DE3564742D1 - Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates - Google Patents

Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates

Info

Publication number
DE3564742D1
DE3564742D1 DE8585305081T DE3564742T DE3564742D1 DE 3564742 D1 DE3564742 D1 DE 3564742D1 DE 8585305081 T DE8585305081 T DE 8585305081T DE 3564742 T DE3564742 T DE 3564742T DE 3564742 D1 DE3564742 D1 DE 3564742D1
Authority
DE
Germany
Prior art keywords
compositions
conductive compositions
substrates
flexible
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585305081T
Other languages
English (en)
Inventor
Frank Wayne Martin
Samson Shahbazi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Materials Corp of America
Original Assignee
Electro Materials Corp of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Materials Corp of America filed Critical Electro Materials Corp of America
Application granted granted Critical
Publication of DE3564742D1 publication Critical patent/DE3564742D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE8585305081T 1984-07-18 1985-07-17 Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates Expired DE3564742D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/631,973 US4595604A (en) 1984-07-18 1984-07-18 Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates
CN85105454A CN85105454B (zh) 1984-07-18 1985-07-17 低阻值电阻组合物

Publications (1)

Publication Number Publication Date
DE3564742D1 true DE3564742D1 (en) 1988-10-06

Family

ID=25741880

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585305081T Expired DE3564742D1 (en) 1984-07-18 1985-07-17 Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates

Country Status (10)

Country Link
US (1) US4595604A (de)
EP (1) EP0169059B1 (de)
JP (1) JPS6143644A (de)
KR (1) KR930000776B1 (de)
CN (1) CN85105454B (de)
AT (1) ATE36918T1 (de)
CA (1) CA1254323A (de)
DE (1) DE3564742D1 (de)
PH (1) PH22389A (de)
SG (1) SG86888G (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
US4673532A (en) * 1986-01-22 1987-06-16 Mcdonnell Douglas Corporation Rosin-free solder composition
US4732702A (en) * 1986-02-13 1988-03-22 Hitachi Chemical Company, Ltd. Electroconductive resin paste
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US4959178A (en) * 1987-01-27 1990-09-25 Advanced Products Inc. Actinic radiation-curable conductive polymer thick film compositions and their use thereof
US4795508A (en) * 1987-02-05 1989-01-03 Shell Internationale Research Maatschappij B.V. Soldering compositions
US5112687A (en) * 1990-05-02 1992-05-12 Advanced Products Inc. Highly conductive polymer thick film compositions
US5089173A (en) * 1990-05-02 1992-02-18 Advanced Products Inc. Highly conductive polymer thick film compositions
US5141777A (en) * 1990-05-02 1992-08-25 Advanced Products, Inc. Highly conductive polymer thick film compositions
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
JPH0826251B2 (ja) * 1991-06-05 1996-03-13 福田金属箔粉工業株式会社 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料
CN1185230A (zh) * 1995-05-10 1998-06-17 保险丝公司 Ptc电路保护装置及其制造过程
US5663702A (en) * 1995-06-07 1997-09-02 Littelfuse, Inc. PTC electrical device having fuse link in series and metallized ceramic electrodes
US6023403A (en) 1996-05-03 2000-02-08 Littlefuse, Inc. Surface mountable electrical device comprising a PTC and fusible element
US6282072B1 (en) 1998-02-24 2001-08-28 Littelfuse, Inc. Electrical devices having a polymer PTC array
US6582647B1 (en) 1998-10-01 2003-06-24 Littelfuse, Inc. Method for heat treating PTC devices
US6218446B1 (en) 1999-01-11 2001-04-17 Dymax Corporation Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US6602741B1 (en) * 1999-09-14 2003-08-05 Matsushita Electric Industrial Co., Ltd. Conductive composition precursor, conductive composition, solid electrolytic capacitor, and their manufacturing method
JP3787717B2 (ja) * 1999-12-28 2006-06-21 ニッタ株式会社 感圧導電性インク組成物
US6750301B1 (en) * 2000-07-07 2004-06-15 National Starch And Chemical Investment Holding Corporation Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
US6628498B2 (en) 2000-08-28 2003-09-30 Steven J. Whitney Integrated electrostatic discharge and overcurrent device
WO2002080637A1 (en) 2001-04-02 2002-10-10 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
EP1383364A3 (de) * 2002-05-23 2006-01-04 Nashua Corporation Schaltungselemente mit tintenaufnehmender Beschichtung und einer Leiterbahn und Verfahren zu deren Herstellung
CN101147212B (zh) * 2005-04-25 2011-09-14 株式会社村田制作所 电阻膏、可变电阻器及其制造方法
CN104194454B (zh) * 2009-02-16 2019-01-08 塞特克技术公司 用于热固性复合材料的雷击及电磁干扰屏蔽的共固化导电表面膜
CN102803406B (zh) * 2009-06-12 2015-10-14 洛德公司 防止基底被雷击的方法
US20150104625A1 (en) * 2012-04-27 2015-04-16 Taiyo Ink Mfg. Co., Ltd. Electroconductive composition
KR101639411B1 (ko) * 2012-12-31 2016-07-14 주식회사 아모그린텍 연성인쇄회로기판
CN105629027A (zh) * 2014-10-31 2016-06-01 北京精密机电控制设备研究所 一种高可靠高耐磨导电塑料电位计

