題， 因會產生擾流（t u r b u 1 e n c e )。傳統上，晶片之轉速係用以把 施加於其中心之被覆用流體，輻射式的朝外擴散至晶片之 緣部。然而，此種方式將在晶片之整面上造成湍急之氣流 ，致使被覆未能平坦及均勻。固然可減低大型晶片之轉速 以減低晶片表面上之擾流，但此又造成新的問題。倘把該 種速度降低，則晶片表面上流體之流速即趨緩，即有可能肇 流體未全達於晶片端緣便已停止或已乾固。 半導體製造上用以施加液體者，傳統上係使用泵浦。但 是，所適用之泵浦均極價昂，且因過度的磨耗，故須經常 更換。此外，此種泵浦之腳印可能太大而須作矯正使其合 適，雖非可供全部、但可供大部分所須之應用。 含有差壓計測之液體流量控制器，如NT6 5 00(Entegris Corp· Chaska，MN出品）雖可採用，但該種控制器無法適用 200408457 於不问流量及/或不问黏度之較覓朝圍。故乃希求提供一種 可容易調整壓力降之解決方案。 因之，乃希提供一種流量測量及供給（d i s p e n s e，或稱分 配、施加等）系統，可精準的、重複的供給流量而無上述各 種缺點者。此外，本發明亦提供所希或所需液體流量之精 準控制。 再者，更希提供一種無泵浦系統，而可用以使流體可作 精準、重複之供給者。 此外，尤希提供一種氣動型比例式流量閥，其爲線性或φ 實質上爲線性，壓力降爲最小，且幾無或無磁滯者。 發明內容 本發明可解決前述諸種問題，依本發明，係包括裝置及 控制系統，用以監視（最好爲數位式）及/或控制施加於例如 比例式流體控制閥等氣動負載之壓力，並應用來自反應於 流量之流體測量裝置的測量輸入，利用此種液體測量輸入 可控制施加於氣動負載之壓力，則氣動負載即可增加或減 少（比例式的開啓或關閉氣動閥），以改變流體之流量爲希<1 望之値。又，氣動負載亦可因應流體溫度及黏度之變化而 作調整（比例式的啓開或關閉氣動閥）。 本發明之諸實施例，係提供一種流體測量裝置’基於一 其流體與比例式流體控制閥相通之摩擦式流量元件、橫跨 於其間所造成之壓力降，乃可產生一流量測量信號。在摩 擦式流量元件之出口處或附近，及其出口處或附近，均可 測得流體壓力，所測得之信號可予放大，且其間所致之壓 -8- 200408457 力m可予變換爲流體之流夏輸出，並可作控制。流量輸出 可送至一控制器，用以調節一個或多個閥之流量爲所希之 値。 本發明亦提供一種可適用於各種不同流體之控制系統， 並可適用於各種不同黏度之流體。而其可依低成本、彈性 化方式作精準及重複之流量控制與供給性能，再者，亦可 迅速的反應隨時之過程變化，並可使操作之難度降至最低 者。 本發明亦係關於一種比例式流體控制閥，則利用此種閥馨 之流體控制器及馬達泵浦系統，即可改良其線性並減少磁 滯。此閥可令流體平順、穩定的流動，實質上之流動係成 線性方式，流體之翻動甚小。此閥最好爲氣動式。此閥不 會產生溫度，且此閥可用任何適當裝置使其動作，包括步 進式馬達、線性馬達、聲音線圈或其他施力動作器等。 本發明亦係關於一種輔助性輸入模組，其上游之流體係 與一流量測量裝置相連通，該流量測量裝置則係配設於馬 達泵浦系統中，則可用以調節進入該流量測量裝置之前的着 流體者。此一模組可自例如一桶（b a r r e 1)之無壓力化源作塡 補。此一模組尙可由一壓力化饋送線（機房饋給或一壓力化 筒）對不適當或過度的流體壓力作補償。此一模組復可對系 統內使用之流體消泡。 本發明尙提供一無馬達泵浦系統，可適用於各種不同之 流體及饋送源，故在半導體之製造中，即可令多數的供液 點作成標準化，並可使消費者作模組化之其他特性的配置 -9- 200408457 ，諸如過濾及溫度控制等。 本發明復提供一種泛用之模製閥體，較諸機械式之閥體 而言，本發明之閥體僅須少數組件即可。在一實施例中， 該模製閥體特別設計用於流量控制，且包含兩個具有精準 定位之流道的感知器殼體，使空間作最恰當之使用。一個 或複數個感知器殻體可予以分開形成而作爲內嵌（inserts) ，乃可作各種不同定位之裝設。在閥穴之對向端內裝設氣 動式及機械式組件，則系統之差壓即可反向運作，且閥之 差壓上游可予記錄以監視供應之壓力。 _ 本發明之一實施例，可包括一套儲存於一電腦記憶體上 、並可用一個或多個處理器執行之電腦可讀指令，該套電 腦可讀指令包括可用以執行接收一上游壓力信號；接收一 下游壓力信號；計算一錯誤信號；及基於該上游壓力信號 、下游壓力信號及錯誤信號而計算一閥控制信號；等之指 依本發明之另一實施例，其裝置係包括有一套儲存於電 腦可讀記憶體上、並可用一個或多個處理器執行之電腦可春 讀指令，該套電腦可讀指令包括可用以執行接收一上游壓 力信號；接收一下游壓力信號；及基於所對應之閥的閥增 益曲線而決定用於一特定閥之閥增益，其中該閥增益之變 化係依該特定閥之位置而定；及基於上游壓力信號、下游 壓力信號、錯誤信號、與閥增益等而計算一閥控制信號； 等指令。 本發明之另一實施例，其裝置係包括一套儲存於電腦可 -10- 200408457 讀記憶體上、而可用一個或多個處理器執行之指令，該套 電腦可讀指令包括可用以執行接收一上游壓力信號；接收 一下游壓力信號；基於用於上游壓力信號與下游壓力信號 之比例、積分與導數等數値而計算錯誤信號；將一錯誤增 益加諸於該錯誤信號；基於所對應閥之閥增益曲線而決定 用於一特疋閥之閥增益，其中閥增益係依該特定閥之位置 而改變；基於上游壓力信號、下游壓力信號、錯誤信號、 及閥增益等而計算一閥控制信號；及基於一套過去位置之 數値而適當的調整閥控制信號；等指令。 實施方式 · 首先’如第1圖所示，係依本發明之一代表性實施例之 流體流動（量）控制器方塊圖。一流體控制裝置，例如以氣 壓動作之流體控制閥1 0 ’具有一流體入口之線路1 2及一 流體出口之線路1 3，用以作液體之供應至例如基板、晶圓 (未示）等之使用點。流體出口線路1 3與一摩擦式流量元件 1 5之流體相通，則存在於流體控制閥1 〇之全部流體乃可 進入摩擦式流量元件1 5。例如壓力變換器之一第1壓力感 知器24 ’其可和流體控制閥1 〇作成一體，係設在摩擦式胃 流量兀件1 5之入口處或附近（例如位在流體控制閥1 0之出 口處或附近），以感知一第1壓力，及例如壓力變換器之一 第2壓力感知器2 5，係設在摩擦式流量元件1 5之出口處 或附近’以感知一第2壓力。此外，亦可應用一種單一壓 差之感知裝置。壓力感知器接觸流體部分最好以惰性材料 衣成（依所應用之流體而疋）’例如藍寶石（S a P P ^ i r e )、或施 加被覆材料’例如Perfluorοροίymer等，以不和流體直接 -11- 200408457 接觸。適當壓力感知器之細節如第7圖之例示。因之，殻 體60係具有一流體入口 6 1及與該入口 6 1相隔開之一流體 出口 62。壓力及溫度感知器64係以Perfluoroelastomer 0 形環密封於殼體60內。端蓋65係以所示、例如多數只不 鏽鋼螺栓或梢件66聯接於殻體60。感知器64係感知入口 6 1與出口 62間之流體流路內液體的壓力與溫度，並把所 感知之壓力與溫度信號送至控制器。 再回到第1圖，一氣動型比例式控制閥、例如電磁閥， 係氣動式的連接於流體控制閥1 0。各壓力感知器2 4、2 5 (或單一壓差感知裝置）係接於例如具有比例、積分及導致 (PID)回授組件之電腦處理器或控制電路30。因各感知器 24、25係對各流體線路之壓力與溫度取樣，故係取樣之資 料送於控制器3 0。控制器3 0則比較送來之各項數値，並 計算橫跨於摩擦流量元件1 5間之壓力差，詳情將於下述。 基於壓力降之一來自控制器3 0的信號，係送至氣動型比例 式控制閥2 0，以調節流體控制閥1 0，最好則是在補償溫度 、及/或黏度及/或密度之後爲之。 < 較特別者，本系統最好是使用適當之流體，例如去離子 化水、或異丙基酒精等作爲一流體標準而予以校正。例如 ，此系統一旦校正趨於標準，則擬供給之流體的特性、例 如黏度及密度等，即可自動的輸入或決定之，如是，擬供 給之液體即可和標準作比較並建立彼此間之關係。基於此 一關係，所測得橫跨摩擦式流量元件間之壓力降（選用作溫 度、黏度等之校準），乃成比較於與所希或目標流量之流量 -12- 200408457 相關聯’且流體控制閥l 〇乃藉氣動型比例式控制閥2 〇予 以調節之。 屬於獨立性之一吸回閥2 1，最好爲一種使用者可程式之 比例閥’係與例如電磁閥之比例式控制閥（其可相同於或不 同於氣動型比例式控制閥1 0)相通，並以控制器（或以不同 之控制器）作控制。當流體之供給停止或流通時，此一吸回 閥即動作’則當流體供給之動作中斷時，即可減少或抑制 液滴滴落於晶圓上，並把液體自供給噴嘴吸回，以減少或 防止流體暴露於大氣中。吸回閥啓開或關閉率或程度係經· 控制者。吸回閥2 1最好設在流體控制閥丨〇之下游。 控制施加於流體控制閥1 0及/或吸回閥2 1之壓力，即可 控制各種流體之供給參數。例如，所供給之流體爲低黏度 液體時，使用壓力即可精準的調節液體控制閥1 〇，以確保 液體作均勻之供給。相同的，因流體排放點之流量係依比 率以該吸回閥3 1吸回，故可控制流體之流量。一旦所使用 之特定流體控制閥1 0的壓力對容積關係特性化後，利用本 發明之系統即可獲得不受限制之彈性。確實，供給之壓力# 爲供液品質（例如均勻性）之良好指標，但對所有之應用而 言，並不存在有’’理想性"供給壓力之型式，且在所有的液 體控制中，該種理想性壓力亦無法前後均爲相同。本發明 之控制系統，一旦知曉流體控制閥之特性後，流程工程師 即可調整流體之供給壓力以達成用於特定流程所使用之 "理想型式’’。 第8A〜8E圖爲依本發明一代表性實施例之一體式流體控 -13- 200408457 制閥1 〇與感知器總成。此閥實質上爲線性，其含義爲作用 於隔膜上之動作壓力增加時，流體之流量即減小。此外， 此閥之磁滯甚小。最好是，壓力（及溫度）感知器均設在流 體之流注內’且殼體60最好與閥之主殻體70 —體形成之 ’（因之’感知流體壓力與溫度）可恰在摩擦式流量元件入 口之前爲之。 特別如第8Β、8C、8D及8Ε圖所示，閥頂部端蓋71含 有兩個同心之圓形環套8 4、8 5，兩者間可界定一圓溝，以 容納氣動環74之一合成橡膠〇環72，用以把閥氣動式隔鲁 膜7 3封閉於殻體內。對向之螺紋式閥扣7 6用以夾置閥上 部隔膜77與閥底部隔膜78，且被彈簧80偏動。其內部總 成係和螺合於不鏽鋼螺栓7 5之螺紋扣7 6持住在一起，而 其外部總成則係和閥底部端蓋8 2、不繡鋼栓梢或螺栓8 3 、及閥上部端蓋7 1等持住在一起。聯結於閥上部端蓋7 0 者爲一按入連通式另件，用以和具有適當配管或類似品之 氣動型比例式控制閥20達成氣動之連接。流體控制閥1 〇 中之流路（入口與出口間）並非直列，故可進一步降低壓力· 降及未旋刮之容積，如第7Α〜7D圖之例示。閥之入、出的 偏位流路易於使稠狀物或其他流體順暢流動，並可使蓄積 最少。 流體進入閥入口 1 2並在線性流路1 2 Α中流動，直到經入 口穴99抵達圓形穴90爲止。流體在穴90內係傾向作迴旋 ，之後，依施加之氣壓的動作，乃使閥打開，流動乃流動 ，越過隔膜77、78而進入狹窄之圓形通道92並進入穴89 -14- 200408457 。在穴8 9內可產生藉由線性路徑1 3 A而朝向出口（經出口 孔8 5 )之迴旋流體流動路徑。爲了減低孔穴8 9與9 0間之壓 損，並爲了使裝置中之流體的旋刮作用發揮最大功效，閥 之密封表面上可設以半徑式（radiused)或凹槽式（chamfered) 之肩部93 (例如0· 04吋）。流體入口路徑12A及流體出口路 徑1 3 A最好是分別循沿孔穴8 9及9 0之正切方向（比中心軸 向爲佳）設置，有助於流體流動之均勻性，並可減少壓力降 及蓄積。 控制進入推壓連通式直線型另件8 6之壓力，即可控制使· 閥隔膜73變形動作之氣壓量。氣動穴88內之壓力越大， 氣動隔膜7 3之變形量即越大，推入連通頂部之閥鈕7 6， 即令隔膜77、78變形，令彈簧80壓縮，則隔膜78即自閥 座或自部分用以界定通路92(第8D圖）之肩部93離位，使 閥開啓。尤特別者，乃此閥之設計係，彈簧8 0之彈力與氣 壓係相互計數’彈簧8 0係用以推動所有的隔膜，使底部隔 膜7 8以座落於肩部9 3之方式將主閥體密封。導入氣壓時 ，係對抗彈簧8 0。一旦施加足夠之氣壓，彈簧即無法保持® 閥之關閉。彈簧之壓縮，促使各隔膜在被壓縮之彈簧的方 向上變形，則可啓開閥。越大的氣壓，對彈簧8 0之壓縮越 大，閥之開啓量亦越大。 除了吸回之選用外，流體控制閥之關閉速度亦可有效的 控制在噴嘴之排放端或出口處之流體高度，且在任何狀況 中，均可選用完全的代之以一吸回閥，由於閥之設計爲兩 個流體隔膜，故此爲可能之作法。當閥關閉時，氣壓係在 -15- 200408457 氣動穴內釋放，且彈簧即迫使閥底部流體隔膜78(第8D圖） 啣接在閥座處。由於該流體閥膜7 8之啣接，另一流體隔膜 7 7即朝外並朝向氣動穴彎曲。此種位移可造成較小的吸回 功效。 控制器可包括一種惰性之特性，可顯著的減少自閥至閥 反應時間之差異。依用於所定閥之開啓壓力需求，惰性壓 力可加以調整，以令來自單元至單元之反應時間趨於相等 。當閥未被動作產生流體之流動時，惰性壓力係提供於氣 壓穴之壓力。因之，倘某一特定之閥須以40p si之氣壓開鲁 啓，而另一特定閥須以30psi之氣壓開啓時，則惰性氣壓 即可分別設爲15psi及5psi。結果，其時間量即近乎相同 。閥之惰性特性，亦可使系統在甚少設定需求下，用以作 系統排氣之用。閥可保持開啓，可令最少程度之排氣、最 好爲氮氣、自氣動型比例式控制閥洩放，俾使封閉之系統 內部具有一安全之排氣，尤以系統設置處配設有電子元件 爲然。 第3 0圖爲一控制器2 7 0 0之一實施例方塊圖，此種控制馨 器可產生一閥驅動信號，用以束縮/開啓氣動型比例式控制 閥20。控制器2 700可包括一電源2702，一管理之處理器 27 04，一壓力電路2705，一輔助性功能電路2706，一控制 閥驅動器2 7 0 8，一吸回閥驅動器2 7 0 9，一相稱之介面2 7 1 0 ，一輸入/輸出電路2 7 1 1及一控制處理器2 7 1 2。控制處理 器27 1 2可包括一可儲存一套電腦可讀指令27 1 6之快閃記 憶體，該套指令係基於所接收來自壓力電路之壓力信號（如 -16- 200408457 第6圖之說明）而被執行用以產生一閥控制信號。控制器 2 7 0 0之諸項組件可經資料匯流排2 7 1 8作連通。此間注意 者，當電腦可讀指令2 7 1 6於一單一電腦如爲軟體時，則該 電腦可讀指令可依軟體、韌體（f i r m w a r e )、硬體指令或依其 他習知之適當程式予遂行之，此外，各指令可予分散在多 重之記憶體中，並可用多數個處理器加以執行。 動作時，電源2 7 0 2係供給電力至控制器2 7 0 0之各項組 件上。壓力電路2705可讀取來自上游及下游壓力感知器之 壓力，並提供上游及下游壓力信號，用以控制該控制處理φ 器27 12。控制器處理器2712基於所接收來自壓力電路2 705 之壓力信號，可計算一閥控制信號，依序，基於閥控制信 號，可產生一閥驅動信號。閥控制信號之產生，可依下述 第6圖之方法發生。此種方法可依軟體、或儲存於一電腦 可讀記憶體（如RAM、ROM、FLASH、磁性儲存或其他習知 之電腦可讀記憶體）中，其可用控制處理器2702存取之其 他電腦可讀指令遂行之。 關於控制器2 7 0 0之其他組件，管理之處理器2 7 0 4可爲馨 一種通用之處理器，其可達成如習知之各種功能’包括與 其他裝置之連通、或其他任何可程式之功能等。通用處理 器之一例，可爲Motorola 8051處理器者。輔助功能電路 2 7 0 6可和其他裝置作介面。吸回閥驅動器2 7 〇 9可控制一 吸回閥（例如第1圖中之吸回閥2 1)。相稱之介面2 7 1 0及輸 入/輸出電路2 7 1 1可提供不同之各種裝置’用以把資料連 通於控制器2 7 0 0。其他之組件可包含一監控單元2 7 2 0 ’如 -17- 200408457 習知，其可用以監控系統之各種功能；如各種e e p r 〇 m記憶 體體或其他記憶體；擴展性孔口或其他習用之電腦組件等。 第3 1圖爲控制器2 7 00之控制邏輯電路一代表例方塊圖 ，該控制器可產生一閥驅動信號，用以束縮/開啓比例式控 制閥20。控制器2700所例示之數種組件，包括一控制處 理器2712，相稱之介面2710及監控單元2710。此外，並 繪示有一擴展之口 2 8 02。擴展口 2 8 02可用以附加複數個 子系板（daughter boards)，以擴展控制器2700之功能。 在第3 1圖之實施例中，管理處理器2 7 04之功能係分成φ 三項··處理部、記憶裝置部2 8 0 8及雙口 RAM部2 8 1 0。記 憶裝置部2 8 0 8可包含各種的記憶體，如快閃記憶體、RAM 、EE及其他習知的電腦可讀記憶體。管理處理器2704如 設快閃記憶體，其優點係可藉例如相稱之介面27 1 0容易下 載韌體之最新資料。此外，記憶裝置部2 80 8亦可包括晶片 選擇及位址解碼等功能。應注意者，乃各記憶裝置部2 8 0 8 、雙口 RAM記憶體部2 8 1 0及處理部2 8 0 6等，可設在單一 個處理器內。 籲 控制處理器2 7 1 2可包括其可儲存一套電腦可讀指令 2 7 1 6之快閃記憶體2 7 1 4，執行該套指令，即可基於所接收 來自壓力電路之壓力信號而產生閥控制信號，如第6圖之 說明。管理處理器之控制處理器2 7 1 2及處理部2 8 0 8，在 本發明之一實施例中，可經由彼此間對雙口 RAM部2810 之存取而分攤資料。管理處理器之控制處理器2 7 1 2與處理 部2 8 0 8可藉由一單一系統時鐘28 1 2(例如20 Μ HZ時鐘）或 -18- 200408457 不同之系統時鐘予以驅動。 第3 2圖爲壓力控制電路2 7 0 5之一實施例。壓力控制電 路2705可包括上游壓力輸入2902與下游壓力輸入2904， 分別來自上游與下游壓力感知器。輸入之上游與下游信號 ，在用A/D變換器290 5與2906變換爲數位信號前，可予 放大並濾波。如第2 9圖所示，壓力控制電路2 7 0 4亦可產 生使用A/D變換器290 8可予變換爲數位信號之差壓信號。 壓力控制電路可用校正電路2 9 1 0作校正，該校正電路可包 括硬體及/或軟體，基於施加在壓力感知器之已知壓力，於φ 感知器上讀取之壓力結果如有變化，可予以作補償。 此外，壓力控制電路2704可用以作接收上游與下游輸入之 溫度信號（如在輸入點2920、2922處），以A/D變換器可將 該種溫度信號變換爲數位信號。一個或兩個壓力感知器24 、25(或差壓感知器），均各可包含一溫度感知裝置，可在 其之各位置（例如在摩擦式流量元件之入口處或出口處或 附近處）感知流體之溫度，俾把溫度信號提供至輸入點2920 與2 922。此外，溫度感知器可和壓力感知器分開設置。所# 感知之各種溫度均連通於控制器，控制器即計算適當之流 體流量校正値，並基於用以校正各種溫度變化之計算而送 出信號至氣動型比例式閥20。因壓力感知器本身可產生熱 ，並由流體吸收，且可實現系統中流體之流動特性，故上 述之動作確爲可行；感知器表面之區域性溫度改變可改變 感知器之輸出。本發明之其他實施例可基於、例如，橫跨 在一恒定電流裝置(如壓力感知器本身）之電壓降而校正溫 -19- 200408457 度之誤差。 第4圖爲壓力控制裝置2 7 0 5之另一實施例。如第4圖之 簡圖所示’壓力感知器24、2 5最好是使用兩個儀控放大器 :一者用於上游壓力，另一者用於下游壓力。利用數位增 益及偏位控制，以自動或手動方式校正各感知者。此兩個 類比信號可用類比/數位（A/D)變換器變換爲數位信號，且 僅扣除該値即可在軟體中導出差壓壓力。此一技術之缺憾 係解析度之折衰及公用之模式。 類比/數位變換器必須轉換各信號並數學的去除公用之 模式。可行的作法係增加A/D變換器之解析能力，以獲得 所需之差動壓力。例如，下游壓力爲1 5 p s i，且用於此流量 之差壓爲O.lpsi時，其即變換爲5.00Vdc(15psi = 2.50Vdc) ，各變換器須爲可測量峰値壓力（3 0 p s i)以上者方可。因 15.1psi 爲 2.517Vdc，則壓差信號爲 〇.〇i7Vdc(5.00Vdc 之 外）。 增設第3放大器與各A/D變換器作電氣性接通時，便可 去除公用之模式，令各A/D變換器僅須作最大差動壓力之 解析即可，如是，公用之模式乃大幅減少，因之，上例中 之全量差壓乃等於5psi，變換爲5.00Vdc之電壓。此種方 式可增加6倍（6X)之解析度。 差動壓力（差壓）放大之增益亦可增加，以更增加差壓信 號之解析處。以一個單一的差壓感知器亦可爲之，但在一 實施例中，卻無法探知上游及下游壓力之單獨信號。 上游及下游壓力最好亦包括A/D變換器。則此等分開之 -20- 200408457 壓力可用以作上游及下游壓力之監視’並可用以決定流程 之改變（例如更換出過濾器）。該等壓力亦可分開的用於作 單一之壓力控制，其可使用於黏度之計算。 第6圖爲用於流量控制閥1 0之調節、一控制演算法之流 程表實施例。使用一控制器（例如第1圖所示之控制器3 0) 執行一套儲於一電腦可讀記憶體（例如，RAM、ROM、磁性 記憶體裝置、或任何習知之其他電腦可讀記憶體）之電腦可 讀記令，即可實現該種演算法，該演算法亦可包括削減來 自一匹配控制器之模糊邏輯（Fuzzy logic)及元件的技術。φ 因此，控制器乃爲一種基於動態模式之線性控制系統。倘 有希求，可使用匹配控制或智慧型控制，以達較大精準度 。匹配控制可使用一非線性最佳控制器（Optimizer)，以改 善控制系統之全盤動作，其爲習知者。第2 7圖爲一控制器 之實施例。 如第6圖所示之控制器流程，在步驟902上，可讀取來 自上游及下游壓力感知器經A/D變換器（例如A/D變換器 29 0 5、290 6)之上游及下游壓力信號。在此點上，上游及下鲁 游信號可用電壓取樣（亦即，數位取樣），代表壓力感知器 所產生之類比電壓。在步驟9 04上，控制器亦可基於一溫 度感知器之讀取而讀取一溫度，或基於流經一感知器之電 流而計算一溫度，亦利用習知之任何一種溫度校正演算法 修正用於溫度之上游及下游壓力信號。在步驟906上，控 制器可過濾上游及下游壓力信號，且在步驟9 0 8上，將壓 力信號變換成壓力値，並可儲存在記憶體內（步驟909)。 -21- 200408457 在控制器之步驟910及911上’係可計算1用於上游及下 游壓力之積分値’導數値及任何之修正値。使用習知之各 種方法均可遂行積分値與導數値之計算°控制益亦可胃十算 (步驟912)及儲存（步驟91 4)上游及下游壓力中之差壓。在 步驟9 1 6上，控制器可基於用於上游及下游壓力之導數値 與積分値而計算錯誤（誤差）信號’且在步驟9 1 8上’可將 該錯誤値儲存之。依本發明之一實施例’在步驟9 2 0上’ 可在一錯誤信號上加以一錯誤增益’則在低壓力時’有助 於對低信號値之補償。 在步驟922上，控制器可讀取閥之增益。第5圖爲一實 施例之閥增益曲線圖。此一曲線係調整施加於閥上、使其 依比例式的到達目前位置之信號的增益。以軟體達成之增 益曲線，可令系統中之閥至閥間的變化作成修正，除了可 對特定閥之變化作修正外’閥增益曲線亦可用於對越標 (over shoot)及反應時間作補償。第5圖中，閥增益曲線係 用於兩個閥，其中閥A爲線5 00、閥B爲線5 0 1。用於各 閥之曲線（或閥之等級）可依經驗作成，亦可儲存於控制器鲁 之記憶體內。該曲線可基於目前之閥位置而調整閥控制信 號之增益。 第5圖之曲線圖中，X軸表示閥之位置，Y軸則表示增 益。在本發明一實施例中，各曲線係使用4點作成：最大 增益、最小增益、傾斜起始點、及傾斜終止點。最大增益 典型的係自閥未動作之位置起始，並直至傾斜起始位置。 最小增益係傾斜終止位置起始，並在閥行程之1 0 0 %點終止 -22- 200408457 。增益中之實際上的傾斜（斜率slope)，係自傾斜起始點至 傾斜終止點成線性減少。控制器可讀取用於各閥之閥增益 曲線，並因而調整閥控制信號。例如，當閥位在線5 0 2及 5 04之間時，在步驟922上，控制器即可讀取閥曲線，並 調整用於控制信號之數値，以計數爲高增益。當閥A位於 線5 02及5 04之間時，該曲線可令閥信號之增益保持爲高 準位以克服保持閥關閉之力量。在閥實際上爲開啓之該點 上，控制器可基於閥增益曲線及閥位置而調整控制信號， 以作用於減少增益之計數。控制器可循沿閥增益曲線而調· 整閥控制信號以在任一點上作閥增益之計數。此間應注意 者，乃第5圖所示之閥增益曲線僅爲代表性之例示，該控 制器可基於儲存於任可電腦可讀記憶體中、可由控制器存 取之任何一種閥增益曲線而調整閥之控制信號者。 在步驟924上，基於錯誤信號及壓力値，可產生一控制 信號，並予寫入數位/類比（A/D)變換器（如控制閥驅動器） 。A/D變換器可產生一類比閥驅動信號，以驅動一閥。本 發明諸實施例可包括一閥積分步驟（例如步驟926)，以延緩# 閥控制信號，以及一匹配之調整步驟（例如步驟9 2 8)。匹配 調整步驟可讀取預先界定數量、經儲存之先前位置數値而 用以調整目前的閥控制信號。 此外，控制器亦可實現監視步驟9 3 0，其可爲匹配調整 之一部分。此種功能可實時（real time)的編輯諸如設定點越 標（s e t - ρ 〇 i n t 〇 v e r s h ο 〇 t)，沈降時間（s e 111 i n g t i m e)、傾斜穩 定性及百分比錯誤等之資料。在設置模式期間，所編輯之 -23- 200408457 資料係以控制器作分析，且其可將控制値調整爲最適當之 性能（亦即，遂行匹配調整步驟928)。 此間應注意者，控制器亦可調整閥控制信號以補償黏度 之改變。因流體之黏度在相同流量時係改變△ p測試値， 故須作校正。校正之一種方法把目前之△ p與流量，和作 爲標準之異丙基或水的△ p與流量作一比較。之後，使用 者即可輸入其間之差異。另一種方法係測量內部參數並和 預設之類似參數作比較，且在內部作補償。第3種方法則 是使用在工廠即已作成、用於各種不同流體之曲線爲之，泰 控制器內可儲存多種曲線，使用者可作多種選擇。 可設定含蓋各種應用上寬廣變化之多數不同參數，以確 保吸回閥之適當動作。例如，吸回閥”不動作時間"（off time) 可用以調整ON至OFF壓力變換之時間。此係把閥隔膜由 其全伸展位置移動至吸回位置之時間。此種移動速度如太 快，可能造成流注拉使氣泡進入流注內或穴內。吸回閥·’ 動作時間’’（on time)可用以調整由OFF至ON壓力變換之時 間。此係把閥隔膜之端部由吸回位置移動至全伸展位置所馨 須之時間。此種移動太快時，可能造成流注之’’凸出’’（buldge) ，而有害於改變實際之供給量。有兩種其他之設定：吸回 ON及OFF壓力設定。此兩種調整係決定閥開啓以達所希 吸回量之距離者。此壓力中之差異越大，越增加吸回之量 。使用ON壓力及OFF壓力兩者，其理由有二：用以適應 類似型式但爲不同閥件之差異；及調整不同閥件與其他系 統組態中之非線性。此一整個動作亦可予延遲，以分開控 -24- 200408457 制閥之停止動作及吸回動作。在某些應用中，吸回閥可用 以輔助控制閥對流體之停止動作，其方式係如第2 9圖所示 ，藉由流體止動作時所作用於一分開之吸回（S u c k b a c k)位置 達成之。此一輔助功能亦可予程式化爲停止動作伊始、或 停止終了所加載之停止動作的一個百分比値。倘已程式化 ，則延遲之後，即可利用正常之吸回位置作吸回。現返觀 第2圖，所示之殼體1 00係容納有本發明各種組件。最好 爲諸如LED板105及主要的印刷電路板1〇6等之電氣組件 ，及摩擦式流量元件1 5、流體控制閥1 〇等與流體相隔離· 之氣動型比例式閥岐管1 1 0。流體在流體入口（未示）進入主 流體控制閥1 〇。之後，流體即流經該閥進入摩擦式流量元 件1 5，在所示之實施例中，該流量元件丨5含有一相當短 的直線部1 5 B，之後，即成螺旋狀之捲繞直到抵達另一相 當長之直線部1 5 A終結，該較長之直線部1 5 A可發生第2 壓力（及溫度）之感知者。摩擦式流量元件15可爲一管、或 一導管、或兩個平行中空纖維管之包紮空間，均具有足量 之尺寸，則流體流經其間時，可造成壓力降。其他之適當H 摩擦式流量元件包括例如以塊狀聚合性材料、多孔性膜、燒 結物及過濾器等形式所作成之蜿蜒形通道。摩擦式流量元 件最好避免作90度之轉彎，否則將增加阻塞或造成剪力之 過度擾流。雖摩擦式流量元件1 5可爲直線式，惟摩擦式流 量元件1 5最好作成螺旋盤管式，以儉省空間，而其直徑及 長度則依流量而定。因此，摩擦式流量元件1 5之直徑與長 度爲所須壓力降之函數，故”雜音”即可忽略不計。就所賦 -25- 200408457 與之一流體而言，關於管子之長度及系統無須條件，管子之 直徑越小，壓力降即越大，就已賦與之管子外形而言，流 體之黏度增加，壓力降亦將增加。例如，用於一流體控制 閥1 〇以供給去離子化之水，其摩擦式流量元件1 5之規格 爲外徑1/4吋管子、壁厚約0.047吋、管長約40吋時，可 產生之最大流量約爲每分鐘2公升，惟亦依系統條件，例 如供應流體之壓力、供應之氣壓壓力及裝置外之系統壓力 差等而定。單純的改變摩擦式流量元件之幾何外形，即可 令用於一所賦與之供給/流動條件之流量達到最佳狀況。爲φ 了降低或減除流體在元件1 5外部之流過，摩擦式流量元件 之內徑最好相同於或實質上相同於管子、或其他元件1 5下 游流動路徑之內徑。流經摩擦式流量元件1 5之流體可爲層 流或爲擾流。故流體路徑爲：流體進入流體控制閥1 〇之流 體入口，流徑閥（並經過壓力與溫度感知器），並進入摩擦 式流量元件1 5之入口，經過摩擦式流量元件1 5，並在其 出口送出（且經過摩擦式流量元件1 5出口之上游及下游處 所設之壓力及溫度感知器）。本發明之彈性，依本發明之一馨 實施例，係該摩擦式流量元件，可基於例如流動特性及/或 流體特性而具有簡便之可互換性。 用以產生壓力降之其他型式裝置，雖可適合各種工業處 理之應用，但將產生一些所不希望之邊際效果’該等負面 效果包括未經控制及過度的入口與出口壓力損失、局部之 逆流區或渦流、及陷入區（traP zones)等。此等導致額外壓 力降之元件包括文氏管、流體噴嘴、孔穴群（薄板之方形緣 -26- 200408457 部，象限緣部’偏心及弓形），離心、及線性等之阻抗。 以下之實例，係演示一套摩擦式流量元件之規格： 螺旋盤管之內徑爲〇·〇625吋，長度：20吋，匝數：2.5 匝，在室溫下，水之流量在0.5cc/秒〜5cc/秒間。 螺旋盤管之內徑爲0.156吋，長度：40吋，匝數：5.5 匝，在室溫下，水之流量在lcc/秒〜30cc/秒間。 螺旋盤管之內徑爲0.2 5 0吋，長度·· 2 0吋，匝數：2.5 匣，在室溫下，水之流量爲2.5 Ι/min.〜5 Ι/min.間。 螺旋盤管之內徑爲0 · 3 7 5吋，長度：2 0吋，匝數：2.5 _ 匝，在室溫下，水之流量爲2 Ι/min.〜10 Ι/min.間。 在某些應用中，進入流體入口 12(第1及8C圖）之流體壓 力可能太底或太高。爲了調節流體壓力，如第3圖所示之 一輔助輸入模組200可用以作爲上游之供給模組。輔助輸 入模組200具有一本體或容器90及四個常閉式（因受彈簧 97之偏壓）提動閥91，該4個提動閥係固設在模組底座92 與蓋部93之間。如圖示，底座92上鎖固有4個流體另件 94及94 A。其中之一只另件爲壓力口，另一只另件爲真空· □ ’第3只另件（94 A)爲流體入口，第4只另件則爲排氣Q ° 4只壓入連通式另件95係固設於蓋部93，並提供氮氣以動 作提動閥9 1，之後，提動閥9 1即開啓，可令流體流至口 94及94A。本體90之底部設有一流體出口 98。液位感知 器9 6係以托架1 0 1裝設在本體9 0上，用以感知模組本體 @ $器內之流體液位。本體90亦可設以過濾器（未示）。 胃7以壓力化流體源塡充模組2 0 0，實質上可同時打開 -27· 200408457 入口閥暨排氣閥，則壓力化流體即可流入模組，經過一段 時間，或以液位感知器所感知之液位已達預定値時，壓力 化流體之流入即予停止。排氣閥可用以作均壓，以令經入 口閥之流體可流入容器9 0。之後，把入口及排氣閥關閉， 打開流體供應壓力閥，如系統須流入流體時，可同時打開 流體控制閥1 0。 倘來自供給源之流體壓力太低時，可隨著塡充之周期施 加壓力以提升供應之壓力。此種壓力之施加可爲持續或僅 在須要時方爲之。同樣的，當流體供應之壓力發生不規則φ 變動時，則亦須施加該種壓力。 倘係使用非壓力化之供給源時，實質上可同時打開入口 及真空閥。真空閥用以自流體源抽入流體。 模組200亦可用以作消泡器（defoamer)。特別的，如上述 ，循環（cycle)中之充塡部係用於壓力化流體源者。一旦容 器90已充塡至所希液位，入口及排氣閥即予關閉，並以使 者可程式之時間或所希時間施加真空於流體，因之即可由 流體中去除泡泡。 41 在本發明之另一實施例中，其對於空間之儉省甚爲先進 ，所使用之閥如第12〜23圖所示。與第8圖之閥類似的， 第12圖之閥上部端蓋71’包括兩個同心的圓形環84’、85’， 兩者間界定有一圓形溝，用以容裝具有頂部氣動環74’之合 成橡膠〇形環7 2 ’，此一 Ο形環並可將閥氣動隔膜7 3 ’密封 在殼體內。複數只成對向之螺紋式閥扣76’係用以夾置閥上 部隔膜7 7 ’與閥底部隔膜7 8 ’，並係以彈簧8 0 ’施以偏壓。內 -28- 200408457 部總成係倂同旋合於不鏽鋼螺絲、螺栓或梢件7 5，之螺紋扣 一起予以持住。外部總成則係和閥底部端蓋8 2，，不鏽鋼梢 件或螺栓83^及閥上部端蓋71，等，以不相觸方式予以持 住之。一壓入連通式另件係聯結於閥上部端蓋7 Γ，藉適當 配管或類似方式使氣動型比例式控制閥2 〇達成氣動之連 接。