TW200400371A - Optical waveguide - Google Patents
Optical waveguide Download PDFInfo
- Publication number
- TW200400371A TW200400371A TW092112945A TW92112945A TW200400371A TW 200400371 A TW200400371 A TW 200400371A TW 092112945 A TW092112945 A TW 092112945A TW 92112945 A TW92112945 A TW 92112945A TW 200400371 A TW200400371 A TW 200400371A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- optical waveguide
- item
- optical
- waveguide according
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 71
- 239000010410 layer Substances 0.000 claims abstract description 72
- 238000005253 cladding Methods 0.000 claims abstract description 42
- 239000012792 core layer Substances 0.000 claims abstract description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims 1
- 229910052716 thallium Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 19
- 239000011162 core material Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- -1 nitride nitride Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 241001529936 Murinae Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000033558 biomineral tissue development Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005383 fluoride glass Substances 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12085—Integrated
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/177,102 US6832034B2 (en) | 2002-06-21 | 2002-06-21 | Optical waveguide |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200400371A true TW200400371A (en) | 2004-01-01 |
Family
ID=29999079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092112945A TW200400371A (en) | 2002-06-21 | 2003-05-13 | Optical waveguide |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6832034B2 (https=) |
| EP (1) | EP1516211A1 (https=) |
| JP (1) | JP2005531030A (https=) |
| KR (1) | KR20050012819A (https=) |
| CN (1) | CN100345011C (https=) |
| AU (1) | AU2003222671A1 (https=) |
| TW (1) | TW200400371A (https=) |
| WO (1) | WO2004001463A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI514560B (zh) * | 2011-12-20 | 2015-12-21 | 英特爾股份有限公司 | 矽上iii-v族半導體裝置之混合整合 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7006746B2 (en) * | 2002-08-29 | 2006-02-28 | Micron Technology, Inc. | Waveguide for thermo optic device |
| US7020365B2 (en) * | 2002-08-29 | 2006-03-28 | Micron Technology, Inc. | Resistive heater for thermo optic device |
| US7120336B2 (en) * | 2002-08-29 | 2006-10-10 | Micron Technology, Inc. | Resonator for thermo optic device |
| US20060293644A1 (en) * | 2005-06-21 | 2006-12-28 | Donald Umstadter | System and methods for laser-generated ionizing radiation |
| WO2007011727A1 (en) * | 2005-07-14 | 2007-01-25 | Massachusetts Institute Of Technology | Ring resonators comprising chalcogenide glass |
| JP2008181411A (ja) * | 2007-01-25 | 2008-08-07 | Nitto Denko Corp | タッチパネル用光導波路 |
| US8144392B2 (en) * | 2007-02-12 | 2012-03-27 | The United States Of America As Represented By The Secretary Of The Navy | Waveguide amplifier in a sputtered film of erbium-doped gallium lanthanum sulfide glass |
| JP2010117380A (ja) * | 2008-10-14 | 2010-05-27 | Nitto Denko Corp | 光導波路装置の製造方法 |
| US20110085773A1 (en) * | 2009-10-13 | 2011-04-14 | Electronics And Telecommunications Research Institute | Optical waveguide and method of forming the same |
| JP2013210623A (ja) | 2012-02-28 | 2013-10-10 | Furukawa Electric Co Ltd:The | 光導波路素子およびその製造方法 |
| US10371890B2 (en) | 2013-02-26 | 2019-08-06 | Furukawa Electric Co., Ltd. | Optical waveguide element |
| US9726820B2 (en) * | 2014-08-14 | 2017-08-08 | Raytheon Company | End pumped PWG with tapered core thickness |
| CN104849878A (zh) * | 2015-06-03 | 2015-08-19 | 东南大学 | 一种基于马赫-曾德结构的氮化硅波导热光开关阵列芯片及其制作方法 |
| CN107238891B (zh) * | 2017-05-23 | 2019-11-05 | 深圳信息职业技术学院 | 一种可集成的无定型硅波导结构及其制作方法 |
| CN109324369A (zh) * | 2018-12-12 | 2019-02-12 | 科新网通科技有限公司 | 一种平面波导器件的生产工艺 |
