TW200307593A - Multi-joint robot and control device thereof - Google Patents

Multi-joint robot and control device thereof Download PDF

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Publication number
TW200307593A
TW200307593A TW092114942A TW92114942A TW200307593A TW 200307593 A TW200307593 A TW 200307593A TW 092114942 A TW092114942 A TW 092114942A TW 92114942 A TW92114942 A TW 92114942A TW 200307593 A TW200307593 A TW 200307593A
Authority
TW
Taiwan
Prior art keywords
axis
control
robot
processing
control device
Prior art date
Application number
TW092114942A
Other languages
English (en)
Chinese (zh)
Other versions
TWI311521B (enExample
Inventor
Hirokazu Kariyazaki
Tatsuzo Nakazato
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Publication of TW200307593A publication Critical patent/TW200307593A/zh
Application granted granted Critical
Publication of TWI311521B publication Critical patent/TWI311521B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Numerical Control (AREA)
  • Manipulator (AREA)
TW092114942A 2002-06-04 2003-06-02 Multi-joint robot and control device thereof TW200307593A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002163511A JP2004009172A (ja) 2002-06-04 2002-06-04 多関節ロボットおよびその制御装置

Publications (2)

Publication Number Publication Date
TW200307593A true TW200307593A (en) 2003-12-16
TWI311521B TWI311521B (enExample) 2009-07-01

Family

ID=29706636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092114942A TW200307593A (en) 2002-06-04 2003-06-02 Multi-joint robot and control device thereof

Country Status (5)

Country Link
US (1) US7363092B2 (enExample)
JP (1) JP2004009172A (enExample)
KR (1) KR100774077B1 (enExample)
TW (1) TW200307593A (enExample)
WO (1) WO2003101676A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008100292A (ja) * 2006-10-17 2008-05-01 Toshiba Mach Co Ltd ロボットシステム
CN104647391B (zh) 2011-06-28 2016-06-08 株式会社安川电机 机器人手和机器人
JP5829313B1 (ja) 2014-06-25 2015-12-09 ファナック株式会社 シミュレーションを用いたオフライン教示装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3890552A (en) * 1972-12-29 1975-06-17 George C Devol Dual-armed multi-axes program controlled manipulators
JPS6027906A (ja) * 1983-07-27 1985-02-13 Mitsubishi Heavy Ind Ltd ロボツト
JPH0371887U (enExample) 1989-11-17 1991-07-19
JP2599571B2 (ja) * 1994-05-11 1997-04-09 ダイトロンテクノロジー株式会社 基板搬送ロボット
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
KR20000014795A (ko) 1998-08-25 2000-03-15 윤종용 직교좌표 이송장치의 직선보간 방법
JP2000072248A (ja) * 1998-08-27 2000-03-07 Rorze Corp 基板搬送装置
JP2000077499A (ja) * 1998-09-03 2000-03-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000183128A (ja) * 1998-12-17 2000-06-30 Komatsu Ltd ワーク搬送装置の制御装置
KR20000042618A (ko) 1998-12-26 2000-07-15 윤종용 원통좌표계로봇
JP3973006B2 (ja) * 2000-03-23 2007-09-05 日本電産サンキョー株式会社 ダブルアーム型ロボット
US6845295B2 (en) * 2002-03-07 2005-01-18 Fanuc Robotics America, Inc. Method of controlling a robot through a singularity

Also Published As

Publication number Publication date
WO2003101676A1 (en) 2003-12-11
US20050204848A1 (en) 2005-09-22
KR20050016504A (ko) 2005-02-21
JP2004009172A (ja) 2004-01-15
TWI311521B (enExample) 2009-07-01
US7363092B2 (en) 2008-04-22
KR100774077B1 (ko) 2007-11-06

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