經濟部智慧財產局員工消費合作社印¾ 200301477 _____ B7 五、發明説明（1 ) [技術領域] 本發明有關用於製造具有凹槽（groove)或資訊孔（pit) 等之凹凸圖形之資訊媒體時所用之原模，用於製造該原模 之光阻劑母板，使用上述光阻劑原版之原模之製造方法以 及利用上述原模所製造之資訊媒體。 [背景技術] 資訊媒體之一的光碟現在有可以追加或重寫等的光記 錄磁碟，以及事先記錄有資訊之再生專用磁碟。 在光記錄磁碟的磁碟基板形成有追蹤（tracking)等所利 用之導槽（groove)，另外，在該磁碟基板上層合有含有相 變化材料或有機色素材料之記錄層。雷射光束照射到記錄 層時，該記錄層即發生化學變化或物理變化而形成記錄標 誌（資訊孔）。一方面，在再生專用磁碟的磁碟基板上面事先 形成有記錄標誌（資訊孔）做爲凹凸圖案之一部分。如對該等 記錄標誌照射讀取用雷射光束，則光反射量會變動，藉由 檢測該變動，即可以讀取（再生）資訊。 要製造具有導槽或資訊孔等之凹凸圖形之磁碟基板時 ，須使用事先形成有該凹凸之負圖形（此也爲一種凹凸圖形） 的原模。例如利用模槽內固定有上述原模之模具進行注入 成形（injection molding)，並在被塡充之樹脂上複製上述負 圖形以製造磁碟基板爲一般的方法。 具有凹凸圖形之原模通常是由含鎳等之金屬板所構成 。製造該原模（stamper)之工程是首先事先製作具有上述原 (請先間讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ¾ 200301477 _____ B7 V. Description of the Invention (1) [Technical Field] The present invention relates to the production of information media with concave and convex patterns such as grooves and pits. The original mold used is used for manufacturing the photoresist mother board of the original mold, the method for manufacturing the original mold using the above original photoresist, and the information medium manufactured by using the above original mold. [Background Art] Optical discs, which are one of the information media, include optical recording discs that can be added or rewritten, and reproduction-only discs in which information is recorded in advance. The disk substrate of the optical recording disk is formed with a groove for tracking and the like, and a recording layer containing a phase change material or an organic pigment material is laminated on the disk substrate. When a laser beam strikes a recording layer, the recording layer undergoes a chemical or physical change to form a recording mark (information hole). On the other hand, a recording mark (information hole) is formed in advance on the disk substrate of the reproduction-only magnetic disk as a part of the uneven pattern. If such a recording mark is irradiated with a reading laser beam, the light reflection amount changes, and by detecting this change, information can be read (reproduced). In order to manufacture a disk substrate having a concave-convex pattern such as a guide groove or an information hole, an original mold in which a concave-convex pattern (this is also a concave-convex pattern) formed in advance must be used. For example, injection molding is performed using a mold in which the above-mentioned original mold is fixed in a mold groove, and the above negative pattern is copied on a resin filled to manufacture a magnetic disk substrate. The original mold with the uneven pattern is usually composed of a metal plate containing nickel or the like. The process of manufacturing the stamper is to first make the original with the above (please read the precautions on the back before filling this page)
本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -5- 200301477 A7 B7 五、發明説明（） 模之凹凸圖形之負圖形之光阻劑母板，再利用電鍍在該光 阻劑原版上面形成金屬膜。然後，由光阻劑母板剝離上述 金屬板，並藉由表面洗淨等之特定處理而製及原模。 (請先間讀背面之注意事項再填寫本頁) 現在參照圖5所示之先前光阻劑母板1以說明該光阻 劑母板1之製造工程。首先在玻璃基板2上面形成光阻層4 。然後，利用雷射等之製作圖形用之光束進行光阻層4之 曝光，以顯像其潛像圖形。藉此製及凹凸圖形6形成於光 阻層4之光阻劑母板。 要利用該光阻劑母板以電鍍方法製作原模20時，須如 圖6所示，首先在凹凸圖形6之表面以無電解電鍍等形成 含鎳材料等之金屬薄膜8，以賦予光阻劑母板以電導性。 然後，以該金屬薄膜8爲底子通電進行電鍍，以形成 含有鎳等之金屬膜1〇。如由光阻原版1剝離該等金屬薄膜 8與金屬膜10即可製及複製有凹凸圖形6之原模20。 經濟部智慧財產局員工消費合作社印災 近幾年，隨著光記錄媒體之大容量化，導槽（groove)等 之凹凸圖形趨於細微化，其形狀誤差對記錄、讀取精確度 影響極大。從而要求將尖銳的凹凸圖形形成於磁碟基板上 ，但是爲此目的，須將做基礎之光阻層4之凹凸圖形形成 高精確度（淸晰）。 形成於光阻層4之潛像圖形之最小寬度是由到達該光 阻層4之雷射光束之光點直徑（spot size)所限制。光點直 徑w係設雷射波長爲λ，照射光學系統之物鏡之數値孔徑 爲ΝΑ時，可以w = k · λ /ΝΑ表示。另外，k爲以物鏡之開 口形狀與入射光束之強度分布所決定之常數。 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） __ 6 - 200301477 經濟部智¾財產局工消費合作社印踅 A7 _____B7__ 五、發明説明$ ) 可是，縱使理論上不超過光點直徑之界限之寬度的圖 形，如光阻層設薄，則該製到原模之凹凸圖形變淺，或凹 凸圖形之形狀帶著圓形（此種現象稱爲「谷」）而淸晰度不足 爲業界所知。一般認爲這是由於通常在曝光作業中，光阻 層4之厚度發生變動（簡稱爲「膜消」）所致。此種厚度之變 動被認爲是雷射光束在光阻層4與玻璃基板2之間反射， 而由於該反射光使光阻層4過度曝光所致。 [發明之揭示] 本發明是鑑及上述課而完成者，其目的在提供一種光 阻劑母板之製造方法，光阻劑母板及利用該母板製造之原 模’該方法可以淸晰形成比雷射光束之光點直徑更小寬度 之圖形。 本發明人等對磁碟離散媒體（discrete media)等之資訊 媒體之製造方法等反覆銳意硏究而發現了在原模上淸晰形 成凹凸圖形之方法。亦即，藉由以下所示之發明，達成了 上述目的。 (1)一種資訊媒體製造用原模之製造方法，其特徵包括 :在基板上依次至少形成光吸收層與光阻劑層，並在該光 阻劑層由與上述光吸收層接面之反對面照射光以形成潛像 ’藉由顯像該潛像而形成凹凸圖形以製造光阻劑母板之工 程’在上述光阻劑母板之凹凸圖形上形成金屬薄膜之工程 ，在該金屬薄膜上面形成金屬膜，並由上述光阻劑母板剝 離上述金屬薄膜與金屬膜以形成原模之工程，以及對上述 (請先閱讀背面之注意事\^!填寫本頁) -裝- 訂 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29?公釐） 200301477 Α7 Β7 經濟部智慧財產局員工消費合作社印說 五、發明説明4 ) 凹凸圖形表面施予鈀（Pd)做爲在上述光阻劑層形成上述金屬 薄膜之工程的預處理。 (2) —種資訊媒體製造用原模之製造方法，其特徵爲在 上述（1)中，在施加鈀之工程中，相對於藉由上述凹凸圖形 施予形成有凹凸圖形之區域之圖形面的鈀量X，使未形成 有凹凸圖形之區域的鏡面的鈀量Y成爲0.9X<Y<1.1X。 (3) —種原模，爲事先在表面形成有凹凸圖形之資訊媒 體製造用之原模，其特徵爲經歷下列工程所製造：在基板 上依次至少形成光吸收層與光阻劑層，並在該光阻劑層由 與上述光吸收層接面之反對面照射光以形成潛像，藉由顯 像該潛像而形成凹凸圖形以製造光阻劑母板之工程、在上 述光阻劑母板之凹凸圖形上形成金屬薄膜之工程、在該金 屬薄膜上面形成金屬膜，並由上述光阻劑母板剝離上述金 屬薄膜與金屬膜以形成原模之工程、以及對上述凹凸圖形 表面施予鈀（Pd)做爲在上述光阻劑層形成上述金屬薄膜之工 程的預處理。 (4) 一種光阻劑母板，其特徵具備：基板、層合於該基 板上面之光吸收層、以及連接於該光吸收層層合，且藉由 潛像之形成及其顯像即可以形成凹凸圖形之光阻劑層，在 形成於上述光阻劑層的上述凹凸圖形表面施予鈀。 (5) —種光阻劑母板，具備：基板、層合於該基板上面 之光吸收層、以及連接於該光吸收層層合，且藉由潛像之 形成及其顯像即可以形成凹凸圖形之光阻劑層、係由形成 於上述光阻劑層之上述凹凸圖形表面施予鈀的光阻劑母板 請 先 閱 讀 背 ιέ 冬 意 事 Ρ 寫 本 頁 裝 訂 線 本紙張尺度適用中國國家標準（CNS ) Α4規格（21〇Χ297公釐） -8 - 200301477 經濟部智¾財產局員工消費合作社印製 A7 __B7 五、發明説明9() 製造之資訊媒體製造用之原模，其特徵爲相對於藉由上述 凹凸圖形形成有凹凸的區域之圖形面所施予之鈀量X，未 形成凹凸圖形之區域的鏡所施予之鈀量Y是被設定爲〇.9X< Υ<1·1Χ 〇 (6) —種資訊媒體，其特徵爲：以經由下列工程製造之 原模上之上述凹凸圖形做爲負圖形以形成最終之凹凸圖形 :在基板上至少依次形成光吸收層與光阻劑層並在該光阻 劑層由與上述光吸收層接面之反對面照射光以形成潛像， 藉由顯像該潛像而形成凹凸圖形以製造光阻劑母板之工程 、在上述光阻劑母板之凹凸圖形上形成金屬薄膜之工程、 在該金屬薄膜上面形成金屬膜，並由上述光阻劑母板剝離 上述金屬薄膜與金屬膜以形成原模之工程、以及對上述凹 凸圖形表面施予鈀（Pd)做爲在上述光阻劑層形成上述金屬薄 膜之工程之預處理。 (7) 在上述（6)中之資訊媒體，其特徵具備由上述原模直 接複製凹凸圖形而形成之最終凹凸圖形。 (8) 在上述（6)中之資訊媒體，其特徵具備由以上述原模 做爲主板複製凹凸圖而形成之母板，再複製凹凸圖形而形 成的最終凹凸圖形。 (9) 在上述（6)中之資訊媒體，其特徵爲上述最終凹凸圖 形爲將子板的凹凸圖形複製而形成者，而該子板的凹凸圖 形是由以上述原模做爲主板以複製凹凸圖形而形成之母板 再複製凹凸圖形而形成者。 (10) —種資訊媒體，具備：基板、層合於該基板上面之 本紙張尺度適用令國國家標準（CNS ) A4規格（210X 297公釐） (請先閱讀背面之注意事填寫本頁) -裝·This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -5- 200301477 A7 B7 V. Description of the invention () The photoresist mother board of the negative pattern of the concave-convex pattern of the mold. A metal film is formed on the agent original plate. Then, the above-mentioned metal plate is peeled off from the photoresist mother board, and the original mold is made by a specific treatment such as surface cleaning. (Please read the precautions on the back before filling out this page.) Now refer to the previous photoresist mother board 1 shown in Figure 5 to explain the manufacturing process of the photoresist mother board 1. First, a photoresist layer 4 is formed on the glass substrate 2. Then, the photoresist layer 4 is exposed using a light beam for patterning such as a laser to develop a latent image pattern. In this way, a photoresist mother board having the uneven pattern 6 formed on the photoresist layer 4 is formed. When using the photoresist mother board to make an original mold 20 by electroplating, as shown in FIG. 6, firstly, a metal film 8 containing a nickel-containing material or the like is formed on the surface of the concave-convex pattern 6 by electroless plating or the like to impart photoresist The mother board is electrically conductive. Then, the metal thin film 8 is used as a substrate to carry out current plating to form a metal film 10 containing nickel or the like. If the metal thin film 8 and the metal film 10 are peeled off from the photoresist original plate 1, the original mold 20 with the uneven pattern 6 can be made and copied. In recent years, with the increase of the capacity of optical recording media, the concave-convex patterns of grooves and the like have tended to become finer. The shape error has a great impact on the accuracy of recording and reading. . Therefore, it is required to form a sharp concave-convex pattern on the magnetic disk substrate, but for this purpose, it is necessary to form the concave-convex pattern of the basic photoresist layer 4 with high accuracy (clear). The minimum width of the latent image pattern formed in the photoresist layer 4 is limited by the spot size of the laser beam reaching the photoresist layer 4. The light spot diameter w is set as the laser wavelength λ, and when the numerical aperture of the objective lens irradiating the optical system is NA, it can be expressed by w = k · λ / ΝΑ. In addition, k is a constant determined by the opening shape of the objective lens and the intensity distribution of the incident beam. This paper size is applicable to China National Standard (CNS) A4 (210X 297 mm) __ 6-200301477 Ministry of Economic Affairs ¾ Industrial Property and Consumer Cooperative Cooperative Seal A7 _____B7__ 5. Description of the Invention The pattern of the width of the dot diameter limit, if the photoresist layer is thin, the concave-convex pattern made to the original mold becomes lighter, or the shape of the concave-convex pattern is round (this phenomenon is called "valley") and is clear. Degree is not well known in the industry. It is generally believed that this is caused by a change in the thickness of the photoresist layer 4 (referred to as "film elimination") during an exposure operation. Such a change in thickness is considered to be caused by the laser beam reflecting between the photoresist layer 4 and the glass substrate 2, and this reflected light overexposed the photoresist layer 4. [Disclosure of the invention] The present invention has been completed in light of the above-mentioned lessons. The purpose of the present invention is to provide a method for manufacturing a photoresist mother board. The photoresist mother board and an original mold manufactured using the mother board can be clarified. Form a pattern with a width smaller than the spot diameter of the laser beam. The present inventors repeatedly researched the manufacturing methods of information media such as