TWI410820B - Method and system for evaluating an object - Google Patents

Method and system for evaluating an object Download PDF

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TWI410820B
TWI410820B TW97114685A TW97114685A TWI410820B TW I410820 B TWI410820 B TW I410820B TW 97114685 A TW97114685 A TW 97114685A TW 97114685 A TW97114685 A TW 97114685A TW I410820 B TWI410820 B TW I410820B
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TW200945090A (en
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Nir Ben-David Dodzin
Vered Gatt
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Applied Materials Israel Ltd
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Abstract

A method, system and a computer program product for evaluating a object; the method includes: (i) obtaining an image of an area of the object; wherein the area comprises multiple arrays of repetitive structural elements that are at least partially surrounded by at least one group of non-repetitive regions; wherein non-repetitive regions that belong to a single group of non-repetitive regions are ideally identical to each other; wherein the non-repetitive regions are arranged in a repetitive manner; and (ii) providing an evaluation result in response to a comparison between image information of a first sub-area to image information of a second sub-area that is proximate to the first sub-area; wherein the first sub-area comprises a first array of repetitive structural elements and a first non-repetitive region; wherein the second sub-area comprises a second array of repetitive structural elements and a second non-repetitive region.

Description

評估物件的方法及系統Method and system for evaluating objects

本發明主要涉及用於微製造、平板顯示器、微電子機械(micro-electromechanical,MEM)器件等等的諸如晶圓、光罩(mask)或倍縮光罩(reticle)的物件的自動檢測領域。The present invention generally relates to the field of automated inspection of articles such as wafers, masks or reticles for microfabrication, flat panel displays, micro-electromechanical (MEM) devices and the like.

在過去的幾十年中,對於檢測微觀製造缺陷的缺陷檢測已經成為尤其是用於半導體晶圓的微加工製造流程的標準部分。In the past few decades, defect detection for detecting microfabrication defects has become a standard part of the micromachining manufacturing process especially for semiconductor wafers.

適用於最可能發現多種類型缺陷的各種檢測技術通常應用於半導體製造流程的多個步驟中。檢測的經濟效益已經非常顯著並且一般認為檢測技術對20世紀九十年代出現的半導體晶圓製造領域的顯著增長有重要貢獻。The various detection techniques that are most likely to find multiple types of defects are commonly used in multiple steps in a semiconductor manufacturing process. The economic benefits of testing have been very significant and it is generally believed that detection technology has made a significant contribution to the significant growth in the field of semiconductor wafer fabrication that emerged in the 1990s.

檢測系統被應用于大量的不同應用中,該等應用包括當製造流程中的特定程序步驟具有超過在該步驟正常預期水平的增加的缺陷密度時,監控以標記的程序;透過檢測稱為短迴圈晶圓來解決問題,該晶圓僅用製造程序步驟的子集進行處理,從而有助於故障檢修和診斷或者優化程序步驟的特定子集,以及在程序發展期間,從而優化新的製造程序來減少或消除程序特有的或系統缺陷機制。The detection system is applied to a large number of different applications, including monitoring of the marked program when a particular program step in the manufacturing process has an increased defect density that exceeds the normal expected level of the step; Circle wafers to solve the problem, the wafer is processed only with a subset of the manufacturing process steps to facilitate troubleshooting and diagnostics or to optimize a specific subset of program steps, and to optimize new manufacturing processes during program development To reduce or eliminate program-specific or system defect mechanisms.

用於經構圖的晶圓檢測的晶圓檢測系統通常工作如下所述。高功率顯微鏡,傳統為光學顯微鏡,或最近常用的SEM(Scanning Electron Microscope,掃描電子顯微鏡)或電子顯微鏡,設置為受電腦控制以順序獲取物件的區域 的圖像,該物件諸如於製造期間或之後用於微加工、平板顯示器、微電子機械(MEM)器件等等的含有以小塊(dice)排列的多個積體電路的晶圓、光罩或倍縮光罩。Wafer inspection systems for patterned wafer inspection typically operate as described below. High-power microscopes, traditionally optical microscopes, or more recently SEM (Scanning Electron Microscope) or electron microscopes, set to be computer controlled to sequentially acquire objects An image, such as a wafer or reticle containing a plurality of integrated circuits arranged in dices, for micromachining, flat panel displays, microelectromechanical (MEM) devices, etc., during or after fabrication. Or double the reticle.

以這種方式獲取的圖像或對比資料隨後與參考資料相比較。在參考圖像和獲取圖像之間存在差別處發現或檢測到缺陷。參考圖像可從如通常使用光罩或倍縮光罩檢測的電腦輔助設計(Computer Aided Design,CAD)資料得出另外地或可選地,參考圖像可僅為緊鄰單元或晶圓上晶片或被檢測的相似晶圓的圖像。對小缺陷的缺陷檢測程序靈敏度可透過調整圖像獲取參數諸如圖元尺寸、對比度、亮度、充電和偏壓條件等,以及用於比較所獲取的檢測圖像和參考圖像的圖像處理參數來控制。The image or comparison data acquired in this way is then compared to the reference material. A defect is found or detected at a difference between the reference image and the acquired image. The reference image may be derived from Computer Aided Design (CAD) data, such as is typically detected using a reticle or doubling mask, additionally or alternatively, the reference image may be only the immediately adjacent cell or wafer on the wafer. Or an image of a similar wafer being detected. The sensitivity of the defect detection program for small defects can be adjusted by adjusting image acquisition parameters such as primitive size, contrast, brightness, charging and bias conditions, and image processing parameters for comparing the acquired detected image and reference image. To control.

物件諸如晶圓可包括重複區域,其包括許多重複的結構元件,諸如儲存單元(諸如靜態記憶體(SRAM)、動態記憶體(DRAM)、鐵電記憶體(FRAM)、快閃記憶體)。重複區域還可包括重複的結構元件可編程邏輯單元,諸如包含在可編程邏輯器件(PLA)、可編程邏輯電路(PLD)中的可編程邏輯單元。其他物件諸如MEM顯示器和平板顯示器可包括重複區域。An object, such as a wafer, can include a repeating region that includes a number of repeating structural elements, such as a storage unit (such as static memory (SRAM), dynamic memory (DRAM), ferroelectric memory (FRAM), flash memory). The repeating region may also include a repeating structural element programmable logic unit, such as a programmable logic unit included in a programmable logic device (PLA), a programmable logic circuit (PLD). Other items such as MEM displays and flat panel displays may include repeating regions.

