SG90705A1 - Method and system for inspecting a pattern - Google Patents

Method and system for inspecting a pattern

Info

Publication number
SG90705A1
SG90705A1 SG9703413A SG1997003413A SG90705A1 SG 90705 A1 SG90705 A1 SG 90705A1 SG 9703413 A SG9703413 A SG 9703413A SG 1997003413 A SG1997003413 A SG 1997003413A SG 90705 A1 SG90705 A1 SG 90705A1
Authority
SG
Singapore
Prior art keywords
inspecting
pattern
Prior art date
Application number
SG9703413A
Inventor
Hiroi Takashi
Tanaka Maki
Watanabe Masahiro
Kuni Asahiro
Shinada Hiroyuki
Nozoe Mari
Sugimoto Aritoshi
Shishido Chie
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG90705A1 publication Critical patent/SG90705A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG9703413A 1996-09-17 1997-09-15 Method and system for inspecting a pattern SG90705A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24516196A JP3566470B2 (en) 1996-09-17 1996-09-17 Pattern inspection method and apparatus

Publications (1)

Publication Number Publication Date
SG90705A1 true SG90705A1 (en) 2002-08-20

Family

ID=17129526

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9703413A SG90705A1 (en) 1996-09-17 1997-09-15 Method and system for inspecting a pattern

Country Status (7)

Country Link
US (2) US6347150B1 (en)
JP (1) JP3566470B2 (en)
KR (1) KR100310106B1 (en)
CN (1) CN1160660C (en)
MY (1) MY125570A (en)
SG (1) SG90705A1 (en)
TW (1) TW350111B (en)

