DE1962760C3 - Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum - Google Patents

Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum

Info

Publication number
DE1962760C3
DE1962760C3 DE1962760A DE1962760A DE1962760C3 DE 1962760 C3 DE1962760 C3 DE 1962760C3 DE 1962760 A DE1962760 A DE 1962760A DE 1962760 A DE1962760 A DE 1962760A DE 1962760 C3 DE1962760 C3 DE 1962760C3
Authority
DE
Germany
Prior art keywords
aluminum
flux
soldering
vacuum
inert gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1962760A
Other languages
German (de)
Other versions
DE1962760B2 (en
DE1962760A1 (en
Inventor
Heinz Dipl.-Ing. 5301 Alfter Schoer
Werner Dr.-Ing. 5300 Bonn Schultze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vereinigte Aluminium Werke AG
Original Assignee
Vereinigte Aluminium Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE758884D priority Critical patent/BE758884A/en
Application filed by Vereinigte Aluminium Werke AG filed Critical Vereinigte Aluminium Werke AG
Priority to DE1962760A priority patent/DE1962760C3/en
Priority to GB1776473A priority patent/GB1333030A/en
Priority to AT986070A priority patent/AT299647B/en
Priority to CH1256172A priority patent/CH555216A/en
Priority to CH1656170A priority patent/CH538325A/en
Priority to DK576370A priority patent/DK132868C/en
Priority to FR7041153A priority patent/FR2072194A5/fr
Priority to NO04483/70A priority patent/NO130098B/no
Priority to GB5653370A priority patent/GB1328642A/en
Priority to ZA708097*A priority patent/ZA708097B/en
Priority to SE16683/70A priority patent/SE362375B/xx
Priority to LU62217D priority patent/LU62217A1/xx
Priority to SU1725153A priority patent/SU532324A3/en
Priority to SU1725550A priority patent/SU453818A3/en
Priority to NLAANVRAGE7018270,A priority patent/NL170707C/en
Priority to CA100,643A priority patent/CA964082A/en
Priority to JP45111355A priority patent/JPS504466B1/ja
Publication of DE1962760A1 publication Critical patent/DE1962760A1/en
Publication of DE1962760B2 publication Critical patent/DE1962760B2/en
Priority to US00285100A priority patent/US3811177A/en
Priority to CA158,737A priority patent/CA965995A/en
Priority to NO486573A priority patent/NO133022C/no
Priority to US05/729,039 priority patent/US4121750A/en
Priority to US05/836,766 priority patent/US4173302A/en
Priority to US05/853,768 priority patent/US4241148A/en
Application granted granted Critical
Publication of DE1962760C3 publication Critical patent/DE1962760C3/en
Priority to US06/661,281 priority patent/US4905887A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • B23K35/288—Al as the principal constituent with Sn or Zn
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Description

Die Erfindung betrifft die Verwendung eines Lotes zum flußmittelfreien Hartlöten von Aluminiumwerkstoffen in nichtoxidJerender Atmosphäre.The invention relates to the use of a solder for flux-free brazing of aluminum materials in a non-oxidizing atmosphere.