典型地,包括在相同重複區域內的理想相同的結構元件(稱為單元)進行相互比較或與所謂的「黃金單元(golden cell)」相比較。兩種類型的比較稱為單元與單元比較。Typically, ideally identical structural elements (called cells) included in the same repeating region are compared to each other or to a so-called "golden cell". The two types of comparisons are called unit to unit comparisons.

儲存陣列通常被非重複區域圍繞。這些非重複區域通常利用所謂的晶片與晶片比較來相互比較。The storage array is usually surrounded by non-repeating areas. These non-repetitive regions are typically compared to one another using so-called wafer versus wafer comparisons.

晶片與晶片比較涉及將一個晶片的圖像資訊與另一晶片的圖像資訊相比較。本技術領域已知晶片與晶片比較由於其減小的靈敏性因此對缺陷的敏感度顯著低於單元與單 元比較。後者優於晶片與晶片比較,原因在於其對程序變化、顏色變化(當應用光場技術時以及當局部透明層設置在單元上時發生的現象),以及對光圖像採集(和/或照射)過程的變化不太敏感。這些變化可包括輻射強度變化、光行差;焦距不准,感測器飽和、感測器陣列不均勻、不對準等等。Comparing a wafer to a wafer involves comparing image information of one wafer with image information of another wafer. It is known in the art that wafers versus wafers are significantly less sensitive to defects due to their reduced sensitivity than units and wafers. Yuan comparison. The latter is superior to wafer-to-wafer comparisons due to program variations, color changes (when applying light field techniques and when localized transparent layers are placed on the cell), and optical image acquisition (and/or illumination). The process changes are less sensitive. These variations may include changes in radiation intensity, aberrations; focal length misalignment, sensor saturation, sensor array non-uniformity, misalignment, and the like.

儘管單元與單元比較具有一些優點。其對靠近重複區域邊緣的單元的圖像資訊的採集和與重複區域的邊緣隔開的單元的圖像資訊的採集之間的區別作出回應。注意到由於用於照射區域的輻射的較寬能量分佈以及當照射靠近陣列的邊緣的結構元件時產生通過空間頻率濾波器的圖案資訊,因此特定的結構元件的圖形資訊可能受特定結構元件的圍繞物影響。典型地,此種空間頻率濾波器係配置用於阻擋重複結構元件陣列的干涉波瓣(1obes)。非重複區域可改變干涉波瓣的位置,從而圖像資訊可通過這些空間頻率濾波器。Although the unit has some advantages compared to the unit. It responds to the difference between the acquisition of image information of cells near the edge of the repeating region and the acquisition of image information of cells separated from the edges of the repeating region. Noting that due to the wider energy distribution of the radiation used to illuminate the area and the pattern information passing through the spatial frequency filter when illuminating structural elements near the edge of the array, the graphical information of a particular structural element may be surrounded by specific structural elements Object impact. Typically, such spatial frequency filters are configured to block interference lobes of an array of repeating structural elements. The non-repetitive region changes the position of the interfering lobes so that image information can pass through these spatial frequency filters.

第1圖示出現有技術晶圓的區域8。多個儲存單元陣列10-18被垂直縫(以V表示)和水平縫(以「H縫」20-30表示)圍繞。在通常實施的混合比較過程期間,每個陣列內的重複結構元件的圖像資訊與相同陣列內的重複結構元件的圖像資訊相比較,而垂直縫的圖像資訊與另一晶片的垂直縫的圖像資訊相比較。這種混合比較過程具有以上所述的晶片與晶片比較的缺點和單元與單元比較的缺點。Figure 1 shows a region 8 of a prior art wafer. The plurality of storage unit arrays 10-18 are surrounded by vertical slits (indicated by V) and horizontal seams (represented by "H slits" 20-30). During the commonly performed hybrid comparison process, the image information of the repeating structural elements within each array is compared to the image information of the repeating structural elements within the same array, while the image information of the vertical stitches is perpendicular to the vertical stitching of the other wafer. The image information is compared. This hybrid comparison process has the disadvantages of wafer versus wafer described above and the disadvantages of unit versus unit.

越來越需要提供可評估物件的改進的系統、方法和電腦程式產品。There is an increasing need for improved systems, methods, and computer program products that provide evaluable objects.

一種用於評估物件的方法,該方法包括:(i)獲得物件一區域的圖像;其中該區域包括至少部分地被至少一組非重複區域所圍繞的多個陣列的重複結構元件;其中屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中非重複區域以重複方式排列;以及(ii)回應第一子區域的圖像資訊與緊鄰第一子區域的第二子區域的圖像資訊之間的比較,而提供評估結果;其中第一子區域包括第一陣列的重複結構元件和第一非重複區域;其中第二子區域包括第二陣列的重複結構元件和第二非重複區域。A method for evaluating an object, the method comprising: (i) obtaining an image of an area of the object; wherein the area comprises a plurality of arrays of repeating structural elements at least partially surrounded by at least one set of non-repetitive areas; The majority of the non-repetitive regions of a single set of non-repeating regions are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner; and (ii) the image information in response to the first sub-region and the second sub-region immediately adjacent to the first sub-region Providing an evaluation result between the image information; wherein the first sub-region includes the first array of repeating structural elements and the first non-repetitive region; wherein the second sub-region includes the second array of repeating structural elements and the second non- Repeat the area.

一種用於評估物件的系統;該系統包括:配置用於儲存物件一區域的圖像的儲存單元;其中該區域包括多個陣列的重複結構元件,其至少部分被至少一組非重複區域所圍繞;其中屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中非重複區域以重複方式排列;以及處理器,其係配置用於回應第一子區域的圖像資訊與緊鄰第一子區域的第二子區域的圖像資訊之間的比較,而提供評估結果;其中第一子區域包括第一陣列的重複結構元件和第一非重複區域;其中第二子區域包括第二陣列的重複結構元件和第二非重複區域。A system for evaluating an item; the system comprising: a storage unit configured to store an image of an area of the object; wherein the area comprises a plurality of arrays of repeating structural elements at least partially surrounded by at least one set of non-repetitive areas Wherein the plurality of non-repetitive regions belonging to a single set of non-repetitive regions are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner; and the processor configured to respond to the image information of the first sub-region and immediately adjacent to the first Providing an evaluation result between the image information of the second sub-region of the sub-region; wherein the first sub-region includes the first array of repeating structural elements and the first non-repetitive region; wherein the second sub-region includes the second array Repeating structural elements and second non-repetitive regions.

