HK1017387A1 - Process for manufacturing inductive counting systems - Google Patents

Process for manufacturing inductive counting systems

Info

Publication number
HK1017387A1
HK1017387A1 HK99102104A HK99102104A HK1017387A1 HK 1017387 A1 HK1017387 A1 HK 1017387A1 HK 99102104 A HK99102104 A HK 99102104A HK 99102104 A HK99102104 A HK 99102104A HK 1017387 A1 HK1017387 A1 HK 1017387A1
Authority
HK
Hong Kong
Prior art keywords
counting systems
manufacturing inductive
manufacturing
inductive counting
electroconductive substrate
Prior art date
Application number
HK99102104A
Other languages
English (en)
Inventor
Franz Kohnle
Heinrich Meyer
Desmaison Gonzalo Urrutia
Original Assignee
Autotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Autotech Deutschland Gmbh filed Critical Autotech Deutschland Gmbh
Publication of HK1017387A1 publication Critical patent/HK1017387A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • General Factory Administration (AREA)
  • Chemically Coating (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Catalysts (AREA)
  • Credit Cards Or The Like (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
  • Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
HK99102104A 1996-04-17 1999-05-11 Process for manufacturing inductive counting systems HK1017387A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP96106010A EP0802266B1 (de) 1996-04-17 1996-04-17 Verfahren zur Herstellung von induktiv arbeitenden Zählsystemen
PCT/EP1997/000845 WO1997039163A1 (de) 1996-04-17 1997-02-21 Verfahren zur herstellung von induktiv arbeitenden zählsystemen

Publications (1)

Publication Number Publication Date
HK1017387A1 true HK1017387A1 (en) 1999-11-19

Family

ID=8222675

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99102104A HK1017387A1 (en) 1996-04-17 1999-05-11 Process for manufacturing inductive counting systems

Country Status (14)

Country Link
US (1) US6120672A (xx)
EP (1) EP0802266B1 (xx)
JP (1) JP2000511657A (xx)
CN (1) CN1071804C (xx)
AT (1) ATE195154T1 (xx)
BR (1) BR9706567B1 (xx)
CA (1) CA2228611A1 (xx)
DE (1) DE59605676D1 (xx)
ES (1) ES2149401T3 (xx)
GR (1) GR3034310T3 (xx)
HK (1) HK1017387A1 (xx)
SI (1) SI0802266T1 (xx)
TW (1) TW337012B (xx)
WO (1) WO1997039163A1 (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100373405C (zh) * 2003-02-19 2008-03-05 中兴通讯股份有限公司 一种网卡封装结构装置及其封装方法
DE102004004128A1 (de) * 2004-01-28 2005-08-18 Deutsche Telekom Ag Verfahren zum Entwerten von Chipkarten und Chipkarten hierzu
FR3004735B1 (fr) * 2013-04-23 2015-07-03 Dourdin Procede de vernissage de pieces metallisees
FR3122885A1 (fr) * 2021-05-11 2022-11-18 Plastiques Du Val De Loire Procédé de fabrication d’un décor métallisé sur un substrat galvanisable

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
US5158860A (en) * 1990-11-01 1992-10-27 Shipley Company Inc. Selective metallization process

Also Published As

Publication number Publication date
GR3034310T3 (en) 2000-12-29
CN1071804C (zh) 2001-09-26
ATE195154T1 (de) 2000-08-15
WO1997039163A1 (de) 1997-10-23
EP0802266B1 (de) 2000-08-02
BR9706567A (pt) 1999-07-20
TW337012B (en) 1998-07-21
EP0802266A1 (de) 1997-10-22
JP2000511657A (ja) 2000-09-05
CA2228611A1 (en) 1997-10-23
ES2149401T3 (es) 2000-11-01
DE59605676D1 (de) 2000-09-07
CN1198782A (zh) 1998-11-11
US6120672A (en) 2000-09-19
BR9706567B1 (pt) 2009-05-05
SI0802266T1 (en) 2001-02-28

Similar Documents

Publication Publication Date Title
BR9503615A (pt) Processo de fabricação de catalisador suportado de carbono ativado e catalisador suportado ativado feito pelo dito processo
WO1999010916A3 (en) Copper electroless deposition on a titanium-containing surface
EP1073106A3 (en) Method for reducing oxidation of an interface of a semiconductor device and resulting device
TW344897B (en) A process for forming gate oxides possessing different thicknesses on a semiconductor substrate
WO2001099173A3 (en) Method of treating a substrate
EP0603849A3 (en) A method for manufacturing a semiconductor substrate using a bonding method, and a semiconductor substrate made by this method.
TW345742B (en) Method for producing integrated circuit capacitor
TW351770B (en) Shield layer, method for forming shield layer and producing substrate
WO1997034459A3 (en) Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation
AU3800495A (en) Process for coating electrically non-conducting surfaces with connected metal structures
HK1017387A1 (en) Process for manufacturing inductive counting systems
TW200520655A (en) Method for forming metal wire by microdispensing
AU4772499A (en) Process for the preliminary treatment of a metallic workpiece before coating
EP0642148A3 (en) Etching process, color selection device and manufacturing process.
BR0012474A (pt) Revestimentos de metal-aluminìdio nobres de uma etapa
TW373260B (en) Method and equipment for etching semiconductor substrate
DE69314090D1 (de) Ionenselektieve Elektrode und Verfahren zur Herstellung derselben
TW337610B (en) Structure with reduced stress between a spin-on-glass layer and a metal layer and process for producing the same
TW353814B (en) Metallic wiring substrate and producing method thereof
EP0736369A4 (en) METALIZED FIBER REINFORCED ROLLER AND THEIR PRODUCTION
TW430693B (en) Currentless metallisation process for non electroconductive substrates
EP0629110A3 (en) Process for forming a conductive pattern on a substrate.
WO2000004209A3 (de) Verfahren zur beschichtung von körpern aus leichtmetallen oder leichtmetallegierungen mittels plasmaunterstützung
EP0599658A3 (en) Process for the preparation of 6-beta, 14-alpha-dihydroxy-4-androstene-3,17-dione.
FI19992235A (fi) Menetelmä alkuaineohutkalvojen kasvattamiseksi

Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100221