magnetic disc discrete media and discovered a method for forming a concave-convex pattern clearly on the original mold. That is, the above-mentioned object is achieved by the invention shown below. (1) A method for manufacturing an original mold for manufacturing information media, comprising: forming at least a light absorbing layer and a photoresist layer on a substrate in order, and opposing the interface with the light absorbing layer on the photoresist layer. Projecting light on a surface to form a latent image 'Project of forming a concave-convex pattern by developing the latent image to produce a photoresist mother board' A process of forming a metal thin film on the concave-convex pattern of the above photoresist mother board, The process of forming a metal film on the above, and peeling the metal film and metal film from the photoresist mother board to form a master mold, and the above (please read the precautions on the back first \ ^! Fill this page) This paper size applies Chinese National Standard (CNS) A4 specification (210X29? Mm) 200301477 Α7 Β7 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention 4) Palladium (Pd) is applied on the surface of the uneven pattern as above The pretreatment of the process of forming the photoresist layer into the above-mentioned metal thin film. (2) A method for manufacturing an original mold for manufacturing information media, characterized in that in the above (1), in the process of applying palladium, the graphic surface of the area where the uneven pattern is formed by the above uneven pattern is applied The amount of palladium X is such that the amount of palladium Y on the mirror surface of the area where the uneven pattern is not formed becomes 0.9X < Y < 1.1X. (3) A kind of master mold, which is a master mold for the manufacture of information media with a concave-convex pattern formed on the surface in advance, and is characterized by being manufactured through the following processes: forming at least a light absorbing layer and a photoresist layer on the substrate in order, and The photoresist layer is irradiated with light from the opposite surface of the interface with the light absorbing layer to form a latent image, and a concave-convex pattern is formed by developing the latent image to produce a photoresist mother board. A process of forming a metal thin film on the concave-convex pattern of the mother board, forming a metal film on the metal thin film, and peeling the metal thin film and the metal film from the photoresist mother board to form a master mold, and applying the surface of the concave-convex pattern Pre-palladium (Pd) is used as a pretreatment for the process of forming the metal thin film on the photoresist layer. (4) A photoresist mother board, comprising: a substrate, a light absorbing layer laminated on the substrate, and a laminate connected to the light absorbing layer, and the formation and development of a latent image are sufficient. A photoresist layer having an uneven pattern is formed, and palladium is applied to the surface of the uneven pattern formed on the photoresist layer. (5) A photoresist mother board comprising a substrate, a light absorbing layer laminated on the substrate, and a laminate connected to the light absorbing layer, and can be formed by forming a latent image and developing it. The photoresist layer of the concave-convex pattern is a photoresist mother board to which palladium is applied on the surface of the above concave-convex pattern formed on the photoresist layer. Please read the back first. National Standard (CNS) A4 Specification (21 × 297 mm) -8-200301477 Printed by A7 __B7, Employees' Cooperative of Intellectual Property Office of the Ministry of Economic Affairs, V. 5. Description of Invention 9 () Original model for information media manufacturing, its characteristics The amount of palladium Y applied to the mirror of the area where the uneven pattern is not formed is set to 0.9X < Υ < 1 1 × 〇 (6) — an information medium characterized by using the above concave-convex pattern on the original mold manufactured by the following process as a negative pattern to form the final concave-convex pattern: forming at least a light-absorbing layer and light on the substrate in order. Resist layer and in the The resist layer is irradiated with light from the opposite surface that is in contact with the light absorbing layer to form a latent image, and a concave-convex pattern is formed by developing the latent image to produce a photoresist mother board. A process of forming a metal thin film on the uneven pattern, forming a metal film on the metal thin film, and peeling the metal thin film and the metal film from the photoresist mother board to form a master mold, and applying palladium to