TH94651B - Epoxy resin composition and preparation of the substance - Google Patents
Epoxy resin composition and preparation of the substanceInfo
- Publication number
- TH94651B TH94651B TH702000822F TH0702000822F TH94651B TH 94651 B TH94651 B TH 94651B TH 702000822 F TH702000822 F TH 702000822F TH 0702000822 F TH0702000822 F TH 0702000822F TH 94651 B TH94651 B TH 94651B
- Authority
- TH
- Thailand
- Prior art keywords
- epoxy resin
- weight
- preparation
- parts
- resin composition
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 238000002360 preparation method Methods 0.000 title abstract 2
- 239000000126 substance Substances 0.000 title 1
- 150000008064 anhydrides Chemical class 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229920000459 Nitrile rubber Polymers 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000004100 electronic packaging Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000615 nonconductor Substances 0.000 abstract 1
Abstract
DC60(03/12/55) การประดิษฐ์เกี่ยวข้องกับองค์ประกอบอีพอกซีเรซินและการเตรียมของสารนั้นองค์ ประกอบนั้นประกอบด้วยส่วนประกอบซึ่งถูกผสมต่อไปนี้:100ส่วนโดยน้ำหนักของอีพอกวีเรชิน 30ถึง120ส่วนโดยน้ำหนักของสารบ่มแอนไฮไดรต์(anhydridecuringagent)1ถึง45ส่วน โดยน้ำหนักของยางไนไตรล์ผงโดยไม่มีตัวเร่งการบ่มถูกรวมไว้ในองค์ประกอบองค์ประกอบของ การประดิษฐ์มีทั้งความทนทานความร้อนที่สูงขึ้นและความเหนียวที่สูงขึ้นและเหมาะสมสำหรับ สาขาต่างๆซึ่งต้องการความทนทานความร้อนสูงเช่นแผงวงจร,บรรจุภัณฑ์อิเล็กโทรนิกส์,ตัวยึด และสารเคลือบที่เป็นฉนวนไฟฟ้าฯลฯ DC60(03/12/12) The invention relates to an epoxy resin composition and the preparation thereof. The compound consists of the following ingredients: 100 parts by weight of epoxy resin. 30 to 120 parts by weight of anhydride curing agent, 1 to 45 parts by weight of anhydride curing agent. By weight, powdered nitrile rubber without a curing accelerator is included in its composition. The fabrication has both higher heat resistance and higher toughness and is suitable for Various fields which require high heat resistance such as circuit boards, electronic packaging, fasteners. and coatings that are electrical insulators, etc.
Claims (1)
Publications (3)
| Publication Number | Publication Date |
|---|---|
| TH94651S TH94651S (en) | 2009-03-27 |
| TH133811A TH133811A (en) | 2014-05-19 |
| TH94651B true TH94651B (en) | 2014-05-19 |
Family
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