TH26628B - The process of producing transponder for contactlee chip card - Google Patents

Abstract

DC60 (07/08/52) receiver manufacturing process Or a card to receive and transmit data (contactless chip card) where the receiver or the data sheet, (contactless chip card) is composed of a non-conductive substrate. First and second, one each One electronic component and an antenna with a non-conductive substrate The first and the second ones have the same outer boundary. Electronic components are placed on the first conductive substrate. It serves as a component support and antenna arrangement on a second non-conductive substrate. And then assembled Each substrate is correctly positioned. It uses a total switching mechanism by coating various layers of the substrate with heat and melting different layers of the substrate to seal the inner electronic components. The non-conductive substrate acts as a base card body after assembly is complete. Receiver manufacturing process Or a sheet to receive and transmit data (contactless chip card) where the receiver or the data sheet, (contactless chip card) is composed of a non-conductive substrate. First and second, one each One electronic component and an antenna with a non-conductive substrate The first and the second ones have the same outer boundary. Electronic components are arranged on the first conductive substrate. It acts as a component support and antenna arrangement on a second non-conductive substrate. And then assembled Each substrate is correctly positioned. And using a total switching mechanism by coating different layers of substrates with heat and melting different layers of substrates to seal electronic components in The non-conductive substrate will act as a base card boby after assembly.

Claims (9)

1. The process of manufacturing a receiver Or a sheet for receiving and sending information Where the receiver or the transmitting plate consists of a first non-conductive substrate. And a non-conductive substrate Second electric One electronic component And an antenna, but the substrate is not conductive First electric and second non-conductive substrate It must have the same periphery, and the manufacturing process has the following steps - the process of placing the electronic component on the first non-conductive substrate that serves as the - The process of placing the antenna on the second non-conductive substrate - The process of fusing the first non-conductive substrate in direct contact with the substrate. Titrate that is not Second conductor Until the electronic components are sealed into the two non-conductive substrates and there is a sealed connection between the electronic part and the antenna. The substrate that is not The connected conductors form a base card body with a thickness equal to the sum of the first and second non-conductive substrate thicknesses. 2.Process for manufacturing a receiver Or a sheet for receiving and sending information According to claim No. 1, where the receiver Or a sheet for receiving and sending information It consists of several electronic components and an antenna. 3.Process for manufacturing a receiver Or a sheet for receiving and sending information Claim No. 1 also includes a procedure for the electrification of the electronic components placed on the non-conductive substrates. One touches an antenna placed on a second non-conductive substrate 4.Process for manufacturing a receiver Or a sheet for receiving and sending information According to claim No. 3, in relation to the contact of the parts, it includes the insertion of auxiliary material between the parts. Electronics with antenna 5. The process of manufacturing the receiver Or a sheet for receiving and sending information According to claim 3, the contact of the parts includes: Micro-Welding (micro-welding) electronic media placed pieces On the first non-conductive substrate With an antenna placed on a non-conductive substrate that Two, without adding additional materials 6.Process for manufacturing a receiver Or a sheet for receiving and sending information According to claim 4, in respect of the auxiliary materials, including solder material or the bonding material to the two adhesives. 7. Receiver or pad to receive and transmit data Which contains the first non-conductive substrate And a second non-conductive substrate One electronic component And one antenna, which must have the same outer edge Where the electronic components are placed on a non-conductive substrate. First electric Which serves as a receiver for the various parts, and the antenna is placed on a non- Second conductor And a receiver or a plate to receive and transmit data Will be produced by welding Felt first non-conductive sulfate in direct contact with the second non-conductive substrate by heat. This causes the first and second non-conductive substrates to melt. Until the electronic component is sealed into the two non-conductive substrates and there is a hermetic connection between the electronic component and the antenna. By definition, the receiver or chip card must be equal to the sum of the thickness of the first and second non-conductive substrates. 8. Receiver according to claim 7, including the top of the upper or lower substrates. 9. The receiver according to claim 8 is a receiver. Integrated into another (housing)