Beim Löten von Aluminium und Aluminiumlegierungen besteht ein v. esentliches Problem darin, daß der Werkstoff infolge der stets auf der Oberfläche vorhandenen und sehr zähen Oxidhaut vom schmelzflüssigen Lot in nicht ausreichendem Maße benetzt wird. Diese Oxidhaut ist zwar dünn, aber dicht und stabil, bildet sich nach ihrer Beseitigung, z. B. durch Beizen, spontan neu und verstärkt sich außerdem während des Lötvorganges, sofern dieser unter oxydierender Atmosphäre (z. B. Luft) durchgeführt wird. Abgesehen von den Sonderverfahren des Reib- und Ultraschallötens war es daher beim Löten von Aluminium bisher erforderlich, die Oxidhaut an der Verbindungsstelle durch die Anwendung von Flußmitteln zu beseitigen und außerdem die Lötstelle vor erneuter Oxydation zu schützen. Ferner werden den Flußmitteln zum Teil noch Metallsalze, ζ. B. Zinksalz, beigefügt, die zu Metallab-Scheidungen an der Verbindungsstelle und damit zu einer Verbesserung der Benetzungsverhältnisse führen. Die für das Löten von Aluminium geeigneten Flußmittel enthalten im allgemeinen Chloride bzw. Fluoride, beim Weichlöten zum Teil auch rein organische Verbindungen. Alle Flußmittel weisen jedoch den Nachteil auf. daß sie korrodierend wirken — meist sogar in starkem Maße - und ihre Rückstände daher beseitigt werden müssen. Außerdem besteht die Gefahr von Flußmitteleinschlüssen an der Lötstelle. Die Flußmittelrückstände und Flußmitteleinschlüsse beeinträchtigen die Korrosionsbeständigkeit der gelöteten Teile in starkem Maße, besonders wenn Feuchtigkeit auf die Lötstelle einwirken kann. Die Beseitigung der Flußmittekeste ist kostenintensiv und wird zudem meist nicht vollständig erreicht. Das Löten ohne Flußmittel erbringt daher wesentliche technische und wirtschaftliche Vorteile.When soldering aluminum and aluminum alloys, there is a v. The main problem is that the Material as a result of always being on the surface existing and very tough oxide skin is not sufficiently wetted by the molten solder. Although this oxide skin is thin, it is dense and stable. B. by pickling, spontaneously new and also intensifies during the soldering process, provided this is in an oxidizing atmosphere (e.g. air) is carried out. Apart from the special processes of friction and ultrasonic soldering it was therefore previously necessary when soldering aluminum to remove the oxide skin at the connection point to be eliminated by the use of flux and also to prevent renewed oxidation of the soldered joint protection. In addition, some metal salts are added to the fluxes, ζ. B. zinc salt, added, which lead to metal deposits at the connection point and thus lead to an improvement in the wetting conditions. The fluxes suitable for soldering aluminum generally contain chlorides or fluorides Soft soldering partly also purely organic compounds. However, all fluxes have the disadvantage. that they have a corrosive effect - usually even to a great extent - and their residues are therefore removed have to. There is also the risk of flux inclusions at the soldering point. The flux residues and flux inclusions impair the corrosion resistance of the soldered parts to a large extent, especially if moisture acts on the soldered joint can. The elimination of the mid-river estates is cost-intensive and is usually not fully achieved. Soldering without flux therefore yields significant technical and economic advantages.

Durch die deutsche Patentschrift 8 96 444 aus dem Jahre 1941 ist zwar bereits ein Lot. bestehend aus Fein/ink und Reinstaluminium, zum Ixiten von Alumini um und Aluminiumlegierungen bekannt, dem unter anderem bis zu 1% Antimon und/oder bis zu 1% Wismut zugesetzt werden können, aber nach dem damaligen Stand der Technik wurde bei der Benutzung solcher Lote die Verwendung eines Flußmittels für unbedingt erforderlich gehallen. Dies zeigt auch die britische Patentschrift 7 47 813 aus den Jahren 1951/52, die bei der Verwendung von gegebenenfalls unter »nderem je 0,25 bis 5% Antimon und/oder Wismut enthaltenden Zink-Aluminium-Lolen (Anspruch 8) die gleichzeitige Anwendung von speziellen Flußmitteln mit Zusätzen vöfi MetällsalZen fördert. Due to the German patent specification 8 96 444 from 1941 there is already a lot. consisting of fine / ink and pure aluminum, known for Ixiten of aluminum and aluminum alloys, to which, among other things, up to 1% antimony and / or up to 1% bismuth can be added, but according to the state of the art at the time, such solders were used the use of a flux was deemed essential. This is also shown by British patent specification 7 47 813 from the years 1951/52, which, when using zinc-aluminum lozenges (claim 8), possibly containing 0.25 to 5% antimony and / or bismuth, allows simultaneous use promotes special fluxes with additives vöfi metal salts.

Der Erfindung liegt die Aufgabe zugrunde, ein Lot zum flußmittelfreien Löten von Aluminiumwerkstoffen zu schaffen, das mit Sicherheit ein flußmittelfreies Löten erlaubt und keine Reinstmetalle erfordert. The invention is based on the object of creating a solder for flux-free soldering of aluminum materials , which certainly allows flux-free soldering and does not require any high-purity metals.

