SI0802266T1 - Process for manufacturing inductive payment systems - Google Patents

Process for manufacturing inductive payment systems

Info

Publication number
SI0802266T1
SI0802266T1 SI9630244T SI9630244T SI0802266T1 SI 0802266 T1 SI0802266 T1 SI 0802266T1 SI 9630244 T SI9630244 T SI 9630244T SI 9630244 T SI9630244 T SI 9630244T SI 0802266 T1 SI0802266 T1 SI 0802266T1
Authority
SI
Slovenia
Prior art keywords
payment systems
inductive payment
manufacturing inductive
manufacturing
electroconductive substrate
Prior art date
Application number
SI9630244T
Other languages
English (en)
Inventor
Franz Dipl-Ing Kohnle
Meyer Heinrich Dipl-Chem Dr
Desmaison Gonzalo Urrutia D Dr
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SI0802266T1 publication Critical patent/SI0802266T1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • General Factory Administration (AREA)
  • Chemically Coating (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Credit Cards Or The Like (AREA)
  • Catalysts (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
SI9630244T 1996-04-17 1996-04-17 Process for manufacturing inductive payment systems SI0802266T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP96106010A EP0802266B1 (fr) 1996-04-17 1996-04-17 Procédé de fabrication de moyens de paiement inductifs

Publications (1)

Publication Number Publication Date
SI0802266T1 true SI0802266T1 (en) 2001-02-28

Family

ID=8222675

Family Applications (1)

Application Number Title Priority Date Filing Date
SI9630244T SI0802266T1 (en) 1996-04-17 1996-04-17 Process for manufacturing inductive payment systems

Country Status (14)

Country Link
US (1) US6120672A (fr)
EP (1) EP0802266B1 (fr)
JP (1) JP2000511657A (fr)
CN (1) CN1071804C (fr)
AT (1) ATE195154T1 (fr)
BR (1) BR9706567B1 (fr)
CA (1) CA2228611A1 (fr)
DE (1) DE59605676D1 (fr)
ES (1) ES2149401T3 (fr)
GR (1) GR3034310T3 (fr)
HK (1) HK1017387A1 (fr)
SI (1) SI0802266T1 (fr)
TW (1) TW337012B (fr)
WO (1) WO1997039163A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100373405C (zh) * 2003-02-19 2008-03-05 中兴通讯股份有限公司 一种网卡封装结构装置及其封装方法
DE102004004128A1 (de) * 2004-01-28 2005-08-18 Deutsche Telekom Ag Verfahren zum Entwerten von Chipkarten und Chipkarten hierzu
FR3004735B1 (fr) * 2013-04-23 2015-07-03 Dourdin Procede de vernissage de pieces metallisees

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
US5158860A (en) * 1990-11-01 1992-10-27 Shipley Company Inc. Selective metallization process

Also Published As

Publication number Publication date
EP0802266B1 (fr) 2000-08-02
DE59605676D1 (de) 2000-09-07
JP2000511657A (ja) 2000-09-05
WO1997039163A1 (fr) 1997-10-23
EP0802266A1 (fr) 1997-10-22
HK1017387A1 (en) 1999-11-19
ATE195154T1 (de) 2000-08-15
BR9706567B1 (pt) 2009-05-05
ES2149401T3 (es) 2000-11-01
GR3034310T3 (en) 2000-12-29
TW337012B (en) 1998-07-21
CA2228611A1 (fr) 1997-10-23
BR9706567A (pt) 1999-07-20
CN1198782A (zh) 1998-11-11
US6120672A (en) 2000-09-19
CN1071804C (zh) 2001-09-26

Similar Documents

Publication Publication Date Title
WO1999010916A3 (fr) Depot autocatalytique de cuivre sur une surface titanee
TW344897B (en) A process for forming gate oxides possessing different thicknesses on a semiconductor substrate
AU2835195A (en) Method of making activated carbon having dispersed catalyst
EP0779612A4 (fr) Substrat de disque magnetique, disque magnetique et procede de production de substrats de disques magnetiques
TW344892B (en) Method of forming a semiconductor metallization system and structure therefor
EP0603849A3 (fr) Procédé pour fabriquer un substrat semi-conducteur utilisant un procédé de bonding, et substrat semi-conducteur fabriqué par ce procédé.
GR3003228T3 (en) Process and installation for applying an insulating multilayer refractory coating, and coating so obtained
WO1997034459A3 (fr) Procede de formation d'une couche metallique a la surface d'un element destinee a menager un blindage contre les rayonnements electromagnetiques
TW351770B (en) Shield layer, method for forming shield layer and producing substrate
EP0350206A3 (fr) Procédé de préparation d'articles en matière plastique conductrice de l'électricité
SI0802266T1 (en) Process for manufacturing inductive payment systems
AU4772499A (en) Process for the preliminary treatment of a metallic workpiece before coating
EP0657923A3 (fr) Méthode de protection d'une bille de soudure lors d'un procédé d'attaque, par application d'une résine autour de la base de la bille de soudure.
EP0642148A3 (fr) Procédé de gravure, dispositif de sélection de couleurs et procédé de fabrication.
EP0708581A3 (fr) Procédé de dépÔt sans courant de métal sur un substrat
TW373260B (en) Method and equipment for etching semiconductor substrate
EP0666592A3 (fr) Procédé de fabrication d'une couche diélectrique sur une couche de métal à genid de fusion élevé.
EP1431413A3 (fr) Système protégé, comprenant un boitier recouvert par un métal à nombre atomique élevé, appliqué par pulvérisation thermique
EP0785917A4 (fr) Procede de traitement d'un revetement antireflet sur un substrat
TW337610B (en) Structure with reduced stress between a spin-on-glass layer and a metal layer and process for producing the same
TW353814B (en) Metallic wiring substrate and producing method thereof
TW430693B (en) Currentless metallisation process for non electroconductive substrates
EP0629110A3 (fr) Procédé de formation d'un motif conducteur sur un substrat.
KR960008525B1 (en) Manufacturing method of metal wiring layer pattern
FI19992235A (fi) Menetelmä alkuaineohutkalvojen kasvattamiseksi