SU132722A1 - Method of soldering electrode pins of semiconductor devices - Google Patents
Method of soldering electrode pins of semiconductor devicesInfo
- Publication number
- SU132722A1 SU132722A1 SU650337A SU650337A SU132722A1 SU 132722 A1 SU132722 A1 SU 132722A1 SU 650337 A SU650337 A SU 650337A SU 650337 A SU650337 A SU 650337A SU 132722 A1 SU132722 A1 SU 132722A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- semiconductor devices
- electrode pins
- soldering electrode
- electrode
- soldering
- Prior art date
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Description
Существующие способы припайки электродных выводов не обеспечивают достаточной автоматизации процесса пайки.Existing methods of electrode electrode soldering do not provide sufficient automation of the soldering process.
Предлагаемый способ отличаетс от известных тем, что облегчает автоматизацию процесса пайки. Это достигаетс подачей нагревател совместно с электродами и регулировкой размеров капли припо давлением в расплаве.The proposed method differs from the known ones in that it facilitates the automation of the soldering process. This is achieved by supplying the heater together with the electrodes and adjusting the size of the solder drop by pressure in the melt.
Электродна проволока / (см. чертеж) сматываетс с катушки 2 и, проход через подающее устройство 3, поступает в нагреватель 4. Подающее устройство зажимает проволоку, а затем вместе с нагревателем начинает свое движение к электродной капле 5 на полупроводниковом приборе. Как только конец электродно|й проволоки коснулс капли, подающее устройство останавливаетс , а нагреватель продолжает движение до тех пор, пока его гор чий конец с выступающим но кра м электрода через зазор 6 расплавленным припоем не коснетс капли полупроводникового прибора и не расплавит ее. После этого, нагреватель уходит от капли, а проволока, зажата подающим устройством, остаетс неподвижной . Когда капл остынет и электрод окажетс припа нным, нагреватель и подающее устройство отход т еще дальще назад, а полупроводниковый прибор с к Ском припа нной проволоки отрезаетс . Затем цикл повтор етс . Размер капли регулируетс приспособлением (например , гидравлическим), с помощью которого измен етс величина гидростатического давлени Р расплавленного припо 7. От вытекани припой удерживаетс силами поверхностного нат жени в капилл рах устройства.The electrode wire / (see drawing) is unwound from the coil 2 and the passage through the feeding device 3 enters the heater 4. The feeding device clamps the wire and then, together with the heater, begins its movement to the electrode drop 5 on the semiconductor device. As soon as the end of the electrode wire touches the drops, the feeder stops and the heater continues moving until its hot end with the protruding butt edge of the electrode through the gap 6 with molten solder does not touch the drops of the semiconductor device and melts it. After that, the heater leaves the drop, and the wire, clamped by the feeding device, remains stationary. When the droplet cools down and the electrode proves to be soldered, the heater and the feeding device go back further, and the semiconductor device with the Cf of the soldered wire is cut off. Then the cycle is repeated. The size of the droplet is regulated by a device (for example, hydraulic), by means of which the hydrostatic pressure P of the molten solder 7 is varied. From flowing out, the solder is kept by surface tension in the capillaries of the device.
На чертеже показана припайка одновременно к двум капл м.The drawing shows soldering to two drops simultaneously.
Предмет изобретени Subject invention
Способ припайки электродных выводов полупроводниковь Х приборов , отличающийс тем, что, с целью облегчени автоматизации процесса пайки, нагреватель подают совместно с припаеваемым концомThe method of soldering the electrode leads of semiconductor X devices, characterized in that, in order to facilitate the automation of the soldering process, the heater is supplied together with the soldered end
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU650337A SU132722A1 (en) | 1960-01-12 | 1960-01-12 | Method of soldering electrode pins of semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU650337A SU132722A1 (en) | 1960-01-12 | 1960-01-12 | Method of soldering electrode pins of semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
SU132722A1 true SU132722A1 (en) | 1960-11-30 |
Family
ID=48403746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU650337A SU132722A1 (en) | 1960-01-12 | 1960-01-12 | Method of soldering electrode pins of semiconductor devices |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU132722A1 (en) |
-
1960
- 1960-01-12 SU SU650337A patent/SU132722A1/en active
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