TH38422A - The heat sink structure and package for reusing and replacing the wire-fastened zippers? - Google Patents

Abstract

This invention demonstrates and describes the direct attachment of a chip to a heat sink structure for reattachment after chip removal and replacement. The layered heat sink consists of a metal heat sink with a foil layer bonded to the chip attachment surface. A carrier assembly is attached to the chip attachment opening using a dry film adhesive or pressure-sensitive adhesive. The foil layer is bonded to the heat sink, and the contacts are separated. When removing and replacing the chip, peeling the foil from the heat sink results in the foil, chip, and any non-reusable adhesive being removed as a single unit, leaving no adhesive residue at the attachment site that would otherwise need to be sanded or rubbed away. Chip replacement can be achieved by directly reapplying the adhesive or by reattaching the foil layer before chip installation. The foil may cover the entire surface of the heat sink or be patterned to allow for the layered foil to be coated beneath the chip attachment site. Furthermore, the foil and heat sink may be made of different metals. This is to achieve different characteristics, such as a solderable surface to an aluminum heat sink. This technique is used for direct chip attachment to flexible and rigid electronic carrier assemblies. In another form, this invention uses a double-sided adhesive foil layer to secure the chip to the heat sink at the chip mounting location of the carrier assembly. Another form of this invention uses a tape-based socket package structure with a carrier assembly consisting of layered carrier heat sinks arranged in openings to create a chip socket within the package. The adhesive foil layer is attached to the heat sink across the base of the chip socket. This structure results in a low-profile assembly, allowing for chip replacement or reuse, shorter wire lengths, and reduced wire clamping height.

Claims (35)