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JPH10340347A (en) * 1997-06-09 1998-12-22 Hitachi Ltd Pattern inspecting method, device therefor and production of semiconductor wafer
JP2882409B1 (en) 1998-04-24 1999-04-12 株式会社東京精密 Appearance inspection device
KR19990086301A (en) * 1998-05-27 1999-12-15 윤종용 Method and setting device for foreign material inspection area of solid-state imaging device
JP3152203B2 (en) * 1998-05-27 2001-04-03 株式会社東京精密 Appearance inspection device
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US6571196B2 (en) * 1999-11-29 2003-05-27 Hitachi Kokusai Electric Inc. Size inspection/measurement method and size inspection/measurement apparatus
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JP4126189B2 (en) * 2002-04-10 2008-07-30 株式会社日立ハイテクノロジーズ Inspection condition setting program, inspection apparatus and inspection system
US6684164B1 (en) * 2002-08-28 2004-01-27 Macronix International Co., Ltd. True defect monitoring through repeating defect deletion
US6996264B2 (en) * 2002-10-18 2006-02-07 Leco Corporation Indentation hardness test system
JP2004198265A (en) * 2002-12-18 2004-07-15 Dainippon Printing Co Ltd Visual inspection/selection method of processed product, and visual inspection/selection system of processed product
JP4212904B2 (en) * 2003-01-22 2009-01-21 日本板硝子株式会社 Method and apparatus for detecting pinhole defects and dirt defects on a transparent body
US7469057B2 (en) * 2003-02-26 2008-12-23 Taiwan Semiconductor Manufacturing Corp System and method for inspecting errors on a wafer
JP4185789B2 (en) * 2003-03-12 2008-11-26 株式会社日立ハイテクノロジーズ Pattern inspection method and apparatus
US7221727B2 (en) * 2003-04-01 2007-05-22 Kingston Technology Corp. All-digital phase modulator/demodulator using multi-phase clocks and digital PLL
JP4331558B2 (en) * 2003-10-01 2009-09-16 株式会社日立ハイテクノロジーズ Appearance inspection method and appearance inspection apparatus for inspection object
JP4351522B2 (en) * 2003-11-28 2009-10-28 株式会社日立ハイテクノロジーズ Pattern defect inspection apparatus and pattern defect inspection method
US20060171593A1 (en) * 2005-02-01 2006-08-03 Hitachi High-Technologies Corporation Inspection apparatus for inspecting patterns of a substrate
DE102005011237B3 (en) * 2005-03-11 2006-08-03 Leica Microsystems Semiconductor Gmbh Image`s defects determining method, for disc-shaped object e.g. substrate, involves recording images of surface of object, and executing comparison operation when three comparison images with same image content are present in buffer store
KR100705643B1 (en) * 2005-06-07 2007-04-09 (주) 인텍플러스 Method for Inspecting Of Semiconductor device
JP4174504B2 (en) * 2005-08-31 2008-11-05 アドバンスド・マスク・インスペクション・テクノロジー株式会社 Sample inspection apparatus, sample inspection method, and program
JP4266971B2 (en) * 2005-09-22 2009-05-27 アドバンスド・マスク・インスペクション・テクノロジー株式会社 Pattern inspection apparatus, pattern inspection method, and inspection target sample
JP4950550B2 (en) * 2006-04-21 2012-06-13 株式会社東芝 Pattern misalignment measuring method and program
KR100755372B1 (en) * 2006-08-25 2007-09-04 삼성전자주식회사 Wafer inspecting method
JP5466811B2 (en) * 2006-11-22 2014-04-09 オリンパス株式会社 Substrate inspection apparatus and substrate inspection method
US7898653B2 (en) * 2006-12-20 2011-03-01 Hitachi High-Technologies Corporation Foreign matter inspection apparatus
JP5110977B2 (en) * 2007-06-22 2012-12-26 株式会社日立ハイテクノロジーズ Defect observation apparatus and method
JP4659004B2 (en) * 2007-08-10 2011-03-30 株式会社日立ハイテクノロジーズ Circuit pattern inspection method and circuit pattern inspection system
JP5104291B2 (en) * 2007-12-26 2012-12-19 富士通株式会社 Image analysis program, image analysis apparatus, and image analysis method
JP4919988B2 (en) * 2008-03-07 2012-04-18 株式会社日立ハイテクノロジーズ Circuit pattern inspection apparatus and circuit pattern inspection method
US8249331B2 (en) * 2008-04-09 2012-08-21 Applied Materials Israel, Ltd. Method and system for evaluating an object
TWI410820B (en) * 2008-04-22 2013-10-01 Applied Materials Israel Ltd Method and system for evaluating an object
TWI451284B (en) * 2008-04-22 2014-09-01 Applied Materials Israel Ltd Method and system for evaluating an object
WO2010013665A1 (en) * 2008-08-01 2010-02-04 株式会社日立ハイテクノロジーズ Defect review device and method, and program
JP5275017B2 (en) 2008-12-25 2013-08-28 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus
JP5287385B2 (en) * 2009-03-13 2013-09-11 オムロン株式会社 Measuring device
JP5403367B2 (en) * 2010-02-05 2014-01-29 アイシン精機株式会社 Object shape evaluation device
JP5498189B2 (en) 2010-02-08 2014-05-21 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus
JP2012068454A (en) * 2010-09-24 2012-04-05 Toshiba Corp Pattern shape determining method, pattern shape verifying method, pattern correcting method, method of manufacturing mask for lithography, and method of manufacturing semiconductor device
JP2014515859A (en) * 2011-04-26 2014-07-03 ケーエルエー−テンカー コーポレイション Database-driven cell-to-cell reticle inspection
KR20140006190A (en) * 2012-06-27 2014-01-16 삼성전자주식회사 Optical measurement apparatus and control method thereof
CN102931116B (en) * 2012-11-12 2015-05-06 上海华力微电子有限公司 Synchronous defect detecting method for memorizer
JP2014206446A (en) * 2013-04-12 2014-10-30 株式会社ニューフレアテクノロジー Pattern inspection method
US9171364B2 (en) * 2013-06-21 2015-10-27 Kla-Tencor Corp. Wafer inspection using free-form care areas
JP6303352B2 (en) * 2013-09-18 2018-04-04 株式会社デンソーウェーブ Appearance inspection system
CN103531498B (en) * 2013-10-18 2016-04-20 上海华力微电子有限公司 Wafer defect analytical system
CN103630547B (en) * 2013-11-26 2016-02-03 明基材料有限公司 There is flaw detection method and the pick-up unit thereof of the optical thin film of periodic structure
CN104715250B (en) * 2013-12-17 2018-06-12 中国科学院深圳先进技术研究院 cross laser detection method and device
TWI521476B (en) * 2015-04-17 2016-02-11 銘傳大學 Automatic optical inspection method of periodic patterns
US10902576B2 (en) * 2016-08-12 2021-01-26 Texas Instruments Incorporated System and method for electronic die inking after automatic visual defect inspection
CN106583955B (en) * 2016-12-13 2019-05-03 鸿利智汇集团股份有限公司 A kind of wire soldering method of detection chip fixed-direction
JP7317647B2 (en) * 2019-09-19 2023-07-31 株式会社Ｓｃｒｅｅｎホールディングス LEARNING DEVICE, INSPECTION DEVICE, LEARNING METHOD AND INSPECTION METHOD
CN111415878B (en) * 2020-03-30 2023-09-12 英特尔产品（成都）有限公司 Wafer-level automatic detection method, equipment and system
US11798828B2 (en) * 2020-09-04 2023-10-24 Kla Corporation Binning-enhanced defect detection method for three-dimensional wafer structures

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US4860371A (en) * 1986-07-28 1989-08-22 Hitachi, Ltd. Method and apparatus for detecting pattern defects
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US5173719A (en) * 1989-12-20 1992-12-22 Hitachi, Ltd. Method and apparatus for the inspection of patterns
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US5513275A (en) * 1993-01-12 1996-04-30 Board Of Trustees Of The Leland Stanford Junior University Automated direct patterned wafer inspection

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EP0117559B1 (en) * 1983-02-28 1991-08-21 Hitachi, Ltd. Pattern checking apparatus
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EP0243639B1 (en) * 1986-04-17 1994-07-13 International Business Machines Corporation System for automatic inspection of periodic patterns
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Also Published As

Publication number Publication date
US20020094120A1 (en) 2002-07-18
KR19980024426A (en) 1998-07-06
TW350111B (en) 1999-01-11
CN1182921A (en) 1998-05-27
JPH1089931A (en) 1998-04-10
CN1160660C (en) 2004-08-04
US6347150B1 (en) 2002-02-12
KR100310106B1 (en) 2001-12-15
MY125570A (en) 2006-08-30
US7260256B2 (en) 2007-08-21
JP3566470B2 (en) 2004-09-15

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