JP2007164023A - Exposure method and exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make lateral displacement of a photomask small as far as possible, when the photomask is brought into contact with a substrate. <P>SOLUTION: A substrate 1 having a photosensitive layer formed on its surface is held on a substrate support base 17. A photomask 6 with a pattern drawn is held at a position covering the substrate 1. The substrate 1 is held at the substrate support base. While holding the photomask 6 at a position covering the substrate 1, a space 27 having an open surrounding is formed between the substrate 1 and the photomask 6. An air flow to guide the air within the space 27 to the outside is generated around the substrate 1 to produce a negative pressure in the space 27. By generating the negative pressure in the space 27, the photomask 6 is brought into contact with the substrate 11. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure method for transferring a pattern to a substrate by arranging a photomask on which a pattern is drawn and a substrate having a photosensitive layer formed on the surface in an overlapping manner, and irradiating the substrate with light through the photomask. The present invention relates to an exposure apparatus.

  For example, a substrate such as a printed circuit board does not necessarily have a flat surface. Therefore, in order to faithfully transfer the pattern drawn on the photomask to the surface of the substrate, it is necessary to make the photomask uniformly contact over the entire surface of the substrate. In particular, when the flatness is low, it is necessary to apply a strong force between the photomask and the substrate to bring them into close contact.

  In order to bring the photomask into contact with the substrate, it is known to form a closed space between the two and make this closed space have a negative pressure (for example, JP-A-2004-54255). An annular seal member is provided on the periphery of the substrate support base that supports the substrate, and a closed space is formed by the annular seal member, the substrate support base, and a photomask placed on the annular seal member.

  8 to 11 show an example of a conventional exposure apparatus as described above. The exposure apparatus includes a substrate support 2 for supporting the substrate 1 and an annular seal member 3 attached to the substrate support 2. A photosensitive layer is formed on the upper surface of the substrate 1. A suction hole 4 communicating with a negative pressure source (not shown) is formed in the substrate support 2. The substrate 1 is held on the substrate support 2 by a suction hole 4 to which a negative pressure is applied.

  The annular seal member 3 is made of a hollow elastic material and extends so as to surround the substrate 1. When the photomask 6 on which the pattern 14 is drawn is placed on the annular seal member 3, a closed space 7 is formed by the annular seal member 3, the substrate support 2, and the photomask 6. The closed space 7 communicates with an air pressure source (not shown) via a pipe line 10.

  An internal space 8 of the annular seal member 3 communicates with an air pressure source (not shown) via a pipe line 5. The height of the annular seal member 3 is changed by the pressure in the internal space 8 of the annular seal member 3 and the force applied to the annular seal member 3 via the photomask 6.

  Pins 12 provided on a frame 11 attached to the outer peripheral edge of the photomask 6 so that the corresponding positional relationship on the plane does not change between the photomask 6 and the substrate 1 even if the height of the photomask 6 changes. A rectilinear guide member composed of a hole 13 provided in the substrate support 2 is provided.

  Exposure is performed as follows. First, as shown in FIG. 8, the internal space 8 of the annular seal member 3 is set to a negative pressure to reduce its height so that it does not come into contact with the photomask 6. In this state, the ring-shaped alignment mark 15 attached to the substrate 1 and the circular alignment mark 16 attached to the photomask 6 (FIG. 11) are read by the CCD camera 9. Based on the read data, either one of the photomask 6 and the substrate 1 is moved in the XYθ direction to align the both.

  Next, as shown in FIG. 9, the photomask 6 is brought close to the substrate 1, and the internal space 8 of the annular seal member 3 is set to atmospheric pressure or positive pressure to bring the annular seal member 3 and the photomask 6 into contact with each other. By making the closed space 7 formed in this way a negative pressure, the photomask 6 is brought into contact with or in close contact with the entire surface of the substrate 1.

  In the stage of setting the closed space 7 to a negative pressure, inward lateral force acts on the annular seal member 3 in addition to the force from above through the photomask 6. Since the closed space 7 is surrounded by the substantially rectangular annular seal member 3, a pressure difference occurs depending on the location during decompression. Then, a lateral force that moves the photomask 6 relative to the substrate 1 acts on the annular seal member 3. Further, the annular seal member 3 made of a continuous elastic material does not deform strictly uniformly when receiving a force. Further, the frictional force at the contact portion between the photomask 6 and the annular seal member 3 is not strictly uniform. Due to these factors, the photomask 6 tends to be displaced laterally relative to the substrate 1 in the process of bringing the photomask 6 into contact with the substrate 1.

