SG86888G - Flexible directly solderable conductive compositions,compositions useful in forming them,and their use as coatings on substrates - Google Patents
Flexible directly solderable conductive compositions,compositions useful in forming them,and their use as coatings on substratesInfo
- Publication number
- SG86888G SG86888G SG868/88A SG86888A SG86888G SG 86888 G SG86888 G SG 86888G SG 868/88 A SG868/88 A SG 868/88A SG 86888 A SG86888 A SG 86888A SG 86888 G SG86888 G SG 86888G
- Authority
- SG
- Singapore
- Prior art keywords
- compositions
- conductive compositions
- substrates
- forming
- coatings
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/631,973 US4595604A (en) | 1984-07-18 | 1984-07-18 | Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates |
CN85105454A CN85105454B (zh) | 1984-07-18 | 1985-07-17 | 低阻值电阻组合物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG86888G true SG86888G (en) | 1989-06-16 |
Family
ID=25741880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG868/88A SG86888G (en) | 1984-07-18 | 1988-12-08 | Flexible directly solderable conductive compositions,compositions useful in forming them,and their use as coatings on substrates |
Country Status (10)
Country | Link |
---|---|
US (1) | US4595604A (zh) |
EP (1) | EP0169059B1 (zh) |
JP (1) | JPS6143644A (zh) |
KR (1) | KR930000776B1 (zh) |
CN (1) | CN85105454B (zh) |
AT (1) | ATE36918T1 (zh) |
CA (1) | CA1254323A (zh) |
DE (1) | DE3564742D1 (zh) |
PH (1) | PH22389A (zh) |
SG (1) | SG86888G (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4680141A (en) * | 1984-11-29 | 1987-07-14 | Mcdonnell Douglas Corporation | Solder composition |
US4673532A (en) * | 1986-01-22 | 1987-06-16 | Mcdonnell Douglas Corporation | Rosin-free solder composition |
US4732702A (en) * | 1986-02-13 | 1988-03-22 | Hitachi Chemical Company, Ltd. | Electroconductive resin paste |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
US4959178A (en) * | 1987-01-27 | 1990-09-25 | Advanced Products Inc. | Actinic radiation-curable conductive polymer thick film compositions and their use thereof |
US4795508A (en) * | 1987-02-05 | 1989-01-03 | Shell Internationale Research Maatschappij B.V. | Soldering compositions |
US5141777A (en) * | 1990-05-02 | 1992-08-25 | Advanced Products, Inc. | Highly conductive polymer thick film compositions |
US5112687A (en) * | 1990-05-02 | 1992-05-12 | Advanced Products Inc. | Highly conductive polymer thick film compositions |
US5089173A (en) * | 1990-05-02 | 1992-02-18 | Advanced Products Inc. | Highly conductive polymer thick film compositions |
JPH07123179B2 (ja) * | 1990-10-05 | 1995-12-25 | 信越ポリマー株式会社 | 異方導電接着剤による回路基板の接続構造 |
JPH0826251B2 (ja) * | 1991-06-05 | 1996-03-13 | 福田金属箔粉工業株式会社 | 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料 |
KR19990008423A (ko) * | 1995-05-10 | 1999-01-25 | 데이비드 제이. 크루거 | 양의 온도 계수 회로 보호 디바이스 및 그 제조 방법 |
US5663702A (en) * | 1995-06-07 | 1997-09-02 | Littelfuse, Inc. | PTC electrical device having fuse link in series and metallized ceramic electrodes |
US6023403A (en) | 1996-05-03 | 2000-02-08 | Littlefuse, Inc. | Surface mountable electrical device comprising a PTC and fusible element |
US6282072B1 (en) | 1998-02-24 | 2001-08-28 | Littelfuse, Inc. | Electrical devices having a polymer PTC array |