流體控制閥1 0中之流路（入出口間）並非直列式（i η _丨i n e)200408457 发明 Description of the invention: The technical field to which the invention belongs The present invention is related to 2002.7.1 9 US Patent Application No. 60/3 97, 1 62, `` Fluid Flow Measuring and Proportional Fluid Flow Control Device '' which has been granted US Patent No. 6,348,098 (Flow measurement and proportional flow control device), and the present invention is based on 2002.7.1 9 US Application No. 60 / 397,053, "Liquid Flow Controller and Precision Dispense Apparatus and System" System) "claiming priority. Prior technologies used in the manufacture of semiconductors such as deionized water, photoresist, spin agents on dielectrics (spi η ο ndie 1 ectrics), and spin agents on glass (spi η ο η glass ), Polyimide, developer, chemical mechanical polishing (CMP) slurry, etc., must be accurately distributed and deposited on the substrate to be processed. For example, in the traditional application of the device The wafer to be processed is set under an appropriate nozzle, and then a predetermined amount of liquid or slurry is sprayed and distributed by the nozzle The wafer is covered or treated on the wafer. The predetermined amount is not only based on the absolute amount or quantity of liquid deposited on the wafer, but also depends on the number of pump cycles, piping diameter, or other characteristics of the surrounding environment It is typical. After that, the wafer is rotated, so that the deposited liquid is completely distributed on the entire surface of the wafer. It can be immediately known that the distribution ratio and the amount of liquid deposited have reached a critical level. It is very easy to cause problems. When the fluid flowing through the nozzle is stopped, for example, between 6 and 200408457 of the two wafer processing processes, there is a potential difference on the nozzle, so a droplet ( droplet) and drip on the wafer below the nozzle. At this time, if the pattern formed on the wafer is destroyed, the wafer must be reprocessed or discarded. In order to prevent the formation of harmful droplets on the nozzle, it is generally used to suck back or stop / Suck back valve. The latter valve is typically a double pneumatic control valve pair, one of which is used to stop the liquid flowing to the nozzle, and the other valve is used to hold the nozzle. The liquid at the matching end or the outlet is sucked back. This method can not only prevent the formation of droplets and drips at the nozzle mouth, but also help prevent the liquid from drying out on the exposed surface, and prevent the nozzle from blocking the fluid at the outlet. The content reduction φ is small. There is also a problem with the coating of large wafers (for example, a diameter of 300 mm or more), because turbulence (turbu 1 ence) is generated. Traditionally, the rotational speed of a wafer is used to spread the coating fluid applied to its center radially outward to the edge of the wafer. However, this method will cause turbulent airflow on the entire surface of the wafer, making the coating uneven and uniform. Although the rotation speed of large wafers can be reduced to reduce the turbulence on the surface of the wafers, this causes new problems. If this speed is reduced, the flow velocity of the fluid on the wafer surface will slow down, that is, it is possible that the fluid may have stopped or dried before reaching the edge of the wafer. Those who apply liquids in semiconductor manufacturing have traditionally used pumps. However, all applicable pumps are extremely expensive and must be replaced frequently due to excessive wear. In addition, the footprint of such pumps may be too large to be corrected to make them suitable, although not all, but most applications may be required. Liquid flow controllers with differential pressure measurement, such as NT6 5 00 (Entegris Corp. Chaska, MN) can be used, but this type of controller is not suitable for 200408457. . Therefore, it is desirable to provide a solution that can easily adjust the pressure drop. Therefore, NEX provides a flow measurement and supply (d i s p en s e, or distribution, application, etc.) system that can accurately and repeatedly supply flow without the above-mentioned disadvantages. In addition, the present invention provides precise control of the desired or required liquid flow. Furthermore, it is desirable to provide a pumpless system that can be used as a precise and repeatable supplier of fluids. In addition, Euche provides a pneumatic proportional flow valve that is linear or φ is substantially linear, with minimal pressure drop and little or no hysteresis. SUMMARY OF THE INVENTION The present invention solves the aforementioned problems. According to the present invention, it includes a device and a control system for monitoring (preferably digital) and / or controlling the pressure applied to a pneumatic load such as a proportional fluid control valve, and Apply the measurement input from the fluid measurement device that responds to the flow rate. With this liquid measurement input, the pressure applied to the pneumatic load can be controlled, and the pneumatic load can be increased or decreased (the proportional valve is opened or closed) to change the fluid Flow < 1 Hope. In addition, the pneumatic load can also be adjusted in response to changes in fluid temperature and viscosity (proportional opening or closing of pneumatic valves). The embodiments of the present invention provide a fluid measuring device based on a frictional flow element whose fluid communicates with a proportional fluid control valve, and a pressure drop caused by the friction flow element across the fluid flow measurement signal. The fluid pressure can be measured at or near the exit of the friction flow element, and at or near the exit, and the measured signal can be amplified, and the pressure caused during this time can be converted to The fluid's flowing summer output can be controlled. The flow output can be sent to a controller to adjust the flow of one or more valves as desired. The invention also provides a control system which can be applied to various fluids, and can be applied to fluids with different viscosities. And it can perform accurate and repeatable flow control and supply performance in a low-cost and flexible manner. Furthermore, it can quickly respond to process changes at any time and can minimize the difficulty of operation. The invention also relates to a proportional fluid control valve. By using the fluid controller and the motor pumping system of the valve, the linearity can be improved and the hysteresis can be reduced. This valve can make the fluid flow smoothly and stably. In essence, the flow is linear, and the turning of the fluid is very small. This valve is preferably pneumatic. This valve does not generate temperature, and the valve can be actuated by any suitable device, including a stepper motor, linear motor, voice coil, or other force-actuating actuator. The invention also relates to an auxiliary input module. The upstream flow system is connected to a flow measurement device. The flow measurement device is arranged in a motor pump system and can be used to adjust the flow measurement device before entering the flow measurement device. Of the fluid. This module can be supplemented from a pressureless source such as a barrel (b a r r e 1). This module can be compensated for an inappropriate or excessive fluid pressure by a pressured feed line (machine room feed or a pressured cylinder). This module can defoam fluids used in the system. The present invention provides a motorless pumping system that can be applied to a variety of different fluids and feed sources. Therefore, in semiconductor manufacturing, most liquid supply points can be standardized and consumers can be modularized. Configuration of other features-9-200408457, such as filtering and temperature control. The present invention further provides a general-purpose molded valve body. Compared with mechanical valve bodies, the valve body of the present invention only needs a few components. In one embodiment, the molded valve body is specifically designed for flow control and includes two sensor housings with precisely positioned flow channels to make the most appropriate use of space. One or more perceptron housings can be formed separately as inserts, and can be installed in various positions. When pneumatic and mechanical components are installed in the opposite end of the valve cavity, the differential pressure of the system can be reversed, and the differential pressure of the valve can be recorded upstream to monitor the supply pressure. _ An embodiment of the present invention may include a set of computer-readable instructions stored in a computer memory and executable by one or more processors. The set of computer-readable instructions may be used to execute and receive an upstream pressure signal. Receiving a downstream pressure signal; calculating an error signal; and calculating a valve control signal based on the upstream pressure signal, downstream pressure signal and error signal; etc. means according to another embodiment of the present invention, the device of which includes a set Computer-readable instructions stored on computer-readable memory and executable by one or more processors, the set of computer-readable instructions including instructions for executing an upstream pressure signal; receiving a downstream pressure signal; and The valve gain curve of the corresponding valve determines the valve gain for a specific valve, where the change in the valve gain depends on the position of the specific valve; and based on the upstream pressure signal, downstream pressure signal, error signal, and valve gain Wait to calculate a valve control signal; wait for a command. According to another embodiment of the present invention, the device includes a set of instructions stored in a computer-readable memory, and can be executed by one or more processors. The set of computer-readable instructions includes instructions for performing receiving. An upstream pressure signal; receiving a downstream pressure signal; calculating an error signal based on the ratio, integral, and derivative of the upstream pressure signal and the downstream pressure signal; adding an error gain to the error signal; based on the corresponding valve The valve gain curve is used to determine the valve gain for a special valve. The valve gain is changed according to the position of the specific valve. The valve control is calculated based on the upstream pressure signal, downstream pressure signal, error signal, and valve gain. Signals; and appropriate control valve control signals based on a set of past positions; and other instructions. Embodiments First, as shown in FIG. 1, a block diagram of a fluid flow (volume) controller according to a representative embodiment of the present invention. A fluid control device, for example, a fluid control valve 10 'operated by pneumatic pressure, has a fluid inlet line 12 and a fluid outlet line 13, for supplying liquid to, for example, a substrate, a wafer (not shown), etc. The point of use. The fluid outlet circuit 13 is in fluid communication with a friction flow element 15, and all the fluid existing in the fluid control valve 10 can enter the friction flow element 15. For example, the first pressure sensor 24 ′, which is one of the pressure transducers, can be integrated with the fluid control valve 10, and is located at or near the entrance of the frictional gastric flow element 15 (for example, located at the fluid control valve 10). At or near the outlet) to sense a first pressure, and a second pressure sensor 25, such as one of the pressure transducers, is provided at or near the outlet of the friction flow element 15 to sense a second pressure. In addition, a single pressure difference sensing device can also be applied. The fluid contacting part of the pressure sensor is preferably made of an inert material (depending on the applied fluid), such as sapphire (S a PP ^ ire), or a coating material, such as Perfluorοροίymer, etc. 200408457 contact. Details of a suitable pressure sensor are illustrated in Figure 7. Therefore, the casing 60 has a fluid inlet 6 1 and a fluid outlet 62 spaced from the inlet 61. The pressure and temperature sensor 64 is sealed in the casing 60 with a Perfluoroelastomer 0 ring. The end cap 65 is coupled to the housing 60 with, for example, a plurality of stainless steel bolts or pins 66 as shown. The sensor 64 senses the pressure and temperature of the liquid in the fluid flow path between the inlet 61 and the outlet 62, and sends the sensed pressure and temperature signals to the controller. Returning to Fig. 1, a pneumatic proportional control valve, such as a solenoid valve, is pneumatically connected to the fluid control valve 10. Each pressure sensor 24, 25 (or a single pressure difference sensing device) is connected to, for example, a computer processor or control circuit 30 having a proportional, integral, and lead (PID) feedback component. Since each sensor 24 and 25 samples the pressure and temperature of each fluid circuit, the sampling data is sent to the controller 30. The controller 30 compares the number of items sent and calculates the pressure difference across the friction flow element 15. Details will be described below. Based on one of the pressure drop signals from the controller 30, it is sent to the pneumatic proportional control valve 20 to adjust the fluid control valve 10, preferably after compensating for temperature, and / or viscosity and / or density For it. < More specifically, the system is preferably calibrated using a suitable fluid, such as deionized water, or isopropyl alcohol, as a fluid standard. For example, once the system is calibrated to the standard, the characteristics of the fluid to be supplied, such as viscosity and density, can be automatically entered or determined. If so, the liquid to be supplied can be compared with the standard and established with each other. relationship. Based on this relationship, the measured pressure drop across the frictional flow element (selected for calibration of temperature, viscosity, etc.) is compared to the flow rate associated with the desired or target flow rate -12-200408457 ' The control valve l 0 is adjusted by a pneumatic proportional control valve 2 0. It belongs to one of the suction and return valves 21, preferably a user-programmable proportional valve 'and a proportional control valve such as a solenoid valve (which may be the same as or different from a pneumatic proportional control valve 1 0) Communicate with each other and control by controller (or different controllers). When the supply of fluid is stopped or circulating, this suction valve will act. 