Dies wird erfindungsgemäß dadurch erreicht, daß ein Lot aus 4 bis 20% Silicium und aus je 0,01 bis 2% Wismut, Strontium, Barium und/oder Antimon, Rest Aluminium und herstellungsbedingte Verunreinigungen, in nichtoxidierender Atmosphäre verwendet wird.According to the invention, this is achieved by using a solder made from 4 to 20% silicon and from 0.01 to 2% each. Bismuth, strontium, barium and / or antimony, remainder Aluminum and manufacturing impurities, is used in a non-oxidizing atmosphere.

Versuche haben ergeben, daß bei Anwendung des erfindungsgemäflen Lotes keine über das Übliche hinausgehende Maßnahmen bei der Vorbehandlung des Werkstoffes notwendig sind. Besonders vorteilhaft ist es, wenn an der Lötstelle eine nicht oxydierende Atmosphäre eingehalten wird. Zum Beispiel kann ein inertes Lötschutzgas, beispielsweise Schweißargon, Stickstoff handelsüblicher Qualität, Formiergas oder Ammoniak, oder aber ein niedriges Vakuum von z. B. 10 -' bis 10 Torr angewendet werden.Tests have shown that when the solder according to the invention is used, none is above the usual additional measures are necessary for the pretreatment of the material. Is particularly advantageous if a non-oxidizing atmosphere is maintained at the soldering point. For example, a inert soldering shielding gas, for example welding argon, nitrogen of commercial quality, forming gas or Ammonia, or a low vacuum of z. B. 10- 'to 10 Torr can be used.

Zudem haben die Versuche gezeigt, daß das erfindungsgemäße Lot nicht nur die Viskosität und Oberflächenspannung des schmelzflüssigen Lotes, sondern gleichzeitig auch die Grenzflächenspannung zwischen geschmolzenem Lot und festem Grundwerkstoff in starkem Maße herabsetzen und damit die Benetzungsverhältnisse wesentlich verbessern.In addition, the tests have shown that the solder according to the invention not only the viscosity and Surface tension of the molten solder, but also the interfacial tension between molten solder and solid base material to a great extent and thus reduce the Significantly improve wetting conditions.

Lote mit den beanspruchten Zusätzen können in allen handelsüblichen Formen, wie z.B. Drähte, Stäbe, Formteile, Folien, Lotplattierungen usw. verwendet werden.Solders with the claimed additives can be used in all commercially available forms, such as wires, rods, Moldings, foils, solder plating, etc. are used.

Ausführungsbeispiele für Lotzusammensetzungen mit üblichen BeimengungenExemplary embodiments for solder compositions with the usual additions

Beispiel 1example 1

SiliciumSilicon Beispiel 2Example 2 SiliciumSilicon Beispiel 3Example 3 SiliciumSilicon 11,7%11.7% Manganmanganese Manganmanganese Manganmanganese 0,09%0.09% Magnesiummagnesium Magnesiummagnesium Magnesiummagnesium 0,03%0.03% Eiseniron Eiseniron Eiseniron 0,35%0.35% Titantitanium Titantitanium Titantitanium 0,02%0.02% Kupfercopper Kupfercopper Kupfercopper 0,02%0.02% Zinkzinc Zinkzinc Zinkzinc 0,05%0.05% Wismutbismuth Wismutbismuth Wismutbismuth 0,15%0.15% Rest AluminiumRemainder aluminum Antimonantimony Rest AluminiumRemainder aluminum Rest AluminiumRemainder aluminum 123%123% 0,07%0.07% 0.02%0.02% 0.25%0.25% 0,01%0.01% 0,01%0.01% 0.04%0.04% 0,50%0.50% OJ1%OJ1% 7,2%7.2% 0,07%0.07% 0,03%0.03% 0,63%0.63% 0,04%0.04% 0,18%0.18% 0,11%0.11% 1,95%1.95%

Beispiel 4Example 4

SiliciumSilicon

Manganmanganese

Magnesiummagnesium

Eiseniron

Titantitanium

Kupfercopper

Zinkzinc

Antimonantimony

Bariumbarium

Rest AluminiumRemainder aluminum

Beispiel 5Example 5

Silicium
Mangan
Magnesium
EisenSilicon
manganese
magnesium
iron

Titantitanium

15,8% 0,03% 0,04% 0,41% 0,03% 0,11% 0,18% 1,11% 1.37%15.8% 0.03% 0.04% 0.41% 0.03% 0.11% 0.18% 1.11% 1.37%

