SU750614A1 - Method and device for preparing for contact exposure - Google Patents

Abstract

1536978 Positioning photo-sensitive material ELEKTROMAT VEB 14 Jan 1977 [19 Jan 1976] 01615/77 Heading G2A A circular semi-conductor slice having a photosensitive coating, which is exposed to a template in a contact or near contact printing process, is aligned with the template by upwardly flexing the rim of the slice concentrically about its centre and pressing the flexed rim into contact with the template. As shown, slice 3 is held by vacuum on a work-table 1, which is mounted on a vacuumlockable spherical bearing 7 in a vertically movable holder 9; and is upwardly flexed at its rim by upward movement of a stepped girth ring 10, as a result of the application of vacuum to a cavity 13. A rubber sealing ring 18 may be employed to enable application of vacuum between slice 3 and template 5 during contact printing.

Description

I

The invention relates to the production technology of semiconductor devices by the method of photolithography and can be used to improve the quality of contact exposure.

A known method of preparing for contact exposure includes attaching the substrate to the photomask to align their surfaces, fixing the substrate holder in this position, aligning their designs, and re-pressing the substrate to the photomask to expose 1.

A device for carrying out a known method comprises a substrate holder, a fixing unit of a substrate holder, a template holder, an assembly unit, a vacuum-pneumatic system.

A disadvantage of the known technical solution is that when the substrate is pressed against the photomask to level their surface, intensive wear of the photoglass occurs.

Of the known technical solutions, the closest in technical essence to the present invention is a method of preparing for contact exposure, including pressing the substrate to a photo pattern to align their surface, fixing the substrate holder in this position, creating a micro gaps between the substrate and the photomask, combining their designs, retaining pressure of the substrate to the photomask for exposure 2.

The method is carried out with a device comprising a substrate holder, a fixing unit of the substrate holder, a template holder, an assembly unit, a vacuum-pneumatic system.

The disadvantage of this method is the large wear of the photomask.

The purpose of the invention is to reduce the wear of the photo of the Jablon.

This is due to the fact that in the method of preparing for contact exposure, including pressing the substrate to the photomask to align their surfaces, fixing the substrate holder in this position, creating a microspace between the substrate and the photomask, combining their designs, re-pressing the substrate to the photo pattern for exposure, pressing the substrate to the photomask to align their surfaces

the peripheral part of the substrate is elastically folded towards the photomask, and after fixing the substrate holder, the peripheral part of the substrate is returned to its original position.

Such a method can be implemented with a device containing a substrate holder, a fixing unit for a substrate holder, a pattern holder, an assembly unit, a vacuum-pneumatic system that is equipped with a ring that is mounted concentrically with the substrate holder so that it can move along its axis of symmetry, with an annular recess on the side surface of the substrate holder, and a ring provided with a collar, forming together with an annular recess cavity, connected with. vacuum-pneumatic system.

FIG. 1 shows a device for a plane-parallel orientation of a semiconductor disk relative to a photo substrate in an axisymmetric section; in fig. 2 - the same, after orientation.

The device comprises a substrate holder made in the form of a pressing table 1, the substrate (semiconductor disk 3) is pressed against the pressure surface 2 of which is pressed by vacuum. Opposite the presser surface 2, the template holder 4 is located for the photomask 5 lying in a parallel plane. The presser table 1 is made rotatable with the aid of a more often support 6 inside the socket 7 and consisting of a hemisphere 8 and a spherical thickening 9. The outer ring 10 is concentric with the presser table 1 which can move along a common symmetrical axis relative to the pressing table 1. The common contact surface 11, which functions as a guide, is arranged in steps, so that the pressing table 1 accepts a mushroom shape, and an outer ring 10 - form a thicket. The cavity 12 formed by the surfaces of the table 1 and the outer ring is connected to the pumping system via channel 13. Channel 14 is connected to the pumping system.

The principle of operation and technological operations are as follows.

When applying a semiconductor disk 3, the surface of the adjoining outer ring 10 is located below the pressing surface 2. When orienting, the adjoining surface of the outer ring 10 is raised by a certain amount above the pressing surface 2 by means of reduced pressure created in the cavity 12 through the channel 13. At the same time, the semiconductor disk 3 on the table 1 is pressed against the pressing surface 2 through the channel 14 and is easily concentrically bent along the edge . In this position, the research institutes due to pumping through the channel 15 orient the hemisphere 7 and the presser table 1.

After the semiconductor disk 3 is oriented to the photomask 5, the abutment surface of the outer ring 10 is lowered again by ventilating the cavity 12. Due to this, the semiconductor disk 3 returns to the upper initial position and is located at a positioning distance from the photogame 5. After positioning, the distance for exposure can be set due to the movement of the entire support 6. Due to the movement of the support 6 upwardly venting the cavity 12 through the channel 13 and canceling the cavity 12 between the photomask 5 and along The semiconductor disk 3 can be carried out contact mines.

In another constructive embodiment of the invention, a rubber seal 16 is placed on the surface of the abutment of the outer ring 10.

The rubber seal 16 at the contact copy seals the phototechnique 5. For positioning, the outer ring 10 is lowered so that the rubber seal 16 does not come in contact with the photo frame; with the ablon 5. Furthermore, further lowering of the outer ring 10 facilitates the removal of the semiconductor disk 3 from the table 1. All positions can be oriented by means of a clamping device.

Thanks to the invention, the contacting surfaces of the contact between the photomask and the semiconductor disk are reduced, the risk of contamination and damage is reduced, and the productivity and quality of the semiconductor structures are improved. This significantly reduces the operating costs for the manufacture of semiconductor structural elements.

Claims (2)

1. A method of preparing for contact exposure, including pressing the substrate to the photomask to align their surfaces, fixing the substrate containing 5 bodies in this position, creating a microgap between the substrate and the photomask, combining their designs, re-pressing the substrate to the photomask for exposure, characterized in that In order to reduce the wear of the photomask, before pressing the substrate to the photomask to: Align their surfaces, the peripheral part of the substrate is elastically bent towards the photomask, and after fixation lozhkoderzhatel peripheral return 5 part of the substrate to its original position. 2. The device for the implementation of the method according to claim 1, comprising a substrate holder, a fixing unit of the substrate holder, a template holder, an assembly unit, vacuum