'When the operation of fluid supply is interrupted, the droplets can be reduced or prevented from falling on the wafer, and the liquid is sucked back from the supply nozzle to Reduce or prevent fluid exposure to the atmosphere. The opening or closing rate or degree of the suction valve is controlled by the controller. The suction return valve 21 is preferably provided downstream of the fluid control valve. By controlling the pressure applied to the fluid control valve 10 and / or the suction return valve 21, the supply parameters of various fluids can be controlled. For example, when the supplied fluid is a low-viscosity liquid, the liquid control valve 10 can be precisely adjusted using pressure to ensure a uniform liquid supply. Similarly, since the flow rate at the fluid discharge point is sucked back by the suction valve 31 according to the ratio, the flow rate of the fluid can be controlled. Once the pressure-to-volume relationship of the specific fluid control valve 10 is used, the system of the present invention can be used to obtain unlimited elasticity. It is true that the supply pressure # is a good indicator of the quality of the liquid supply (such as uniformity), but for all applications, there is no `` ideal " supply pressure type, and in all liquid control, This kind of ideal pressure cannot be the same before and after. In the control system of the present invention, once the characteristics of the fluid control valve are known, the process engineer can adjust the supply pressure of the fluid to achieve the " ideal type ' Figures 8A to 8E show a body type fluid control valve according to a representative embodiment of the present invention. This valve is essentially linear, which means that as the operating pressure on the diaphragm increases, the flow rate of the fluid decreases. In addition, the hysteresis of this valve is very small. Preferably, the pressure (and temperature) sensors are provided in the fluid stream, and the casing 60 is preferably formed integrally with the main casing 70 of the valve (therefore, the sensor senses the pressure and temperature of the fluid). This is done before the friction flow element inlet. Particularly as shown in Figures 8B, 8C, 8D and 8E, the valve top end cover 71 contains two concentric circular rings 8 4 and 8 5. A circular groove can be defined between the two to accommodate one of the pneumatic rings 74. A rubber o-ring 72 is used to close the valve pneumatic diaphragm 73 in the housing. The opposite threaded valve buckle 76 is used to sandwich the valve upper diaphragm 77 and the valve bottom diaphragm 78, and is biased by the spring 80. The internal assembly is held together with the threaded buckle 7 6 screwed onto the stainless steel bolt 7 5, while the external assembly is connected with the valve end cap 8 2, stainless steel bolt tip or bolt 8 3, and the valve The upper end covers 71 are held together. Connected to the upper end cap 7 0 of the valve is a push-in communication type for pneumatic connection with the pneumatic proportional control valve 20 with appropriate piping or the like. The flow path (between the inlet and the outlet) in the fluid control valve 10 is not straight, so it can further reduce the pressure, drop, and unswept volume, as illustrated in Figures 7A to 7D. The deflected flow path of the valve in and out allows easy flow of thick matter or other fluids and minimizes accumulation. The fluid enters the valve inlet 12 and flows in the linear flow path 12 A until it reaches the circular cavity 90 through the inlet cavity 99. The fluid tends to rotate in the cavity 90. After that, according to the action of the applied air pressure, the valve is opened, and the flow is flowing. It passes through the diaphragms 77 and 78 and enters the narrow circular channel 92 and enters the cavity 89 -14-200408457. A swirling fluid flow path toward the outlet (through the outlet hole 8 5) through the linear path 1 3 A can be generated in the cavity 89. In order to reduce the pressure loss between the holes 8 9 and 90, and to maximize the swirling effect of the fluid in the device, the valve sealing surface can be provided with a radiused or a chamfered shoulder 93 (such as 0.04 inches). The fluid inlet path 12A and the fluid outlet path 1 3 A are preferably set along the tangent directions of the holes 8 9 and 90 respectively (better than the central axis), which helps the uniformity of fluid flow and reduces the pressure drop. And accumulation. By controlling the pressure entering the push-connected linear linear component 86, the amount of air pressure that deforms the valve diaphragm 73 can be controlled. The greater the pressure in the pneumatic cavity 88, the greater the amount of deformation of the pneumatic diaphragm 73. Pushing the valve button 7 6 connected to the top will deform the diaphragms 77 and 78 and compress the spring 80, and the diaphragm 78 will be from the valve seat or The shoulder 93 of the self-defining passage 92 (Fig. 8D) is out of position, so that the valve opens. In particular, it is the design of this valve. The spring force of the spring 80 and the air pressure system count each other. The spring 80 is used to push all the diaphragms, so that the bottom diaphragm 7 8 is seated on the shoulder 9 3 and the main Valve body is sealed. When the air pressure is introduced, it is against the spring 80. Once sufficient air pressure is applied, the spring cannot keep the ® valve closed. The compression of the spring causes each diaphragm to deform in the direction of the compressed spring, and the valve can be opened. The greater the air pressure, the greater the compression of the spring 80, and the greater the valve opening amount. In addition to the selection of suction, the closing speed of the fluid control valve can also effectively control the height of the fluid at the discharge end or outlet of the nozzle, and in any situation, you can choose to replace it with a suction valve completely. The design of the valve is two fluid diaphragms, so this is possible. When the valve is closed, the air pressure is released in the -15-200408457 pneumatic cavity, and the spring forces the fluid diaphragm 78 (Figure 8D) at the bottom of the valve to engage the valve seat. Due to the connection of the fluid valve membrane 78, the other fluid diaphragm 7 7 is bent outward and towards the pneumatic cavity. This displacement can result in less suction back effect. The controller can include an inert feature that significantly reduces the difference in response time from valve to valve. Depending on the opening pressure requirements for a given valve, the inert pressure can be adjusted so that the response time from unit to unit tends to be equal. When the valve has not been operated to produce fluid flow, inert pressure is the pressure provided in the air pressure cavity. Therefore, if a specific valve must be opened and opened at a pressure of 40 p si and another specific valve must be opened at a pressure of 30 psi, the inert air pressure can be set to 15 psi and 5 psi, respectively. As a result, the amount of time is almost the same. The inert nature of the valve also allows the system to be used for exhausting the system with little setting requirements. The valve can be kept open to allow the least degree of exhaust, preferably nitrogen, to be vented from a pneumatic proportional control valve, so that a safe exhaust can be provided inside the closed system, especially with electronic settings The components are. FIG. 30 is a block diagram of an embodiment of a controller 27000. This control device can generate a valve driving signal for shrinking / opening a pneumatic proportional control valve 20. The controller 2 700 may include a power source 2702, a managed processor 27 04, a pressure circuit 2705, an auxiliary function circuit 2706, a control valve driver 2 7 0 8, a suction valve driver 2 7 0 9, The corresponding interface 2 7 1 0, an input / output circuit 2 7 1 1 and a control processor 2 7 1 2. The control processor 27 1 2 may include a flash memory that can store a set of computer-readable instructions 27 1 6 based on the pressure signal received from the pressure circuit (such as the description of -16-200408457 Figure 6) ) And is executed to generate a valve control signal. The components of the controller 2 7 0 0 can communicate through the data bus 2 7 1 8. Note here that when the computer-readable instructions 2 7 1 6 are software on a single computer, the computer-readable instructions may be executed in accordance with software, firmware, hardware instructions, or other known appropriate programs. In addition, each instruction can be distributed in multiple memories and can be executed by multiple processors. During operation, the power supply 2702 supplies power to the various components of the controller 2700. The pressure circuit 2705 can read the pressure from the upstream and downstream pressure sensors, and provide upstream and downstream pressure signals to control the control processor 27 12. The controller processor 2712 can calculate a valve control signal based on the pressure signal received from the pressure circuit 2 705, and in turn, can generate a valve driving signal based on the valve control signal. The valve control signal can be generated according to the method shown in Figure 6 below. This method can be software-based or stored in a computer-readable memory (such as RAM, ROM, FLASH, magnetic storage, or other conventional computer-readable memory), which can be accessed by the control computer 2702 and other computers. The read instruction does it. Regarding the other components of the controller 2 700, the managed processor 2 700 can be a general-purpose processor that can achieve various functions as is known in the art, including communication with other devices, or any other programmable Features, etc. An example of a general-purpose processor is a Motorola 8051 processor. The auxiliary function circuit 2 7 0 6 can interface with other devices. The suction valve driver 279 can control a suction valve (for example, the suction valve 2 1 in the first figure). The commensurate interface 2 7 1 0 and the input / output circuit 2 7 1 1 can provide different various devices' for connecting data to the controller 2 7 0. Other components may include a monitoring unit 2 7 2 0 'as known in -17-200408457, which can be used to monitor various functions of the system; such as various eepr memory or other memory; expandable orifices or other conventional Computer components, etc. Fig. 31 is a block diagram of a representative example of the control logic circuit of the controller 7000. The controller can generate a valve driving signal for beam shrinking / opening of the proportional control valve 20. Several components exemplified by the controller 2700 include a control processor 2712, a corresponding interface 2710, and a monitoring unit 2710. In addition, an extended mouth 2 8 02 is shown. The expansion port 2 8 02 can be used to add multiple daughter boards to expand the functions of the controller 2700. In the embodiment shown in FIG. 31, the functions of the management processor 2 7 04 are divided into φ three items: a processing section, a memory device section 2 008, and a dual-port RAM section 2 8 1 0. The memory device section 208 may include various memories, such as flash memory, RAM, EE, and other conventional computer-readable memories. If the management processor 2704 is provided with a flash memory, its advantage is that the latest data of the firmware can be easily downloaded by means of a corresponding interface 27 1 0, for example. In addition, the memory device section 2 8 8 may include functions such as chip selection and address decoding. It should be noted that each of the memory device section 2 008, the dual-port RAM memory section 2 810, and the processing section 2 806 may be provided in a single processor. The control processor 2 7 1 2 may include a flash memory 2 7 1 4 which can store a set of computer-readable instructions 2 7 1 6. When the set of instructions is executed, the pressure signal received from the pressure circuit may be Generate a valve control signal, as illustrated in Figure 6. The control processor 2712 of the management processor and the processing unit 2808 can, in one embodiment of the present invention, allocate data by accessing the dual-port RAM unit 2810 to each other. The control processor 2 7 1 2 and the processing unit 2 8 0 of the management processor can be driven by a single system clock 28 1 2 (for example, a 20 MHz HZ clock) or a different system clock of -18-200408457. Fig. 32 is an embodiment of the pressure control circuit 275. The pressure control circuit 2705 may include an upstream pressure input 2902 and a downstream pressure input 2904, respectively from the upstream and downstream pressure sensors. The input upstream and downstream signals can be amplified and filtered before being converted into digital signals by A / D converters 290 5 and 2906. As shown in Fig. 29, the pressure control circuit 2704 can also generate a differential pressure signal that can be converted into a digital signal using the A / D converter 2908. The pressure control circuit can be corrected by a correction circuit 2 9 1 0. The correction circuit may include hardware and / or software. Based on the known pressure applied to the pressure sensor, the pressure result read on the φ sensor will change. Can be compensated. In addition, the pressure control circuit 2704 can be used to receive the upstream and downstream input temperature signals (such as at the input points 2920, 2922), and the A / D converter can convert such temperature signals into digital signals. One or two pressure sensors 24, 25 (or differential pressure sensors), each of which may include a temperature sensing device, which may be located at each position (such as at or near the entrance or exit of a friction flow element) The temperature of the fluid is sensed, and the temperature signal is provided to the input points 2920 and 2 922. In addition, the temperature sensor can be provided separately from the pressure sensor. All the temperatures sensed are connected to the controller, and the controller calculates the appropriate fluid flow correction 値, and sends signals to the pneumatic proportional valve 20 based on the calculations used to correct various temperature changes. Since the pressure sensor itself can generate heat and be absorbed by the fluid, and can realize the flow characteristics of the fluid in the system, the above actions are indeed feasible; the regional temperature change on the surface of the sensor can change the output of the sensor. Other embodiments of the present invention may correct temperature -19-200408457 degrees based on, for example, a voltage drop across a constant current device (such as the pressure sensor itself). FIG. 4 shows another embodiment of the pressure control device 275. As shown in the simplified diagram of Figure 4, the 'pressure sensors 24, 25' preferably use two instrumentation amplifiers: one for upstream pressure and the other for downstream pressure. Use digital gain and offset control to calibrate each sensor automatically or manually. These two analog signals can be converted into digital signals by an analog / digital (A / D) converter, and the differential pressure can be derived in the software just by subtracting this 値. The shortcomings of this technology are the decline of resolution and the common mode. The analog / digital converter must convert each signal and mathematically remove the common mode. A feasible approach is to increase the resolution of the A / D converter to obtain the required differential pressure. For example, when the downstream pressure is 15 psi and the differential pressure used for this flow is 0.1 psi, it will be converted into 5.00Vdc (15psi = 2.50Vdc), and each converter must be a measurable peak to pressure (30 psi) ) Above. Because 15.1psi is 2.517Vdc, the differential pressure signal is 〇i7Vdc (except 5.00Vdc). When a third amplifier is added to electrically connect each A / D converter, the common mode can be removed, so that each A / D converter only needs to analyze the maximum differential pressure. If so, the common mode is It is greatly reduced. Therefore, the total differential pressure in the above example is equal to 5psi, which is converted into a voltage of 5.00Vdc. This method can increase the resolution by 6 times (6X). The gain of differential pressure (differential pressure) amplification can also be increased to increase the resolution of the differential pressure signal. A single differential pressure sensor can also be used, but in one embodiment, separate signals of upstream and downstream pressures cannot be detected. The upstream and downstream pressures preferably also include A / D converters. Then these