SU453818A3 - ALUMINUM SOLDER SOLUTION - Google Patents

ALUMINUM SOLDER SOLUTION

Info

Publication number
SU453818A3
SU453818A3 SU1725550A SU1725550A SU453818A3 SU 453818 A3 SU453818 A3 SU 453818A3 SU 1725550 A SU1725550 A SU 1725550A SU 1725550 A SU1725550 A SU 1725550A SU 453818 A3 SU453818 A3 SU 453818A3
Authority
SU
USSR - Soviet Union
Prior art keywords
aluminum
soldering
aluminum solder
solder solution
solder
Prior art date
Application number
SU1725550A
Other languages
Russian (ru)
Original Assignee
Иностранцы Хайнц Шоер , Вернер Шультце
Иностранна фирма Ферайнигте Алюминиум Верке ФРГ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Иностранцы Хайнц Шоер , Вернер Шультце, Иностранна фирма Ферайнигте Алюминиум Верке ФРГ filed Critical Иностранцы Хайнц Шоер , Вернер Шультце
Application granted granted Critical
Publication of SU453818A3 publication Critical patent/SU453818A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • B23K35/288—Al as the principal constituent with Sn or Zn
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Description

Изобретение относитс  к области пайки, в частности-ПК составу припо  дл  пайк-и алюмиНИЯ .This invention relates to the field of soldering, in particular PC composition of solder for soldering and aluminum.

Известен припой дл  пайки алюмини , предст-авл ющий (ообой сплав .на основе оистем ы а л 1ОМИ1НИЙ-к р eMiHri i и.There is a known solder for aluminum soldering, which is represented (by the type of alloy based on the systems of the OMNI-K p eMiHri i and.

Дл  :0беопечвн:и  бесфлюсово пайки алю|-Мини  ,в состав припо  ВВОД51т элементы, выбраииые из 1труппы 1В ИСмут, .стронций, , сурьма в количестве 0,01 - 10 вес. %, при этом остальные компоненты берут в следуюпд,ем соотношении , вес. %: кремний-4-20, алюминий- остальное.For: 0funded: and flux-free soldering al | -Mini, in the composition of solder INPUT 51t elements selected from group 1B Ismut, .strontium,, antimony in an amount of 0.01 - 10 weight. %, while the remaining components are taken in the following ratio, eat ratio, weight. %: silicon-4-20, aluminum - the rest.

Пайка с иснользованием ггредложсипого припо  может протекать в неокнслителыюй атмосфере 1ил,и же в -атмосфере с НизКИм содержаНием кислорода.Soldering with the use of dry soldering iron can proceed in the neil atmosphere 1il, and in the atmosphere with a low oxygen content.

Температура плавлени  припо  составл ет 590-605°С.The melting point of the solder is 590-605 ° C.

Доба-вка в п-р1}1пой висмута, странци , , сурьмы обеспечивает проведение naiHvH без флюса и -позвол ет сишз-ить поверхностное пат же-ние «а граеице между расплавленным nipinnoBM и ооновны.м материалом, существе-нно улучша  смачиваемость па емой поверхности .The addition of bismuth, country, antimony to p-p1}, provides for carrying out naiHvH without flux and allows sishz-sit surface pat- ternation “and the grains between the molten nipinnoBM and UNON material, significantly improving the wettability of pas surface area.

Припой .может использоватьс  пр-:и пайке -в ииде прутков, стержией, а также na-:HeceiMii iM в виде пла-к ироваН1НОго сло  -и т. д.Solder. Can be used for the pr-: and soldering -in the bars, rod, and na-: HeceiMii iM in the form of flat H.NOH layer, etc.

1,051.05

Висмут римеои Bismuth rimeoi

0,07 Марга нец 0,03 Магний Железо 0,63 0,04 0.07 Marga natz 0.03 Magnesium Iron 0.63 0.04

Т ИТа:Н 0,18 T ITA: H 0.18

Медь 0,11 Цинк Остальное АлюминийCopper 0.11 Zinc Else Aluminum

ример 4.Example 4.

8,1 8.1

Крем1 1ий 2,. 13 Барий 0,76 Стронцнй р1И ме;аи Cream1 1st 2 ,. 13 Barium 0.76 Strontium p1I me; ai

0,05 Mapraineu 0,02 Малший 0,49 Железо 0,02 Тит аи 0,13 Медь 0,09 LiiiiHiK Остальное Алю:м,итий0.05 Mapraineu 0.02 Minor 0.49 Iron 0.02 Titanium 0.13 Copper 0.09 LiiiiHiK Else Alu: m, itium

ример 5.Example 5.

