SU153826A1 - - Google Patents
Info
- Publication number
- SU153826A1 SU153826A1 SU782482A SU782482A SU153826A1 SU 153826 A1 SU153826 A1 SU 153826A1 SU 782482 A SU782482 A SU 782482A SU 782482 A SU782482 A SU 782482A SU 153826 A1 SU153826 A1 SU 153826A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- flux
- soldering
- glycerin
- diethylamine
- hydrochloric acid
- Prior art date
Links
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 230000004907 flux Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 235000011187 glycerol Nutrition 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- HDITUCONWLWUJR-UHFFFAOYSA-N diethylazanium;chloride Chemical compound [Cl-].CC[NH2+]CC HDITUCONWLWUJR-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU153826A1 true SU153826A1 (enrdf_load_html_response) |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104520062B (zh) | 高温无铅焊料合金 | |
| CN101204762B (zh) | 铝及铝合金用软钎焊金属置换型无铅焊助焊剂 | |
| CN104972242B (zh) | 一种铝/钢熔钎焊用自钎剂药芯焊丝 | |
| WO2013132942A1 (ja) | 接合方法、接合構造体およびその製造方法 | |
| CN108326465A (zh) | 高强度无银无铅焊锡 | |
| JP6349615B1 (ja) | はんだ合金、はんだ接合材料及び電子回路基板 | |
| CN104023902B (zh) | Sn-Cu系无铅焊料合金 | |
| US20120199393A1 (en) | Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part | |
| JPWO2014084242A1 (ja) | 低融点ろう材 | |
| JP2013000744A (ja) | 鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部 | |
| CN112453752A (zh) | 一种无铅低温锡基合金焊片 | |
| SU153826A1 (enrdf_load_html_response) | ||
| CN111230355A (zh) | 用于取代Sn-Pb合金、SAC305、Sn-Cu和Sn100C的无铅焊料合金 | |
| CN103484720A (zh) | 一种易熔合金和运用该易熔合金的温度保险丝 | |
| JP7357227B2 (ja) | 鉛フリーはんだ合金 | |
| Dzivy et al. | Influence of multiple reflows and surface finishes on solder joint resistivity | |
| WO2014142153A1 (ja) | はんだ接合物及びはんだ接合方法 | |
| JP6427752B1 (ja) | はんだ合金、はんだ接合材料及び電子回路基板 | |
| CN100488703C (zh) | 一种铜粉增强的锡锌复合钎料及其制备方法 | |
| SU318450A1 (ru) | ФЛЮС ДЛЯ ПАЙКИ м гкими ПРИПОЯМИ | |
| TWI345502B (enrdf_load_html_response) | ||
| SU248468A1 (ru) | Припой для пайки меди и ее сплавов | |
| KR950011322B1 (ko) | 솔더링 합금 | |
| CN101497153A (zh) | 锡铜锑无铅钎料 | |
| RU2705190C1 (ru) | Водорастворимый флюс для пайки |