SU961884A1 - Apparatus for soldering by dipping - Google Patents

Description

(54) DEVICE FOR SINGLE DIVE

one

The invention relates to soldering, in particular to devices for immersion by brazing.

A soldering device is known that contains a tank with molten solder, inside which a soldering bath is installed with side walls rising 5 above the tank to create an increased level of solder in it. The pump injects fresh solder from the reservoir into the bath intended for soldering products by immersion, whereby the mirror is soldered in it, Q is constantly cleaned of the slag film, which has a positive effect on the quality of soldering. Slag film, which accumulates on the solder surface in the tank, does not get into the soldering bath, because the pump supplies solder from the lower zone 1. 15

However, with the open surface of the mirror, not protected by an oxide and slag film, the solder, which is constantly in contact with air, is actively oxidized even without immersing the product, which leads to its 20 overrun and loss of m.

It should also be noted that the constant thickening of the slag film in the tank due to washable oxides leads to saturation with liquid solder when moving, which is associated with additional losses during the periodic removal of the slag.

In addition, the constant cleaning of the solder in the soldering bath leads to the elimination of the thermoisolation effect, which is inherent in the slag film, and therefore the heat loss by the molten solder due to convection and radiation increases. These losses must be compensated for by increasing the amount of energy supplied to the heating system.

A famous soldering bath containing a tank with molten solder, a bath with a lid placed in the tank, a pump for pumping solder. Before soldering, the lid is opened, after which the bath is lifted from the molten solder to perform soldering 2 in it.

Claims (2)

However, during the soldering of the product in the bath, particles of newly formed slag appear on the surface of the solder, and an oxide film due to the interaction of the molten solder with air, which reduces the quality of soldering, since solder cleaning is not provided in the bath. The purpose of the invention is to prevent the oxidation of solder and to reduce heat loss by molten solder. This goal is achieved by the fact that a device for immersion by soldering, containing a tank with solder, a bath with a lid, placed in a tank, a pump for pumping solder from the tank to the bath, is equipped with a mechanism for forcing the lid into the bath, and the lid is made in the form of a float. FIG. 1 shows the device, a general view; in fig. 2 is a view along arrow A in FIG. 1. The immersion soldering device comprises a reservoir 1 for molten solder, equipped with a heating system (not shown), a pump 2, the discharge channel 3 of which is connected to the bath 4 from its bottom, and the side walls of the bath 4 solder above the level of solder tank 1. The floating cap 5 is placed in the bath 4 with gaps a, is in contact with the surface of the mirror of the solder bath, while the outer surface of the cap 5 has a convex shape, and the cap itself is made of a non-wetting material, for example steel XI8HIOT, which share mensche specific gravity of the solder. A hole b is provided in the cover 5, coaxially with the outlet opening in the discharge channel 3. The cover 5 is lowered by means of a drive mechanism, which consists of a double-arm 7 installed on the side wall of tank 1 on axis 6 (Fig. 2). which is U-shaped to provide free access to the mirror by soldering baths 4 and provided with 9 rocker arms mounted on trunnions 9 with stops 10 in contact with the lid 5, while the length of the stops 10 is not less than the lowering of the lid. The opposite end of the two shoulders lever 7 is connected to the power cylinder 11. The device operates as follows. In the period between the immersions of the product, the lever 7, together with the rocker arms 9, is lifted by means of the power cylinder I, and the floating cover 5, under the action of hydrostatic pushing force, floats freely on the surface of the solder in the bath 4 and is limited from lateral displacement by the walls of the bath. The lid 5 during this period separates the solder from the air atmosphere, protecting it from oxidation. In addition, she. interferes with convection and heat radiation, providing a thermal insulating effect. The solder in tank 1 is protected from oxidation and excessive heat loss by the slag film g. When pump 2 is running, fresh solder is sucked from tank 1, through discharge channel 3 is fed into the bath 4 from its bottom part through the hole in and through the gaps a between the side walls of the bath 4 and the lid 5 flows back into the tank 1. This ensures the maintenance of a constant level and the renewal of the Solder in the bath 4 soldering. Before the product is immersed, the lever 7 is rotated around the axis 6 by means of the power cylinder 11, lowering the rocker arms 9, acting with their stops 10 on the cover 5, which, overcoming the buoyant force of the molten solder, also lowers to the lower position and releases the area needed for soldering the product ( shown by a broken line). Due to the presence of the hinge pins 8, the rocker arms 9 do not roll the cover 5, while its hole b in the lowered position is aligned with the hole b, which improves the solder circulation conditions in the bath 4, which cleans the mirror of solder from oxides and slags during the soldering of the product. After the end of the soldering, the power cylinder 11 returns the lever 7 with the rocker arms 9 to its original position, and the cover 5 pops up, again protecting the mirror of the solder. Due to the convex outer surface and non-wettability of the material, the remaining solder flows freely from the cover into the gaps a. The use of the proposed device for soldering by immersion in comparison with the known devices makes it possible to drastically reduce the losses from oxidation, as well as to reduce the energy costs for heating the solder. DETAILED DESCRIPTION OF THE INVENTION The device for immersion by brazing includes a tank with solder, a bath with a lid, placed in a tank, a pump for pumping solder, characterized in that, in order to prevent oxidation of solder and reduce heat loss, the device is equipped with a mechanism for forcing the lid to be forced into the bath, molten solder, and the bath cap is made in the form of a float. Sources of information taken into account in the examination 1. USSR author's certificate number 184598, cl. In 23 K 3/06, 1966. 2. USSR author's certificate number 565786, cl. B 23 K 3/06, 1975 (prototype).