16,5% 0,03% 0,03% 0,43% 0,03% Kupfer16.5% 0.03% 0.03% 0.43% 0.03% copper

Zinkzinc

Bariumbarium

Rest AluminiumRemainder aluminum

0,130/0
0,17%
1,78%0.130 / 0
0.17%
1.78%

Die Lötversuche wurden mit Reinaluminium- und AIuminium-Mangan-Biechen und Loten mit den in den vorstehenden Beispielen angeführten Zusammensetzungen im elektrisch beheizten Ofen durchgeführt DieThe soldering tests were carried out with pure aluminum and aluminum-manganese brackets and solders with the The above examples performed compositions in an electrically heated oven

to Versuche, bei denen erfindungsgemäß ohne Zusatz von Flußmitteln gelöst wurde, erfolgten unter einer Schutzgasatmosphäre, wie z.B. Argon und Stickstoff. Die Löttemperatur lag dabei zwischen 590 und 6050C, die L-^tzeit betrug jeweils 2 Minuten. Bei allen Lötversuchen konnten einwandfreie Lötungen erzielt werden.Attempts in which the invention was carried out without the addition of fluxes were carried out under a protective gas atmosphere, such as argon and nitrogen. The soldering temperature here was 590 to 605 0 C, the L ^ Ttime was 2 minutes each. Flawless soldering could be achieved in all soldering attempts.

Im Gegensatz dazu ergab sich keine Lötung bei Verwendung des handelsüblichen Lotes L-AlSi J 2 ohne die beanspruchten Zusätze, wenn kein Flußmittel benutzt wurde. Auch ein Rütteln der Probe während desIn contrast, there was no soldering when using the commercially available solder L-AlSi J 2 without the claimed additives when no flux was used. Also shaking the sample during the

2Q Lötvorganges erbrachte kein besseres Ergebnis.2Q soldering process did not produce a better result.

Claims (1)

Patentanspruch:Claim: Verwendung eines Lotes zum flußmittelfreien Hartlöten von Aluminiumwerkstoffen in Schutzgas, Inertgas oder Vakuum, dadurch gekennzeichnet, daß es aus 4 bis 20% Silicium und aus je 0,01 bis 2% Wismut, Strontium, Barium und/oder Antimon, Rest Aluminium und herstellungsbedingte Verunreinigungen, bestehtUse of a solder for flux-free brazing of aluminum materials in protective gas, Inert gas or vacuum, characterized in that that it consists of 4 to 20% silicon and 0.01 to 2% each of bismuth, strontium, barium and / or Antimony, the remainder aluminum and production-related impurities
DE1962760A 1969-12-15 1969-12-15 Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum Expired DE1962760C3 (en)

Priority Applications (25)

Application Number Priority Date Filing Date Title
BE758884D BE758884A (en) 1969-12-15 PROCESS FOR BRAZING ALUMINUM AND ITS ALLOYS
DE1962760A DE1962760C3 (en) 1969-12-15 1969-12-15 Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum
GB1776473A GB1333030A (en) 1969-12-15 1970-04-14 Method of brazing aluminium and aluminium alloys
AT986070A AT299647B (en) 1969-12-15 1970-11-02 Flux-free soldering of aluminum materials
CH1256172A CH555216A (en) 1969-12-15 1970-11-09 SOLDER FOR FLUX-FREE SOLDERING OF ALUMINUM MATERIALS.
CH1656170A CH538325A (en) 1969-12-15 1970-11-09 Solder for flux-free soldering of aluminum materials
DK576370A DK132868C (en) 1969-12-15 1970-11-13 SOLDER FOR FLUSE-FREE SOLDERING OF ALUMINUM MATERIAL
FR7041153A FR2072194A5 (en) 1969-12-15 1970-11-17
NO04483/70A NO130098B (en) 1969-12-15 1970-11-23
GB5653370A GB1328642A (en) 1969-12-15 1970-11-27 Method of brazing aluminium and aluminium alloys
ZA708097*A ZA708097B (en) 1969-12-15 1970-11-30 A method of soldering aluminium and aluminium alloys
SE16683/70A SE362375B (en) 1969-12-15 1970-12-09
LU62217D LU62217A1 (en) 1969-12-15 1970-12-10
SU1725153A SU532324A3 (en) 1969-12-15 1970-12-14 Solder for soldering aluminum
SU1725550A SU453818A3 (en) 1969-12-15 1970-12-14 ALUMINUM SOLDER SOLUTION
NLAANVRAGE7018270,A NL170707C (en) 1969-12-15 1970-12-15 METHOD FOR FLUID-FREE SOLDERING OF ALUMINUM MATERIALS
CA100,643A CA964082A (en) 1969-12-15 1970-12-15 Process and solder for soldering aluminum-containing work-pieces
JP45111355A JPS504466B1 (en) 1969-12-15 1970-12-15
US00285100A US3811177A (en) 1969-12-15 1972-08-29 Process for brazing workpieces of aluminum containing material
CA158,737A CA965995A (en) 1969-12-15 1972-12-13 Process and solder for soldering aluminium-containing work-pieces
NO486573A NO133022C (en) 1969-12-15 1973-12-19
US05/729,039 US4121750A (en) 1969-12-15 1976-10-04 Processes for soldering aluminum-containing workpieces
US05/836,766 US4173302A (en) 1969-12-15 1977-09-26 Process and alloy for brazing aluminum-containing articles
US05/853,768 US4241148A (en) 1969-12-15 1977-11-21 Composite aluminum-containing workpieces
US06/661,281 US4905887A (en) 1969-12-15 1984-10-16 Process for soldering aluminum containing workpieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962760A DE1962760C3 (en) 1969-12-15 1969-12-15 Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum

Publications (3)

Publication Number Publication Date
DE1962760A1 DE1962760A1 (en) 1971-07-29
DE1962760B2 DE1962760B2 (en) 1972-01-20
DE1962760C3 true DE1962760C3 (en) 1980-04-03

Family

ID=5753892

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1962760A Expired DE1962760C3 (en) 1969-12-15 1969-12-15 Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum

Country Status (5)

Country Link
AT (1) AT299647B (en)
DE (1) DE1962760C3 (en)
GB (1) GB1333030A (en)
SU (2) SU532324A3 (en)
ZA (1) ZA708097B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2335940B2 (en) * 1973-07-14 1975-06-12 Vereinigte Aluminium-Werke Ag, 5300 Bonn Use of a solder alloy
US3853547A (en) * 1973-05-25 1974-12-10 Reynolds Metals Co Brazing materials
US4039298A (en) * 1976-07-29 1977-08-02 Swiss Aluminium Ltd. Aluminum brazed composite
JPS60250893A (en) * 1984-05-25 1985-12-11 Sumitomo Light Metal Ind Ltd Aluminum alloy brazing filler metal for heat exchanger made of aluminum
DE4217122A1 (en) * 1992-05-23 1993-11-25 Mahle Gmbh Coilable aluminium@ alloy wire - contains silicon or nickel and is drawn from metal-sprayed starting material
EP1462207A1 (en) 2003-03-29 2004-09-29 Grillo-Werke AG Welding, soldering or brazing method under a protective atmosphere of metallic workpieces using a Zn/Al filler material
EP2382087B2 (en) † 2008-11-10 2020-11-04 Aleris Rolled Products Germany GmbH Process for fluxless brazing of aluminium and brazing sheet for use therein
CN102554491B (en) * 2011-12-14 2014-03-05 河南科技大学 Zn (zinc) based high-temperature lead-free soft solder and preparation method for same
PL2855063T5 (en) 2012-05-31 2023-02-20 Gränges Sweden Ab Multilayer aluminium brazing sheet for fluxfree brazing in controlled atmosphere
CN103143854B (en) * 2013-02-25 2015-04-22 大连理工大学 Welding material for connection of magnesium/aluminum heterogeneous metal and preparation method thereof
CN111331278B (en) * 2020-03-26 2021-08-03 中机智能装备创新研究院(宁波)有限公司 High-corrosion-resistance Zn-Al solder powder, solder paste and preparation method

Also Published As

Publication number Publication date
ZA708097B (en) 1971-08-25
SU532324A3 (en) 1976-10-15
SU453818A3 (en) 1974-12-15
DE1962760B2 (en) 1972-01-20
DE1962760A1 (en) 1971-07-29
AT299647B (en) 1972-06-26
GB1333030A (en) 1973-10-10

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