separate -20-200408457 pressures can be used for upstream and downstream pressure monitoring 'and can be used to determine process changes (such as replacing filters). These pressures can also be used separately for a single pressure control, which can be used for viscosity calculations. Fig. 6 is an example of a flow chart for the adjustment of a flow control valve 10 and a control algorithm. Use a controller (such as controller 30 shown in Figure 1) to execute a set stored in a computer-readable memory (such as RAM, ROM, magnetic memory device, or any other computer-readable memory known in the art) ) Computer-readable instructions can implement this kind of algorithm, the algorithm can also include technology to reduce fuzzy logic (Fuzzy logic) and components from a matching controller. φ Therefore, the controller is a linear control system based on dynamic mode. If desired, you can use matching control or smart control to achieve greater accuracy. The matching control can use a non-linear optimal controller (Optimizer) to improve the overall operation of the control system, which is a known person. Figure 27 shows an example of a controller. As shown in the controller flow in FIG. 6, at step 902, the upstream and downstream from the upstream and downstream pressure sensors via the A / D converter (for example, A / D converter 29 0 5, 290 6) can be read. Pressure signal. At this point, the upstream and downstream signals can be sampled with voltage (that is, digitally sampled), which represents the analog voltage generated by the pressure sensor. At step 9 04, the controller may also read a temperature based on the reading of a temperature sensor, or calculate a temperature based on the current flowing through a sensor, and also use any known temperature correction algorithm to correct the temperature. Pressure signals upstream and downstream of temperature. In step 906, the controller can filter the upstream and downstream pressure signals, and in step 908, the pressure signal is converted into a pressure signal and can be stored in the memory (step 909). -21- 200408457 On the controller's steps 910 and 911, '1' can be used to calculate the integral 値 'derivative for upstream and downstream pressures 値' derivative 値 and any corrections 値. The calculation of the integral 値 and the derivative ° can be performed using various known methods. The control benefit can also be calculated (step 912) and stored (step 91 4). The differential pressure in the upstream and downstream pressures. At step 9 1 6, the controller may calculate an error (error) signal based on the derivative 値 and integral 用于 for the upstream and downstream pressures and store the error 値 at step 9 1 8 '. According to an embodiment of the present invention, 'at step 920, an error gain can be added to an error signal', and at a low pressure ', it helps to compensate for the low signal chirp. At step 922, the controller can read the gain of the valve. Fig. 5 is a valve gain curve of an embodiment. This curve adjusts the gain of the signal applied to the valve to proportionally reach the current position. The gain curve achieved by software can make the valve-to-valve change in the system correct. In addition to the correction of specific valve changes, the valve gain curve can also be used to compensate for over shoot and response time. . In Figure 5, the valve gain curve is used for two valves, of which valve A is line 500 and valve B is line 501. The curve (or valve grade) used for each valve can be created based on experience or stored in the memory of the controller. This curve can adjust the gain of the valve control signal based on the current valve position. In the graph of Fig. 5, the X axis represents the position of the valve, and the Y axis represents gain. In one embodiment of the present invention, each curve is made using 4 points: a maximum gain, a minimum gain, a tilt start point, and a tilt end point. The maximum gain is typically from the position where the valve is not actuated to the tilt start position. The minimum gain starts at the tilt end position and ends at 100% of the valve stroke -22- 200408457. The actual slope in the gain (slope) decreases linearly from the beginning of the slope to the end of the slope. The controller can read the valve gain curve for each valve and adjust the valve control signal accordingly. For example, when the valve position is between 502 and 504, at step 922, the controller can read the valve curve and adjust the number of control signals to make the count a high gain. When valve A is between lines 5 02 and 50 04, this curve keeps the gain of the valve signal to a high level to overcome the force that keeps the valve closed. At the point where the valve is actually open, the controller can adjust the control signal based on the valve gain curve and valve position to reduce the gain count. The controller can adjust and adjust the valve control signal along the valve gain curve to count the valve gain at any point. It should be noted here that the valve gain curve shown in Figure 5 is only a representative example. The controller can be based on any valve gain curve stored in any computer-readable memory and accessible by the controller. Control signal of regulating valve. In step 924, based on the error signal and the pressure 値, a control signal can be generated and written into a digital / analog (A / D) converter (such as a control valve driver). The A / D converter can generate an analog valve drive signal to drive a valve. Embodiments of the present invention may include a valve integration step (eg, step 926) to delay the # valve control signal, and a matching adjustment step (eg, step 9 2 8). The matching adjustment step reads a pre-defined number of stored previous position numbers and is used to adjust the current valve control signal. In addition, the controller can also implement monitoring step 930, which can be part of the matching adjustment. This function can edit real-time (real time) data such as set-point cross-reference (s e t-ρ 〇 i n t 〇 v e r s h ο 〇 t), settling time (s e 111 i n g t i m e), tilt stability and percentage error. During the setting mode, the edited data of -23-200408457 is analyzed by the controller, and it can adjust the control frame to the most appropriate performance (that is, the matching adjustment step 928 is performed). It should be noted that the controller can also adjust the valve control signal to compensate for the viscosity change. Because the viscosity of the fluid changes at the same flow rate △ p test 値, it must be corrected. One method of calibration is to compare the current Δp with the flow rate and the standard Δp with water as the standard Δp with the flow rate. The user can then enter the differences between them. Another method is to measure the internal parameters and compare them with similar preset parameters, and compensate internally. The third method is to use the curves that have been created in the factory and used for various fluids. Thai controllers can store multiple curves, and users can make multiple choices. Many different parameters can be set to cover a wide variety of applications to ensure proper operation of the suction return valve. For example, "off time" (off time) can be used to adjust the time from ON to OFF pressure change. This is the time to move the valve diaphragm from its fully extended position to the suction return position. Fast, may cause flow injection to pull bubbles into the flow injection or cavity. Suction valve · 'on time' can be used to adjust the time from OFF to ON pressure change. This is the end of the valve diaphragm The time required to move from the suction-back position to the fully extended position. When this movement is too fast, it may cause the bulge of the stream, which is detrimental to changing the actual supply. There are two other Setting: suction return ON and OFF pressure settings. These two adjustments determine the valve to open to reach the desired suction distance. The greater the difference in pressure, the more the suction amount is increased. Use ON pressure and OFF There are two reasons for both pressures: to adapt to similar types but for the differences between different valves; and to adjust the non-linearity of different valves and other system configurations. This entire action can also be delayed to separate control- 24- 200408457 valve stop operation Suck-back action. In some applications, the suction-suction valve can be used to assist the control valve to stop the fluid. The method is as shown in Figure 29. Suckback) position. This auxiliary function can also be programmed as a percentage of the stop action at the beginning or end of the stop action. If it is programmed, after the delay, the normal suction can be used. The position is sucked back. Referring back to FIG. 2, the housing 100 shown in the figure contains various components of the present invention. It is preferably an electrical component such as the LED board 105 and the main printed circuit board 106, and the friction Type flow element 15, fluid control valve 10, etc. Pneumatic proportional valve manifold 1 1 0 that is isolated from the fluid. The fluid enters the main fluid control valve 1 at the fluid inlet (not shown). After that, the fluid flows It enters the frictional flow element 15 through the valve. In the embodiment shown, the flow element 5 contains a relatively short straight portion 15 B, after which it is wound spirally until it reaches another quite long The straight part 1 5 A ends, The longer straight part 1 5 A can be the sensor of the second pressure (and temperature). The friction flow element 15 can be a tube, or a tube, or the wrapping space of two parallel hollow fiber tubes, which have a sufficient amount Size, the fluid can cause a pressure drop as it flows through it. Other suitable H-friction flow elements include, for example, meandering channels made of block polymer materials, porous membranes, sinters, and filters. .Friction type flow element is best to avoid making 90-degree turns, otherwise it will increase blocking or cause excessive disturbance of shear force. Although friction type flow element 15 can be linear, but friction type flow element 15 is best made spiral Coiled tube to save space, and its diameter and length depend on the flow rate. Therefore, the diameter and length of the frictional flow element 15 are a function of the required pressure drop, so "noise" can be ignored. As far as the fluid given is -25-200408457, there is no need for the length and system of the tube. The smaller the diameter of the tube, the greater the pressure drop. In terms of the shape of the tube, the viscosity of the fluid increases. The pressure drop will also increase. For example, when used for a fluid control valve 10 to supply deionized water, the friction flow element 15 has a specification of a 1/4 inch outer diameter pipe, a wall thickness of about 0.047 inch, and a pipe length of about 40 inches. The maximum flow rate is about 2 liters per minute, but it also depends on the system conditions, such as the pressure of the supplied fluid, the air pressure of the supply, and the system pressure difference outside the device. Simply changing the geometry of the frictional flow element can optimize the flow rate for a given supply / flow condition. In order to reduce or reduce the flow of fluid outside the element 15, the inner diameter of the friction flow element is preferably the same as or substantially the same as the inner diameter of the flow path downstream of the tube or other element 15. The fluid flowing through the frictional flow element 15 may be laminar or turbulent. Therefore, the fluid path is: the fluid enters the fluid inlet of the fluid control valve 10, the flow path valve (and passes the pressure and temperature sensor), and enters the inlet of the friction flow element 15, passes through the friction flow element 15, and Its outlet is sent out (and passes the pressure and temperature sensors located upstream and downstream of the friction flow element 15 outlet). The elasticity of the present invention, according to one embodiment of the present invention, is the friction flow element, which can be easily interchangeable based on, for example, flow characteristics and / or fluid characteristics. Other types of devices used to generate pressure drops, although suitable for various industrial processing applications, will produce some undesirable marginal effects. 'These negative effects include uncontrolled and excessive inlet and outlet pressure loss, local backflow. Zone or eddy current, and traP zones. These components that cause additional pressure drop include Venturi tubes, fluid nozzles, hole groups (square edge of thin plate -26-200408457, quadrant edge's eccentricity and bow shape), centrifugal, and linear impedance. The following example demonstrates the specifications of a set of friction flow elements: The inner diameter of the spiral coil is 0 · 6252 inches, the length is 20 inches, the number of turns is 2.5 turns, and the flow rate of water is 0.5cc at room temperature. / Sec to 5cc / sec. The inner diameter of the spiral coil is 0.156 inches, the length is 40 inches, and the number of turns is 5.5 turns. At room temperature, the flow rate of water is between lcc / sec to 30cc / sec. The inner diameter of the spiral coil is 0.250 inches, the length is 20 inches, and the number of turns is 2.5 boxes. At room temperature, the flow rate of water is 2.5 Ι / min. ~ 5 Ι / min. The spiral coil has an inner diameter of 0.35 inches, a length of 20 inches, and a number of turns of 2.5 coils. At room temperature, the flow rate of water is 2 Ι / min. To 10 Ι / min. In some applications, the fluid pressure into fluid inlet 12 (Figures 1 and 8C) may be too low or too high. In order to adjust the fluid pressure, an auxiliary input module 200 as shown in FIG. 3 can be used as an upstream supply module. The auxiliary input module 200 has a body or container 90 and four normally closed (because of the bias by a spring 97) poppet valve 91. The four poppet valves are fixedly arranged between the module base 92 and the cover portion 93. . As shown in the figure, the base 92 is locked with four fluid parts 94 and 94 A. One of them is a pressure port, the other is a vacuum. □ 'The third one (94 A) is a fluid inlet, and the fourth one is an exhaust Q ° 4 pressure connection type The other part 95 is fixed on the cover part 93 and provides nitrogen to actuate the poppet valve 91. After that, the poppet valve 91 is opened to allow the fluid to flow to the ports 94 and 94A. A fluid outlet 98 is provided at the bottom of the body 90. The level sensor 9 6 is mounted on the body 90 with a bracket 101 to sense the fluid level in the module body @ $ 器. The body 90 may also be provided with a filter (not shown). The stomach 7 fills the module 2 0 with a source of pressurized fluid, which can be opened at the same time. -27 · 200408457 Inlet valve and exhaust valve, the pressurized fluid can flow into the module, after a period of time, or sensed by the liquid level When the liquid level sensed by the device has reached a predetermined threshold, the inflow of the pressurized fluid is stopped. The exhaust valve can be used for pressure equalization, so that the fluid passing through the inlet valve can flow into the container 90. After that, close the inlet and exhaust valves, and open the fluid supply pressure valve. If the system must flow fluid, open the fluid control valve 10 at the same time. If the pressure of the fluid from the supply source is too low, pressure can be applied with the charging cycle to increase the supply pressure. This pressure can be applied continuously or only when needed. Similarly, when the pressure of the fluid supply fluctuates irregularly, such pressure must be applied. If a non-pressure supply source is used, the inlet and vacuum valve can be opened at the same time. A vacuum valve is used to draw fluid from a fluid source. The module 200 can also be used as a defoamer. In particular, as described above, the charging unit in the cycle is used to pressurize the source of the fluid. Once the container 90 has been filled to the desired liquid level, the inlet and exhaust valves are closed, and a vacuum is applied to the fluid at a programmable or desired time, so that bubbles can be removed from the fluid. 