US6582647B1 (en) | 1998-10-01 | 2003-06-24 | Littelfuse, Inc. | Method for heat treating PTC devices |
US6218446B1 (en) | 1999-01-11 | 2001-04-17 | Dymax Corporation | Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced |
US6602741B1 (en) * | 1999-09-14 | 2003-08-05 | Matsushita Electric Industrial Co., Ltd. | Conductive composition precursor, conductive composition, solid electrolytic capacitor, and their manufacturing method |
JP3787717B2 (ja) | 1999-12-28 | 2006-06-21 | ニッタ株式会社 | 感圧導電性インク組成物 |
US6750301B1 (en) * | 2000-07-07 | 2004-06-15 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups |
US6628498B2 (en) | 2000-08-28 | 2003-09-30 | Steven J. Whitney | Integrated electrostatic discharge and overcurrent device |
US6824857B2 (en) | 2001-04-02 | 2004-11-30 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
EP1383364A3 (en) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
WO2006115240A1 (ja) * | 2005-04-25 | 2006-11-02 | Murata Manufacturing Co., Ltd. | 抵抗ペースト、可変抵抗器及びその製造方法 |
MY153335A (en) * | 2009-02-16 | 2015-01-29 | Cytec Tech Corp | Conductive surfacing films for lightning strike and electromagnetic interferance shielding of thermoset composite materials |
CN102803406B (zh) * | 2009-06-12 | 2015-10-14 | 洛德公司 | 防止基底被雷击的方法 |
US20150104625A1 (en) * | 2012-04-27 | 2015-04-16 | Taiyo Ink Mfg. Co., Ltd. | Electroconductive composition |
KR101633013B1 (ko) * | 2012-12-31 | 2016-06-24 | 주식회사 아모그린텍 | 연성인쇄회로기판 |
CN105629027A (zh) * | 2014-10-31 | 2016-06-01 | 北京精密机电控制设备研究所 | 一种高可靠高耐磨导电塑料电位计 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3412043A (en) * | 1966-08-05 | 1968-11-19 | Dexter Corp | Electrically conductive resinous compositions |
JPS57185316A (en) * | 1981-05-11 | 1982-11-15 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin paste |
US4371459A (en) * | 1981-12-17 | 1983-02-01 | E. I. Du Pont De Nemours And Company | Flexible screen-printable conductor composition |
US4535012A (en) * | 1983-09-30 | 1985-08-13 | Electro Materials Corp. Of America | Fast curing solderable conductor |
US4564563A (en) * | 1983-09-30 | 1986-01-14 | Electro Materials Corp. Of America | Solderable conductor |
-
1984
- 1984-07-18 US US06/631,973 patent/US4595604A/en not_active Expired - Fee Related
-
1985
- 1985-06-26 CA CA000485268A patent/CA1254323A/en not_active Expired
- 1985-07-02 PH PH32474A patent/PH22389A/en unknown
- 1985-07-17 AT AT85305081T patent/ATE36918T1/de not_active IP Right Cessation
- 1985-07-17 EP EP85305081A patent/EP0169059B1/en not_active Expired
- 1985-07-17 CN CN85105454A patent/CN85105454B/zh not_active Expired
- 1985-07-17 JP JP60156176A patent/JPS6143644A/ja active Pending
- 1985-07-17 DE DE8585305081T patent/DE3564742D1/de not_active Expired
- 1985-07-18 KR KR1019850005126A patent/KR930000776B1/ko active IP Right Grant
-
1988
- 1988-12-08 SG SG868/88A patent/SG86888G/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0169059A3 (en) | 1986-08-20 |
EP0169059A2 (en) | 1986-01-22 |
KR860001362A (ko) | 1986-02-26 |
ATE36918T1 (de) | 1988-09-15 |
CN85105454B (zh) | 1988-06-22 |
US4595604A (en) | 1986-06-17 |
PH22389A (en) | 1988-08-12 |
DE3564742D1 (en) | 1988-10-06 |
CN85105454A (zh) | 1987-01-28 |
EP0169059B1 (en) | 1988-08-31 |
KR930000776B1 (ko) | 1993-02-04 |
CA1254323A (en) | 1989-05-16 |
JPS6143644A (ja) | 1986-03-03 |
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