the surface of the uneven pattern ( Pd) is used as a pretreatment for the process of forming the metal thin film on the photoresist layer. (7) The information medium described in (6) above, which has a final uneven pattern formed by directly copying the uneven pattern from the original mold. (8) The information medium described in (6) above is characterized by a final concave-convex pattern formed by copying the concave-convex pattern using the master mold as a main board and copying the concave-convex pattern. (9) The information medium in the above (6), characterized in that the final bump pattern is formed by copying the bump pattern of the daughter board, and the bump pattern of the daughter board is copied by using the original mold as the main board The mother board formed by the uneven pattern is formed by copying the uneven pattern. (10) — an information medium with: substrate, the paper size laminated on the substrate, applicable national standard (CNS) A4 specification (210X 297 mm) (please read the precautions on the back and fill in this page) -Loaded ·
、1T 線 -9- 200301477 A7 B7 經濟部智慈財產局員工消費合作社印說 五、發明説明$ ) 光吸收層、以及連接於該光吸收層層合，且可以藉由潛像 之形成及其顯像形成凹凸圖形之光阻劑層、係由形成於上 述光阻劑層之上述凹凸圖形表面施予鈀的光阻劑之光阻劑 母板所製造，相對於以上述凹凸圖形形成有凹凸之區域的 圖形面所施予的鈀量γ，將施予未形成凹凸圖形之區域之 鏡面之鈀量設定爲〇.9Χ<Υ<1.1Χ之原模中之上述凹凸圖形 做爲負圖形，而形成最終凹凸圖形。 (11) 在上述（10)中之資訊媒體，其特徵爲具備由上述原 模直接複製凹凸圖形而形成之最終凹凸圖形。 (12) 在上述（10)中之資訊媒體，其特徵爲由以上述原模 做爲主板模製而形成之母板再複製凹凸圖形而形成之最終 凹凸圖形。 (13) 在上述（10)中之資訊媒體，其特徵爲上述最終凹凸 圖形是將子板之凹凸圖形複製而形成者，該子板之凹凸圖 形是將上述原模做爲主板並複製凹凸圖形而形成母板，再 將凹凸圖形複製而形成者。 本發明人等確認了利用光吸收層再藉由對光阻劑母板 施予鈀，即可將淸晰的凹凸圖形形成於原模上。此應爲光 吸收層之鈀的特性與光阻劑的鈀之特性極爲相近，此種鈀 本身均勻施予光阻劑母板表面的緣故。結果，可以將利用 光吸收層之特性淸晰曝光之凹凸圖形正確地重現於以無電 解電鍍所形成之金屬薄膜上。 以上之結果，資訊媒體，例如光記錄媒體之導槽或資 訊坑（infamation pit)等也可以淸晰形成，因此可以提升記 (請先閱讀背面之注意事\^|^寫本頁) -裝· 訂 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -10- 200301477 Λ7 _B7 五、發明説明X ) (請先閱It背面之注意事\^?^寫本頁) 錄與再生之特性。另外，還可以對付會後遂漸發展的凹凸 圖形之微細化，因此也可以擴充資訊媒體之資訊記憶（記錄） 容量。 [圖式之簡單說明） 圖1爲表示本發明之實施形態之例相關之光阻劑母板 之剖面圖。 圖2(A)爲表示利用該光阻劑母板製造原模中之狀態之 剖面圖。 圖2(B)爲表示同上所製造的原模之剖面圖。 圖3(A)爲表示利用AFM解析本發明的實施例之原模上 所形成之凹凸圖形之狀態圖。 圖3(B)爲表示依照同上AFM解析之凹凸圖形之剖面形 狀之曲線圖。 圖4(A)爲表示將形成於本發明的比較例之原模上所形 成之凹凸圖形之AFM解析之狀態圖。 經濟部智慈財產局S工消費合作社印製 圖4(B)爲表示依據同上AFM解析之凹凸圖形之剖面形 狀之曲線圖。 圖5爲表示先前之光阻劑母板之剖面圖。 圖6爲表示利用先前之光阻劑母板製造原模之情形之 剖面圖。 主要元件對照 100 :光阻劑母板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 - 200301477 Λ7 _B7 五、發明説明$ ) 102 :玻璃基板 讀 先 閱 讀 背 面 之 注 意 事 ψ 本 頁 103 :光吸收層 106凹凸圖形 1 0 6 A ：鈀 107 :非凹凸區域 104光阻劑層 1 1 〇 :鎳膜 120 :原模 1 〇 8 :鎳薄膜 206 :圖形面 207 :鏡面 [實施發明之最佳形態] 以下針對本發明之實施形態之例參照圖式詳細說明。 經濟部智¾財產局員工消費合作社印災 圖1爲表示本發明之實施形態之例有關之光阻劑母板 100。該光阻劑母板100具有玻璃基板102，層合於該玻璃 基板上面之光吸收層103，以及層合於該光吸收層1〇3上面 之光阻劑層104。上述光阻劑層104由於被由光吸收層1〇3 之相反側（圖1中之上側）以製作圖形用雷射光束曝光而形成 凹凸圖形之潛像，並利用該潛像之顯影除去一部分而形成 凹凸圖形1 06。另外，顯像後，凹凸圖形106之凹部底面即 露出光吸收層103之一部分。圖1之符號107表不未形成 凹凸圖形之區域的非凹凸區域。 另外，如後面所述，上述凹凸圖形106成爲原模120 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨0X29*7公釐） -12- 200301477 Α7 Β7 經濟部智慈財產局員工消费合作社印繁 五、發明説明9() 之圖形面206。又未形成凹凸圖形之區域成爲原模120之鏡 面。上述曝光之時，圖形製作用之光束被光吸收層103所 吸收而抑制光反射，並可以將細微之凹凸淸晰形成。 在該光阻劑母板100之凹凸圖形106表面被施予鈀（Pd) 106A。具體地說，除了將催化劑（catalyst(Pd-Sn化合物）吸 附於凹凸圖形106之表面之外，還利用促進劑（accelerator )去除催化劑中之錫以在凹凸圖形106表面析出鈀。 另外，在圖1中雖將鈀（Pd)106A之施予情形示意表示 ，但並不表示實際上之施予狀況。在本實施形態之例中， 宜將凹凸圖形106之區域與非凹凸區域107之鈀施予量， 相對於原模120之圖形面206之鈀析出量X，設定鏡面207 的鈀析出量Y在0.9X<Y<1.1X之範圍內。 圖2(A)表示在上述光阻劑母板100上面形成原模120 之情形。 該形成工程是首先在鈀被析出之凹凸圖形106之表面 上以非電解電鍍形成鎳薄膜108。 此時，電鍍溶液中之還原劑會在具有觸媒活性特性之 紀表面被氧化時釋出電子，而溶液中之鎳離子被該電子所 還原，而鎳薄膜108有效地緊密地粘貼於凹凸圖形。尤其 是，在本實施形態之例中，凹凸圖形1 06之凹部底面也被 施予充分的鈀，所以鎳薄膜108沿著該凹凸圖形106確實 地形成。 然後，以鎳薄膜108爲底子使表面通電，並以電鍍法 形成鎳膜110。如由光阻劑母板100剝離鎳薄膜1 〇8與鎳膜 (請先閱讀背面之注意事填寫本頁) -裝. 、11 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） - 13- 200301477 A7 __ B7 五、發明説明<0 ) 1 10，即如圖2(B)所示，可以獲及凹凸圖形106被正確複製 的原模120。此時，上述鈀106A是粘貼於鎳薄膜108側。 在上述原模120中，圖形面206與鏡面207分別形成與 上面凹凸圖形106之區域以及非凹凸區域107相對應。 另外，雖沒有特別圖示，例如將上述原模設置於模具 中利用注入成形法等製造具有以上述凹凸圖形做爲負圖形 而複製之最終凹凸圖形之磁碟基板。又除了利用原模1 2 0 製造光碟基板之外，也可以利用以該原模1 20做爲主板之 電鑄工程製造母板，再以該母板製造光碟。 再者，也可以將該母板做爲原板以製作子板，再以其 製作光碟。亦即，本發明中之所謂原板1 20實際上並不限 於直接利用於光碟之製造，將其做爲主板以製作母板等而 間接地利用於光碟之製造也無妨。 在本實施形態之例的光阻劑層104上，可以藉由層合 光吸收層1 03以描繪鮮明的潛像而獲得淸晰的凹凸圖形。 除此之外，因爲事先在該凹凸圖形106施予鈀以做爲無電 解電鍍之預處理，所以可以沿著凹凸圖形1 06之形狀形成 正確的鎳薄膜108。 另外，之所以能夠正確形成鎳薄膜108，應爲露出於凹 凸圖形106之凹部之光吸收層103與鈀之親和性好爲最大 原因。由於該等光吸收層103與鈀的施予之相乘效果，才 可以將淸晰的凹凸圖形106直接以淸晰之狀態複製到原模 ，結果可抑制形成於原模1 20之凹凸圖形之「膜消」。利 用該原模120，即可製及記錄，讀取（再生）精確度高的光記 本紙張尺度適用中國國家標隼（CNS ) A4規格（2丨0>< 297公釐) _ ~ -14 - (誇先閲後背面之注意事寫本頁) •裝. 訂 經濟部智慈財產局員工消費合作社印製 200301477 A7 B7 五、發明説明ί1 ) 錄媒體。 請 先 閱 讀 背 & 之 注 意 事 Ρ J裝 頁 又在露出光吸收層之前，亦即把曝光停止於光阻劑層 之厚度方向之中途時，也可以獲得鈀之施予與光吸收層之 相乘效果，因此可以如上述將凹凸圖形以原般淸晰的狀態 複製到原板上。 另外，在本實施形態中僅對利用鎳的電鍍處理加以說 明，惟本發明並不侷限於此，也可以適用於利用其他的金 屬電鍍或藉由電鍍以外之處理法形成金屬薄膜之情形。另 外，鎳膜1 1 0也可以利用電鍍以外之方法所形成之金屬膜 訂 再者，上述原模並不限於光碟，也可以適用於例如含 有磁碟（分立媒體等）之資訊媒體之一般的製造。 [實施例] (實施例：第1原模） 線 經濟部智慧財產局S工消费合作钍印¾ 在被硏磨的玻璃基板上面形成偶合劑層之後，以旋轉 塗敷法形成光吸收層。塗敷液係使用含有4, 4/-雙（二乙 氨基）二苯甲酮做爲光吸收劑之SWK-T5D60(東京應化工業 公司製）。在200度下烘烤該膜1 5分鐘使其硬化，同時去除 殘留溶劑成爲厚140nm之光吸收層。