SG97910A1 - Resin-sealing apparatus - Google Patents

Resin-sealing apparatus

Info

Publication number
SG97910A1
SG97910A1 SG200004368A SG200004368A SG97910A1 SG 97910 A1 SG97910 A1 SG 97910A1 SG 200004368 A SG200004368 A SG 200004368A SG 200004368 A SG200004368 A SG 200004368A SG 97910 A1 SG97910 A1 SG 97910A1
Authority
SG
Singapore
Prior art keywords
resin
sealing apparatus
sealing
Prior art date
Application number
SG200004368A
Other languages
English (en)
Inventor
Tawara Masato
Ebara Toshiyuki
Hatakawa Kazuhiko
Ito Sadayuki
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of SG97910A1 publication Critical patent/SG97910A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG200004368A 1999-08-09 2000-08-04 Resin-sealing apparatus SG97910A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11225525A JP2001047458A (ja) 1999-08-09 1999-08-09 樹脂封止装置

Publications (1)

Publication Number Publication Date
SG97910A1 true SG97910A1 (en) 2003-08-20

Family

ID=16830682

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200004368A SG97910A1 (en) 1999-08-09 2000-08-04 Resin-sealing apparatus

Country Status (4)

Country Link
US (1) US6457963B1 (ja)
JP (1) JP2001047458A (ja)
KR (1) KR20010021240A (ja)
SG (1) SG97910A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7660621B2 (en) 2000-04-07 2010-02-09 Medtronic, Inc. Medical device introducer
US6902569B2 (en) 2000-08-17 2005-06-07 Image-Guided Neurologics, Inc. Trajectory guide with instrument immobilizer
US7704260B2 (en) 2002-09-17 2010-04-27 Medtronic, Inc. Low profile instrument immobilizer
US7636596B2 (en) 2002-12-20 2009-12-22 Medtronic, Inc. Organ access device and method
US7896889B2 (en) 2003-02-20 2011-03-01 Medtronic, Inc. Trajectory guide with angled or patterned lumens or height adjustment
WO2005079903A2 (en) 2004-02-13 2005-09-01 Medtronic, Inc. Methods and apparatus for securing a therapy delivery device within a burr hole
US7497863B2 (en) 2004-12-04 2009-03-03 Medtronic, Inc. Instrument guiding stage apparatus and method for using same
US7744606B2 (en) 2004-12-04 2010-06-29 Medtronic, Inc. Multi-lumen instrument guide
JP3786946B1 (ja) 2005-01-24 2006-06-21 株式会社三井ハイテック 永久磁石の樹脂封止方法
US7653984B2 (en) * 2006-01-11 2010-02-02 Mitsui High-Tec, Inc. Method of resin sealing permanent magnets in laminated rotor core
JP2007243146A (ja) * 2006-02-09 2007-09-20 Sharp Corp 半導体装置の製造方法、および、半導体装置の製造装置
US8443607B2 (en) * 2009-02-20 2013-05-21 General Electric Company Coaxial fuel and air premixer for a gas turbine combustor
US8453454B2 (en) 2010-04-14 2013-06-04 General Electric Company Coannular oil injection nozzle

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222326A (ja) * 1983-06-02 1984-12-14 Matsushita Electronics Corp 樹脂封止装置
JPH0351111A (ja) * 1989-07-19 1991-03-05 Matsushita Electron Corp 樹脂封止装置
JPH11191563A (ja) * 1997-12-26 1999-07-13 Hitachi Ltd モールド方法および装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2738551A (en) * 1952-04-26 1956-03-20 Glaskyd Inc Transfer molding method
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
EP0070320A4 (en) * 1981-01-26 1985-03-06 Dai Ichi Seiko Co Ltd MOLDING AND SEALING APPARATUS.
KR100199261B1 (ko) * 1990-04-27 1999-06-15 가나이 쓰도무 반도체장치 및 그 제조방법 그리고 그것에 사용되는 성형장치
US5204127A (en) * 1991-05-10 1993-04-20 Composite Products, Inc. Compression molding apparatus
JP3400811B2 (ja) * 1993-01-08 2003-04-28 株式会社サイネックス モールド装置
US5753164A (en) * 1995-08-30 1998-05-19 The Budd Company Automated thermoset molding method
US5863485A (en) * 1996-03-22 1999-01-26 Groleau; Rodney J. Injection molding machine employing a flow path gear pump and method of use
US6081997A (en) * 1997-08-14 2000-07-04 Lsi Logic Corporation System and method for packaging an integrated circuit using encapsulant injection
JPH11176855A (ja) 1997-12-09 1999-07-02 Oki Electric Ind Co Ltd 樹脂封止半導体装置の製造方法及びそのための装置
JP2000158493A (ja) * 1998-12-01 2000-06-13 Sony Corp 射出成形装置および方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222326A (ja) * 1983-06-02 1984-12-14 Matsushita Electronics Corp 樹脂封止装置
JPH0351111A (ja) * 1989-07-19 1991-03-05 Matsushita Electron Corp 樹脂封止装置
JPH11191563A (ja) * 1997-12-26 1999-07-13 Hitachi Ltd モールド方法および装置

Also Published As

Publication number Publication date
US6457963B1 (en) 2002-10-01
KR20010021240A (ko) 2001-03-15
JP2001047458A (ja) 2001-02-20

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