41 In another embodiment of the present invention, it is very advanced for saving space. The valves used are shown in Figs. 12 to 23. Similar to the valve of FIG. 8, the upper end cover 71 ′ of the valve of FIG. 12 includes two concentric circular rings 84 ′ and 85 ′, and a circular groove is defined between them to accommodate the top pneumatic ring. 74 'synthetic rubber O-ring 7 2 ′, this 10-ring can seal the valve pneumatic diaphragm 7 3 ′ in the housing. A plurality of paired threaded valve clasps 76 'are used to sandwich the upper diaphragm 7 7' of the valve and the lower diaphragm 7 8 'of the valve, and are biased by a spring 80'. In -28- 200408457, the assembly is screwed together with the stainless steel screws, bolts or tips 7 5 and held together with the threaded buckle. The external assembly is connected to the valve bottom end cover 82, stainless steel tips or bolts 83 ^ and the valve top end cover 71, etc., and held in a non-contact manner. A press-in communication type connection is connected to the upper end cover 7 Γ of the valve, and the pneumatic proportional control valve 20 is pneumatically connected by appropriate piping or the like. The flow path (between inlet and outlet) in the fluid control valve 10 is not in-line (i η _ 丨 i n e)
’故可進一步降低如第2 7 D圖所說明之壓力降及未旋刮之 容積。閥之偏位式入出可使稠狀液體或其他液體易於流動 ，並可使蓄積量最少。 H 閥殻體7 0 ’最好設計爲模製型，使感知器殻體與閥一體製 成。與第8圖之感知器殼體60不同的是，此種一體式之實 施例只需一個單一的感知器端蓋6 5，，可大幅減少所須之構 件數重’並抑制可能造成毀滅性故障之毛顯（burr)。 在第1 2〜1 4圖所示之閥殼體實施例中，流體係進入閥入 口 12’之入口，並流入線性通道12A’，直到抵達藉其內之 入口穴99’的圓穴90’爲止。一旦閥開啓時，流體傾向繞著 圓穴90’成螺旋形，之後，經過兩個隔膜而進入狹窄之環形馨 通道，並進入第2穴內，此狀況與之前第8B、8D圖所示 之實施例相同。螺旋狀之流體流動路徑係經一出口孔穴（未 示），以線性路徑13A’朝向出口 13·，該種路徑係產生於第 2孔穴8 9 ’內。爲了改善孔穴9 0 ’與8 9 ’間之壓力損失，俾令 裝置中可依所產生之壓力降使流體之旋刮作用發揮至極致 ，則可如前述，在閥密封表面設以複數個區域或去角 (camfers)(例如〇.〇4吋）。流體入口路徑12A’與流體出口路 -29- 200408457 徑13Af兩者最好是分別沿著孔穴89’及90f之正切方向（比 沿著軸徑方向爲佳）配置，除可有助於流體之流動均勻化外 ，並可改善壓力降。入口 12,及出口 13’可爲外螺牙式，便 於啣接適當之軟管。 位於第1及第2孔穴9 0 ’及8 9 ’之流動路徑1 3 A ’下游者， 爲一第1感知器殼體60’。此一感知器殻體60’之流體係與 第2孔穴89’及出口 13’相通。壓力及/或溫度感知器64’係 以例如perfluoroelastomer(KALREZ)之Ο形環63'予以密封 在殻體6(Γ內。端蓋65’係以複數之螺栓或梢件66’等予以聯馨 結於殼體60’。感知器64’係用以感知於感知器殼體60’入口 與出口間之流液路徑上的壓力及/或溫度，並把所感知數値 之指示信號送至一控制器。 此一閥之實施例亦可包括一第2感知器殻體1 6 0 ’，其構 造最好與感知器殻體6 0’相同。如第13圖所示，第2感知 器殼體160’之流體係與入口 112’及與入口 112’相隔開之出 口 1 W等相連通。 因之，本實施例之閥，參考第14Α、14Β圖，其功能如# 下。流至閥口入口之流體係進入入口 ，並經通路12Α’ 流至第1閥穴90’而容存於其內，直到閥打開爲止。閥一旦 打開，流體即自第1閥穴90’徑一孔穴流至第2閥穴89’。 流體藉由一出口孔穴而由第2閥穴8V送出，並進入第1感 知器殻體6 Γ，流體之壓力及/或溫度感知器即感知殼體6 1 ’ 內之流體，並予記錄，及/或送信至控制器。流體係由出口 1 3 ’自閥送出，並行經最好成盤管形之摩擦式流量元件，之 -30- 200408457 後，介由入口 1 12’重新進入閥總成， 體係流入第2感知器殼體1 6 0 1，在該 獲得感知及記錄，及/或予以傳輸至控 感知器殼體60’後，係經由一妥爲設置 ，使空間獲得最大利用，並返回流體 同一面處。 爲了使閥總成之一側上具有氣動之 機械之特性等之設計，可使用多重的 個單一單元，此可更進一步儉省空間 。因之，如第13圖所示，感知器601 均相同，而感知器6 0 ’以等距和出口 1 體160’即與入口 112’隔開。因此，倘 ，則閥穴即成垂直之對正，第1 5圖爲 一例，爲了可容納閥之氣動側組件及 (m i d d 1 e c 〇 v e r ) 1 7 1 ’係設計成具有上部 8 2’等兩者之內部一部分。堆疊式閥總 限、其供給爲複數點的流體供給。至 僅須一單一的比例式岐管、一單一的 單一的殼體及纜線，故可毋須兩套構 則包括化學之混合（比例測量式控制） 供給、兩個分開供給點之獨立供給、 立控制、及連續性中不斷供給等。 閥總成之方便設計可達成實質上之ί 如，第1 6圖所示之閥總成係具有一閥 如第1 4 Β圖所示。流 處，壓力及/或溫度可 :制器。流體流出第2 之路徑而行經閥總成 最早進入之裝置的相 特性、另一側上具有 閥總成予以堆疊成一 之佔用以及儉省成本 φ 與1 6 0’之尺寸及組態 1 3 '隔開，則感知器殼 把兩個作垂直之堆疊 該種堆疊式閥總成之 機械側組件，中蓋 端蓋7Γ及下部端蓋 成特別適用於空間有 於其他之優點，包括馨 LED及主PC板、一 件。在各種應用上， 、分開流體之同步化 一體性之獨立或非獨 霉用性（v e r s a t i 1 i t y )。例 及一單一的感知器殼 200408457 體者。閥之各種不同組件的尺寸最好與第1 3圖所示之閥相 一致’以保持須要時之堆疊性，且如須要時，亦可供如第i 8 圖所示另一感知器殼體之附加。確實地，提供如第1 8圖所 不之裝卸性感知器殼體內嵌物（insert)作爲分開之組件，則裝 置即可建構一個或多個感知器殻體，其中各感知器殼體係以 倒立式裝設（對閥穴而言），有助於去除泡泡。 各種組件可予模製成內嵌形。例如，第1 7圖所示之閥即 未有感知器殼體。第19圖則具有雙感知器殻體內嵌件。感 知器殻體之入口 1 1 2 ’、2 1 2 1及出口 1 3 ’、1 1 3 ’等係作成外螺 紋式，便於閥之固裝。用於閥總成之感知器殼體部的內嵌 件，可爲許多不同之組合形態，並可依該等內嵌件作替換 ，以形成使感知器殼體倒立，俾當閥裝設後，依閥之定位 而有助於氣泡之去除，如上所述。同樣的，氣動式及機械 式組件之互換式，亦可令模製閥之竹口與出口顛倒，而用 於上游或下游之壓力控制。把氣動式及機械式組件裝設在 閥穴之對向端時，則系統之差壓即可反向運作，且閥之差 動壓力上游即可取代壓力下游而予以記錄之。此將可令使 用監視供給於系統單元之壓力，以取代接近排放點之壓力 下游。第2 3 A及2 3 B圖分別爲上游型態與下游型態。該兩 圖例示了模製閥設計之萬用性，其中各氣動組件及各機械 組件，依閥是否希望在壓力降之上游或下游的狀況，可設 在閥之任一側上。感知器之位置亦可提供消費者之系統狀 況的監視，非僅供本裝置之監視者。 第2 4 A、2 4 B圖爲一種模製組件形態例示，可用於一流 -32 - 200408457 量控制器上，該控制器經由設在裝置底部的3個口（排氣口 、入口、及出口）即可具有與一 Mykrolis LHVD型過濾器配 對之能力。此種設計係可接受一 LHVD型之過濾設備者。 本發明亦可使用傳統式之氣泡感知器。氣泡感知器係把 一調節之信號送於一控制器，將該信號轉換爲空氣之百分 比。倘此一百分比超過了預設程度，使用者即被告知。適 用之氣泡感知器可爲光感式或電容式，並具有兩個輸出（ON 及OFF)，故在整個時間上，即可作多數的0N及〇FF之計 數，並變換爲稠狀物或流體中空氣之百分比。 _ 第25A、25B圖爲無氣泡陷落位置（n0 bubble trap location)之一種閥設計例示。流體經閥之入口進入，沿 著直線往上，氣泡亦隨之上升至頂部。剩下之流路則係一 連續性直徑路徑暨均位於路徑下方之感知器袋形細件，故 即無氣泡可供陷落捕捉（傳統式之閥所具之特點係造成氣 體無法逸離之複數袋形爲之）。相較之前的各實施例，此一 設計亦可減少3項構件，包括流體隔膜、閥端蓋及扣件等 ，故可減低組裝成本、材料成本及減低複雜性。此外，尙® 可減少兩個重要的流體密封處所，包括隔膜舌片與槽溝密 封兩者中之一者，及兩個流體隔膜間之干擾配件（interference fit) 0 在流體隔膜401與氣動隔膜402間施加壓動壓力時，此 一氣動壓力大於一預先加載、施加偏壓令閥關閉之彈簧壓 力時，閥即被驅動而開啓。因氣動隔膜402係大於流體隔 膜401，且兩個隔膜係以螺絲403及扣件404相互抑制， -33- 200408457 故在氣動閥402上將造成較大的負載，並進使閥開啓。壓 力係經倒鈎形另件〇&14^川1^)40 5 (第253圖）及配管（如 聚乙烯）4 0 6作供給。氣動穴4 1 0係以〇形環4 0 7、氣動隔 膜舌部及溝部等作密封，如圖所示。而感知器4 1 1係以〇 形環4 1 2密封，並固附有一感知器端蓋4 1 3。 在另一實施例中，爲了減少9 0度之轉彎，可修正如第 2 6圖所示之設計。其中感知器穴係移至閥之側面。偏位之 流路可消除流體之轉彎，並可消除未旋刮之區域。因在氣 動側並無〇形環之存在，且因諸隔膜相互間之設計及尺寸# 等因素，故此種閥的磁滯甚小。以提動（pop pet)設計而言， 亦可達成最優質之線性，流體之流量將隨施加於閥上之壓 力而實質上及直接上均成比例式之變化，在整個工作流程 中均然。 第2 8 A、2 8 B圖爲流體控制閥之另一實施例，其中一 〇 形環係用以分隔流體隔膜及氣動隔膜。此種方式可防止在 兩個隔膜上過度加載使得閥之壽命降低。流體控制閥之流 路並無用於空氣之高點以作陷落之捕捉（除非是位在流體β 控制閥體一側上之諸感知器密封件處具有可供收集之微量 空氣）。此種流體控制閥流路係設計成具有一單一的流體隔 膜，在閥內並無高點（不含壓力感知器密封方法），則在流 體之流路中，即無空氣可供陷落捕捉。在流體控制閥內之 空氣陷落捕捉，一旦流體控制閥關閉時，將對排放之端部 有害，且空氣亦可能被解壓。流體控制閥中之空氣陷落捕 捉亦將不利於流體排放之啓始。流體控制閥中之空氣陷落 -34- 200408457 捕捉亦將促成其他之空氣溶入流中’或形成有害於晶圓上 之微細氣泡。 將氣壓施加於氣動隔膜4 02,與氣動封閉〇形環415間之 氣動穴410’，閥即動作，該所施加之氣壓係克服以彈簧8〇〇， 之偏動使閥關閉之壓縮力’乃令閥開啓。施加於氣動隔膜 4 02’表面上之壓力乃促使其變形並在迫流體隔膜4〇ι，，因 此一隔fe 4 0 1 ’係以螺絲4 〇 3，及扣件4 〇 4，而受隔膜4 〇 2，之壓 迫，故隔fl吴4 0 1 '即被打開。氣動密封〇形環4丨5 ,可防範任 可的熟壓到遂流體隔膜，故其可防止氣動壓力在兩個隔膜馨 上施加過度之負載。壓力係經由倒鈎形另件4 〇 5，及適當之 配管供給。一選用之感知器穴5 〇 〇可設在閥密封件之上方 。此種設計可防止空氣陷落於流體穴、入口通道、出口通 道、及其係至感知器穴與感知器穴之通道等之內。因切線 方向之流動可防止未旋刮之區域。故流體入口通道係設成 正切於閥流體穴9 0，之內徑方向上。所有的高點均在流體路 徑之內’或均不高於流體路徑。流動之路徑均無尖銳之轉 角’故流體之流動甚平順。 φ 各種設計及其彈性化係可使複數的閥件與感知器作多種 的組合以成爲模組化之總成，並可提供各種不同之組態， 用以建構複數之閥件、感知裝置、流量表、流量控制器、 壓力控制器及溫度控制器等構件。因此，第2 0圖爲一種堆 疊式流量控制器及ΟΝ/OFF閥總成，包括一第1閥300、一 第2閥3 0 0 ·及第一與第2感知器3 1 0、3 1 0 ’，其流體係與一 摩擦式流量元件15相通。第21圖爲4個感知器310、310’ -35- 200408457 、3 2 0、及3 2 0 ’之堆疊總成。而第2 2圖爲一流量控制器及 流量表總成。 第24 A、24Β圖爲模製型閥設計之另一實施例，其組態 係用於一流量控制器，且經設在裝置底部之3個口，即可 和一 LHVD(Low Hold-up Volume Device)型過濾器裝置作 配對，3個口中，口 6 1 0爲來自過濾器之排氣，口 6 1 2爲 至過濾器之入口，口 614爲來自過濾器之出口。 依本發明之另一實施例，可用作閥輔助功能。於使用電 磁閥、針閥等之傳統式閥件中可加以應用，以改變施加於φ 各閥件之壓力變化，典型的，係使壓力緩慢的消散。在順 序控制之停止部中，減低施加於閥吸回部之流量變化，吸 回閥可輔助停止閥。如本發明之第2 9圖所示，在控制閥 (或停止閥）之OFF time期間，吸回閥壓力可予降低以輔助 停止。一旦控制閥之0 F F t i m e終止，可提供一吸回延遲， 則壓力仍恒定的施加在吸回閥上。此一預設之延遲過後，· 施加於吸回閥之壓力再度降低，直至吸回閥壓力到達一預 設之準位爲止，則吸回閥即回復其正常或靜止位置。此一馨 順序控制有助於保持液滴不自噴嘴口滴落。在其他另一個 實施例中，係把吸回輔助動作，在隨著控制閥動作之後延 遲一段時間方啓動者；或可將設動作縮短，則吸回閥之動 作僅在控制閥之停止動作啓始時方發生。此間說明者，乃 則述之壓力雖係爲動作式方法（a c t u a t e d m e t h 〇 d)，但如使用 任何種之閥動作方法，例如馬達等，仍屬本發明之範疇。 •36- 200408457 實施方式 第1例 系統業已設置爲，一已知之差壓及一固定之供給（排放） 時間可予輸入至控制器，且由一搭疊式電腦所作之順序性 激發而可作供給液。去離子化水之合成輸出流係捕捉在一 容器內，並使用一精密之量規予以秤重，俾決定其物質。 利用各供給之物質暨流體材料之已知密度，即可計算各供 給之容量。結合供給之容量及已知之供給時間，即可決定 流重。測試黏度自約0 · 9 2至約9 · 5百分泊（c e n t i p a i s e )第5肇 種不同黏度之流體，其壓力與流量關係曲線圖如第1 0圖所 不 ° 第2例 使用3種閥作磁滯之測試，包括兩個市售閥及一個本發 明第8 A〜8 D圖所示之閥。閥之作動壓力係上下變動，且測 試系統內之壓力經測量結果，係經閥作動壓力範圍而成階 段式上下波動，測量結果並予描繪爲電壓。具體言之，此 項測試之建立係閥之閉合系統及下游壓力感知器，以及閥<1 係在恒定壓力下，且此閥之動作係經閥閉至全開再返回關 閉之過程，而該壓力感知器係監測閥壓力下游之壓力改變 者。 測試之結果如第9A、9B及9C圖所示。 在各曲線圖中，曲線最遠至右邊處係表示用以改變由低 至高壓力之數據，而曲線往左方處，則係壓力由高至低之 變化。各曲線間之差異即是表示磁滯量。因之，壓力係依 -37- 200408457 作動壓力之步驟而成上下變化，倘無磁滯時，雨個齒線將 會重合。第9C圖表示依本發明之閥，就磁滯而言，此市售 之閥少得甚多。 第3例 此例係本發明一實施例之應用例示，用於化學機械平面 化基片之處理，可用以測量及控制流體之流量，以使流體 可作各別流量（容積）之饋送者。具體言之，此例係說明本 發明之實施例何以可用以測量及控制液流，而可供應各別 容量之拋光液體於一基板上者。 g 光學鏡頭之製造中，係使用化學機械拋光。在半導體裝 置之製造中，則使用化學機械式之平面化。拋光用之流體 可爲酸、或酸性及可包含諸如矽石或氧化鋁之磨料；用於 拋光矽氧化物之流體包括矽石漿體，係成水性鉀氫氧基溶 液狀；用於拋光銅金屬之流體，包括如過氧化物之氧化物 、如Benzotriazole之抑制劑、及如醋酸之有機酸的水性溶 液等。 本發明實施例之入口，係連接於盛裝有拋光流體、以壓馨 力或重力作饋送之容器。流動裝置之出口係連接於拋光器 具之噴嘴。拋光器具具有一擬予拋光之基片，係以一轉動 之墊或皮帶令其作轉動以作拋光。該基片係和拋光墊接觸 ，該拋光墊乃可依流體之化學反應而把材料自該基片去除 。拋光流體係經噴嘴而送至器具上之基片；供應噴嘴之拋 光流體流量係以流動裝置及其電子功能作控制。流動裝置 之電子功能可連接於器具之控制器’俾可令器具控制拋光 -38- 200408457 流體洪給於基片上之排放時序。該器具亦可包含一拋光終 點檢知器，此亦可用以控制拋光流體送至基片之時序。流 動裝置中之電子功能的信號處理器，可消除盛納拋光流體 之壓力容器內因壓力之變化所導致拋光流體供給流量之變 動。比較蠕動性（peristalic)之泵浦而言，本發明之拋光液 的供給係爲恒定之流量。此種對於拋光流體的容量控制及 供給率控制至一基片的作法，可降低化學物質上之浪費， 更可使基片作均勻且重複之拋光。 第4例 _ 本發明一實施例之此一例示係測量及控制流體量者，故 可將各別容積之流體送至一汽化器以形成氣體。具體言之 ，此一實施例係說明本發明何以可用作送至一汽化器之流 體的測量與控制者。 使用之液體爲化學性液體，可在汽化器內加熱而成爲氣 體。汽化後所成之氣體再送至一反應室內的加熱基片，在 加熱的基片上，送入之氣體即可作進一步的分解或反應。 該氣體亦可用以形成一金屬之薄膜、一半導體，或在基片# 上形成電介質（化學氣體沈積法或微粒層化學氣體沉積法） ，氣體復可用以蝕劑基片之表面，或用以乾燥基片。使用 之液體可爲純種液體，諸如：水、2-丙烷、或四乙酯正矽 酸鹽、TEOS等。使用之液體亦可含有溶於例如四氫呋喃 (tetrahydrofuran)溶解液中之總 dipivaloylmethane、Sr(DPM)等 的固形份。某些使用之液體，諸如銅（I)hexafluoropentanedionate vinyltrimethylsilane、（VTMS)Cu(hfac)等，均具有熱敏感 -39- 200408457 性’由流重表中所周之熱感知器即可加以解拆。所使用之 液體，一般之流量約每分〇 . 1克〜約5 0克。諸如鏡頭及光 纖等光學裝置之被覆中，薄膜非常重要。而各種平板（flat panels)、微處理器、及記憶裝置等之製造上，薄膜及薄膜 之蝕刻亦甚爲重要。 依本發明一實施例之流量裝置，其入口係連接於使用液 體之壓力化供給源。流量裝置之出口則接於一汽化器。用 於流量裝置之閥可設於汽化器之上游或下游側。汽化器之 出口則接於器具之處理室，該處理室內容裝有擬以氣體處φ 理之基片。作多重處理而需使用多種液體時，可使用多種 流量裝置。流量裝置之電子功能可連接於器具之控制器。 此可令處理器具由壓力化之供給源、經流量表再進入加熱 之汽化器、的整個流程上，對液體之流動作遙控。用於化 學氣體沉積處理之汽化器包括：加熱之金屬熔前玻璃原料 (heated metal frits)、加熱之閥、及加熱之配管等構成。 容裝使用液體之容器內的壓力變化，將使送至汽化器之 液體流量發生變化。而熱流動元件中之使用液體的熱分解馨 ，亦將使流至汽化器液體流量不準確。因汽化器會飽和， 故流至汽化器之液體流量不控制好，將導致液體之不完全 汽化。而不完全之汽化將使得液滴滴落於處理室內進而滴 落在擬處之基片上，造成了基片之瑕疵。依本發明實施例 之演練結果係，不以熱流動元件控制所使用之流體、且供 應至汽化器之流體爲重複性並經控制，此外，尙無關於上 游壓力之上下變動者。 -40- 200408457 第5例 本發明一實施例之此一例示，係用以測量及控制液體之 流動’可令流體供施於一基片作無電式之鍍裝者。具體而 言，本例係說明本發明一實施例可用以在鍍裝處理中，控 制施加於一基片上之一系列化學物質的排放量，以形成一 金屬膜者。此種處理可消除一般浸浴式鍍裝處理所須對化 學物質之拖出作業。 用作鑛裝之各種金屬及金屬合金的溶液包括（但並非限 制僅爲）：銀、銅、鉑、鈀、金及錫等。通常須要觸媒用以馨 使鍍液在基片上活化。該等觸媒包括：膠態鈀、碳、石墨 、錫鈀、膠體、及例如polypyrrole之傳導性聚合體等，某 些此等的觸媒與鍍液中之金屬，用以施作鍍裝處理時，因 其價格昂費且浪費甚多，故須作撙節而使鍍裝處理之成本 降低。此外，某些此等溶液中之金屬，在作鍍裝處理時， 因係會產生毒性，故亦須使其排放於環境之量減至最小， 並須降低廢棄物之處理成本。 對於鍍裝處理中所使用的每一項化學物質，本發明一實馨 施例之裝置，其入口係連接於一壓力化、泵浦饋送、或以 重力饋送之化學物質供給源。本發明此一實施例之出口係 連接於擬將各化學物質洩放於基片之噴嘴上。使用一熱交 換器、冷卻器、或電阻性加熱器元件等，在溶液送至基片 前，可將其溫度降低或升高。例如，以無電式之處理，可 將銅金屬沈積（生長）於基片上，其過程爲··藉由一第1流 量裝置，使基片和含有膠質鈀之活化劑相接觸；利用一第 -41- 200408457 2流量裝置，以水漂洗基片；利用一第3流量裝置，把催 化之基板和一氫氯酸活性溶液相接觸；及經由一第4流量 裝置，把基板和含有酸銅離子、類似甲醛之還元劑、類似 EDTA之複合劑、類似荷性鉀之鹹、等來源並爲一定容量之 銅溶液相接觸。基片係在第2流量裝置以水予以淸洗之。 各流量裝置之電子（功能）可予連接至鍍裝器具之控制器 ，以經由各流量裝置調節液體供給之時序、週期及順序等 。如是，在每一個處理之步驟上，均可使各化學性物質以 測量之容量快速且精準的送於基板上。因僅是供應足資達馨 成完全反應之適當化學物質量於基片上，故可減低化學物 質之不當耗費，因而減低了材料成本。且因在基片上拖曳 出化學物質之污染亦可減少。再者，因流動元件之快速反 應以及閥之循環動作時間減少，故處理之整個產能亦因之 而增加。 第6例 本發明一實施例之此一例示，係用以測量及控制液體之 流量，以使供給於一基片上之流體可形成一致性的被覆。H 具體言之，本例係說明本發明之實施例係如何的測量及控 制施加於基片上之流體流量，以令液體材料在基片上可作 精密的被覆。 在旋鍍式（spin coating)之處理方法中，一般所使用沈積 於基片上之液體或漿體，包括電介質材料、光阻、防反射 被覆材、聚亞醯胺，例如h e X a m e t h y 1 d i s i 1 a z a n e之黏性助催 化劑、鐵電材料、及溶膠…膠固體（s〇l-861)等。該等材料 -42- 200408457 係以一固定式或移動式之噴嘴供給於一靜態或緩速轉動之 基片上。被覆用之材料施加於基片上後’基片即以約 1 0 0〜5 0 0 0 r p m之阔速轉動’將賦予其上之被覆材料作均勻 的散播被覆，以在其上形成液體材料之薄膜。此種處理中 ，重要的是諸多的該等材料均甚價廉，且使用量不多’浪 費亦少。而作重複性之被覆，其施加於基板上之流體量須 爲一致。 此一流量裝置實施例之入口係接於盛納被覆液體、以壓 力化或重力化作饋給之容器上，出口則係接於被覆器具上之# 噴嘴。被覆器具具有以一旋轉夾頭固設之一基片。被覆液 體係經噴嘴送於器具上之基片；流至噴嘴之被覆液體係以 流量裝置及其閥件作控制。流量裝置之電子功能可連接於 器具之控制器，以令器具可控制施加於基片上之被覆液體 的時序及流量等。藉電子功能與流量裝置的連通，被覆器 具可依噴嘴位置及基片旋轉速度等因素而改變流體之流量 ，以達成所希之被覆。流量裝置之信號處理器，可消除盛 裝被覆液體之容器因壓力變化所致被覆液體之容量與流量β 的變化。結果，被覆液體係以經控制之容量送於基板者。 此種結果，除了減少化學物質之浪費外，且該複數片基片 可作均勻及重複之被覆。 第7例 本發明一實施例之此一例示，係用以測量及控制流體之 流量’使其在一基片上作反應者。具體言之，此一例示係 說明本發明之此一實施例係如可的可用以測量及控制施加 -43- 200408457 於一基片上之反應流體的流量者。該等反應流體（reactive liquids)包括、但不僅限制、如正性或負性光阻顯像劑、光 阻、脫色劑（stripper)、例如氫氟酸之酸、例如臭氧式去離 子化水之氧化劑、或例如過氧酸類之蝕刻劑等。 本發明此一實施例之流量裝置，其入口係接於盛裝反應 液體之壓力化或重力饋給的容器上，而流量裝置之出口則 係連接於器具上之噴嘴。反應液體係經噴嘴送至器具上之 基片；·以流量裝置及其閥件控制流入於器具上噴嘴內之反 應流體。流量裝置之電子功能可連接於器具之控制器，俾· 使器具得以控制施加於基片上反應流體之施加時序與流量 等。而流量裝置之電子功能亦可經器具之控制器而連接於 一反應終點檢知器上，則當接近或到達反應終點時，反應 流體之流量即可減少或停止。蝕刻處理之一代表例爲使用 過氧酸類之酸，將銅由已鍍裝之晶圓的緣部加以去除。應 用本發之此一實施例，可控制施加於基片上之反應液體 流量，並可對處理之終點作精準的控制者。 第8例 · 此一例示係使用本發明一實施例串聯複數個化學物質感 知益’用以測量及控制流體之流量及其組成（c 〇 m ρ 〇 s i t i ο η ’或稱成分）。具體而言，本例係說明本發明之實施係如何 的和一個或複數個化學物質感知器相串聯，可控制流體之 流量及流體成分。此種控制之應用希包括（但非限制）鍍槽 、RCA淸洗槽、臭氧式水槽、及氫氟酸之酸槽等。本發明 一實施例結合該等感知器之其他應用，包括保持一化學物質 -44- 200408457 槽之純化。例如，在一循環槽中污染物之增加’諸如粒子 、有機材料、或金屬離子等，可能須要把此槽內之污染性 流體作週期性的排放，並再更換以等量之非污染性流體。 此外，此槽亦可切換成一純化器或粒子過濾器，當保持恒 定之流量時，可同時除掉污染物質，直到污染物質可予去 除前，可保護目前進行之處理及產品。 對於各種基片表面上有機材料之去除，可使用溶解有臭 氧之去離子化水爲之。臭氧產生機中之不規則變動所輸出 之氣體濃度，將導致溶解於水中之臭氧濃度的變化。此種· 所溶解之臭氧濃度變化將導致使用臭氧化水將基片表面氧 化所須之時間，亦造成處理過程暨淸洗時間均無法一致之 不良後果。 爲了在一溢流式淸潔槽中保持所溶解臭氧之濃度，依本 發明一實施例，係將入口接於去離子化水之源部，出口則 接於一氣體接觸器（gas contactor)。該氣體接觸器係一種物 質轉換裝置，可把各種氣體溶解成液體。該種裝置暨其動 作說明，可見諸 W.L. Gore，Elkton，MD，及 Mykrolis Φ Corporation，Bedford，ΜΑ.等所提供之產品。由臭氧機所產 生之臭氧氣體係送於氣體接觸器之殼體側，在該殻體側處 ’臭氧氣體即溶入流經氣體接觸器管子之去離子化水內。 溶入水中之臭氧濃度，可由例如美國Needham，ΜΑ，所製 售 '連接於氣體接觸器之流體出口的一種臭氧溶解濃度監 測器予以測量之。由臭氧溶解濃度監測器所輸出之信號， 係用以作輸入於本發明流量裝置之電子功能的輸入信號。 -45- 200408457 本發明之電子功能可在預設之限度內改變流經氣體接觸器 之水流量，俾可令臭氧依所預設之濃度溶入在水中。例如 ，倘由臭氧產生器所輸出之臭氧濃度有所降低時’則藉流 量裝置即可減少流通於氣體接觸器之水流量’俾可保持臭 氧溶解之一定濃度。 此外，本發明流量裝置之電子功能，藉一適當之設備’即 可用以改變臭氧產生器之氣體流量或電力準位’同時亦可保 持流經氣體接觸器之流量爲固定，而無關於流量裝置之上游 水壓力。例如，倘所溶解之臭氧濃度超出了一預設之門檻且鲁 水之流動爲恒定時，則可降低施加於臭氧產生機之電力以降 低所溶解臭氧之濃度，恢復其適當程度之濃度。 依本發明之實施例，可就一化學混合物作預備及輸送之 控制，使其以恒定之成分組成施加於一基板者。 第9例 本發明一實施例之此例應用，係測量及控制一有機性液 體之流量，使其得以作低流量之流動者。 使用之壓力降元件爲40吋長之PFA管，內徑爲0.058吋# ，扭轉數爲1 4。入口之流體爲2丙烷，溫度爲2 3 °C，且係 來自一容器源，表壓力爲2 0 p s i。2丙烷之流量係以控制器 設定點（S Ο)予以決定，而閥之動作時序則以一外部電腦作 控制。依本發明一實施例所送出之2丙烷量係在一 0haus Analytical Plus Balance上作測量，且所記錄之量係作爲使 用Balance的RS 2 3 2 口之一第2電腦上、其時間之函數。 關於2丙烷物質是對時間之關係，描繪如第1 1圖所示之曲 -46- 200408457 線。第1 1圖並顯示各最佳供給量之片段曲線。用於各片段 之最佳曲線斜率爲2丙烷之流量，單位爲克/秒。由其結果 可知，流體在流動系統中之流量可在每秒0·00 8 3克（每分 0.16克）至每秒0·49克（每分9.6克）之範圍內作供應，此種 對流量作控制之流動系統適用於各種之化學氣體沉積處理 過程。 圖式簡單說明 弟1圖爲本發明一實施例之方塊圖。 第2圖爲依本發明一實施例，用以容裝一無馬達泵浦或 供液模組之氣動部及流體控制部的殼體斜視圖。 第3圖爲依本發明一實施例之一輔助性輸入模組的分解 圖。 第4圖爲依本發明一實施例之差動放大器簡圖。 第5圖爲依本發明一實施例之閥增益曲線圖。 第6圖爲依本發明一實施例之控制系統之流程圖。 弟7圖爲依本發明一實施例之壓力變換器分解圖。 第8Α圖爲依本發明一實施例之比例閥端部分解圖。 第8Β圖爲第8Α圖Β-Β方向剖面圖。 第8C圖爲第8Α圖C-C方向剖面圖。 第8D圖爲第8Α圖D-D方向剖面圖。 第8Ε圖爲本發明一實施例、如第8Α圖所示之比例閥的 分解圖。 第9 Α圖爲傳統式F u r ο η閥之磁滯曲線圖。 第9 Β圖爲傳統式S M C閥之磁滯曲線圖。 200408457 第9 C圖爲第3圖所示之閥，其磁滯曲線圖。 第1 0圖爲5種不同流體中其流量對壓力降之曲線圖。 第1 1圖爲依第9例、2 -丙烷流量之物質與時間之曲線圖。 第1 2圖爲依本發明另一實施例之閥的分解圖。 桌13圖爲第12圖之一體式閥及感知器感體斜視圖。 第1 4 A圖爲第1 2圖之閥，其流體入口側之剖面斜視圖。 第1 4 B圖爲第1 2圖之閥’其流體出口側之剖面斜視圖。 桌1 5圖爲依本發明一實施例之堆疊式閥斜視圖。 第16圖爲依本發明一實施例之具有單一感知器殼體的着 閥，其之斜視圖。 第1 7圖爲依本發明一實施例之未有感知器殼體的閥，其 之斜視调。 第1 8圖爲依本發明一實施例之單一感知器殼體斜視圖。 第1 9圖爲依本發明一實施例之雙感知器殻體斜視圖。 第20圖爲依本發明一實施例之流量控制器及〇n/〇FF閥 總成斜視圖。 第2 1圖爲依本發明一實施例之感知裝置斜視圖。 # 第22圖爲依本發明一實施例之流量控制器及流量計總 成斜視圖。 第23A圖爲依本發明一實施例之閥，其在下游壓差時之 型式斜視圖。 第2 3 B圖爲依本發明一實施例之閥，其在上游壓差時之 型式斜視圖。 第24 A與24B圖爲依本發明另一實施例之閥斜視圖。 -48- 200408457 第2 5 A與2 5 B圖爲依本發明再一實施例之閥剖面圖。 第2 6圖爲依本發明又一實施例之閥剖面圖。 第27 A-C圖爲類似於本發明流體控制閥之某些市售閥剖 面圖，而第27D圖爲本發明一實施例之剖面圖。 第2 8 A、2 8 B圖爲依本發明另一實施例之閥，其在關閉 、部分啓開位置時之剖面圖。 第29圖爲依本發明一實施例，其在停止輔助功能時，時 序/控制曲線圖。 第30圖爲依本發明一實施例之控制器、其可產生閥驅動φ 信號，該控制器之方塊圖。 第3 1圖爲控制器之控制邏輯電路一實施例，其之方塊圖。 第3 2圖爲壓力控制電路一實施例之方塊圖。 