然後，在該光吸收層 上旋轉塗敷光阻劑（日本Zeon公司製DVR100)，並藉由烘烤 使殘留溶液蒸發而得厚25nm的光阻劑層。 然後，利用新力公司製之切割機，以形成軌距（track pitch)32〇nm，導槽寬I50nm之導槽圖形爲圓的，利用Kr* 本紙張尺度適用中國國家標準（CNS ) A4規格（2I0X297公釐） -15- 200301477 經濟部智慈財產局員工消費合作社印災 A7 _ B7五、發明説明<2 ) 雷射（波長=3 5 1 nm)對光阻劑層進行曝光，再進行顯像而形 成凹凸圖形而製及光阻劑母板。 利用界面活性劑活化該光阻劑母板之光阻劑表面之處 ，施予催化劑（鈀，錫膠質）做爲非電解電鍍之預處理。然後 ，利用促進劑（HBF4溶液）去除錫並在表面析出鈀而獲及已 完成非電解電鍍之事先準備之光阻劑母板。 接著，將該光阻劑母板浸漬於氯化鎳浴中，藉由非電 解電鍍形成鎳薄膜。以該鎳薄膜做爲底子進行電鍍以形成 鎳膜。再由母板剝離由該等鎳薄膜及鎳膜所構成的層合體 ，並進行背面硏磨與表面洗淨而製爲第1原模。 (比較例，第2原模） 除了不具光吸收層之條件以外，以第1製作法一樣製 作第2原模。 (評估結果1) 利用AFM(原子間力顯微鏡）確認形成於各原模之凹凸 圖形之形狀。AFM之探針是使用氮化矽（SiN)。測定係在不 接觸模式下進行，並將樣品與探針間之原子間力之變化影 像化。 圖3(A)與圖3(B)分別以曲線圖表示第1原模之AFM像 ，與其剖面形狀。又，圖4(A)與圖4(B)分別以曲線圖圖示 第2原模之AFM像與其剖面狀。在AFM中，描繪點之密度 高的區域爲凹凸圖形中之凹部’描繪點密度低或白色之區 (請先閱讀背面之注意事填寫本頁) -裝 、1Τ 線 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公瘦） -16- 2003014771T line-9- 200301477 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Office of the Ministry of Economic Affairs. 5. Description of the invention $) Light absorption layer, and laminated to the light absorption layer, and can be formed by latent images and A photoresist layer for developing a concave-convex pattern is produced from a photoresist mother plate formed with a photoresist to which palladium is applied on a surface of the concave-convex pattern of the photoresist layer, and the concave-convex pattern is formed with the concave-convex pattern The amount of palladium γ applied to the pattern surface of the area is set as the negative pattern, and the amount of palladium applied to the mirror surface of the area where the pattern of unevenness is not formed is set to 0.9 × < Υ < 1.1 ×. The final bump pattern is formed. (11) The information medium described in (10) above is characterized by having a final uneven pattern formed by directly copying the uneven pattern from the original mold. (12) The information medium in the above (10) is characterized by a final concave-convex pattern formed by replicating the concave-convex pattern from a mother board formed by molding the original mold as the main board. (13) The information medium in the above (10), characterized in that the final concave-convex pattern is formed by copying the concave-convex pattern of the daughter board, and the concave-convex pattern of the daughter-board is that the original mold is used as the main board and the concave-convex pattern is copied Then, a mother board is formed, and the concave-convex pattern is copied and formed. The present inventors have confirmed that the use of a light absorbing layer and the application of palladium to the photoresist mother plate can form a clear uneven pattern on the original mold. This should be because the characteristics of the palladium of the light absorbing layer are very similar to those of the photoresist. This palladium itself is uniformly applied to the surface of the photoresist mother board. As a result, the concave-convex pattern which is clearly exposed using the characteristics of the light-absorbing layer can be accurately reproduced on the metal thin film formed by electroless plating. As a result, information media, such as guide grooves or information pits for optical recording media, can also be clearly formed, so you can improve your mind (please read the notes on the back first \ ^ | ^ write this page)-install · The paper size of the book is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -10- 200301477 Λ7 _B7 V. Description of the invention X) (Please read the notice on the back of It first \ ^? ^ Write this page ) Recording and reproduction characteristics. In addition, it can also cope with the miniaturization of the concave-convex graphics that gradually develop after the meeting, so it can also expand the information memory (recording) capacity of the information media. [Brief description of the drawings] Fig. 1 is a cross-sectional view showing a photoresist mother board according to an example of an embodiment of the present invention. Fig. 2 (A) is a cross-sectional view showing a state in which an original mold is manufactured by using the photoresist mother board. FIG. 2 (B) is a cross-sectional view showing the original mold manufactured as described above. Fig. 3 (A) is a diagram showing a state of an uneven pattern formed on a master mold according to an embodiment of the present invention analyzed by AFM. Fig. 3 (B) is a graph showing a cross-sectional shape of a concave-convex pattern analyzed by the same AFM as above. Fig. 4 (A) is a diagram showing a state of AFM analysis of a concave-convex pattern formed on a master mold of a comparative example of the present invention. Printed by Intellectual Property Co., Ltd., Ministry of Economic Affairs, Industrial Cooperative Cooperative Figure 4 (B) is a graph showing the cross-sectional shape of the concave-convex