SU578170A1 - Apparatus for soldering with solder jet - Google Patents

Apparatus for soldering with solder jet

Info

Publication number
SU578170A1
SU578170A1 SU7602376307A SU2376307A SU578170A1 SU 578170 A1 SU578170 A1 SU 578170A1 SU 7602376307 A SU7602376307 A SU 7602376307A SU 2376307 A SU2376307 A SU 2376307A SU 578170 A1 SU578170 A1 SU 578170A1
Authority
SU
USSR - Soviet Union
Prior art keywords
soldering
protective fluid
bath
stand
drain
Prior art date
Application number
SU7602376307A
Other languages
Russian (ru)
Inventor
Виктор Борисович Аршинов
Дамир Харисович Аюкасов
Original Assignee
Уфимский Приборостроительный Завод Им.В.И.Ленина
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Уфимский Приборостроительный Завод Им.В.И.Ленина filed Critical Уфимский Приборостроительный Завод Им.В.И.Ленина
Priority to SU7602376307A priority Critical patent/SU578170A1/en
Application granted granted Critical
Publication of SU578170A1 publication Critical patent/SU578170A1/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Description

Работает устройство следующим образом.The device works as follows.

На поверхность расплавленното припо  3 налит слой защитной жидкости 2. Нагнетательный узел 11 подает из ванны 1 припой 3 в сопло 12. Струйка чистой защитной жидкости из емкости 4 стекает на поверхность припо , защища  его от окислени .A layer of protective fluid 2 is poured onto the surface of the molten solder 3. The injection unit 11 supplies solder 3 from the bath 1 to the nozzle 12. A clean liquid protective jet from the tank 4 flows to the solder surface, protecting it from oxidation.

Избыточный загр зненный слой защитной жидкости и щлам, образуюихийс  при пайке изделий, нереливаетс  через верхний край сто ка н уноситс  в бак 10 дл  сбора.The excess contaminated layer of protective fluid and the slots formed during soldering of the products are not radiated over the top edge of the wall one hundred to the collection tank 10.

Дл  того чтобы полностью слить защитную жидкость с новерхности прино  (при замене жидкости носле ее отработки в течение 4- 5 часов или неред сливом припо  из ванны дл  его рафинировани ) втулку 7 необходнмо развернуть на сто ке 6 до совмещени  вырезов 8 н 9. Защитна  жидкость через вырезы 8 и 9 устремитс  по отверстию сто ка вниз в бак 10 дл  сбора жидкости н щлама.In order to completely drain the protective liquid from the surface of the prio (when replacing the liquid after it was used for 4–5 hours or not to drain the solder from the bath to refine it), the sleeve 7 must be turned on stand 6 until the cut-outs 8 n 9 coincide. through the notches 8 and 9, it rushes along the opening of the stand down into the tank 10 to collect the liquid and slit.

Такое вьшолнение конструкнин улучшает удобства Обслуживапи , а Процесс ведени  слива жидкости улучп1ает услови  труда, кроме того, повышаетс  техника безонасиости. Such an design improves the convenience of the Service, and the process of managing the discharge of liquid improves working conditions, in addition, the safety-free technique is improved.

4four

Claims (2)

1.Устройство дл  пайки струей припо , содержащее ванну с расплавленным припоем, расположенное в ванне сопло, насос дл  подачи прило  в сопло, приспособление дл  подачи защитной жидкости и сток дл  слива избыточной защитной жидкости, отличающеес  тем, что, с целью удалени  защитной жидкости, с новерхности нрипо  самотеком, сто к снабжен поворотной втулкой, установленной в зоне защитной жидкости, при этом в сто ке н поворот ой втулке выполнены вырезы , глубиной не :меньще толщины защитной жидкости.1. A soldering device for soldering, comprising a bath with molten solder, a nozzle disposed in the bath, a pump for supplying an applicator to the nozzle, a device for supplying a protective fluid and a drain for draining excess protective fluid, characterized in that From the bottom of the rim, by gravity, it is equipped with a rotatable bushing installed in the protective fluid zone, while notches with a depth not smaller than the thickness of the protective fluid are made in the stand of the bushing. 2.Устройство но п. 1, отличающеес  тем, что, с целью регулировани  глубины слива занщтной жидкости, вырезы в сто ке и поворотной втулке выполнены наклонными к оси.2. A device according to claim 1, characterized in that, in order to regulate the depth of the drain of the liquid, the notches in the stand and the rotary sleeve are inclined to the axis. Источиики информации, Прин тые во внимание лри экспертизеSources of information taken into account 1.Авторское свидетельство СССР Лд 299313, кл. В 23К 3/06, 1970.1. Authors certificate of the USSR Ld 299313, cl. In 23K 3/06, 1970. 2.Патент США J 3752383, кл. В 23К 1/08, 1973.2. US Patent J 3752383, cl. In 23K 1/08, 1973. о Ю about u -/1-/one Фиъ.ЗFi.Z
SU7602376307A 1976-06-18 1976-06-18 Apparatus for soldering with solder jet SU578170A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU7602376307A SU578170A1 (en) 1976-06-18 1976-06-18 Apparatus for soldering with solder jet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU7602376307A SU578170A1 (en) 1976-06-18 1976-06-18 Apparatus for soldering with solder jet

Publications (1)

Publication Number Publication Date
SU578170A1 true SU578170A1 (en) 1977-10-30

Family

ID=20667025

Family Applications (1)

Application Number Title Priority Date Filing Date
SU7602376307A SU578170A1 (en) 1976-06-18 1976-06-18 Apparatus for soldering with solder jet

Country Status (1)

Country Link
SU (1) SU578170A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5209389A (en) * 1992-02-26 1993-05-11 Digital Equipment Corporation Solder pump bushing seal
DE4136804A1 (en) * 1991-11-08 1993-05-13 Ernst Hohnerlein Soldering installation - has oxide formation prevented by a jacket around the pump shaft

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4136804A1 (en) * 1991-11-08 1993-05-13 Ernst Hohnerlein Soldering installation - has oxide formation prevented by a jacket around the pump shaft
DE4136804C2 (en) * 1991-11-08 2001-01-25 Seho Systemtechnik Gmbh Soldering device
US5209389A (en) * 1992-02-26 1993-05-11 Digital Equipment Corporation Solder pump bushing seal

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