電腦程式產品,其包括具有電腦可讀程式的電腦可使用媒體,其中電腦可讀程式,當在電腦上執行時,使得電腦可執行以下步驟:接收物件一區域的圖像;其中該區域包括多個陣列的重複結構元件,其至少部分被至少一組非重複區域所圍繞;屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中非重複區域以重複方式排列;以及回應第一子區域的圖像資訊與緊鄰第一子區域的第二 子區域的圖像資訊之間的比較,而提供評估結果;其中第一子區域包括第一陣列的重複結構元件和第一非重複區域;其中第二子區域包括第二陣列的重複結構元件和第二非重複區域。A computer program product comprising a computer usable medium having a computer readable program, wherein when executed on a computer, the computer can perform the following steps: receiving an image of an area of the object; wherein the area includes Repeating structural elements of the array, at least partially surrounded by at least one set of non-repetitive regions; most non-repetitive regions belonging to a single set of non-repetitive regions are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner; and responding to the first Image information of the sub-area and second of the first sub-area Providing an evaluation result between the image information of the sub-regions; wherein the first sub-region includes the first array of repeating structural elements and the first non-repetitive region; wherein the second sub-region includes the second array of repeating structural elements and Second non-repetitive area.

一種於製造期間或之後用於評估用於微加工、平板顯示器、微電子機械(MEM)器件等等的諸如晶圓、光罩或倍縮光罩之類的物件的方法、系統和電腦程式產品。A method, system and computer program product for evaluating articles such as wafers, reticle or reticle for micromachining, flat panel displays, microelectromechanical (MEM) devices, etc., during or after manufacturing .

根據本發明的實施方式子區域被限定。每個子區域包括重複的結構元件陣列。該重複的結構元件陣列被至少一組非重複區域所圍繞。屬於單一組非重複區域的多數非重複區域理想地為彼此相同。非重複區域以重複方式排列。取代晶片與晶片比較,該方法、系統和電腦程式產品採取其他比較方式。該比較在屬於彼此緊鄰的子區域(通常屬於相同晶片)的多個非重複區域的圖像資訊之間進行。這種類型的比較由於較少受程序變化、顏色變化或圖像採集條件變化的影響而更為可靠。Sub-areas are defined in accordance with embodiments of the present invention. Each sub-region includes an array of repeating structural elements. The repeating array of structural elements is surrounded by at least one set of non-repetitive regions. Most of the non-repetitive regions belonging to a single set of non-repetitive regions are desirably identical to each other. The non-repeating regions are arranged in a repeating manner. The method, system, and computer program product take other comparisons in place of the wafer and the wafer. This comparison takes place between image information of a plurality of non-repetitive regions belonging to sub-regions that are immediately adjacent to one another (typically belonging to the same wafer). This type of comparison is more reliable due to less impact from program changes, color changes, or changes in image acquisition conditions.

根據本發明的實施方式,取代重複圖案陣列的一個結構元件的圖像資訊與重複結構元件的相同陣列的另一結構元件的圖像資訊比較,第一子區域的重複結構元件的圖像資訊與第二子區域的對應重複結構元件的圖像資訊比較。這種比較克服了比較誤差,該誤差由位於重複結構元件陣列的邊緣附近的結構元件的圖像資訊與遠離重複結構元件的陣列的邊緣的結構元件的圖像資訊比較引起。According to an embodiment of the present invention, image information of one structural element replacing the repeating pattern array is compared with image information of another structural element of the same array of repeating structural elements, image information of the repeated structural elements of the first sub-area Image information comparison of corresponding repeating structural elements of the second sub-region. This comparison overcomes the comparison error caused by the comparison of the image information of the structural elements located near the edges of the repeating structural element array with the image information of the structural elements remote from the edges of the array of repeating structural elements.

根據本發明的另一實施方式,重複元件的陣列分離為內部分和外部分。外部分可定位在內部分和圍繞重複結構 元件的陣列的非重複區域之間。該內部分包括所選擇的結構元件,其被選擇使得它們的圖像資訊不受非重複區域影響而外部分的結構元件的圖像資訊可能受非重複區域影響。重複結構元件陣列的內部分內的結構元件的圖像資訊與相同內部分內的其他結構元件的圖像資訊進行比較。屬於特定子區域的重複結構元件陣列的外部分內的結構元件的圖像資訊,與屬於另一子區域的重複結構元件另一陣列的外部分內的結構元件的對應圖像資訊相比較。According to another embodiment of the invention, the array of repeating elements is separated into an inner portion and an outer portion. The outer part can be positioned inside and around the repeating structure Between non-repeating regions of the array of components. The inner portion includes selected structural elements that are selected such that their image information is unaffected by the non-repetitive region and the image information of the structural elements of the outer portion may be affected by the non-repetitive region. The image information of the structural elements within the inner portion of the repeating structural element array is compared to the image information of other structural elements within the same inner portion. The image information of the structural elements within the outer portion of the array of repeating structural elements belonging to a particular sub-region is compared to the corresponding image information of the structural elements within the outer portion of another array of repeating structural elements belonging to another sub-region.

除非另外說明,術語諸如「第一」和「第二」用於任意區別該術語描述的元件。因此,這些術語不意在指出-該元件的時間或其他優先次序。Terms such as "first" and "second" are used to arbitrarily distinguish between the elements described by the term unless otherwise stated. Therefore, these terms are not intended to indicate - the timing or other prioritization of the elements.

除非另外說明,術語「對應結構元件」意指屬於不同子區域的結構元件,該不同子區域關於它們所屬的子區域的邊界而實質上定位在相同位置處。Unless otherwise stated, the term "corresponding structural element" means a structural element belonging to a different sub-area that is substantially positioned at the same location with respect to the boundaries of the sub-areas to which they belong.

術語「圖像資訊」意指用於描述在圖像的光採集期間所獲得資訊之資訊。該資訊通常包括一個或多個灰階圖元,但這不是必須的。注意圖像資訊可透過利用成像鏡片或不成像鏡片而獲得。圖像資訊可在與其他圖像資訊進行比較前先進行數位處理(例如透過使用濾波器)。The term "image information" means information used to describe information obtained during light collection of an image. This information usually includes one or more grayscale primitives, but this is not required. Note that image information can be obtained by using an imaging lens or a non-imaging lens. Image information can be digitally processed (eg by using a filter) before being compared to other image information.