figure analyzed according to the above AFM analysis. Fig. 5 is a sectional view showing a conventional photoresist mother board. Fig. 6 is a cross-sectional view showing a state where an original mold is manufactured using a conventional photoresist mother board. Main component comparison 100: Photoresist mother board The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -11-200301477 Λ7 _B7 V. Description of the invention ψ Page 103: Concave-convex pattern 106 of light absorbing layer 106 A: Palladium 107: Non-concave-convex region 104 Photoresist layer 1 1 0: Nickel film 120: Original mold 1 08: Nickel film 206: Graphic surface 207: Mirror surface [Best Mode for Carrying Out the Invention] An example of an embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a photoresist mother board 100 showing an example of an embodiment of the present invention. The photoresist mother substrate 100 has a glass substrate 102, a light absorption layer 103 laminated on the glass substrate, and a photoresist layer 104 laminated on the light absorption layer 103. Since the photoresist layer 104 is exposed from the opposite side (upper side in FIG. 1) of the light absorbing layer 103 to produce a pattern, a latent image of a concave-convex pattern is formed by exposure with a laser beam, and a part of the latent image is developed to remove a part of the latent image. The uneven pattern 106 is formed. After development, a part of the light absorbing layer 103 is exposed on the bottom surface of the concave portion of the uneven pattern 106. Reference numeral 107 in FIG. 1 indicates a non-concavo-convex region in a region where no concavo-convex pattern is formed. In addition, as described later, the above concave-convex pattern 106 becomes the original model 120. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 0X29 * 7 mm) -12- 200301477 Α7 Β7 Employees ’Intellectual Property Bureau of the Ministry of Economy The cooperative prints the fifth and fifth aspect 206 of the invention description 9 (). The area where the uneven pattern is not formed becomes the mirror surface of the original mold 120. At the time of the above-mentioned exposure, the light beam for pattern production is absorbed by the light absorption layer 103 to suppress light reflection, and fine unevenness can be formed clearly. Palladium (Pd) 106A is applied to the surface of the uneven pattern 106 of the photoresist mother substrate 100. Specifically, in addition to adsorbing a catalyst (catalyst (Pd-Sn compound)) on the surface of the uneven pattern 106, an accelerator is used to remove tin in the catalyst to precipitate palladium on the surface of the uneven pattern 106. In addition, Although the application of palladium (Pd) 106A is schematically shown in 1, it does not indicate the actual application. In the example of this embodiment, it is preferable to apply palladium to the area of the uneven pattern 106 and the non-convex area 107. A predetermined amount is set to a range of 0.9X < Y < 1.1X with respect to the palladium precipitation amount X of the pattern surface 206 of the original mold 120. Fig. 2 (A) shows the above-mentioned photoresist master The original mold 120 is formed on the plate 100. In the formation process, a nickel film 108 is first formed by electroless plating on the surface of the embossed pattern 106 on which palladium is precipitated. At this time, the reducing agent in the plating solution will have catalytic activity. The characteristic surface releases electrons when the surface is oxidized, and the nickel ions in the solution are reduced by the electrons, and the nickel film 108 is effectively adhered to the uneven pattern. In particular, in the example of this embodiment, the uneven pattern 1 06 recess A sufficient amount of palladium is also applied to the bottom surface, so that the nickel thin film 108 is reliably formed along the concave-convex pattern 106. Then, the surface is energized with the nickel thin film 108 as a substrate, and the nickel film 110 is formed by electroplating. Board 100 peeled nickel film 108 and nickel film (please read the note on the back to fill in this page) -packed, 11-line paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm)-13- 200301477 A7 __ B7 V. Description of the invention < 0) 1 10, that is, as shown in FIG. 2 (B), the original mold 120 in which the concave-convex pattern 106 is correctly copied can be obtained. At this time, the palladium 106A is stuck on the nickel thin film 108 side. In the above-mentioned master mold 120, the pattern surface 206 and the mirror surface 207 are formed to correspond to a region of the upper surface uneven pattern 106 and a non-concave region 107, respectively. In addition, although not particularly shown, for example, a disk substrate