SG96671A1 - Novel high temperature underfilling material with low exotherm during use - Google Patents

Novel high temperature underfilling material with low exotherm during use

Info

Publication number
SG96671A1
SG96671A1 SG200107806A SG200107806A SG96671A1 SG 96671 A1 SG96671 A1 SG 96671A1 SG 200107806 A SG200107806 A SG 200107806A SG 200107806 A SG200107806 A SG 200107806A SG 96671 A1 SG96671 A1 SG 96671A1
Authority
SG
Singapore
Prior art keywords
high temperature
during use
novel high
exotherm during
underfilling material
Prior art date
Application number
SG200107806A
Other languages
English (en)
Inventor
M Carpenter Neil
Ruyters Michel
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of SG96671A1 publication Critical patent/SG96671A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG200107806A 2000-12-13 2001-12-10 Novel high temperature underfilling material with low exotherm during use SG96671A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/735,821 US6548575B2 (en) 2000-12-13 2000-12-13 High temperature underfilling material with low exotherm during use

Publications (1)

Publication Number Publication Date
SG96671A1 true SG96671A1 (en) 2003-06-16

Family

ID=24957317

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200107806A SG96671A1 (en) 2000-12-13 2001-12-10 Novel high temperature underfilling material with low exotherm during use

Country Status (9)

Country Link
US (1) US6548575B2 (zh)
EP (1) EP1215718A3 (zh)
JP (1) JP2002284851A (zh)
KR (1) KR20020046941A (zh)
CN (1) CN1273535C (zh)
CA (1) CA2364933A1 (zh)
MY (1) MY126833A (zh)
SG (1) SG96671A1 (zh)
TW (1) TWI225507B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7323360B2 (en) 2001-10-26 2008-01-29 Intel Corporation Electronic assemblies with filled no-flow underfill
US6974737B2 (en) * 2002-05-16 2005-12-13 Spinnaker Semiconductor, Inc. Schottky barrier CMOS fabrication method
US6902954B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Temperature sustaining flip chip assembly process
IE20030601A1 (en) * 2003-08-14 2005-02-23 Loctite R & D Ltd Curable compositions having a reduced enthalpy output
WO2007050611A1 (en) * 2005-10-25 2007-05-03 Henkel Corporation Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
KR101148051B1 (ko) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 에폭시 수지 조성물
CN101517029B (zh) 2006-07-31 2013-10-16 汉高股份及两合公司 可固化的环氧树脂-基粘合剂组合物
KR20090080956A (ko) * 2006-10-06 2009-07-27 헨켈 아게 운트 코. 카게아아 발수성의 펌핑가능한 에폭시 페이스트 접착제
KR100986365B1 (ko) * 2008-06-30 2010-10-08 박연준 분리공간을 갖는 건물 바닥용 완충층 구조
JP2014091744A (ja) * 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
WO2018077411A1 (en) * 2016-10-27 2018-05-03 Kordsa Teknik Tekstil Anonim Sirketi Exotherm stopper mixtures

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002011902A1 (en) * 2000-08-09 2002-02-14 Enthone Inc. Platable dielectric materials for microvia technology

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
JP2728106B2 (ja) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド
US5444127A (en) * 1992-10-19 1995-08-22 Henkel Corporation Tertiary amine derivatives as components of polymer forming systems
US5541000A (en) * 1993-08-17 1996-07-30 Minnesota Mining And Manufacturing Company Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms
US6180696B1 (en) 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
JP2001506313A (ja) 1997-07-24 2001-05-15 ロックタイト コーポレーション アンダーフィル密封材として有用な熱硬化性樹脂組成物
US6060540A (en) * 1998-02-13 2000-05-09 Landec Corporation Modeling pastes
US5953814A (en) 1998-02-27 1999-09-21 Delco Electronics Corp. Process for producing flip chip circuit board assembly exhibiting enhanced reliability
WO1999067324A1 (en) 1998-06-22 1999-12-29 Loctite Corporation Thermosetting resin compositions useful as underfill sealants
US6057402A (en) 1998-08-12 2000-05-02 Johnson Matthey, Inc. Long and short-chain cycloaliphatic epoxy resins with cyanate ester
CA2351963A1 (en) * 2000-07-18 2002-01-18 Illinois Tool Works Inc. One-part, heat cured epoxy adhesive

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002011902A1 (en) * 2000-08-09 2002-02-14 Enthone Inc. Platable dielectric materials for microvia technology

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SHAH D.N.: "Latent Amine Addresses Needs For One-Package Epoxy Adhesives" JOURNAL OF THE ADHESIVE AND SEALANT COUNCIL, 1 October 1997 (1997-10-01), pages 271-284, XP001120823 *
SHAH D.N.: "Novel Latent Amine Technology" ADHESIVE TECHNOLOGY, vol. 17, no. 3, 1 June 2000 (2000-06-01), pages 20-21, XP002224440 *

Also Published As

Publication number Publication date
JP2002284851A (ja) 2002-10-03
TWI225507B (en) 2004-12-21
CA2364933A1 (en) 2002-06-13
CN1273535C (zh) 2006-09-06
CN1358798A (zh) 2002-07-17
EP1215718A2 (en) 2002-06-19
US6548575B2 (en) 2003-04-15
MY126833A (en) 2006-10-31
KR20020046941A (ko) 2002-06-21
EP1215718A3 (en) 2003-11-05
US20020106515A1 (en) 2002-08-08

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