第2圖示出根據本發明的實施方式的兩個子區域。第一子區域的圖像資訊與第二子區域的對應圖像資訊相比較。第2圖示出連續的子區域。注意圖像資訊比較可在彼此緊鄰的子區域之間進行,即使這些子區域彼此隔開。參照第1圖描述的實施例,包括陣列10和水平縫20的子區域可與包括陣到18和水平縫27的另一子區域相比較。注意第一子區域的圖像資訊可與表示多個其他子區域的資訊相比較。這可包括將第一子區域的資訊與多個其他子區域 的平均(或其他統計或統計相關函數)進行比較。Figure 2 shows two sub-areas in accordance with an embodiment of the present invention. The image information of the first sub-area is compared with the corresponding image information of the second sub-area. Figure 2 shows successive sub-regions. Note that the image information comparison can be made between sub-regions that are immediately adjacent to each other, even if the sub-regions are separated from each other. Referring to the embodiment depicted in FIG. 1, the sub-areas including the array 10 and the horizontal slits 20 can be compared to another sub-area including the array 18 and the horizontal slit 27. Note that the image information of the first sub-area can be compared with information representing a plurality of other sub-areas. This may include the information of the first sub-area with a plurality of other sub-areas The average (or other statistical or statistical correlation function) is compared.

如果這些區域之間由於程序變化引起的預期變化低於特定的程序變化閥值,則兩個子區域可視為緊鄰。另外地或可選地,如果顏色變化、光圖像採集和/或照射過程的時間變化對比較過程的影響低於特定閥值,則兩個子區域可視為緊鄰。這些閥值的每個可由用戶、評估工具操作者或物件製造商為回應各種參數諸如要求的靈敏度、要求的信噪比,所期望檢測到的缺陷等等來設定。如果這些子區域之間的距離不超過晶片的長度(或寬度)的一小部分,則通常子區域認為彼此緊鄰。If the expected change between these regions due to program changes is below a certain program change threshold, then the two sub-regions can be considered as being in close proximity. Additionally or alternatively, if the temporal change in color change, light image acquisition, and/or illumination process has a lower impact on the comparison process than a particular threshold, then the two sub-regions may be considered as being in close proximity. Each of these thresholds can be set by the user, the evaluation tool operator, or the item manufacturer in response to various parameters such as required sensitivity, required signal to noise ratio, desired detected defects, and the like. If the distance between these sub-regions does not exceed a small portion of the length (or width) of the wafer, then typically the sub-regions are considered to be in close proximity to each other.

第4圖示出根據本發明的實施方式用於評估物件的方法100。Figure 4 illustrates a method 100 for evaluating an item in accordance with an embodiment of the present invention.

方法100開始於步驟110,其獲得物件一區域的圖像;其中該區域包括至少部分地被至少一組非重複區域所圍繞的重複結構元件的多個陣列。屬於單一組非重複區域的多數非重複區域理想地為彼此相同。非重複區域以重複的方式排列。The method 100 begins at step 110 by obtaining an image of an area of an object; wherein the area includes a plurality of arrays of repeating structural elements at least partially surrounded by at least one set of non-repetitive areas. Most of the non-repetitive regions belonging to a single set of non-repetitive regions are desirably identical to each other. The non-repeating regions are arranged in a repeating manner.

注意該區域可比晶片小得多,可包括一個或多個小塊(dice)等等。Note that this area can be much smaller than a wafer, can include one or more dices, and the like.

參照第2圖描述的實施例,重複結構元件的陣列是陣列10和陣列13。第一組的非重複區域包括水平縫20、23和26,而第二組非重複區域包括垂直縫(以V表示)。Referring to the embodiment depicted in Figure 2, the array of repeating structural elements is array 10 and array 13. The non-repeating regions of the first set include horizontal slits 20, 23, and 26, while the second set of non-repeating regions include vertical slits (indicated by V).

步驟110可包括光學式(包括使用電子光學)獲得這些圖像,獲得表示這些圖像的圖像資訊,及其它類似物。注意區域,諸如第1圖的區域8的圖像可涉及採集區域8的多部分的圖像並生成合成圖像,其包括多個獨立光學式採集的圖像的多部分。另外,注意圖像的光學採集可能需 要對準。當每個子區域完成對準時,對準通常更容易(以及花費更少時間)。注意區域的多部分的光學式獲得的圖像可能部分重疊,從而補償圖像的光學採集相關的各種未對準問題。另外,注意區域8的圖像可在取得該區域的多個圖像並處理這些圖形後生成(例如,透過求和這些圖像從而平均掉隨機噪音)。本領域的技術人員將理解該圖像可透過使用單色輻射、帶電粒子束、寬帶輻射、脈衝光源、連續光源等等方式進行採集。Step 110 may include obtaining these images optically (including using electro-optics), obtaining image information representative of the images, and the like. An attention area, such as the image of area 8 of Figure 1, may involve capturing a multi-part image of area 8 and generating a composite image that includes portions of a plurality of independently optically acquired images. Also, note that optical collection of images may be required To be aligned. When each sub-area is aligned, alignment is usually easier (and less time spent). Note that the multi-part optically obtained images of the regions may partially overlap, thereby compensating for various misalignment problems associated with optical acquisition of the image. In addition, it is noted that the image of region 8 can be generated after acquiring a plurality of images of the region and processing the graphics (eg, by summing the images to average random noise). Those skilled in the art will appreciate that the image can be acquired by using monochromatic radiation, charged particle beams, broadband radiation, pulsed light sources, continuous light sources, and the like.

步驟110後接著步驟130,其回應第一子區域的圖像資訊與緊鄰第一子區域的第二子區域的圖像資訊之間的比較而提供評估結果。第一子區域包括第一陣列的重複結構元件和第一非重複區域。第二子區域包括第二陣列的重複結構元件和第二非重複區域。注意每個子區域可包括一個或多個非重複區域的一個或多個部分。Step 110 is followed by step 130, which provides an evaluation result in response to a comparison between the image information of the first sub-area and the image information of the second sub-area immediately adjacent to the first sub-area. The first sub-region includes a repeating structural element of the first array and a first non-repetitive region. The second sub-region includes a repeating structural element of the second array and a second non-repetitive region. Note that each sub-region may include one or more portions of one or more non-repetitive regions.

合宜地,步驟130包括步驟132、134和136中至少一個步驟。Conveniently, step 130 includes at least one of steps 132, 134, and 136.

步驟132包括第一子區域的圖像資訊和第二子區域的圖像資訊之間的比較,其中第一子區域包括第一陣列的儲存單元以及包括有第一縫的第一非重複區域。第二子區域包括第二陣列的儲存單元以及包括有第二縫的第二非重複區域。第2圖提供該等子區域的實施例。Step 132 includes comparing the image information of the first sub-region with the image information of the second sub-region, wherein the first sub-region includes a storage unit of the first array and a first non-repetitive region including the first slit. The second sub-region includes a second array of storage units and a second non-repeating region including a second slit. Figure 2 provides an embodiment of the sub-areas.