  The linear guide member described above provides a certain degree of suppressing effect against such lateral displacement. However, considering that there is a slight gap between the pin 12 and the hole 13 constituting the rectilinear guide member and that the structural member such as the pin 12 that receives the lateral force is slightly bent, It is impossible to prevent a lateral shift of several μm to several tens of μm between the photomask 6 and the substrate 1.

  In recent years, it has been required to faithfully transfer a high-definition pattern to a substrate by high-precision alignment. Accordingly, it has become unacceptable that the photomask and the substrate after alignment are shifted from several μm to several tens of μm in the horizontal direction.

  Therefore, the problem to be solved by the present invention is to reduce the lateral deviation between the two, which has conventionally occurred when the photomask is brought into contact with the substrate, as much as possible.

In order to solve the above problems, according to the present invention,
An exposure method in which a photomask on which a pattern is drawn and a substrate having a photosensitive layer formed on the surface are arranged in an overlapping manner, and the substrate is irradiated with light through the photomask to transfer the pattern to the substrate,
Hold the substrate on the substrate support,
A photomask is held at a position covering the substrate, and a space having an open periphery is formed between the substrate and the photomask,
Creating an air flow around the substrate to guide the air in the space outward from the open environment, thereby creating a negative pressure in the space;
An exposure method is provided in which a photomask is brought into contact with a substrate by the action of the negative pressure.

  The air flow may be a flow of air from a pressure source that takes in air in the space by being ejected outward from the plurality of nozzles provided around the substrate.

  Alternatively, the air flow may be a flow of air from the space that is sucked into a plurality of suction ports that are provided around the substrate and communicate with a negative pressure source.

  The photomask may be sequentially brought into contact from the center portion to the peripheral portion of the substrate while the height position for holding the photomask is brought close to the substrate continuously or stepwise.

According to the invention,
An exposure apparatus for transferring a pattern onto a substrate by arranging a photomask on which a pattern is drawn and a substrate on which a photosensitive layer is formed in an overlapping manner and irradiating the substrate with light through the photomask,
A substrate support for holding the substrate;
A photomask holding member for holding a photomask at a position covering the substrate, and forming a space having an open periphery between the substrate and the photomask;
A plurality of air circulation ports provided around the substrate;
A pressure source communicating with the air circulation port, and a pressure source for generating an air flow for guiding the air in the space outward from the open surroundings through the air circulation port,
An exposure apparatus in which the air in the space is led from the open periphery to the outside by the air flow to cause a negative pressure in the space, and the photomask contacts the substrate by the action of the negative pressure. Is also provided.

  The pressure source is a pressure source, the air circulation port is a nozzle that ejects pressurized air toward the outside of the space, and the air ejected from the nozzle forms the air flow, Air in the space may be taken in.

  Alternatively, the pressure source is a negative pressure source, the air circulation port is a suction port for sucking air in the space, and the air in the space sucked into the suction port forms the air flow. It may be.

  The photomask holding member can be adjusted in height with respect to the substrate.

  In the present invention, the use of the annular seal member that has caused the lateral displacement of the photomask has been eliminated. Thereby, in the process of bringing the photomask into uniform contact over the entire surface of the substrate after alignment, the lateral displacement of the photomask was minimized. As a result, it is possible to perform highly accurate alignment and transfer a high-definition pattern.

  The exposure apparatus according to one embodiment of the present invention shown in FIGS. 1 to 5 includes a substrate support 17 for holding the substrate 1 and a photomask holding member 19 for holding the photomask 6. A pattern 14 to be transferred to the substrate 1 is drawn on the photomask 6. A frame 18 is attached to the outer peripheral edge of the photomask 6. The height of the photomask holding member 19 can be adjusted, and the photomask 6 is held via the frame 18. A photosensitive layer is formed on the surface (upper surface) of the substrate 1. The substrate 1 is held on the substrate support 17 by the suction holes 4 to which negative pressure is applied. As shown in FIG. 1, a space 27 having an open periphery is formed between the substrate 1 and the photomask 6 held at a position covering the substrate 1.

  In the state shown in FIG. 1, the ring-shaped alignment mark 15 attached to the substrate 1 and the circular alignment mark 16 attached to the photomask 6 (FIG. 5) are read by the CCD camera 9. The photomask 6 and the substrate 1 are aligned by moving either the photomask 6 or the substrate 1 in the XYθ direction based on the read data. After the alignment is completed, the photomask 6 is brought into contact with the surface of the substrate 1 by applying a negative pressure in the space 27 formed between the substrate 1 and the photomask 6 as described later.

  The exposure apparatus of the present invention further includes a plurality of air circulation ports provided around the substrate 1 and a pressure source communicating with the air circulation ports. In the embodiment shown in FIGS. 1 to 5, the air circulation port is the nozzle 21 facing outward from the space 27, and the pressure source is a pressurizing source (not shown). As shown in FIG. 5, the plurality of nozzles 21 are arranged at equal intervals along the periphery of the substrate 1. Each nozzle 21 may be formed integrally with the substrate support base 17 or may be made separately and incorporated into the substrate support base 17.

  When the pressurizing source communicating with the nozzle 21 is operated, the compressed air reaches the nozzle 21 through the pipe line 20 and is guided to the inclined portion 22 formed on the substrate support base 17 toward the outside of the space 27. As a result, the air flow 23 is ejected (FIG. 4). The nozzle 21 and the inclined portion 22 constitute an ejector. The air in the space 27 becomes an air flow 24 taken into the air flow 23 to be ejected, and is guided outward from the open periphery of the space 27. As a result, the space 27 gradually becomes negative pressure.

  When the pressure in the space 27 becomes negative, the photomask 6 held by the photomask holding member 19 via the frame 18 gradually comes into contact with the surface of the substrate 1 from the center (FIG. 2). The photomask 6 is moved from the central portion to the peripheral portion of the substrate 1 by gradually lowering the height of the photomask holding member 19 continuously or stepwise while proceeding with the operation of creating a negative pressure in the space 27. Sequential contact is made over the entire surface (FIG. 3).

  In order to recover the air flow 23 ejected from the nozzle 21 and the air flow 24 guided outwardly from the space 27 in the process of creating a negative pressure in the space 27, an opening (not shown) is formed on the outer periphery of the substrate support base 17. And the opening may be communicated with a negative pressure source. In this case, scattering of the surrounding garbage due to the air flow is effectively prevented.

  FIG. 6 shows an exposure apparatus having another form of ejector. As shown in detail in FIG. 4, the ejector in the exposure apparatus described above is configured by the inclined portion 22 and the nozzle 21 formed on the substrate support base 17, but in the embodiment of FIG. 6, the inclined nozzle The ejector is comprised only by 21a. In this embodiment, the surface of the substrate support 17 around the opening end of the inclined nozzle 21a is flat. The nozzles 21a may be provided in a plurality of rows so as to correspond to substrates having different sizes. In FIG. 6, the nozzles 21 a in the inner row for accommodating a relatively small substrate are indicated by a two-dot chain line.

  Further, a linear guide member (see FIG. 1) constituted by a pin 12 and a hole 13 which have been conventionally used may be used in the exposure apparatus of the present invention.

  In the state where the substrate 1 and the photomask 6 are arranged in contact or in close contact with each other as described above, the light 29 is irradiated to the substrate 1 through the photomask 6, whereby the pattern 14 drawn on the photomask 6 is formed on the substrate. 1 can be transferred.

  FIG. 7 shows another embodiment for generating a negative pressure in the space 27. In this embodiment, the air circulation port which was the nozzle 21 in the above-described embodiment is formed integrally with the substrate support base 25 as the suction port 28 for sucking the air in the space 27, and the pipe line 26 is formed. A pressure source that communicates with the suction port 28 via the negative pressure source (not shown). In this embodiment, the air in the space 27 sucked into the suction port 28 itself forms an air flow for guiding the air in the space 27 outward from the open periphery. The suction port 28 may be made separately and incorporated into the substrate support base 25.

  In addition, a plurality of suction ports 28 may be provided so as to correspond to substrates having different sizes.

  As a configuration for generating a negative pressure in the space 27, the embodiment shown in FIGS. 1 to 6 and the embodiment shown in FIG. 7 may be used in combination.

  In the exposure apparatus and the exposure method according to the present invention, the space formed between the substrate and the photomask is not a space closed by the seal member, but the periphery is open. Therefore, high negative pressure cannot be set in the space. However, when a substrate having a relatively flat surface is used, it is possible to obtain a negative pressure sufficient to uniformly contact or closely contact the substrate and the photomask.

  Note that the light irradiated to the substrate through the photomask at the time of exposure is preferably parallel light with good light quality.

