FR2220879B1
(ja )
1978-01-06
DK0551382T3
(da )
2002-04-15
Halvlederchipenheder, fremgangsmåder til fremstilling deraf og komponenter dertil
KR930001365A
(ko )
1993-01-16
복합 플립 칩 반도체 소자와 그 제조 및 번-인(burning-in) 방법
GB1276095A
(en )
1972-06-01
Microcircuits and processes for their manufacture
GB1492478A
(en )
1977-11-23
Electrical circuitry packages
KR930006870A
(ko )
1993-04-22
플립-칩 (Flip-Chip) 장착 방법을 위한 반도체 패키지
GB1373008A
(en )
1974-11-06
Electronic components
IL102269A
(en )
1997-03-18
Integrated socket-type package for flip chip semiconductor devices and circuits
DE3482719D1
(de )
1990-08-23
Halbleiterelement und herstellungsverfahren.
KR940012578A
(ko )
1994-06-23
반도체장치
US4295182A
(en )
1981-10-13
Interconnection arrangements for testing microelectronic circuit chips on a wafer
JPS5553446A
(en )
1980-04-18
Container of electronic component
US3558994A
(en )
1971-01-26
Electrical component supporting structure with improved mounting and electrical connector means
US3371148A
(en )
1968-02-27
Semiconductor device package and method of assembly therefor
SU265203A1
(ja )
1973-10-26
JPS57176738A
(en )
1982-10-30
Connecting structure for flip chip
GB1223705A
(en )
1971-03-03
Semiconductor devices
JPS5732661A
(en )
1982-02-22
Module of semiconductor element having high density
GB1143531A
(ja )
US3504098A
(en )
1970-03-31
Printed circuit panel
KR850005166A
(ko )
1985-08-21
반도체 장치와 이의 제조방법
US3440716A
(en )
1969-04-29
Miniaturized electrical circuits
US3684931A
(en )
1972-08-15
Semiconductor device with coplanar electrodes also overlying lateral surfaces thereof
GB1369995A
(en )
1974-10-09
Electrical connecting devices
JPS62134945A
(ja )
1987-06-18
モ−ルドトランジスタ