步驟134包括比較不同子區域的對應結構元件的圖像資訊。每個結構元件係位在相對於包括該結構元件的子區域的邊界的實質上相同位置處。步驟134包括,例如:(i)將屬於第一子區域且位於不靠近它們陣列的邊緣的重複結構元件的圖像資訊與位於不靠近另一陣列的邊緣的第二子區域的對應結構元件相比較,以及(ii)將第一子區域的 非重複區域的結構元件的圖像資訊與第二子區域的另一非重複區域的對應結構元件相比較。Step 134 includes comparing image information of corresponding structural elements of different sub-regions. Each structural element is tied at substantially the same position relative to the boundary of the sub-region comprising the structural element. Step 134 includes, for example: (i) image information of repeating structural elements belonging to the first sub-area and located not near the edge of their array, and corresponding structural elements of the second sub-area located not near the edge of the other array Comparison, and (ii) the first sub-area The image information of the structural elements of the non-overlapping region is compared to the corresponding structural elements of another non-overlapping region of the second sub-region.

步驟136包括將靠近第一陣列的邊緣的結構元件的圖像資訊和靠近第二陣列的對應邊緣的對應元件的圖像資訊相比較。注意步驟134可視為包括步驟136,但這不是必須的。Step 136 includes comparing image information of structural elements proximate the edges of the first array with image information of corresponding elements proximate to corresponding edges of the second array. Note that step 134 can be considered to include step 136, but this is not required.

第3圖示出根據本發明的實施方式的兩個子區域。Figure 3 shows two sub-areas in accordance with an embodiment of the present invention.

第3圖示出陣列10和13中每個陣列係分割為內部分(分別為10(1)和13(1))和外部分(分別為10(2)和13(2))。外區域包括結構元件,它們的圖像資訊受圍繞其陣列的一個或多個非重複區域影響(至少大於特定閥值)。內部區域包括結構元件,它們的圖像資訊不受非重複區域的影響(或影響低於特定閥值)。注意閥值可以表示單元與單元比較的特徵和子區域與子區域比較的特徵之間的平衡。Figure 3 shows that each of the arrays 10 and 13 is divided into inner portions (10 (1) and 13 (1), respectively) and outer portions (10 (2) and 13 (2), respectively). The outer region includes structural elements whose image information is affected by one or more non-repetitive regions surrounding their array (at least greater than a particular threshold). The internal area consists of structural elements whose image information is unaffected by the non-repetitive area (or affects below a certain threshold). Note that the threshold can represent the balance between the features of the cell versus the cell and the features of the subregion compared to the subregion.

第5圖示出根據本發明的實施方式的方法200。Figure 5 illustrates a method 200 in accordance with an embodiment of the present invention.

方法200開始於步驟110,其獲得物件一區域的圖像;其中該區域包括重複結構元件的多個陣列,該重複結構元件至少部分地被至少一組非重複區域所圍繞;其中屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中非重複區域以重複的方式排列。The method 200 begins at step 110 with obtaining an image of an area of an object; wherein the area includes a plurality of arrays of repeating structural elements that are at least partially surrounded by at least one set of non-repetitive regions; wherein the single set is non-repeating Most of the non-repetitive regions of the repeating region are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner.

步驟110之後是步驟144和146。這些步驟可彼此並行地執行,但為簡化說明,第5圖示出步驟144之後為步驟146。Step 110 is followed by steps 144 and 146. These steps can be performed in parallel with each other, but for simplicity of explanation, FIG. 5 shows step 146 after step 144.

步驟144包括將包含在第一陣列重複結構元件的的外部分中的第一重複元件的圖像資訊與包含在第二陣列的重複結構元件的外部分中的對應重複元件的圖像資訊相比 較。第一陣列屬於第一子區域以及第二陣列屬於第二子區域。第一和第二子區域彼此緊鄰。Step 144 includes comparing image information of the first repeating element contained in the outer portion of the first array of repeating structural elements to image information of the corresponding repeating element contained in the outer portion of the repeating structural element of the second array Compared. The first array belongs to the first sub-area and the second array belongs to the second sub-area. The first and second sub-regions are in close proximity to each other.

步驟146包括將包含在第一陣列的重複結構元件的內部分中的第一重複元件的圖像資訊與包含在第一陣列的重複結構元件的內部分中的另一重複元件的圖像資訊相比較。Step 146 includes comparing image information of the first repeating element contained in the inner portion of the repeating structural element of the first array with image information of another repeating element included in the inner portion of the repeating structural element of the first array Comparison.

步驟146後是步驟148,其回應步驟144和146的至少其中一個比較而-提供評估結果。Step 146 is followed by step 148, which provides an evaluation result in response to at least one of steps 144 and 146.

第6圖示出根據本發明的實施方式的系統300。Figure 6 shows a system 300 in accordance with an embodiment of the present invention.

系統300包括儲存單元320、處理器310和圖像採集單元330。系統300可自包括圖像採集單元的檢測工具光學式獲得區域的圖像或可接收圖像(或表示該等圖像的資訊)。System 300 includes a storage unit 320, a processor 310, and an image acquisition unit 330. System 300 can optically obtain images of regions or receive images (or information representing such images) from a detection tool that includes an image acquisition unit.

儲存單元320係配置用於儲存物件一區域的圖像。該區域包括至少部分地被至少一組非重複區域所包圍的多個陣列的重複結構元件;其中屬於單一組非重複區域的多數非重複區域理想地彼此相同;其中非重複區域以重複的方式排列。The storage unit 320 is configured to store an image of an area of the object. The region includes a plurality of arrays of repeating structural elements at least partially surrounded by at least one set of non-repetitive regions; wherein the plurality of non-repetitive regions belonging to a single set of non-repetitive regions are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner .

處理器310係配置用於回應第一子區域的圖像資訊與緊鄰第一子區域的第二子區域的圖像資訊的比較,而提供評估結果;其中第一子區域包括第一陣列的重複結構元件和第一非重複區域;其中第二子區域包括第二陣列的重複結構元件和第二非重複區域。The processor 310 is configured to provide an evaluation result by comparing the image information of the first sub-area with the image information of the second sub-area adjacent to the first sub-area; wherein the first sub-area includes a repetition of the first sub-area a structural element and a first non-repetitive region; wherein the second sub-region comprises a repeating structural element of the second array and a second non-repetitive region.