1. A reusable direct-attach zip assembly consists of a carrier element with a plate placement surface. This plate has surfaces for attaching the integrated circuit (IC). A foil layer has a top and bottom surface. An adhesive layer is used to attach the bottom surface of the IC to the top surface of the foil layer. Removing the foil layer from the carrier element allows the IC, adhesive, and the underlying foil to be removed from the carrier element. 2. The reusable, direct-attachable zip assembly of Claim 1 features a foil layer coated with pressure-sensitive adhesive on both the top and bottom surfaces, with adhesive applied to the top surface to securely attach the integrated circuit to the board. 3. The reusable, direct-fit zipper assembly of Patent 1 features a metal-based heat sink as the carrier element. 4. The reusable, direct-attachment zipper assembly of Patent 1 features an adhesive layer that is a pressure-sensitive adhesive film. 5. Direct-fit, reusable zipper assembly (Patent 1): The foil layer is aluminum. 6. The reusable direct-attach zip assembly of Claim 1 features a foil layer that incorporates solderable material, and the assembly also includes a solder layer placed over the foil layer, with an adhesive material securing the integrated circuit to the solder layer. 7. The direct-fit, reusable zipper assembly, under patent #6, features a foil layer of gold-bronze. 8. Method for fabricating an electronic assembly with a chip as a component. The chip has a flat surface on the carrier assembly, which is attached to other electronic components using a filament connection method. This involves: a layer of adhesive foil on the plate; applying adhesive to the foil layer on the plate; attaching the component chip to the adhesive layer on the plate; connecting the component chip to the filament connection on the carrier assembly; determining the component chip to be replaced; removing the component chip from the electronic assembly by peeling off the foil layer on the plate, allowing the foil layer, filament connection, and component chip to be removed as a single unit; changing the filament connection on the plate; attaching the new component chip to the filament connection on the carrier assembly; and connecting the new component chip to the filament connection on the carrier assembly. 9. The method for constructing the electronic assembly of claim 8 involves the assembly being formed by attaching a layer of foil film to the surface of the heat sink assembly, causing the heat sink assembly to be layered, and attaching the layered heat sink assembly to the carrier assembly, with the foil surface visible at the cut-out opening in the carrier designated as the plate position. 10. The electronic assembly method described in Patent 9 involves attaching a foil film layer to the heat sink surface above the surface area of the carrier cut-off opening. This is followed by steps for removing the chip, template adhesive, and foil film layer, cutting the foil film layer within the cut-off opening, and cutting along the template adhesive to separate the foil film from the remaining foil film layer, then attaching it to the heat sink. 11. The method for constructing the electronic assembly of claim 10 prior to the template adhesive replacement step involves attaching a layered foil film to the surface area of the heat sink from which the foil layer has been removed. 12. The method for constructing the electronic assembly of claim 9 involves an electronic assembly formed by attaching layered foil sheets to the surface of a heat sink arranged within a cut-out opening. When the layered heat sink assembly is attached to the carrier assembly, 13. The method for constructing the electronic assembly of claim 12 prior to the template adhesive replacement step involves attaching a new layered foil film to the surface of the heat sink from which the previous layered foil film has been removed. 14. A reusable direct-attachable (DCA) assembly consists of a carrier assembly with top and bottom surfaces, a carrier element, and a direct-attachable zip site where the integrated circuit is attached. The zip site is a hole in the carrier assembly that expands from the top surface to the bottom surface, with a carrier assembly containing an inductive connector adjacent to the zip site. An adhesive-coated foil is attached to the bottom surface of the carrier assembly, and the adhesive-coated foil surface is visible at the zip site. The integrated circuit is bonded to the foil using the adhesive-coated foil surface at the chip attachment site. The integrated circuit retracts into the hole in the carrier assembly at the chip attachment site, and an electrical connection method allows the integrated circuit to connect to the inductive connector of the carrier assembly. 15. The reusable, direct-fit zipper assembly of Patent 14 includes a heat sink attached to the carrier element, and a hole at the zipper attachment point expands from the top surface of the carrier assembly to the bottom surface of the carrier assembly, passing through both the carrier element and the heat sink. 16. A reusable, direct-attachment zipper assembly, repurposing patent 15, where the foil material is an aluminum foil sheet with a pressure-sensitive adhesive. 17. A reusable, direct-attachable zipper assembly, repurposing patent 15, where the foil material is a tape with an organic core and a pressure-sensitive adhesive. 18. The reusable, direct-attachable zipper assembly of Patent 16 has an aluminum foil sheet with an adhesive coating on each surface. The carrier assembly has a surface that adheres to and supports the surface adjacent to the underside of the carrier assembly. 19. The reusable, direct-attachable zipper assembly of Patent 17, an organic core tape, has an adhesive coating on each surface. The carrier assembly has a surface that adheres to and supports the surface adjacent to the bottom surface of the carrier assembly. 20. The reusable direct-attachment zip assembly of claim 15: The integrated circuit device is securely attached with a wire to the inductive connector of the carrier assembly. 21. The reusable direct-to-chip assembly of claim 20, where the integrated circuit device mounted at the chip mounting position is secured with wire to the inductive connector and the integrated circuit device is enclosed and secured with wire at the chip mounting position. 22. A reusable, direct-fit zipper assembly, a reinterpretation of patent 16, features a pressure-sensitive adhesive incorporating a filter material to enhance heat induction. 23. A reusable, direct-fit zipper assembly, a new application of patent 17, features a pressure-sensitive adhesive incorporating a filter material to enhance heat induction. 24. A reusable, direct-fit zipper assembly, repurposing patent 16, features a pressure-sensitive adhesive composed of a filter material that makes the adhesive coating electrically conductive. 25. A reusable, direct-fit zipper assembly, repurposing patent 17, utilizes a pressure-sensitive adhesive composed of a filter material that makes the adhesive coating electrically conductive. 26. A reusable direct-attachment (DCA) chip assembly consists of a carrier assembly with top and bottom surfaces and a heat sink located on the top surface that adheres to the bottom surface of the carrier element. The chip mounting position is on the carrier assembly. Holes in the carrier element and those on the top surface of the heat sink combine to form the chip mounting position. There is an inductive contact area on the carrier element adjacent to the circumference of the holes. A foil layer with top and bottom surfaces, with an adhesive coating on the bottom surface, adheres the foil layer to the heat sink at the chip mounting position. The integrated circuit is attached to the top surface of the foil layer, and an electrical connection method is used to make the circuit connect to the contact area on the carrier element. 27. The reusable direct-attachment zip assembly of Patent 26 features a foil layer with a pressure-sensitive adhesive coating on both the top and bottom surfaces, attaching the integrated circuit to the chip mounting location via the pressure-sensitive adhesive coating. 28. The reusable, direct-attachment zipper assembly of patent 26 features a foil layer that is peelable aluminum foil with pressure-sensitive adhesive on both the top and bottom surfaces. 29. The reusable direct-attachment zipper assembly of claim 28 shall have carrier components of both flexible and rigid circuit boards. 30. A reusable, direct-attachment zipper assembly, repurposing patent 29, features an adhesive layer on the foil surface containing a filter material to enhance the electrical conductivity of the adhesive layer. 31. A reusable, direct-fit zipper assembly, patent 28, features an adhesive layer on the foil surface composed of a filter material that creates an electrically conductive layer. 32. The method for fabricating an electronic assembly with a chip as a component, with a flat surface attached to the carrier assembly using a wire connection method, involves the following steps: creating an opening through the carrier assembly that determines the chip mounting position; attaching a layer of adhesive-coated foil to the carrier assembly across the opening to create a chip socket with an adhesive-coated surface at its base; placing the chip in the socket and securing it to the base with the adhesive surface; and electrically connecting the chip to the carrier assembly using a wire connection method. 33. Method of fabricating the electronic assembly of claim 32. The carrier assembly is formed from layers of carrier components attached to a heat sink. The through-holes of the carrier assembly consist of openings arranged to allow passage of the carrier components and the heat sink, and the base surface of the chip mount is formed from layers of adhesive-coated foil attached to the heat sink. 34. Method for fabricating the electronic assembly of claim 33. The electrical connection procedure for the chip consists of securing the chip with wire to the carrier assembly, and the method also consists of encapsulating the chip and securing it with wire. 35. The method for fabricating the electronic assembly of claim 34, the adhesive foil layering procedure, consists of applying the adhesive foil layer to both sides, and the procedure also includes the steps for attaching the electronic assembly to a surface mount by applying the adhesive to the foil surface that is not attached to the heat sink. (Clause 35, page 6, figure 7)