TH166408A - Diesing Sheet and chip manufacturing methods that use that - Google Patents

Abstract

A dieing sheet (1) in which the base material (2) and the adhesive layer (3) are overlaid on at least one side of the base material (2), the adhesive layer (3) is formed from an adhesive composition consisting of Polymer compounds Synthesized by energy radiation (B), adhesive layer (3), has a storage elastic modulus at 23 ° C before irradiation, energy does not exceed 135,000 Pa, the adhesion force of the die sheet (1). Before irradiating the adhesive layer (3), which was measured while performing a 180 ํ peel adhesion test on a stainless steel test plate in accordance with JIS Z02372009, was 10 N / 25mm or more, even using the tester. The Gardner type mandrel banding tester performs a folding test. Bend the dosing sheet (1) after irradiating the adhesive layer (3) of the dosing sheet (1) to the diameter. The mandrel is 2 mm according to ASTM-D522, there is no crack on the adhesive layer (3) after irradiation.

Claims (1)

1. A dye sheet containing a base material and an adhesive layer, which is layered on at least one side of the base material, which has The specific characteristics are The adhesive layer is made up of an adhesive composition composed of a polymer compound. Synthesized by radiation energy (B) with a function group, polymer synthesis can be with energy radiation. Such adhesive layers contain precious materials, modulus of elasticity.