合宜地,處理器310係配置用於將第一子區域的圖像資訊與第二子區域的圖像資訊相比較;其中第一子區域包括第一陣列的儲存單元以及包括有第一縫的第一非重複區域;其中第二子區域包括第二陣到的儲存單元以及包括有 第二縫的第二非重復區域。Conveniently, the processor 310 is configured to compare image information of the first sub-area with image information of the second sub-area; wherein the first sub-area comprises a first array of storage units and includes a first slot a first non-repetitive area; wherein the second sub-area includes a second array of storage units and includes a second non-repetitive region of the second slit.

合宜地,處理器310係配置用於將不同子區域的不同結構元件的圖像資訊進行比較,其中每個結構元件係位在相對於包括該結構元件的子區域的邊界的實質上相同位置處。Conveniently, the processor 310 is configured to compare image information of different structural elements of different sub-regions, wherein each structural element is tied at substantially the same position relative to a boundary of a sub-region comprising the structural element .

合宜地,處理器310係配置用於將靠近第一陣列的重複結構元件邊緣的結構元件的圖像資訊與靠近第二陣列的對應邊緣的對應元件的圖像資訊相比較。Conveniently, the processor 310 is configured to compare image information of structural elements proximate the edges of the repeating structural elements of the first array with image information of corresponding elements proximate to corresponding edges of the second array.

合宜地,處理器310係配置用於將包括在第一陣列的重複結構元件的外部分中的第一重複元件的圖像資訊與包括在第二陣列的重複結構元件的外部分中的對應重複元件的圖像資訊相比較。Conveniently, the processor 310 is configured to map image information of the first repeating element included in the outer portion of the repeating structural element of the first array with corresponding repeats in the outer portion of the repeating structural element included in the second array The image information of the component is compared.

合宜地,處理器310係配置用於將包含在第一陣列的重複結構元件的內部分中的第一重複元件的圖像資訊與包含在第一陣列的重複結構元件的內部分中的另一重複元件的圖像資訊相比較。Conveniently, the processor 310 is configured to image information of the first repeating element contained in the inner portion of the repeating structural element of the first array with another one of the inner portions of the repeating structural element included in the first array The image information of the repeating components is compared.

合宜地,提供一種電腦程式產品。其包括具有電腦可讀程式的電腦可用媒體,其中該電腦可讀程式,當在電腦上執行時,使電腦可執行以下步驟:接收物件一區域的圖像;其中該區域包括至少部分地被至少一組非重複區域所圍繞的多個陣列的重複結構元件;其中屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中非重複區域以重複方式排列;以及回應第一子區域的圖像資訊與靠近第一子區域的第二子區域的圖像資訊之間的比較,而提供評估結果;其中第一子區域包括第一陣列的重複結構元件和第一非重複區域;其中第二子區域包括第二陣列的重複結構元件和第二非重複區域。Suitably, a computer program product is provided. The computer includes a computer readable program, wherein the computer readable program, when executed on a computer, causes the computer to perform the steps of: receiving an image of an area of the object; wherein the area includes at least partially at least partially a plurality of arrays of repeating structural elements surrounded by a set of non-overlapping regions; wherein the plurality of non-repetitive regions belonging to a single set of non-overlapping regions are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner; and responsive to the first sub-region Providing an evaluation result between the image information and image information of the second sub-area adjacent to the first sub-region; wherein the first sub-region includes the first array of repeating structural elements and the first non-repetitive region; wherein The two sub-regions include a repeating structural element of the second array and a second non-repetitive region.

合宜地,電腦程式產品使電腦可將第一子區域的圖像資訊與第二子區域的圖像資訊進行比較;其中第一子區域包括第一陣列的儲存單元以及包括有第一縫的第一非重複區域;其中第二子區域包括第二陣列的儲存單元和包括有第二縫的第二非重複區域。Conveniently, the computer program product enables the computer to compare the image information of the first sub-area with the image information of the second sub-area; wherein the first sub-area includes the first array of storage units and the first slot a non-repetitive region; wherein the second sub-region includes a second array of storage units and a second non-repetitive region including a second slit.

合宜地,電腦程式產品使電腦可比較不同子區域的不同結構元件的圖像資訊;其中每個結構元件係位在相對於包括結構元件的子區域的邊界的實質上相同位置處。Conveniently, the computer program product enables the computer to compare image information of different structural elements of different sub-areas; wherein each structural element is tied at substantially the same position relative to the boundary of the sub-area including the structural element.

合宜地,電腦程式產品使電腦可將靠近第一陣列的重複結構元件的邊緣的結構元件的圖像資訊與靠近第二陣列的重複結構元件的對應邊緣的對應元件的圖像資訊相比較。Conveniently, the computer program product enables the computer to compare image information of structural elements near the edges of the repeating structural elements of the first array with image information of corresponding elements adjacent the corresponding edges of the repeating structural elements of the second array.

合宜地,電腦程式產品使電腦可將包括在第一陣列的重複結構元件的外部分中的第一重複元件的圖像資訊與包括在第二陣列的重複結構元件的外部分中的對應重複元件的圖像資訊相比較。Conveniently, the computer program product causes the computer to image information of the first repeating element included in the outer portion of the repeating structural element of the first array with corresponding repeating elements included in the outer portion of the repeating structural element of the second array The image information is compared.

合宜地,電腦程式產品使電腦可將包括在第一陣列的重複結構元件的內部分中的第一重複元件的圖像資訊與包括在第一陣列的重複結構元件的內部分中的另一重複元件的圖像資訊相比較。Conveniently, the computer program product causes the computer to image information of the first repeating element included in the inner portion of the repeating structural element of the first array with another repeat included in the inner portion of the repeating structural element of the first array The image information of the component is compared.

注意雖然以上正文涉及兩個子區域的結構元件的圖像資訊之間的比較,但可實施超過兩個不同子區域的結構元件之間的多個比較。例如,如果兩個子區域的兩個理想地相同的對應結構元件的圖像資訊之間存在差別,則可進行至少一個額外比較,從而確定進行比較的該等兩個理想相同的對應結構元件中的哪個結構元件為缺陷的。Note that while the above text relates to the comparison between image information of structural elements of two sub-regions, multiple comparisons between structural elements of more than two different sub-regions may be implemented. For example, if there is a difference between the image information of two ideally identical structural elements of the two sub-regions, at least one additional comparison can be made to determine the two ideally identical corresponding structural elements to be compared. Which structural component is defective.

