SU764619A3 - Cathode block - Google Patents
Cathode block Download PDFInfo
- Publication number
- SU764619A3 SU764619A3 SU2023934A SU2023934A SU764619A3 SU 764619 A3 SU764619 A3 SU 764619A3 SU 2023934 A SU2023934 A SU 2023934A SU 2023934 A SU2023934 A SU 2023934A SU 764619 A3 SU764619 A3 SU 764619A3
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- cathode
- substrate
- working
- april
- gas
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Abstract
Description
(54) КАТОДНЫЙ БЛОК(54) CATHODE UNIT
1one
Изобретение относитс к области нанесени покрытий в вакууме и может .найти-применение, например, при получении металлоокисных покрытий на различных подложках.The invention relates to the field of vacuum coating and can be used, for example, in the preparation of metal oxide coatings on various substrates.
.Известен катодный блок преимущественно дл устройств дл нанесени электропровод гцих пленок методом распылени , содержащий металлический катод, многослойный электростатический экран, окружающий катод со всех сторон, за исключением рабочего участка поверхности катода 1 .A cathode block is known predominantly for sputtering devices for applying electrically conductive films, containing a metal cathode, a multilayer electrostatic screen surrounding the cathode from all sides, with the exception of the working portion of the cathode surface 1.
Однако этот блок обладает невысокой надежностью работы за счет воз- н-икновени электрического пробо между катодом и электростатическим экраном.However, this unit has a low reliability of operation due to the return of electrical breakdown between the cathode and the electrostatic screen.
Цель изобретени - повышение надежности работы катода за счет предотвращени возможности возникновени электрического пробо между катодом и электростатическим экраном. х,,The purpose of the invention is to increase the reliability of the cathode by preventing the possibility of electrical breakdown between the cathode and the electrostatic screen. x ,,
Дл этого катодный блок преимущественно дл устройств дл .нанесени электропровод щих пленок методом распылени , содержащий металлический катод, многослойный электростатический экран, окружающий катод со всех сторон, за исключением рабоче о участка поверхности катода, снабжен; трубопроводом, один конец которого введен в зазор между стенками электростатического экрана, а другой, конец соединен с системой подачи нейтрального газа.For this, the cathode block is mainly used for devices for sputtering electrically conductive films containing a metal cathode, a multi-layer electrostatic shield surrounding the cathode from all sides, except for the working surface of the cathode surface; pipeline, one end of which is introduced into the gap between the walls of the electrostatic screen, and the other end is connected to the supply system of neutral gas.
На фиг. 1 приведена схема конструкции катодного блока, на фиг. 2 разрез катодного блока, на фиг-. 3 10 схема размещени трубопровода и катодных блоков.FIG. 1 is a diagram of the structure of the cathode block; FIG. 2 is a section through the cathode block; FIG. 3 10 layout of the pipeline and cathode blocks.
Катодный блок преимущественно дл устройств дл нанесени электропровод щих пленок методом распылени содержит трубопровод 1,. один конед которого введен в эазор между стенками 2 и 3, образующими многослойный электростатический экран, окружающий металлический катод 4The cathode block, preferably for sputtering devices for applying electrically conductive films, comprises a conduit 1 ,. one end of which is inserted into the gap between walls 2 and 3, forming a multi-layer electrostatic screen surrounding the metal cathode 4
20 со всех сторон, кроме рабочего20 from all sides except the worker
участка поверхности катода 4. Второй конец трубопровода 1 соединен с системой подачи, нейтрального газа.the surface of the cathode 4. The second end of the pipeline 1 is connected to the supply system, neutral gas.
Катодный блок функционирует сле25 .дующим образом.The cathode block functions as follows.
Несколько катодных блокой размещены в вакуумной камере (не показала ) . Трубопровод 1 подсоединен ко всем катодным блокам. Напыление металла производитс на подложку 5,Several cathode block placed in a vacuum chamber (not shown). Pipeline 1 is connected to all cathode blocks. The metal is sprayed onto the substrate 5,
Котора находитс в вакуумной камере и расположена над катодными блоками. При напылении металла катод 4 нагреваетс . Дл охлаждени катода 4 его внут ренн полость заполн етс водой, подаваемой по трубе б или 7. Однако из этих труб вл етс наполн ющей , а втора - отвод щей охлаждающую воду.This is located in a vacuum chamber and located above the cathode blocks. When the metal is sprayed, the cathode 4 is heated. In order to cool the cathode 4, its internal cavity is filled with water supplied through pipe b or 7. However, of these pipes is the filling and the second is the cooling water discharging.
По трубопроводу 1 подаетс нейтральный газ. Трубопроводов может несколько. Дл получени большей однородности потока в полости между стенками 2 и 3 могут быть расположены дополнительные перего-. родки 8,9.Pipeline 1 supplies neutral gas. Pipelines may be several. To achieve greater uniformity of flow in the cavity between walls 2 and 3, additional baffles may be located. birth 8.9.
Дл пр моугольного катода 4 с раз мерами 7,5 60 см обща скорость потока газа электростатический экран приблизительно равна 15 л/с при давлении 0,05 мм рт.ст. Промежуток между стенками 2 и 3 может быть выбран в пределах от 3 до 5 мм. Рабочее напр жение катодного блока выбираетс в пределах от 2 до 5 кВ.For a rectangular cathode 4 with dimensions of 7.5 to 60 cm, the total gas flow rate of the electrostatic screen is approximately 15 l / s at a pressure of 0.05 mm Hg. The gap between walls 2 and 3 can be selected from 3 to 5 mm. The operating voltage of the cathode block is selected from 2 to 5 kV.