15,8 15.8

Кремший 1,11 Сурьма Kremshy 1,11 Antimony

1,37 Барий .м&он 1.37 Barium .m &

0,03 Марганец 0,04 Магний0.03 Manganese 0.04 Magnesium

Железо Iron

0,41 Титаи 0,03 Медь 0,03 Цинк 0,18 0.41 Titanium 0.03 Copper 0.03 Zinc 0.18

АлЮМ;ИИ1ИЙ ОстальноеALUM; II1I Else

ри1мер 6.size 6.

Кремний Silicon

16,5 Барий ,78 р И1меои Mapraineu 16.5 Barium, 78 p I1meoi Mapraineu

0,03 Марний 0,03 Железо 0,43 0,03 Титан Медь 0,13 ЦшнгК 0,17 Алюм.и.ний Остальное0.03 Marnium 0.03 Iron 0.43 0.03 Titanium Copper 0.13 CshngK 0.17 Alum. And. Rest

Предмет и з о б р е т е и и  Subject and d on and e and

ПрилОЙ дл  пайки алюмини , содержащий алю1миний, «реМ1Ний, отличающийс  тем, что, с целью обеспечени  бесфлюсовой иайки алюмини  в его состав ввод т элементы, выбранные ИЗ пруПпы иисмут, строНЦий, барий, сурьма в количестве 0,01 -10 вес. %, при этом остальные комноненты берут в следующем соотношении , вес. % :APPLICATION for aluminum soldering, containing aluminum, is a “reMiNi”, characterized in that, in order to provide flux-free aluminum ionic, elements chosen from the foil are included in the composition from 0.01 to 10% by weight. %, while the remaining components are taken in the following ratio, weight. %:

Кремний4-20Silicon4-20

30 АлюминийОстальное30 Aluminum Else

SU1725550A 1969-12-15 1970-12-14 ALUMINUM SOLDER SOLUTION SU453818A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962760A DE1962760C3 (en) 1969-12-15 1969-12-15 Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum

Publications (1)

Publication Number Publication Date
SU453818A3 true SU453818A3 (en) 1974-12-15

Family

ID=5753892

Family Applications (2)

Application Number Title Priority Date Filing Date
SU1725153A SU532324A3 (en) 1969-12-15 1970-12-14 Solder for soldering aluminum
SU1725550A SU453818A3 (en) 1969-12-15 1970-12-14 ALUMINUM SOLDER SOLUTION

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SU1725153A SU532324A3 (en) 1969-12-15 1970-12-14 Solder for soldering aluminum

Country Status (5)

Country Link
AT (1) AT299647B (en)
DE (1) DE1962760C3 (en)
GB (1) GB1333030A (en)
SU (2) SU532324A3 (en)
ZA (1) ZA708097B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2335940B2 (en) * 1973-07-14 1975-06-12 Vereinigte Aluminium-Werke Ag, 5300 Bonn Use of a solder alloy
US3853547A (en) * 1973-05-25 1974-12-10 Reynolds Metals Co Brazing materials
US4039298A (en) * 1976-07-29 1977-08-02 Swiss Aluminium Ltd. Aluminum brazed composite
JPS60250893A (en) * 1984-05-25 1985-12-11 Sumitomo Light Metal Ind Ltd Aluminum alloy brazing filler metal for heat exchanger made of aluminum
DE4217122A1 (en) * 1992-05-23 1993-11-25 Mahle Gmbh Coilable aluminium@ alloy wire - contains silicon or nickel and is drawn from metal-sprayed starting material
EP1462207A1 (en) 2003-03-29 2004-09-29 Grillo-Werke AG Welding, soldering or brazing method under a protective atmosphere of metallic workpieces using a Zn/Al filler material
CN102209629A (en) † 2008-11-10 2011-10-05 阿勒里斯铝业科布伦茨有限公司 Process for fluxless brazing of aluminium and brazing sheet for use therein
CN102554491B (en) * 2011-12-14 2014-03-05 河南科技大学 Zn (zinc) based high-temperature lead-free soft solder and preparation method for same
MX2014014444A (en) * 2012-05-31 2015-09-08 Gränges Sweden Ab Multilayer aluminium brazing sheet for fluxfree brazing in controlled atmosphere.
CN103143854B (en) * 2013-02-25 2015-04-22 大连理工大学 Welding material for connection of magnesium/aluminum heterogeneous metal and preparation method thereof
CN111331278B (en) * 2020-03-26 2021-08-03 中机智能装备创新研究院(宁波)有限公司 High-corrosion-resistance Zn-Al solder powder, solder paste and preparation method

Also Published As

Publication number Publication date
DE1962760A1 (en) 1971-07-29
AT299647B (en) 1972-06-26
DE1962760B2 (en) 1972-01-20
DE1962760C3 (en) 1980-04-03
ZA708097B (en) 1971-08-25
GB1333030A (en) 1973-10-10
SU532324A3 (en) 1976-10-15

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