主要部分之代表符號說明 10 流體控制閥 1 2 流體入口線 13 流體出口線 15 摩擦式流量元件 15A，15B 直線部 1 2f 入口 1 2 A’ 通路 1 3f 出口 1 3 A' 線性路徑 20 氣動型比例式控制閥 2 1 收回閥 24 第1壓力感知器 -49- 200408457 25 第 2 壓 力 感 知 器 3 0 控 制 電 路 60 感 知 器 殼 體 6 1 流 體 入 □ 62 流 體 出 □ 63 0 形 環 64 壓 力 及 溫 度 感 知器 65 丄山 芸 rrrt. 66 梢 件 60’ 第 1 感 知 器 殼 體 63 1 〇 形 64' 壓 力 /溫度感知器 65' 單 — 感 知 器 端 蓋 66' 梢 件 7 1 閥 上 部 端 蓋 72 0 形 環 73 閥 氣 動 隔 膜 74 氣 動 環 75 不 鏽 鋼 螺 栓 76 螺 紋 式 閥 扣 77 閥 上 部 隔 膜 78 閥 底 部 隔 膜 70' 閥 殼 體 7 1’ 閥 上 部 端 蓋Therefore, it is possible to further reduce the pressure drop and the unswept volume as illustrated in Fig. 27D. The valve's biased inlet and outlet can make thick liquids or other liquids easily flow, and can minimize the accumulation. The H valve housing 70 'is preferably designed as a mold so that the sensor housing and the valve are integrally formed. Different from the sensor housing 60 of FIG. 8, this one-piece embodiment only requires a single sensor end cap 65, which can greatly reduce the number of required components and reduce the possibility of causing devastation Faulty burr. In the embodiment of the valve housing shown in FIGS. 12 to 14, the flow system enters the inlet of the valve inlet 12 ′ and flows into the linear passage 12A ′ until it reaches the circular cavity 90 ′ of the inlet cavity 99 ′ therein. until. Once the valve is opened, the fluid tends to spiral around the circular cavity 90 '. After that, it passes through the two diaphragms and enters the narrow annular channel, and enters the second cavity. This condition is similar to that shown in Figures 8B and 8D. The examples are the same. The spiral-shaped fluid flow path passes through an outlet hole (not shown) and is directed toward the outlet 13 · in a linear path 13A '. This path is generated in the second hole 8 9 ′. In order to improve the pressure loss between the holes 90 'and 89', the rotation of the fluid can be maximized according to the pressure drop generated in the device. As described above, a plurality of areas can be provided on the valve sealing surface. Or camfers (for example, 0.04 inches). The fluid inlet path 12A 'and the fluid outlet path-29- 200408457 diameter 13Af are preferably arranged along the tangent directions of the holes 89' and 90f (preferably along the axis diameter direction), except that they can help the fluid The flow is homogenized and the pressure drop is improved. The inlet 12, and the outlet 13 'can be externally threaded, so as to connect the appropriate hose. Downstream of the flow path 1 3 A 'of the first and second holes 9 0 ′ and 8 9 ′ is a first sensor case 60 ′. The flow system of the sensor housing 60 'is in communication with the second cavity 89' and the outlet 13 '. The pressure and / or temperature sensor 64 'is sealed in the housing 6 (Γ) with, for example, an O-ring 63' of perfluoroelastomer (KALREZ). The end cap 65 'is connected with a plurality of bolts or pins 66', etc. It is connected to the casing 60 '. The sensor 64' is used to sense the pressure and / or temperature on the flow path between the inlet and the outlet of the sensor casing 60 ', and send an indication signal of the sensed data to a Controller. An embodiment of this valve may also include a second sensor housing 16 0 ′, the structure of which is preferably the same as the sensor housing 60 0 ′. As shown in FIG. 13, the second sensor housing The flow system of the body 160 'is in communication with the inlet 112' and the outlet 1 W separated from the inlet 112 ', etc. Therefore, the valve of this embodiment is referred to Figures 14A and 14B, and its function is ##. Flow to the valve The flow system at the mouth of the inlet enters the inlet and flows through the passage 12A ′ to the first valve cavity 90 ′ and is stored therein until the valve is opened. Once the valve is opened, the fluid flows from the first valve cavity 90 ′ to a hole. To the second valve cavity 89 '. The fluid is sent from the second valve cavity 8V through an outlet hole and enters the first sensor housing 6 Γ The pressure and / or temperature sensor of the fluid senses the fluid in the casing 6 1 ′ and records it and / or sends it to the controller. The flow system is sent from the outlet 13 ′ from the valve, and it is preferably coiled in parallel. Shaped friction flow element, after -30-200408457, it re-entered the valve assembly through inlet 1 12 ', and the system flowed into the second sensor housing 1 6 0 1, where it was sensed and recorded, and / or After transmission to the sensor housing 60 ', it is properly set to make the most of the space and return to the same side of the fluid. In order to make the valve assembly on one side have the characteristics of pneumatic machinery, etc., Multiple single units can be used, which can further save space. Therefore, as shown in Figure 13, the perceptron 601 is the same, and the perceptron 60 0 'is equidistant from the exit 1 body 160', which is the same as the entrance 112 'Separate. Therefore, if the valve cavity becomes vertical alignment, Figure 15 is an example, in order to accommodate the pneumatic side components of the valve and (midd 1 ec 〇ver) 1 7 1' is designed to have an upper part 8 2 'and other internal parts of the two. Stacked valve assembly Limit, its supply is a plurality of points of fluid supply. Only a single proportional manifold, a single single housing and cables are required, so chemical mixing (proportional measurement control) is not required for two sets of structures. Supply, independent supply at two separate supply points, stand-alone control, and continuous supply in continuity, etc. The convenient design of the valve assembly can achieve substantially the same. For example, the valve assembly shown in Figure 16 has a valve As shown in Figure 14B. At the flow point, pressure and / or temperature can be controlled. The fluid flows out of the second path and passes through the phase characteristics of the earliest device entered by the valve assembly. The occupation of stacking into one and saving cost φ is separated from the size and configuration 13 ′ of 1 60 ′, then the sensor housing separates two mechanical side components of the stacking valve assembly which are vertically stacked, and the middle cover end The cover 7Γ and the lower end cover are particularly suitable for space and have other advantages, including Xin LED, the main PC board, and one piece. In various applications, the synchronization of separate fluids can be integrated and independent or non-exclusive (V er s a t i 1 i t y). Example and a single perceptron shell 200408457. The dimensions of the various components of the valve are preferably the same as those of the valve shown in Figure 13 to maintain stackability when needed, and if required, another sensor housing as shown in Figure i 8 is available Attached. Indeed, by providing separate inserts for the removable sensor housing as shown in Figure 18, the device can construct one or more sensor housings, where each sensor housing is inverted Installation (for valve cavities) to help remove bubbles. Various components can be pre-molded. For example, the valve shown in Figure 17 has no sensor housing. Figure 19 has a dual sensor housing insert. The inlets 1 1 2 ', 2 1 2 1 and outlets 1 3', 1 1 3 'of the sensor housing are made of external screw type, which is convenient for the valve to be fixed. The inserts for the sensor housing part of the valve assembly can be in many different combinations, and can be replaced by these inserts to form the sensor housing upside down. When the valve is installed, It helps to remove air bubbles depending on the positioning of the valve, as mentioned above. Similarly, the interchangeable type of pneumatic and mechanical components can also reverse the bamboo mouth and outlet of the molded valve, which can be used for upstream or downstream pressure control. When pneumatic and mechanical components are installed at the opposite end of the valve cavity, the differential pressure of the system can be operated in reverse, and the differential pressure upstream of the valve can be recorded instead of the downstream pressure. This will allow monitoring of the pressure supplied to the system unit to replace the pressure downstream of the discharge point. Figures 2 3 A and 2 3 B are the upstream and downstream patterns, respectively. The two figures illustrate the versatility of a molded valve design, where each pneumatic component and each mechanical component can be located on either side of the valve depending on whether the valve wishes to be upstream or downstream of the pressure drop. The position of the sensor can also provide monitoring of the system status of consumers, not just the monitor of this device. Figures 2 4 A and 2 4 B are examples of a molded component, which can be used on a first-class -32-200408457 volume controller. The controller passes three ports (exhaust port, inlet, and outlet) provided at the bottom of the device. It has the ability to pair with a Mykrolis LHVD type filter. This design is acceptable for a LHVD type filtering equipment. The present invention can also use a conventional bubble sensor. A bubble sensor sends a conditioned signal to a controller, which converts the signal to a percentage of air. If this percentage exceeds the preset level, the user is notified. The applicable bubble sensor can be light-sensing or capacitive, and has two outputs (ON and OFF), so it can count most 0N and 0FF over the entire time and convert it into a thick or The percentage of air in the fluid. _ Figures 25A and 25B are examples of a valve design with n0 bubble trap location. The fluid enters through the inlet of the valve and goes straight up, and the air bubble rises to the top. The rest of the flow path is a continuous diameter path and sensor-shaped bag-shaped pieces that are located below the path, so there are no bubbles for trapping (the characteristics of traditional valves are that the gas cannot escape) The bag is shaped). Compared with the previous embodiments, this design can also reduce 3 components, including fluid diaphragm, valve end cap and fasteners, so it can reduce assembly costs, material costs and complexity. In addition, 尙 ® reduces one of two important fluid-tight spaces, including one of the diaphragm tongue and groove seal, and the interference fit between the two fluid diaphragms. 0 In the fluid diaphragm 401 and the pneumatic diaphragm When a compressive pressure is applied between 402 and this pneumatic pressure is greater than a spring pressure that is pre-loaded and biased to close the valve, the valve is driven to open. Because the pneumatic diaphragm 402 is larger than the fluid diaphragm 401, and the two diaphragms are mutually inhibited by screws 403 and fasteners 404, -33- 200408457, a large load will be caused on the pneumatic valve 402, and the valve will open. The pressure is supplied through a barb-shaped accessory 0 & 14 ^ 川 1 ^) 40 5 (Fig. 253) and a piping (such as polyethylene) 406. Pneumatic hole 4 10 is sealed with 0-ring 407, pneumatic diaphragm tongue and groove, as shown in the figure. The sensor 4 1 1 is sealed with an O-ring 4 1 2, and a sensor end cap 4 1 3 is fixedly attached thereto. In another embodiment, in order to reduce 90-degree turns, the design shown in FIG. 26 may be modified. The sensory acupuncture system is moved to the side of the valve. Off-set flow paths eliminate fluid turns and eliminate unswept areas. Because there is no O-ring on the pneumatic side, and due to factors such as the design and size of the diaphragms, the hysteresis of this valve is very small. In terms of pop pet design, the best linearity can also be achieved. The flow rate of the fluid will change substantially and directly proportional to the pressure applied to the valve, which is the same throughout the entire workflow. . Figures 28A and 2B show another embodiment of the fluid control valve, in which an O-ring is used to separate the fluid diaphragm and the pneumatic diaphragm. This method prevents excessive loading on the two diaphragms and reduces valve life. The flow path of the fluid control valve does not have a high point for air for trapping (unless there is a trace amount of air available at the sensor seals located on the side of the fluid β control valve body). The flow control system of this fluid control valve is designed to have a single fluid diaphragm. There is no high point in the valve (excluding the pressure sensor sealing method). In the flow path of the fluid, no air is available for trapping. Air trapping inside the fluid control valve will be harmful to the discharge end once the fluid control valve is closed, and the air may be decompressed. Air trapping in the fluid control valve will also be detrimental to the initiation of fluid discharge. Air trapping in the fluid control valve -34- 200408457 Trapping will also cause other air to dissolve into the stream 'or form fine bubbles that are harmful to the wafer. The air pressure is applied to the pneumatic diaphragm 402, and the pneumatic cavity 410 'between the pneumatically closed O-ring 415, and the valve is actuated. The applied air pressure overcomes the compressive force that closes the valve with the bias of the spring 800 The valve is opened. The pressure exerted on the surface of the pneumatic diaphragm 4 02 'is to cause it to deform and force the fluid diaphragm 4〇ι. Therefore, a spacer fe 4 0 1' is fastened by a screw 4 〇3 and a fastener 4 〇4. 