SU1454598A1 - Apparatus for soldering by dipping in solder melt - Google Patents

Abstract

The invention relates to soldering, in particular to equipment for immersion by brazing. The purpose of the invention is to increase productivity and improve working conditions by mechanizing the removal of sludge. The device contains a bath 1 with solder and pressure 2 and drain 3 pockets. The latter is communicated by a channel with a reservoir where a pump 8 is installed for pumping solder. In the drain pocket 3 placed capacity 10 of the sludge trap. The bottom of the tank is perforated. To unload the sludge collector, a tipping mechanism is provided in the device. A hole with a flap 15 for adjusting the level of solder in the tank 10 is made in the wall of the vessel. During the operation of the tipping mechanism of the tank 10, the pump B is turned off. No soldering is performed. 2 Il. SL tb SP from 00

Description

The invention relates to soldering, in particular to equipment for immersion by brazing.

The purpose of the invention is to improve productivity and improve working conditions by mechanizing the removal of sludge.

FIG. 1 shows an immersion soldering device, general view; in fig. 2 - the same, a section on a drain pocket with a capacity.

A device for soldering by immersion in molten solder contains a bath 1 (Fig. 1) for molten solder with pressure 2 and drain 3 pockets located on opposite walls 4 and 5 of bath 1, while the drain pocket 3 channel 6 communicates with the reservoir 7.

In the tank 7 is installed pump

8 for pumping solder connected by pipeline 9 with pressure pocket 2.

In the drain pocket 3, a container 10 of the sludge trap is placed, the bottom II of which is perforated with holes 12, and in one of its end walls 13 there is a slot 14 with a valve 15 for adjusting the level of solder in the container 10.

The container 10 is mounted on the axis 16, which is fixed on the support 17, located outside the bath 1.

The tilting mechanism includes a power cylinder 18 mounted on an axis 19 with a possibility of swinging, the rod 20 of which is hingedly connected to a container 10.

The device works as follows.

Pump 8 pumps fresh solder from reservoir 7 through the pipeline

9c, the discharge pocket 2, after which the solder is filled, overflowing through wall 4, enters bath 1 with molten solder. The solder level in bath 1 rises,

and it begins to pour over the wall 5.

Thus, a directional circulation of solder is created between the injected formation of oxides and contamination along with the tripo flow, the wall 5 of bath 1 is poured, and the reservoir 10 of the sludge collector flows.

On the container 10, the melted out sing through the holes in the bottom 1 1 of the slot opening 14 in the end ke 13 flows into the drain pocket 10 further along the channel 6 into the tank 7

By adjusting the area of the slotted version 14, the flap 1 sets the total capacity of the slotted hole 15 and the holes 12, at which the solder level is maintained in the container 10, which is known above the upper edge of the left hole 14 (level a see fig. 2).

Due to this, oxides and other contaminants located on the surface of the solder remain in the tank of the sludge trap, and clean solder is drained from it.

As they accumulate, oxides and soils harden to form sludge b (see Fig. 2).

The mechanized removal of the slider is carried out periodically, with this turning on the power cylinder of the tilting mechanism, it is pulled in, turning the tank around the axis 16. The tank 10, rising, leaves the drain pocket and drips from it into the sleeping pocket 3 through the holes 12 in the bottom 1 1 and the sludge remains in the tank

Upon further movement, bone I) is tilted and the sludge from it is mixed into a team container.

Thereafter, using the power lindra 18, the container 10 returns to its original position;

During the period of operation of the mechanism for testing the capacity of the sludge tank 10, the pump 8 is turned on and does not perform the process of soldering the product.

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Formula

invented

A device for soldering immersion in molten solder, containing a bath for molten solder with pressure and drain pockets

. ,, - - iv- L i "jiijnDin p -ppappy pockets

2 pockets and 3 drain pockets, which is 55 and a pump for pumping solder.

ensures the cleaning of the solder mirror in the bath 1 from oxides and other contaminants released during the process of soldering products in the bath 1.

It is noted that in order to increase production and improve working conditions by mechanizing the removal of sludge,

The resulting oxides and soils, together with the flow of tripot, overflowing the wall 5 of bath 1, enter the - tank 10 of the sludge trap.

On the container 10, the molten solder through the holes in the bottom 1 1 and the slot hole 14 in the end wall 13 flows into the drain pocket 3 and 10 further along the channel 6 into the tank 7.

By adjusting the area of the slotted hole 14 with the help of the flap 15, the total throughput of the slotted hole 14 15 and the holes 12 are established, at which the level of solder in the container 10 is maintained, which is known above the upper edge of the slotted hole 14 (level a, see Fig. 2).

Due to this, oxides and other contaminants on the surface of the solder remain in the tank 10 of the sludge collector, and clean solder is drained from it.

As they accumulate, oxides and pollution harden, forming a layer of sludge b (see Fig. 2).

The mechanized removal of sludge is carried out periodically, at 0 this turns on the power cylinder 18 of the tilting mechanism, its rod 20 is drawn in, turning the container 10 around the axis 16. The capacity 10, lifting, comes out of the drain pocket 3, the remnants of solder flow from it into the drain pocket 3 through the holes 12 in the bottom 1 1, and the sludge remains in the tank 10.

Upon further movement, bone I) is tilted and the sludge from it is mixed into a team container.

Thereafter, with the help of the ram 18, the reservoir 10 returns to its original position;

During the operation of the tilting mechanism, the pump 8 is turned off and the product is not soldered.

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Formula

the invention

A device for soldering by immersion in molten solder, containing a bath for molten solder with discharge and drain pockets

- iv- L i "jiijnDin n -ppappy pockets

and a pump for pumping solder.

It is excellent because, in order to increase productivity and improve working conditions by mechanizing the removal of sludge,

The hinged pocket of the tank with the tipping mechanism perforated and the bath bottom and the slot hole mounted on an axis, mounted with a damper in the end wall, outside the bath, with a sludge collector, is hinged on the wall; in the tipping mechanism.

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Claims (1)

Claim A device for brazing by immersion in molten solder containing a bath for molten solder with discharge and drain pockets and a pump for pumping solder, characterized in that, in order to increase productivity and improve working conditions due to mechanization of sludge removal, it provides a drain pocket of the tank with a perforated bottom and a slotted hole with a shutter in the end wall, while the sludge collector is pivotally connected to the ® tipping mechanism. wife tipping mechanism pivotally mounted on the wall of the bathtub and mounted on an axis installed outside the bathtub, a sludge collector made in the form placed in Wed (12 2