進一步注意到該方法、系統和電腦程式產品可針對子 區域的圖像資訊與「黃金」子區域的圖像資訊之間的比較進行適當修正。因此,第一子區域的圖像資訊可與第二子區域的圖像資訊相比較。Further noting that the method, system and computer program product can be targeted The comparison between the image information of the area and the image information of the "gold" sub-area is appropriately corrected. Therefore, the image information of the first sub-area can be compared with the image information of the second sub-area.

本領域的熟習技術人員將容易理解不同的修改和變化可應用於如以上所述的本發明的實施方式,而不偏離所附申請專利範圍書限定的保護範圍。A person skilled in the art will readily appreciate that various modifications and variations can be applied to the embodiments of the invention as described above without departing from the scope of the invention as defined by the appended claims.

8‧‧‧晶圓區域8‧‧‧ Wafer area

10-18‧‧‧儲存單元陣列10-18‧‧‧Storage unit array

20-30‧‧‧水平縫20-30‧‧‧ horizontal seam

30‧‧‧第一子區域30‧‧‧First subregion

40‧‧‧第二子區域40‧‧‧Second subregion

10(1),13(1)‧‧‧內部分10(1), 13(1) ‧‧‧

10(2),13(2)‧‧‧外部分10(2), 13(2) ‧ ‧ outer parts

為了理解本發明並說明實際如何實施,將僅透過非限制實施例的方式,參照附圖描述實施方式,其中:第1圖示出晶圓的一區域;第2圖示出根據本發明的實施方式的兩個子區域;第3圖示出根據本發明的另一實施方式的兩個子區域;第4圖示出根據本發明的實施方式的方法;第5圖示出根據本發明的另一實施方式的方法;以及第6圖示出根據本發明的實施方式的系統。In order to understand the present invention and to explain how it is actually implemented, the embodiments will be described with reference to the accompanying drawings, by way of non-limiting embodiments, in which: FIG. 1 shows an area of a wafer; FIG. 2 shows an implementation according to the present invention. Two sub-regions of the mode; Figure 3 shows two sub-regions according to another embodiment of the invention; Figure 4 shows a method according to an embodiment of the invention; Figure 5 shows another method according to the invention A method of an embodiment; and a sixth diagram illustrates a system in accordance with an embodiment of the present invention.

Claims (4)