having the final uneven pattern copied by using the uneven pattern as a negative pattern is produced by placing the above-mentioned original mold in a mold and using an injection molding method or the like. In addition to using the original mold 120 to manufacture the optical disc substrate, it is also possible to use the electroforming process using the original mold 120 as the main board to manufacture a mother board, and then use the mother board to manufacture an optical disc. Furthermore, the mother board can also be used as a master to make a daughter board, and then use it to make a disc. That is, the so-called original plate 120 in the present invention is actually not limited to being directly used in the manufacture of optical discs, and it may be used as a main board to make a motherboard, etc. and indirectly used in the manufacture of optical discs. On the photoresist layer 104 of the example of this embodiment, a clear concave-convex pattern can be obtained by laminating the light absorbing layer 103 to draw a sharp latent image. In addition, since the embossed pattern 106 is previously subjected to palladium as a pretreatment for electroless plating, an accurate nickel film 108 can be formed along the shape of the embossed pattern 106. In addition, the reason why the nickel thin film 108 can be formed correctly is that the light absorption layer 103 exposed to the concave portion of the concave-convex pattern 106 has the best affinity with palladium. Due to the multiplying effect of the light absorbing layer 103 and the application of palladium, the sharp concave-convex pattern 106 can be directly copied to the original mold in a clear state, and as a result, the concave-convex pattern formed on the original mold 1 20 can be suppressed. "Film elimination". Using this master 120, you can make and record, and read (regenerate) optical notebooks with high accuracy. The paper size applies to the Chinese National Standard (CNS) A4 specification (2 丨 0 > < 297 mm) _ ~- 14-(explain the first page of the note and write this page on the back) • Pack. Order printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 200301477 A7 B7 V. Description of the invention ί 1) Recording media. Please read the note on the back & PJ before the exposure of the light absorbing layer, that is, when the exposure is stopped in the thickness direction of the photoresist layer, the application of palladium and the light absorbing layer can also be obtained. Multiplying effect, so that the concave-convex pattern can be copied to the original plate in the original sharp state as described above. In this embodiment, only the electroplating process using nickel is described. However, the present invention is not limited to this, and it can also be applied to a case where a metal thin film is formed by other metal plating or by a processing method other than plating. In addition, the nickel film 1 10 can also be ordered using a metal film formed by a method other than plating. The above-mentioned master is not limited to an optical disc, but can also be applied to general information media including magnetic discs (discrete media, etc.). Manufacturing. [Examples] (Examples: the first master model) Lines Intellectual Property Bureau of the Ministry of Economic Affairs, Industrial and Commercial Cooperation Cooperative Seal ¾ After forming a coupling agent layer on a glass substrate to be honed, a light-absorbing layer was formed by spin coating. As the coating liquid, SWK-T5D60 (manufactured by Tokyo Chemical Industry Co., Ltd.) containing 4, 4 / -bis (diethylamino) benzophenone as a light absorber was used. The film was baked at 200 ° C for 15 minutes to harden it, and at the same time, the residual solvent was removed to form a light-absorbing layer having a thickness of 140 nm. Then, a photoresist (DVR100, manufactured by Zeon Corporation, Japan) was spin-coated on the light absorbing layer, and the residual solution was evaporated by baking to obtain a photoresist layer having a thickness of 25 nm. Then, using a cutting machine made by Sony Corporation, the guide groove pattern with a track pitch of 32nm and a guide groove width of I50nm was rounded, and Kr * was used as the paper standard to comply with Chinese National Standard (CNS) A4 specifications ( 2I0X297 mm) -15- 200301477 A7 _ B7 of the Consumer Cooperatives of the Intellectual Property Office of the Ministry of Economic Affairs, A7 _ B7 V. Description of the invention < 2) Laser (wavelength = 3 5 1 nm) Expose the photoresist layer, and then It is developed to form a concave-convex pattern to produce a photoresist mother board. A surfactant is used to activate the photoresist surface of the photoresist mother board, and a catalyst (palladium, tin colloid) is applied