4 02, oppressed, so fl Wu 4 0 1 'was opened. Pneumatic seal o-rings 4 丨 5 can prevent any cooked pressure from reaching the diaphragm. Therefore, it can prevent the pneumatic pressure from exerting excessive load on the two diaphragms. The pressure is supplied via a barb-shaped piece 405 and an appropriate piping. An optional sensor cavity 500 can be set above the valve seal. This design prevents air from falling into the fluid cavity, the inlet channel, the outlet channel, and the channels connected to the sensor cavity and the sensor cavity. The tangential flow prevents unswept areas. Therefore, the fluid inlet channel is set tangent to the valve fluid cavity 90, in the direction of the inner diameter. All the high points are within or not higher than the fluid path. There are no sharp corners in the flow path, so the flow of the fluid is smooth. φ Various designs and their elasticity can make a variety of combinations of multiple valves and sensors to become a modular assembly, and provide a variety of different configurations for building multiple valves, sensing devices, Flow meter, flow controller, pressure controller and temperature controller. Therefore, Figure 20 is a stacked flow controller and ON / OFF valve assembly, including a first valve 300, a second valve 3 0 0 · and first and second sensors 3 1 0, 3 1 0 ', its flow system communicates with a friction flow element 15. Fig. 21 is a stack assembly of four perceptrons 310, 310 '-35- 200408457, 3 2 0, and 3 2 0'. Figure 22 shows a flow controller and flow meter assembly. Figures 24A and 24B show another embodiment of the molded valve design. The configuration is used for a flow controller and can be connected to an LHVD (Low Hold-up Volume) through three ports on the bottom of the device. Device) type filter device is paired. Of the three ports, port 6 10 is the exhaust from the filter, port 6 12 is the inlet to the filter, and port 614 is the outlet from the filter. According to another embodiment of the present invention, it can be used as a valve auxiliary function. It can be applied to traditional valve parts using solenoid valves, needle valves, etc. to change the pressure change applied to φ valve parts. Typically, the pressure is slowly dissipated. In the sequence-controlled stop section, the change in the flow rate applied to the valve suction section is reduced, and the suction valve can assist the stop valve. As shown in Fig. 29 of the present invention, during the OFF time of the control valve (or stop valve), the pressure of the suction valve can be reduced to assist the stop. Once 0 F F t i me of the control valve is terminated, a suction delay can be provided, and the pressure is still applied to the suction valve constantly. After this preset delay, the pressure applied to the suction valve decreases again until the pressure of the suction valve reaches a preset level, and the suction valve returns to its normal or rest position. This sequence control helps keep droplets from dripping from the nozzle opening. In another embodiment, the suction operation is started after the control valve is actuated for a period of time after the control valve is actuated; or the setting operation can be shortened, the operation of the suction valve is activated only when the control valve is stopped. It happened from the beginning. It is explained here that although the pressure described is an action method (a c t u a t e d m e t h 〇 d), if any kind of valve operation method is used, such as a motor, it still belongs to the scope of the present invention. • 36- 200408457 Implementation The first example of the system has been set up so that a known differential pressure and a fixed supply (discharge) time can be input to the controller, and can be activated by sequential activation by a stack computer Supply fluid. The synthetic output stream of deionized water is captured in a container and weighed with a precision gauge to determine its substance. Using the known density of each supplied material and fluid material, the capacity of each supply can be calculated. Combining the supply capacity with the known supply time determines the flow weight. The test viscosity is from about 0 · 92 to about 9. · 5 centipaise. The pressure and flow curve of the fifth fluid with different viscosities is as shown in Figure 10 °. The second example uses 3 types of valves. The hysteresis test includes two commercially available valves and one valve as shown in Figures 8A to 8D of the present invention. The operating pressure of the valve fluctuates up and down, and the pressure in the test system is measured through the pressure range of the valve operating pressure. The measurement result is plotted as a voltage. Specifically, the establishment of this test was a valve closure system and downstream pressure sensor, and the valve < 1 is under constant pressure, and the action of this valve is from the valve closing to full opening and then back to closing, and the pressure sensor monitors the pressure change downstream of the valve pressure. The test results are shown in Figures 9A, 9B and 9C. In each graph, the farthest to the right of the curve indicates the data used to change the pressure from low to high, and the left to the curve indicates the change of pressure from high to low. The difference between the curves is the amount of hysteresis. Therefore, the pressure changes up and down according to the steps of -37- 200408457. If there is no hysteresis, the tooth lines of the rain will coincide. Fig. 9C shows the valve according to the present invention. In terms of hysteresis, this commercially available valve is much smaller. Third example This example is an application example of an embodiment of the present invention. It is used for the processing of chemical mechanical planarization substrates, which can be used to measure and control the flow rate of the fluid so that the fluid can be used as a feeder for each flow rate (volume). Specifically, this example illustrates how the embodiments of the present invention can be used to measure and control liquid flow, and can supply polishing liquids of various capacities on a substrate. g In the manufacture of optical lenses, chemical mechanical polishing is used. In the manufacture of semiconductor devices, chemical mechanical planarization is used. Polishing fluids can be acid, or acidic and can include abrasives such as silica or alumina; fluids used to polish silicon oxides include silica slurry, which is in the form of an aqueous potassium hydroxide solution; used to polish copper Metal fluids include oxides such as peroxides, inhibitors such as Benzotriazole, and aqueous solutions of organic acids such as acetic acid. The inlet of the embodiment of the present invention is connected to a container containing a polishing fluid and feeding by pressure or gravity. The outlet of the flow device is connected to the nozzle of the polishing appliance. The polishing apparatus has a substrate to be polished, which is rotated by a rotating pad or belt for polishing. The substrate is in contact with a polishing pad. The polishing pad can remove material from the substrate according to the chemical reaction of the fluid. The polishing flow system is sent to the substrate on the appliance through the nozzle; the flow rate of the polishing fluid supplied to the nozzle is controlled by the flow device and its electronic function. The electronic function of the mobile device can be connected to the controller of the appliance ', which enables the appliance to control the polishing -38- 200408457 The timing of the discharge of the fluid on the substrate. The device can also include a polishing end point detector, which can also be used to control the timing of the polishing fluid to the substrate. The electronic function signal processor in the flow device can eliminate the change in the supply flow of the polishing fluid caused by the pressure change in the pressure vessel containing the polishing fluid. For a peristaltic pump, the supply of the polishing liquid of the present invention is a constant flow rate. This method of controlling the capacity and supply rate of the polishing fluid to a substrate can reduce the waste of chemicals, and can even make the substrate be polished uniformly and repeatedly. Fourth example_ This example of an embodiment of the present invention is for measuring and controlling the amount of fluid, so each volume of fluid can be sent to a vaporizer to form a gas. Specifically, this embodiment illustrates how the present invention can be used as a measurement and controller of a fluid sent to a vaporizer. The liquid used is a chemical liquid, which can be heated in a vaporizer to become a gas. The gas formed after the vaporization is sent to a heating substrate in a reaction chamber, and on the heated substrate, the supplied gas can be further decomposed or reacted. The gas can also be used to form a thin film of metal, a semiconductor, or a dielectric (chemical gas deposition method or particle layer chemical gas deposition method) on a substrate #. The gas can be used to etch the surface of the substrate, or Dry the substrate. The liquid used can be a pure liquid, such as: water, 2-propane, or tetraethyl orthosilicate, TEOS, and the like. The liquid used may also contain solids such as total dipivaloylmethane, Sr (DPM), etc., dissolved in a solution of tetrahydrofuran. Some liquids used, such as copper (I) hexafluoropentanedionate vinyltrimethylsilane, (VTMS) Cu (hfac), etc., are all thermally sensitive -39- 200408457, which can be disassembled by the thermal sensor in the flow meter. The general flow rate of the liquid used is about 0.1 grams to about 50 grams per minute. In the coating of optical devices such as lenses and optical fibers, films are very important. In the manufacture of various flat panels, microprocessors, and memory devices, the etching of films and films is also very important. An inlet of the flow device according to an embodiment of the present invention is connected to a pressure supply source using a liquid. The outlet of the flow device is connected to a carburetor. The valve for the flow device may be provided on the upstream or downstream side of the carburetor. The outlet of the carburetor is connected to the processing room of the appliance, which contains the substrate to be treated with gas φ. When multiple liquids are required for multiple processes, multiple flow devices can be used. The electronic function of the flow device can be connected to the controller of the appliance. This allows the processor to remotely control the flow of liquid from the pressured supply source, through the flow meter and then into the heated vaporizer. Vaporizers used for chemical gas deposition include heated metal frits, heated valves, and heated piping. The pressure change in the container containing the liquid will change the liquid flow rate to the vaporizer. The thermal decomposition of the liquid in the heat flow element will also cause the liquid flow to the vaporizer to be inaccurate. Because the vaporizer will saturate, the liquid flow to the vaporizer will not be controlled properly, which will cause incomplete vaporization of the liquid. The incomplete vaporization will cause the droplets to fall into the processing chamber and then onto the intended substrate, causing defects in the substrate. The result of the exercise according to the embodiment of the present invention is that the fluid used is not controlled by the thermal flow element, and the fluid supplied to the carburetor is repetitive and controlled. In addition, there is no concern about the fluctuation of the upstream pressure. -40- 200408457 Example 5 This is an example of an embodiment of the present invention, which is used to measure and control the flow of a liquid ', which enables the fluid to be applied to a substrate for electroless plating. Specifically, this example illustrates that an embodiment of the present invention can be used to control the discharge of a series of chemical substances applied to a substrate in a plating process to form a metal film. This treatment can eliminate the need to pull out the chemical substances required for the general immersion bath plating treatment. Solutions for various metals and metal alloys used as minerals include (but are not limited to): silver, copper, platinum, palladium, gold and tin. A catalyst is usually required to activate the plating solution on the substrate. These catalysts include colloidal palladium, carbon, graphite, tin-palladium, colloids, and conductive polymers such as polypyrrole. Some of these catalysts and metals in the plating solution are used for plating treatment. At the same time, because of its high price and waste, it is necessary to make a reduction to reduce the cost of plating treatment. In addition, some of the metals in these solutions are toxic when they are plated, so they must be discharged to the environment to a minimum, and waste disposal costs must be reduced. For each chemical substance used in the plating process, the device of an embodiment of the present invention has an inlet connected to a chemical substance supply source that is pressured, pumped, or gravity-fed. The outlet of this embodiment of the present invention is connected to a nozzle which intends to discharge each chemical substance on the substrate. Using a heat exchanger, cooler, or resistive heater element, the temperature of the solution can be lowered or raised before it is sent to the substrate. For example, by electroless treatment, copper metal can be deposited (grown) on a substrate, the process of which is to contact the substrate and the activator containing colloidal palladium through a first flow device; using a first- 41- 200408457 2 flow device to rinse the substrate with water; a third flow device is used to contact the catalyzed substrate with a hydrochloric acid active solution; and a fourth flow device is used to contact the substrate with the acid copper ion, Reducing agents similar to formaldehyde, complexing agents similar to EDTA, salty salts similar to charged potassium, and other sources of copper solution in contact with a certain capacity. The substrate was rinsed with water in a second flow device. The electronic (function) of each flow device can be connected to the controller of the plating equipment to adjust the timing, period and sequence of liquid supply through each flow device. If so, at each processing step, each chemical substance can be quickly and accurately delivered to the substrate with the measured capacity. Since only the proper chemical mass is supplied to the substrate to fully react to the substrate, the inappropriate consumption of the chemical substance can be reduced, thereby reducing the material cost. Also, pollution caused by chemical substances dragged on the substrate can be reduced. Furthermore, due to the rapid response of the flow elements and the reduced cycle time of the valve, the overall capacity of the process is also increased. Sixth Example This example of an embodiment of the present invention is used to measure and control the flow rate of a liquid so that the fluid supplied on a substrate can form a uniform coating. H Specifically, this example explains how the embodiment of the present invention measures and controls the flow rate of the fluid applied to the substrate so that the liquid material can be precisely coated on the substrate. In the spin coating process, the liquid or slurry deposited on the substrate is generally used, including dielectric materials, photoresist, anti-reflective coating materials, and polyimide, such as he X amethy 1 disi 1 Azane's viscous cocatalyst, ferroelectric materials, and sol ... colloidal solids (solo-861), etc. The materials -42- 200408457 are supplied by a fixed or mobile nozzle on a static or slow-moving substrate. After the coating material is applied to the substrate, the substrate is rotated at a wide speed of about 100 to 5000 rpm, which will give the coating material on it a uniform spread coating to form a liquid material thereon. film. In this kind of processing, it is important that many of these materials are very inexpensive and use a small amount 'and waste less. For repeated coating, the amount of fluid applied to the substrate must be the same. The inlet of this embodiment of the flow device is connected to the container that holds the coating liquid, which is fed by pressure or gravity, and the outlet is connected to the # nozzle on the coating device. The covering device has a substrate fixed with a rotary chuck. The coating liquid system sends the substrate on the device through the nozzle; the coating liquid system flowing to the nozzle is controlled by the flow device and its valve. The electronic function of the flow device can be connected to the controller of the appliance so that the appliance can control the timing and flow of the coating liquid applied to the substrate. Through the communication between the electronic function and the flow device, the coating device can change the flow rate of the fluid according to the nozzle position and the rotation speed of the substrate to achieve the desired coating. The signal processor of the flow device can eliminate the changes in the volume and flow rate β of the coating liquid caused by the pressure change in the container containing the coating liquid. As a result, the coating liquid system is sent to the substrate with a controlled capacity. As