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4371459A (en) * 1981-12-17 1983-02-01 E. I. Du Pont De Nemours And Company Flexible screen-printable conductor composition
US4564563A (en) * 1983-09-30 1986-01-14 Electro Materials Corp. Of America Solderable conductor
US4535012A (en) * 1983-09-30 1985-08-13 Electro Materials Corp. Of America Fast curing solderable conductor

Also Published As

Publication number Publication date
SG86888G (en) 1989-06-16
PH22389A (en) 1988-08-12
EP0169059A3 (en) 1986-08-20
US4595604A (en) 1986-06-17
KR930000776B1 (ko) 1993-02-04
ATE36918T1 (de) 1988-09-15
CA1254323A (en) 1989-05-16
CN85105454A (zh) 1987-01-28
JPS6143644A (ja) 1986-03-03
KR860001362A (ko) 1986-02-26
EP0169059B1 (de) 1988-08-31
EP0169059A2 (de) 1986-01-22
CN85105454B (zh) 1988-06-22

Similar Documents

Publication Publication Date Title
DE3564742D1 (en) Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates
DE3564743D1 (en) Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them
IT8448620A0 (it) Procedimento e composizione per migliorare l'adesione di materiali composti e resine a dentina,smalto ed altri substrati
IL75492A0 (en) Solventless,polyimide-modified epoxy adhesive compositions
AU574692B2 (en) Substrate having fluoropolymer coating
AU575017B2 (en) Modified epoxy resins and coating compositions containing them
JPS56129246A (en) Epoxy resin composition
AU565919B2 (en) Electrically and thermally conductive adhesive transfer tape
DE3062969D1 (en) Precondensed heat-curable aqueous varnish-coating composition and application thereof to the cathodic electrodeposition on electro-conductive substrates
DE3676811D1 (de) Pulverfoermige beschichtungszusammensetzung aus epoxyharz.
AU3133084A (en) Curable epoxy resin composition
AU3184984A (en) Film-forming polymer coating compositions
EP0127915A3 (en) Novel polyglycidyl ethers, their preparation and their use as thermosetting coating compositions
DE3362458D1 (en) Use of unsaturated polyesters as additional adhesive binders in coating compositions for metals
ES8501162A1 (es) Un procedimiento para la preparacion de un conductor electrico aislado
JPS5269936A (en) Thermosetting powder coating composition
IE850184L (en) Circuit boards made of laminates
AU8931982A (en) Epoxy resin composition
HK57781A (en) Graft polymer compositions of terminated epoxy resin,processes for making ans using same,and substrates coated the rewith
JPS52139141A (en) Improved thermosetting coating compositions
SU471148A1 (ru) Разделительное покрытие дл модельной оснастки
GB2150571B (en) Primer coating composition, and epoxy resin varnish
JPS5620078A (en) Hot-melt adhesive composition and bonding method employing thereof
JPS51125131A (en) Expoxide resin composition
JPS5422473A (en) