SU570465A1 - Beryllium soldering method - Google Patents

Beryllium soldering method

Info

Publication number
SU570465A1
SU570465A1 SU7502178740A SU2178740A SU570465A1 SU 570465 A1 SU570465 A1 SU 570465A1 SU 7502178740 A SU7502178740 A SU 7502178740A SU 2178740 A SU2178740 A SU 2178740A SU 570465 A1 SU570465 A1 SU 570465A1
Authority
SU
USSR - Soviet Union
Prior art keywords
beryllium
soldering method
coating
titanium
heated
Prior art date
Application number
SU7502178740A
Other languages
Russian (ru)
Inventor
Виктор Сергеевич Горелов
Михаил Аркадьевич Комаров
Original Assignee
Предприятие П/Я А-1147
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я А-1147 filed Critical Предприятие П/Я А-1147
Priority to SU7502178740A priority Critical patent/SU570465A1/en
Application granted granted Critical
Publication of SU570465A1 publication Critical patent/SU570465A1/en

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  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)

Description

лаждение в контейнере. После этого детали разбираютс  и протираютс  бензином дл  удалени  шлака. Подготовленные таким образом детали собираютс  через фольгу толщиной 0,1-0,2 мм из припо  системы алюминий-бериллий-титан-магний и па ютс  по режиму: температура 980-f-1000°C, выдержка 15 мин, вакуум 5-10- - 5-10-5 j р. ст., охлаждение в контейнере.lodgement in a container. After that, the parts are disassembled and rubbed with gasoline to remove slag. The parts prepared in this way are collected through a 0.1-0.2 mm thick foil from an aluminum-beryllium-titanium-magnesium solder system and are dried in a mode: temperature 980-f-1000 ° C, holding for 15 minutes, vacuum 5-10- - 5-10-5 j p. Art., cooling in the container.

Полученные по указанному процессу па ные соединени  имеют прочность g 20 кгс/мм и обладают герметичностью и вакуумной плотностью.The soldered joints obtained according to the indicated process have a strength of g 20 kgf / mm and have an airtightness and vacuum density.

Применение способа высокотемпературной пайки металлокерамического берилли  позвол ет снизить трудоемкость процесса пайки за счет его упрощени , уменьшает расходы благодар  применению менее дефицитных и дорогосто щих материалов, повышает надежность работы па ных узлов в коррозионном отношении . The use of the method of high-temperature brazing of cermet beryllium reduces the laboriousness of the brazing process due to its simplification, reduces costs due to the use of less scarce and expensive materials, and increases the reliability of the solder joints in terms of corrosion.

Claims (1)

Формула изобретени Invention Formula Способ пайки берилли , при котором на па емую поверхность нанос т покрытие, размещают припой и нагревают до температуры пайки, ртлич. ающийс  тем, что, с целью улучшени  очистки па емой поверхности, в качестве покрыти  берут титан и перед размещением припо  изделие совместно с покрытием нагревают до образовани  жидкой фазы при взаимодействии титана с бериллием, а затем охлаждают.A soldering method of beryllium, in which a coating is applied to the surface, is placed in a solder and heated to the soldering temperature, rtlich. In order to improve the cleaning of the soldered surface, titanium is taken as a coating and, prior to placement, the primer is co-heated with the coating to form a liquid phase when titanium interacts with beryllium and then cooled.
SU7502178740A 1975-10-06 1975-10-06 Beryllium soldering method SU570465A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU7502178740A SU570465A1 (en) 1975-10-06 1975-10-06 Beryllium soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU7502178740A SU570465A1 (en) 1975-10-06 1975-10-06 Beryllium soldering method

Publications (1)

Publication Number Publication Date
SU570465A1 true SU570465A1 (en) 1977-08-30

Family

ID=20633778

Family Applications (1)

Application Number Title Priority Date Filing Date
SU7502178740A SU570465A1 (en) 1975-10-06 1975-10-06 Beryllium soldering method

Country Status (1)

Country Link
SU (1) SU570465A1 (en)

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