a result, in addition to reducing the waste of chemical substances, the plurality of substrates can be covered uniformly and repeatedly. Seventh Example This example of an embodiment of the present invention is used to measure and control the flow rate of a fluid 'to make it react on a substrate. Specifically, this example is to illustrate that this embodiment of the present invention can be used to measure and control the flow rate of the reaction fluid applied to a substrate, if possible. The reactive liquids include, but are not limited to, such as positive or negative photoresist developers, photoresists, and strippers, such as hydrofluoric acid, such as ozone deionized water. An oxidizing agent or an etchant such as a peroxy acid. The inlet of the flow device of this embodiment of the present invention is connected to a container for pressure or gravity feeding of the reaction liquid, and the outlet of the flow device is connected to a nozzle on the appliance. The reaction solution system is sent to the substrate on the device through the nozzle; the flow device and its valves are used to control the reaction fluid flowing into the nozzle on the device. The electronic function of the flow device can be connected to the controller of the appliance, so that the appliance can control the application timing and flow rate of the reaction fluid applied to the substrate. The electronic function of the flow device can also be connected to a reaction end detector via the controller of the device. When the reaction end point is approached or reached, the flow of the reaction fluid can be reduced or stopped. A representative example of the etching process is the use of a peroxyacid-based acid to remove copper from the edge of a plated wafer. By using this embodiment of the present invention, the flow rate of the reaction liquid applied to the substrate can be controlled, and the end point of the process can be accurately controlled. Example 8 This example illustrates the use of an embodiment of the present invention in which a plurality of chemical substance sensors are used in series to measure and control the flow rate and composition of a fluid (c 0 m ρ 0 s i t i ο η ′ or a component). Specifically, this example illustrates how the implementation of the present invention is connected in series with one or more chemical substance sensors to control the flow rate and composition of the fluid. The applications of this control include (but not limited to) plating tanks, RCA wash tanks, ozone water tanks, and acid tanks for hydrofluoric acid. An embodiment of the present invention incorporates other applications of these sensors, including maintaining purification of a chemical-44-200408457 tank. For example, the increase of pollutants in a circulating tank, such as particles, organic materials, or metal ions, may require periodic discharge of the polluting fluid in the tank and replacement with an equal amount of non-polluting fluid. . In addition, this tank can also be switched to a purifier or particle filter. When a constant flow rate is maintained, pollutants can be removed at the same time. Until the pollutants can be removed, the current processing and products can be protected. For the removal of organic materials on the surface of various substrates, deionized water in which ozone is dissolved can be used. The gas concentration output by the irregular changes in the ozone generator will cause the concentration of ozone dissolved in water to change. Such a change in the dissolved ozone concentration will result in the time required to oxidize the substrate surface with ozonated water, and also lead to the unfavorable consequences of inconsistent processing and cleaning time. In order to maintain the concentration of dissolved ozone in an overflow type cleaning tank, according to an embodiment of the present invention, the inlet is connected to the source of deionized water, and the outlet is connected to a gas contactor. The gas contactor is a substance conversion device that can dissolve various gases into liquids. This device and its operation description can be found in the products provided by W.L. Gore, Elkton, MD, and Mykrolis Φ Corporation, Bedford, MA. The ozone gas system produced by the ozone machine is sent to the shell side of the gas contactor, and at this shell side, the ozone gas is dissolved in the deionized water flowing through the gas contactor tube. The concentration of ozone dissolved in water can be measured by, for example, an ozone dissolved concentration monitor manufactured and sold by Needham, MA, USA, connected to the fluid outlet of a gas contactor. The signal output by the ozone dissolved concentration monitor is an input signal for inputting the electronic function of the flow device of the present invention. -45- 200408457 The electronic function of the present invention can change the flow rate of water flowing through the gas contactor within a preset limit, so that ozone can be dissolved in water at a preset concentration. For example, if the ozone concentration output from the ozone generator is reduced, ‘the flow device can reduce the water flow through the gas contactor’, and it can maintain a certain concentration of dissolved ozone. In addition, the electronic function of the flow device of the present invention can be used to change the gas flow rate or power level of the ozone generator by means of an appropriate device. At the same time, the flow rate through the gas contactor can be kept constant, regardless of the flow device Upstream water pressure. For example, if the dissolved ozone concentration exceeds a preset threshold and the water flow is constant, the power applied to the ozone generator can be reduced to reduce the dissolved ozone concentration and restore its proper concentration. According to the embodiment of the present invention, a chemical mixture can be prepared and transported so that it is applied to a substrate with a constant composition. Ninth Example The application of this example of an embodiment of the present invention is to measure and control the flow rate of an organic liquid so that it can be used as a low flow rate flower. The pressure drop element used is a 40-inch-long PFA tube with an inner diameter of 0.058-inch # and a twist number of 14. The inlet fluid is 2 propane, the temperature is 2 3 ° C, and it comes from a container source with a gauge pressure of 20 p s i. 2 The flow rate of propane is determined by the controller set point (S 0), and the valve operation sequence is controlled by an external computer. The amount of 2 propane sent according to an embodiment of the present invention is measured on a 0haus Analytical Plus Balance, and the recorded amount is a function of time on a second computer using one of the RS 2 3 2 ports of Balance. The 2 propane substance is related to time, and the curve -46- 200408457 line shown in Fig. 11 is drawn. Figure 11 shows the segment curve for each optimal supply. The best curve slope for each segment is a flow of 2 propane in grams per second. From the results, it can be seen that the flow rate of the fluid in the flowing system can be supplied in the range of 0.003 g per minute (0.16 g per minute) to 0.49 g per second (9.6 g per minute). The flow control system is suitable for various chemical gas deposition processes. Brief Description of Drawings Figure 1 is a block diagram of an embodiment of the present invention. Fig. 2 is a perspective view of a housing for containing a pneumatic part and a fluid control part of a motorless pump or liquid supply module according to an embodiment of the present invention. FIG. 3 is an exploded view of an auxiliary input module according to an embodiment of the present invention. FIG. 4 is a schematic diagram of a differential amplifier according to an embodiment of the present invention. FIG. 5 is a valve gain curve diagram according to an embodiment of the present invention. FIG. 6 is a flowchart of a control system according to an embodiment of the present invention. Figure 7 is an exploded view of a pressure converter according to an embodiment of the present invention. FIG. 8A is an exploded view of a proportional valve end according to an embodiment of the present invention. Fig. 8B is a sectional view taken along the line B-B in Fig. 8A. Fig. 8C is a sectional view taken along the line C-C in Fig. 8A. Fig. 8D is a sectional view taken along the line D-D in Fig. 8A. Fig. 8E is an exploded view of the proportional valve shown in Fig. 8A according to an embodiment of the present invention. Fig. 9 Α is a hysteresis curve diagram of a conventional Fu r ο η valve. Figure 9B is the hysteresis curve of the traditional S M C valve. 200408457 Figure 9C is the hysteresis curve of the valve shown in Figure 3. Figure 10 is a graph of flow rate versus pressure drop in 5 different fluids. Fig. 11 is a graph of the substance and time of 2-propane flow according to the ninth example. Figure 12 is an exploded view of a valve according to another embodiment of the present invention. Table 13 is a perspective view of the body valve and sensor body of FIG. 12. Figure 1 4A is a perspective view of the valve on the fluid inlet side of Figure 12A. Fig. 14B is a sectional perspective view of the valve 'on the fluid outlet side of Fig. 12; Table 15 is a perspective view of a stacked valve according to an embodiment of the present invention. Fig. 16 is a perspective view of a valve having a single sensor housing according to an embodiment of the present invention. Figure 17 is a perspective view of a valve without a sensor housing according to an embodiment of the present invention. FIG. 18 is a perspective view of a single sensor housing according to an embodiment of the present invention. FIG. 19 is a perspective view of a dual sensor housing according to an embodiment of the present invention. FIG. 20 is a perspective view of a flow controller and an ON / OFF valve assembly according to an embodiment of the present invention. FIG. 21 is a perspective view of a sensing device according to an embodiment of the present invention. # FIG. 22 is an oblique view of a flow controller and a flow meter assembly according to an embodiment of the present invention. Fig. 23A is a perspective view of a valve according to an embodiment of the present invention at the time of a downstream pressure difference. Figure 2 3B is a perspective view of a valve according to an embodiment of the present invention at the time of upstream pressure difference. 24A and 24B are perspective views of a valve according to another embodiment of the present invention. -48- 200408457 Figures 2 5 A and 2 5 B are sectional views of a valve according to yet another embodiment of the present invention. Figure 26 is a sectional view of a valve according to another embodiment of the present invention. Figures 27A-C are cross-sectional views of some commercially available valves similar to the fluid control valve of the present invention, and Figure 27D is a cross-sectional view of an embodiment of the present invention. Figures 2 8 A and 2 8 B are sectional views of a valve according to another embodiment of the present invention when it is in a closed and partially opened position. Fig. 29 is a timing / control curve diagram when the auxiliary function is stopped according to an embodiment of the present invention. FIG. 30 is a block diagram of a controller that can generate a valve driving φ signal according to an embodiment of the present invention. FIG. 31 is a block diagram of an embodiment of the control logic circuit of the controller. Figure 32 is a block diagram of an embodiment of a pressure control circuit. Description of main symbols 10 Fluid control valve 1 2 Fluid inlet line 13 Fluid outlet line 15 Friction flow element 15A, 15B Linear part 1 2f inlet 1 2 A 'passage 1 3f outlet 1 3 A' linear path 20 Pneumatic type ratio Control valve 2 1 retract valve 24 first pressure sensor -49- 200408457 25 second pressure sensor 3 0 control circuit 60 sensor housing 6 1 fluid inlet □ 62 fluid outlet □ 63 0 ring 64 pressure and temperature sensing器 65 丄 山 芸 rrrt. 66 Tip 60 '1st sensor housing 63 1 〇 64' Pressure / temperature sensor 65 'single-Sensor end cap 66' Tip 7 1 Valve upper end cap 72 0 shape Ring 73 Valve Pneumatic diaphragm 74 Pneumatic ring 75 Stainless steel bolt 76 Threaded valve clasp 77 Upper valve diaphragm 78 Lower valve diaphragm 70 'Valve housing 7 1' Upper valve end cap
-50- 200408457 Ί2' 〇 形 環 73 ' 閥 氣 動 隔 膜 7 5 ? 螺 栓 /梢件 16' 螺 紋 式 閥 扣 77' 閥 上 部 隔 膜 78' 閥 底 部 隔 膜 8 0 弓早 簧 82 閥 底 部 端 蓋 83 不 鏽 鋼 梢 件 84 同 心 之 圓 形 環 8 5 同 心 之 圓 形 環 86 推 入 接 通 式 直 線型 8 8 氣 動 穴 89 穴 82’ 閥 底 部 端 蓋 83' 螺 栓 84f 同 心 之 圓 形 環 90 圓 形 穴 9 1 提 動 閥 92 狹 窄 之 圓 形 通 道 93 肩 部 94 流 體 另 件 95 推 入 接 通 式 另 件 96 準 位 感 知 器 另件 -51- 200408457 97 彈簧 98 流體出口 99 入口孔穴 90' 穴 99’ 入口孔穴 100 殼體 1 05 LED(光射二極體）板 106 主印刷電路板 110 閥岐管 112’ 入口 113· 出口 160' 第2感知器殻體 200 輔助輸入模組 3 10 第1感知器 320 感知裝置 3 10' 第2感知器 3 2 0! 感知裝置 40 1 流體隔膜 402 氣動隔膜 403 螺絲（栓） 404 扣 405 倒鈎形另件 406 配管 407 〇形環 -52 - 200408457 40 Γ 流體隔膜 4 02* 氣動隔膜 40 3 ' 螺絲（栓） 404f 扣 4 0 5f 倒鈎形另件 4 1 1 感知器 4 12 〇形環 4 13 端蓋 4 10’ 氣動穴 4 15’ 〇形環 500 線 502 線 5 04 線 6 10 □ 6 12 □ 6 14 □ 800 壓縮彈簧 902〜930 步驟 924 步驟 926 步驟 2700 控制器 2702 電源供給 2 7 04 管理處理器 2705 壓力電路 200408457 2 7 0 6 輔助功能電路 2 7 0 8 控制閥驅動器 2 7 09 吸回閥驅動器 2710 介面 2712 控制處理器 2714 快閃記憶體 2716 電腦可讀指令 2 8 0 2 擴展口 28 10 雙口 RAM(隨機存取記憶體）部 2902 上游壓力輸入 2904 下游壓力輸入 2 90 5 類比/數位變換器 2906 類比/數位變換器 290 8 類比/數位變換器 2910 校正電路 2911 輸入/輸出電路 -54--50- 200408457 Ί2 '〇ring 73' Valve Pneumatic diaphragm 7 5? Bolt / tip 16 'Threaded valve buckle 77' Valve upper diaphragm 78 'Valve bottom diaphragm 8 0 Bow early spring 82 Valve bottom end cap 83 Stainless steel tip Piece 84 Concentric circular ring 8 5 Concentric circular ring 86 Push-in connection straight 8 8 Pneumatic cavity 89 Cavity 82 'Valve bottom end cap 83' Bolt 84f Concentric circular ring 90 Circular cavity 9 1 Lift Actuator 92 Narrow circular channel 93 Shoulder 94 Fluid accessory 95 Push-in accessory 96 Level sensor accessory -51- 200408457 97 Spring 98 Fluid outlet 99 Inlet cavity 90 'Cavity 99' Inlet cavity 100 Housing 1 05 LED (light emitting diode) board 106 Main printed circuit board 110 Valve manifold 112 'Inlet 113 · Outlet 160' Second sensor housing 200 Auxiliary input module 3 10 First sensor 320 Sensing device 3 10 '2nd sensor 3 2 0! Sensing device 40 1 Fluid diaphragm 402 Pneumatic diaphragm 403 Screw Wire (bolt) 404 Buckle 405 Barb piece 406 Piping 407 O-ring -52-200408457 40 Γ Fluid diaphragm 4 02 * Pneumatic diaphragm 40 3 'Screw (bolt) 404f Buckle 4 0 5f Barb piece 4 1 1 Sensor 4 12 O-ring 4 13 End cap 4 10 'Pneumatic cavity 4 15' O-ring 500 Line 502 Line 5 04 Line 6 10 □ 6 12 □ 6 14 □ 800 Compression spring 902 ~ 930 Step 924 Step 926 Step 2700 Controller 2702 Power supply 2 7 04 Management processor 2705 Pressure circuit 200408457 2 7 0 6 Auxiliary function circuit 2 7 0 8 Control valve driver 2 7 09 Suction valve driver 2710 Interface 2712 Control processor 2714 Flash memory 2716 Computer Readable instructions 2 8 0 2 Expansion port 28 10 Dual-port RAM (random access memory) section 2902 Upstream pressure input 2904 Downstream pressure input 2 90 5 Analog / digital converter 2906 Analog / digital converter 290 8 Analog / digital conversion 2910 Correction circuit 2911 Input / output circuit -54-