一種用於評估一物件的方法,該方法包括以下步驟:獲得該物件一區域的一圖像;其中該區域包括至少部分地被至少一組非重複區域所圍繞的多個陣列的重複結構元件;其中屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中該等非重複區域以重複方式排列;以及回應一第一子區域的圖像資訊與緊鄰該第一子區域的一第二子區域的圖像資訊之間的一比較,而提供一評估結果;其中該第一子區域包括一第一陣列的重複結構元件和一第一非重複區域;其中該第二子區域包括一第二陣列的重複結構元件和一第二非重複區域,其中該比較包含以下至少一者:一第一陣列儲存單元及一包括有一第一縫的一第一非重複區域的圖像資訊與一第二陣列儲存單元及一包括有一第二縫的第二非重複區域的圖像資訊之兩圖像資訊之間的比較,不同子區域的不同結構元件的圖像資訊之比較,其中每個結構元件係位在相對於包括該結構元件的一子區域的邊界的實質上相同位置處,靠近該第一陣列的重複結構元件的一邊緣的結構元件的圖像資訊與靠近該第二陣列的重複結構元件的一對應邊緣的對應元件的圖像資訊之兩圖像資訊之間的比較,包含在該第一陣列的重複結構元件的一外部分中的一第一重複元件的圖像資訊與包括在該第二陣列的重複結構元件的一外部分中的一對應重複元件的圖像資訊之兩圖像資訊之間的比較, 在該第一陣列的重複結構元件的一內部分中的一第一重複元件的圖像資訊與包含在該第一陣列的重複結構元件的該內部分中的另一重複元件的圖像資訊之兩圖像資訊之間的比較。 A method for evaluating an object, the method comprising the steps of: obtaining an image of a region of the object; wherein the region comprises a plurality of arrays of repeating structural elements at least partially surrounded by at least one set of non-repetitive regions; The plurality of non-repetitive regions belonging to a single group of non-repetitive regions are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner; and image information in response to a first sub-region and a first portion adjacent to the first sub-region Providing an evaluation result between the image information of the two sub-regions, wherein the first sub-region includes a first array of repeating structural elements and a first non-repetitive region; wherein the second sub-region includes a a second array of repeating structural elements and a second non-overlapping region, wherein the comparing comprises at least one of: a first array of storage units and an image information including a first non-repetitive region including a first slit and a Comparison between two image information of the image information of the second array storage unit and a second non-repetitive area including a second slit, not of different sub-areas Comparison of image information of structural elements, wherein each structural element is tied at substantially the same position relative to a boundary of a sub-area comprising the structural element, adjacent to an edge of the repeating structural element of the first array A comparison between the image information of the component and the image information of the image information of the corresponding component of a corresponding edge of the repeating structural component of the second array is included in an outer portion of the repeating structural component of the first array a comparison between image information of a first repeating element and image information of image information of a corresponding repeating element included in an outer portion of the repeating structural element of the second array, Image information of a first repeating element in an inner portion of the repeating structural element of the first array and image information of another repeating element included in the inner portion of the repeating structural element of the first array A comparison between two image information. 一種用於評估一物件的系統,該系統包括:一儲存單元,該儲存單元係配置用於儲存該物件一區域的一圖像;其中該區域包括至少部分地被至少一組非重複區域所圍繞的多個陣列的重複結構元件;其中屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中該等非重複區域以重複的方式排列;以及一處理器,該處理器係配置用於回應一第一子區域的圖像資訊與緊鄰該第一子區域的一第二子區域的圖像資訊之間的比較,而提供一評估結果;其中該第一子區域包括一第一陣列的重複結構元件和一第一非重複區域;其中該第二子區域包括一第二陣列的重複結構元件和一第二非重複區域,其中該比較包含以下至少一者:一第一陣列儲存單元及一包括有一第一縫的一第一非重複區域的圖像資訊與一第二陣列儲存單元及一包括有一第二縫的第二非重複區域的圖像資訊之兩圖像資訊之間的比較,不同子區域的不同結構元件的圖像資訊之比較;其中每個結構元件係位在相對於包括該結構元件的一子區域的邊界的實質上相同位置處,靠近該第一陣列的重複結構元件的一邊緣的結構元件的圖像資訊與靠近該第二陣列的重複結構元件的一對應 邊緣的對應元件的圖像資訊之兩圖像資訊之間的比較,包含在該第一陣列的重複結構元件的一外部分中的一第一重複元件的圖像資訊與包含在該第二陣列的重複結構元件的一外部分中的一對應重複結構元件的圖像資訊之兩圖像資訊之間的比較,在該第一陣列的重複結構元件的一內部分中的一第一重複元件的圖像資訊與包含在該第一陣列的重複結構元件的該內部分中的另一重複結構元件的圖像資訊之兩圖像資訊之間的比較。 A system for evaluating an object, the system comprising: a storage unit configured to store an image of an area of the object; wherein the area includes at least partially surrounded by at least one set of non-repetitive areas Repeating structural elements of a plurality of arrays; wherein the plurality of non-repetitive regions belonging to a single set of non-repetitive regions are desirably identical to each other; wherein the non-repetitive regions are arranged in a repeating manner; and a processor configured for use in the processor Providing an evaluation result in response to comparison between image information of a first sub-area and image information of a second sub-area adjacent to the first sub-area; wherein the first sub-area includes a first array a repeating structural element and a first non-repetitive region; wherein the second sub-region comprises a second array of repeating structural elements and a second non-repetitive region, wherein the comparing comprises at least one of: a first array of storage units And image information including a first non-repeating area having a first slit and a second array storage unit and a second non-repeating including a second slit Comparison of image information between two image information of a domain, comparison of image information of different structural elements of different sub-regions; wherein each structural component is tied to a boundary with respect to a sub-region including the structural component At substantially the same position, image information of structural elements near an edge of the repeating structural element of the first array and a corresponding one of the repeating structural elements of the second array Comparing the two image information of the image information of the corresponding component of the edge, the image information of a first repeating component included in an outer portion of the repeating structural component of the first array is included in the second array Comparing between two image information of image information of a corresponding repeating structural element in an outer portion of the repeating structural element, a first repeating element in an inner portion of the repeating structural element of the first array A comparison between image information and two image information of image information of another repeating structural element contained in the inner portion of the repeating structural element of the first array. 如申請專利範圍第2項所述之系統,包括一圖像採集單元,該圖像採集單元係配置用於光學式獲得該物件該區域的一圖像。 A system as claimed in claim 2, comprising an image acquisition unit configured to optically obtain an image of the area of the object. 一種電腦程式產品,該電腦程式產品包括具有一電腦可讀程式的一電腦可用媒體,其中該電腦可讀程式,當在一電腦上執行時,使該電腦可執行以下步驟:接收該物件一區域的一圖像;其中該區域包括至少部分地被至少一組非重複區域所圍繞的多個陣列的重複結構元件;其中屬於單一組非重複區域的多數非重複區域理想地為彼此相同;其中該等非重複區域以重複方式排列;以及回應一第一子區域的圖像資訊與緊鄰該第一子區域的一第二子區域的圖像資訊之間的比較,而提供一評估結果;其中該第一子區域包括一第一陣列的重複結構元件和一第一非重複區域;其中該第二子區域包括一第二陣列的重複結構元件和一第二非重複區域;其中該比較包含以下至少一者: 一第一陣列儲存單元及一包括有一第一縫的一第一非重複區域的圖像資訊與一第二陣列儲存單元及一包括有一第二縫的第二非重複區域的圖像資訊之兩圖像資訊之間的比較,不同子區域的不同結構元件的圖像資訊之比較;其中每個結構元件係位在相對於包括該結構元件的一子區域的邊界的實質上相同位置處,靠近該第一陣列重複結構元件的一邊緣的結構元件的圖像資訊與靠近該第二陣列的重複結構元件的一對應邊緣的一對應元件的圖像資訊之兩圖像資訊之間的比較,包含在該第一陣列的重複結構元件的一外部分中的一第一重複元件的圖像資訊與包含在該第二陣列的重複結構元件的一外部分中的一對應重複結構元件的圖像資訊之兩圖像資訊之間的比較,在該第一陣列的重複結構元件的一內部分中的一第一重複元件的圖像資訊與包含在該第一陣列的重複結構元件的該內部分中的另一重複結構元件的圖像資訊之兩圖像資訊之間的比較。A computer program product comprising a computer usable medium having a computer readable program, wherein when executed on a computer, the computer can perform the following steps: receiving an area of the object An image; the region comprising a plurality of arrays of repeating structural elements at least partially surrounded by at least one set of non-overlapping regions; wherein the plurality of non-repetitive regions belonging to a single set of non-overlapping regions are desirably identical to each other; And the non-repeating regions are arranged in a repeated manner; and an evaluation result is provided by comparing the image information of the first sub-region with the image information of a second sub-region immediately adjacent to the first sub-region; The first sub-region includes a first array of repeating structural elements and a first non-repetitive region; wherein the second sub-region includes a second array of repeating structural elements and a second non-repetitive region; wherein the comparing comprises at least the following One: Image information of a first array storage unit and a first non-repetitive area including a first slit and image information of a second array storage unit and a second non-repetitive area including a second slit Comparison of image information, comparison of image information of different structural elements of different sub-areas; wherein each structural element is tied at substantially the same position relative to a boundary of a sub-area including the structural element, Comparison between image information of structural elements of one edge of the first array of repeating structural elements and image information of image information of a corresponding element of a corresponding edge of the repeating structural element of the second array, including Image information of a first repeating element in an outer portion of the repeating structural element of the first array and image information of a corresponding repeating structural element included in an outer portion of the repeating structural element of the second array Comparing the two image information, the image information of a first repeating element in an inner portion of the repeating structural element of the first array and the weight contained in the first array Comparison between the two image information of another repeating structural information elements of the inner portion of the structural element.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020094120A1 (en) * 1996-09-17 2002-07-18 Takashi Hiroi Method and system for inspecting a pattern
US7065239B2 (en) * 2001-10-24 2006-06-20 Applied Materials, Inc. Automated repetitive array microstructure defect inspection
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
US20070206184A1 (en) * 2006-03-01 2007-09-06 Sachio Uto Defect inspection method and system
TW200802188A (en) * 2006-03-16 2008-01-01 Sony Corp Image processing apparatus and method, program recording medium and program

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020094120A1 (en) * 1996-09-17 2002-07-18 Takashi Hiroi Method and system for inspecting a pattern
US7065239B2 (en) * 2001-10-24 2006-06-20 Applied Materials, Inc. Automated repetitive array microstructure defect inspection
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
US20070206184A1 (en) * 2006-03-01 2007-09-06 Sachio Uto Defect inspection method and system
TW200802188A (en) * 2006-03-16 2008-01-01 Sony Corp Image processing apparatus and method, program recording medium and program

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