It is a schematic sectional drawing of the exposure apparatus by one Embodiment of this invention. The state before making the negative pressure in the space between a board | substrate and a photomask is shown. FIG. 2 is a view similar to FIG. 1 but showing a state in which a negative pressure is started in the space between the substrate and the photomask. FIG. 3 is a view similar to FIG. 1 and FIG. 2, but shows a state in which an exposure operation is performed with the substrate and the photomask in contact or in close contact with each other. FIG. 2 is an enlarged cross-sectional view of a portion surrounded by a circle A in FIG. 1. It is a top view of the exposure apparatus shown in FIG. It is a schematic sectional drawing of the exposure apparatus which has another nozzle form. It is a schematic sectional drawing of the exposure apparatus by another embodiment of this invention. A state before the negative pressure is applied in the space between the substrate and the photomask is shown, and the photomask holding member is not shown. It is a schematic sectional drawing of the conventional exposure apparatus. The state which aligns between a board | substrate and a photomask is shown. FIG. 9 is a view similar to FIG. 8, but showing a state in which a closed space is formed between the substrate and the photomask to create a negative pressure in the closed space. FIG. 10 is a view similar to FIG. 8 and FIG. 9, but shows a state in which an exposure operation is performed with the substrate and the photomask in contact or in close contact with each other. It is a top view of the conventional exposure apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 board | substrate, 2 board | substrate support stand, 3 annular seal member, 4 suction hole, 5 pipe line, 6 photomask, 7 closed space, 8 internal space of annular seal member, 9 CCD camera, 10 pipe line, 11 frame of photomask , 12 pins (straight guide member), 13 holes (straight guide member), 14 patterns, 15 alignment mark, 16 alignment mark, 17 substrate support base, 18 photomask frame, 19 photomask holding member, 20 pipeline , 21 Nozzle, 21a Nozzle, 22 Inclined portion, 23 Air flow, 24 Air flow, 25 Substrate support, 26 Pipe line, 27 Space between substrate and photomask, 28 Suction hole, 29 Light.

Claims (8)

An exposure method in which a photomask on which a pattern is drawn and a substrate having a photosensitive layer formed on the surface are arranged in an overlapping manner, and the substrate is irradiated with light through the photomask to transfer the pattern to the substrate,
Hold the substrate on the substrate support,
A photomask is held at a position covering the substrate, and a space having an open periphery is formed between the substrate and the photomask,
Creating an air flow around the substrate to guide the air in the space outward from the open environment, thereby creating a negative pressure in the space;
An exposure method comprising contacting a photomask with a substrate by the action of the negative pressure. 2. The exposure method according to claim 1, wherein the air flow is from a pressurized source that takes in air in the space by being ejected from a plurality of nozzles provided around the substrate toward the outside of the space. An exposure method that is a flow of air. 2. The exposure method according to claim 1, wherein the air flow is a flow of air from the space sucked into a plurality of suction ports provided around the substrate and communicating with a negative pressure source. Method. 4. The exposure method according to claim 1, wherein the photomask is sequentially brought into contact from the central portion to the peripheral portion of the substrate while the height position for holding the photomask is brought close to the substrate continuously or stepwise. Finally, the exposure method. An exposure apparatus for transferring a pattern onto a substrate by arranging a photomask on which a pattern is drawn and a substrate on which a photosensitive layer is formed in an overlapping manner and irradiating the substrate with light through the photomask,
A substrate support for holding the substrate;
A photomask holding member for holding a photomask at a position covering the substrate, and forming a space having an open periphery between the substrate and the photomask;
A plurality of air circulation ports provided around the substrate;
A pressure source communicating with the air circulation port, and a pressure source for generating an air flow for guiding the air in the space outward from the open surroundings through the air circulation port,
An exposure apparatus in which the air in the space is led from the open periphery to the outside by the air flow to cause a negative pressure in the space, and the photomask contacts the substrate by the action of the negative pressure. . 6. The exposure apparatus according to claim 5, wherein the pressure source is a pressurizing source, and the air circulation port is a nozzle that ejects pressurized air toward the outside of the space, and the air ejected from the nozzle. Forming the air flow, and the air in the space is taken into the air flow. 6. The exposure apparatus according to claim 5, wherein the pressure source is a negative pressure source, the air circulation port is a suction port that sucks air in the space, and the space in the space is sucked into the suction port. An exposure apparatus in which air forms the air flow. 8. The exposure apparatus according to claim 5, wherein the height of the photomask holding member is adjustable with respect to the substrate.

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