-2 Давление в вакуумной камере 5x10 мм-2 Pressure in vacuum chamber 5x10 mm
рт.ст.Hg
Наличие нейтрального газа между стенками 2 и 3 устран ет возможностьThe presence of a neutral gas between walls 2 and 3 eliminates the possibility
пробо между катодом 4 и стенками 2 и 3, образующими электростатический экран.sample between the cathode 4 and the walls 2 and 3, forming an electrostatic screen.
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2018473A GB1443827A (en) | 1973-04-27 | 1973-04-27 | Reactive sputtering apparatus and cathode units therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
SU764619A3 true SU764619A3 (en) | 1980-09-15 |
Family
ID=10141798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU2023934A SU764619A3 (en) | 1973-04-27 | 1974-04-26 | Cathode block |
Country Status (13)
Country | Link |
---|---|
US (1) | US3890217A (en) |
JP (1) | JPS539594B2 (en) |
BE (1) | BE814286A (en) |
CA (1) | CA1024937A (en) |
CH (1) | CH590936A5 (en) |
DE (1) | DE2418008A1 (en) |
FR (1) | FR2227345B1 (en) |
GB (1) | GB1443827A (en) |
IT (1) | IT1010755B (en) |
NL (1) | NL7404891A (en) |
SE (1) | SE408913B (en) |
SU (1) | SU764619A3 (en) |
ZA (1) | ZA742375B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3945911A (en) * | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Cathodes for sputter-coating glass sheets or other substrates |
US3976555A (en) * | 1975-03-20 | 1976-08-24 | Coulter Information Systems, Inc. | Method and apparatus for supplying background gas in a sputtering chamber |
US4009090A (en) * | 1975-12-03 | 1977-02-22 | Shatterproof Glass Corporation | Sputter-coating of glass sheets or other substrates |
FR2403645A2 (en) * | 1977-09-14 | 1979-04-13 | Vide & Traitement Sa | Furnace for thermochemical metal treatment - ensures ion bombardment by anodes and cathodes without arc discharge |
US4116806A (en) * | 1977-12-08 | 1978-09-26 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
US4175030A (en) * | 1977-12-08 | 1979-11-20 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
JPS57111031A (en) * | 1980-12-27 | 1982-07-10 | Clarion Co Ltd | Sputtering device |
US4362611A (en) * | 1981-07-27 | 1982-12-07 | International Business Machines Corporation | Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield |
US4420385A (en) * | 1983-04-15 | 1983-12-13 | Gryphon Products | Apparatus and process for sputter deposition of reacted thin films |
US4526670A (en) * | 1983-05-20 | 1985-07-02 | Lfe Corporation | Automatically loadable multifaceted electrode with load lock mechanism |
US20050211544A1 (en) * | 2004-03-29 | 2005-09-29 | Seagate Technology Llc | Electrical biasing of gas introduction means of plasma apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3325394A (en) * | 1963-07-01 | 1967-06-13 | Ibm | Magnetic control of film deposition |
US3526584A (en) * | 1964-09-25 | 1970-09-01 | Western Electric Co | Method of providing a field free region above a substrate during sputter-depositing thereon |
US3369991A (en) * | 1965-01-28 | 1968-02-20 | Ibm | Apparatus for cathode sputtering including a shielded rf electrode |
US3361659A (en) * | 1967-08-14 | 1968-01-02 | Ibm | Process of depositing thin films by cathode sputtering using a controlled grid |
US3595775A (en) * | 1969-05-15 | 1971-07-27 | United Aircraft Corp | Sputtering apparatus with sealed cathode-shield chamber |
-
1973
- 1973-04-27 GB GB2018473A patent/GB1443827A/en not_active Expired
-
1974
- 1974-04-08 CA CA197,030A patent/CA1024937A/en not_active Expired
- 1974-04-09 DE DE2418008A patent/DE2418008A1/en not_active Withdrawn
- 1974-04-10 NL NL7404891A patent/NL7404891A/xx unknown
- 1974-04-11 US US459988A patent/US3890217A/en not_active Expired - Lifetime
- 1974-04-12 IT IT12736/74A patent/IT1010755B/en active
- 1974-04-16 ZA ZA00742375A patent/ZA742375B/en unknown
- 1974-04-18 FR FR7413485A patent/FR2227345B1/fr not_active Expired
- 1974-04-22 CH CH551774A patent/CH590936A5/xx not_active IP Right Cessation
- 1974-04-25 SE SE7405594A patent/SE408913B/en unknown
- 1974-04-26 BE BE143706A patent/BE814286A/en unknown
- 1974-04-26 SU SU2023934A patent/SU764619A3/en active
- 1974-04-27 JP JP4715974A patent/JPS539594B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2227345A1 (en) | 1974-11-22 |
GB1443827A (en) | 1976-07-28 |
BE814286A (en) | 1974-10-28 |
FR2227345B1 (en) | 1977-10-14 |
ZA742375B (en) | 1975-11-26 |
CH590936A5 (en) | 1977-08-31 |
SE408913B (en) | 1979-07-16 |
AU6775774A (en) | 1975-10-16 |
NL7404891A (en) | 1974-10-29 |
JPS539594B2 (en) | 1978-04-06 |
DE2418008A1 (en) | 1974-11-21 |
US3890217A (en) | 1975-06-17 |
IT1010755B (en) | 1977-01-20 |
JPS5013275A (en) | 1975-02-12 |
CA1024937A (en) | 1978-01-24 |
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