as a pretreatment for non-electrolytic plating. Then, a promoter (HBF4 solution) was used to remove tin and precipitate palladium on the surface to obtain a previously prepared photoresist mother board for non-electrolytic plating. Next, the photoresist mother substrate was immersed in a nickel chloride bath, and a nickel film was formed by non-electrolytic plating. Electroplating was performed using this nickel thin film as a substrate to form a nickel film. The laminated body composed of the nickel thin film and the nickel thin film is peeled off from the mother board, and the back surface honing and surface cleaning are performed to prepare a first master mold. (Comparative example, second master mold) A second master mold was produced in the same manner as in the first production method except that the light absorbing layer was not provided. (Evaluation result 1) The shape of the concave-convex pattern formed on each master mold was confirmed with an AFM (Interatomic Force Microscope). The AFM probe uses silicon nitride (SiN). The measurement was performed in non-contact mode and the change in the interatomic force between the sample and the probe was imaged. FIG. 3 (A) and FIG. 3 (B) are graphs showing the AFM image of the first master model and its cross-sectional shape, respectively. 4 (A) and 4 (B) are graphs showing the AFM image of the second original model and its cross-sectional shape, respectively. In AFM, the areas with high density of drawing points are the recesses in the concave-convex pattern. The areas with low drawing density or white (please read the notes on the back first and fill in this page).-1T line. (CNS) Α4 specifications (210 × 297 male thin) -16- 200301477
7 B 五、發明説明彳3 ) 域爲凸部，而分別與光阻劑母板中之凹凸圖形之凸部與凹 部相對應。另外，圖3(B)，圖4(B)中，凹凸係以0.32 // m 節距來形成。 比較圖3，圖4即可明白，利用本發明所製造之第1原 模上由於光吸收層之效果形成了淸晰的圖形，忠實複製了 該圖形。 (評估結果2) 利用ESCA(電子能譜學的化學分析）（Electron Spectroscopy for Chemical Analysis)對第 1 原模及第 2 原 模之圖形面與鏡面表面進行鈀量分析。結果如表1所示。 另外，圖形面之鈀量由於ESCA的光點直徑爲mm爲單位尺 寸，所以成爲跨越多個凹凸之測定値。 [表1] 鈀量分析結果 第1原模 第2原模 圖形面 鏡面 圖形面 鏡面 63 62 8 100 由表1可知，使用光吸收層之第1原模中，圖形面與 鏡面雙方存在有同量之鈀。另方面，第2原模中，原模面 之鈀量與鏡面相比非常少。此應爲第2原模中光阻劑母板 例之凹凸圖形上之凹部底面之玻璃面曝露出來的緣故。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (貧先M豫背面之注意事\^^填寫本頁) -裝· 訂 經濟部智慧財產局S工消費合作社印製 -17- 200301477 A7 B7 五、發明説明0 ) [產業上之可利用性] 本發明藉由粘接於光阻劑層之光吸收層，可在光阻劑 母板形成淸晰的凹凸圖形，並藉由施予凹凸圖形表面之鈀 而可以獲忠實於該凹凸圖形的原模。 (請先閲讀背面之審事填寫本ί 裝· 訂 線 經濟部智慧財產局貸工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） -18-7 B V. Description of the invention 彳 3) The domain is a convex part, which corresponds to the convex part and the concave part of the concave-convex pattern in the photoresist mother board, respectively. In addition, in FIGS. 3 (B) and 4 (B), the unevenness is formed at a pitch of 0.32 // m. Comparing FIG. 3 and FIG. 4, it can be understood that a clear pattern is formed on the first master made by the present invention due to the effect of the light absorbing layer, and the pattern is faithfully reproduced. (Evaluation result 2) The ESCA (Electron Spectroscopy for Chemical Analysis) was used to analyze the amount of palladium on the graphic surface and mirror surface of the first and second masters. The results are shown in Table 1. In addition, the amount of palladium on the graphic surface is a measurement unit that spans a plurality of irregularities because the spot diameter of the ESCA is in mm as a unit size. [Table 1] Analysis result of palladium content The first original mold and the second original mold graphic surface mirror surface graphic surface mirror surface 63 62 8 100 As can be seen from Table 1, in the first original mold using the light absorbing layer, both the graphic surface and the mirror surface are identical. Amount of palladium. On the other hand, in the second master mold, the amount of palladium on the master surface is very small compared to the mirror surface. This is because the glass surface of the bottom surface of the concave portion on the concave-convex pattern example of the photoresist mother plate in the second master is exposed. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Notes on the back of the poor first M Yu \ ^^ Fill in this page) 17- 200301477 A7 B7 V. Description of the Invention 0) [Industrial Applicability] The present invention can form a clear concave-convex pattern on the photoresist mother board by bonding the light absorption layer to the photoresist layer, and By applying palladium on the surface of the uneven pattern, an original model faithful to the uneven pattern can be obtained. (Please read the trial on the back and fill in this first. Binding and printing. Printed by the Loan Workers and Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The paper size applies to the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) -18-