| NL2023679B1 (en) * | 2019-08-09 | 2021-04-13 | Illumina Inc | System and method for patterning flow cell substrates |
| WO2025253524A1 (ja) * | 2024-06-04 | 2025-12-11 | Ｎｔｔ株式会社 | 光回路 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4923264A (en) * | 1989-01-18 | 1990-05-08 | University Of Pittsburgh Of The Commonwealth System Of Higher Education | Resonance coupled optical coupler with semiconductor waveguide layer comprising a multi-quantum-well structure |
| DE69418752T2 (de) | 1993-03-18 | 2000-01-27 | Nippon Telegraph And Telephone Corp., Tokio/Tokyo | Herstellungsverfahren von optischen Wellenleitern aus Polyimid |
| US5613995A (en) | 1993-04-23 | 1997-03-25 | Lucent Technologies Inc. | Method for making planar optical waveguides |
| US6271954B1 (en) * | 1994-03-17 | 2001-08-07 | Molex Fiber Optics, Inc. | Waveguide absorption modulator with integral optical isolator |
| FR2732777B1 (fr) * | 1995-04-05 | 1997-06-20 | Bruno Adrien | Demultiplexeur insensible a la polarisation et procede de realisation |
| US5963573A (en) | 1997-08-25 | 1999-10-05 | 3M Innovative Properties Company | Light absorbing layer for II-VI semiconductor light emitting devices |
| JPH11103130A (ja) * | 1997-09-29 | 1999-04-13 | Mitsubishi Electric Corp | 半導体光素子，及びその製造方法 |
| US6563998B1 (en) * | 1999-04-15 | 2003-05-13 | John Farah | Polished polymide substrate |
| AU3772099A (en) * | 1998-05-01 | 1999-11-23 | University Of New Mexico | Highly doped lasers and amplifiers |
| US6052215A (en) * | 1999-01-22 | 2000-04-18 | Harris Corporation | Index-guided solid acoustic traveling wave lens |
| US6312581B1 (en) | 1999-11-30 | 2001-11-06 | Agere Systems Optoelectronics Guardian Corp. | Process for fabricating an optical device |
| EP1116973A1 (en) * | 2000-01-11 | 2001-07-18 | Corning Incorporated | Athermalized integrated optical waveguide devices |
| EP1368680A2 (en) * | 2000-10-13 | 2003-12-10 | Massachusetts Institute Of Technology | Optical waveguides with trench structures |
| US6580850B1 (en) | 2000-11-24 | 2003-06-17 | Applied Wdm, Inc. | Optical waveguide multimode to single mode transformer |
| US6600864B2 (en) * | 2000-12-20 | 2003-07-29 | Intel Corporation | Method and apparatus for switching an optical beam using an optical rib waveguide |
| JP4004025B2 (ja) * | 2001-02-13 | 2007-11-07 | 日東電工株式会社 | 透明導電性積層体およびタッチパネル |
| JP2002258081A (ja) * | 2001-02-28 | 2002-09-11 | Fujitsu Ltd | 光配線基板、光配線基板の製造方法及び多層光配線 |
| US6873638B2 (en) * | 2001-06-29 | 2005-03-29 | 3M Innovative Properties Company | Laser diode chip with waveguide |
-
2002
- 2002-06-21 US US10/177,102 patent/US6832034B2/en not_active Expired - Fee Related
-
2003
- 2003-04-22 CN CNB038143062A patent/CN100345011C/zh not_active Expired - Fee Related
- 2003-04-22 KR KR10-2004-7020713A patent/KR20050012819A/ko not_active Withdrawn
- 2003-04-22 JP JP2004515641A patent/JP2005531030A/ja active Pending
- 2003-04-22 AU AU2003222671A patent/AU2003222671A1/en not_active Abandoned
- 2003-04-22 EP EP03719868A patent/EP1516211A1/en not_active Withdrawn
- 2003-04-22 WO PCT/US2003/012264 patent/WO2004001463A1/en not_active Ceased
- 2003-05-13 TW TW092112945A patent/TW200400371A/zh unknown
-
2004
- 2004-04-28 US US10/833,555 patent/US6909831B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI514560B (zh) * | 2011-12-20 | 2015-12-21 | 英特爾股份有限公司 | 矽上iii-v族半導體裝置之混合整合 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003222671A1 (en) | 2004-01-06 |
| JP2005531030A (ja) | 2005-10-13 |
| EP1516211A1 (en) | 2005-03-23 |
| CN100345011C (zh) | 2007-10-24 |
| US6832034B2 (en) | 2004-12-14 |
| WO2004001463A1 (en) | 2003-12-31 |
| KR20050012819A (ko) | 2005-02-02 |
| US6909831B2 (en) | 2005-06-21 |
| US20040008959A1 (en) | 2004-01-15 |
| US20040197065A1 (en) | 2004-10-07 |
| CN1662833A (zh) | 2005-08-31 |
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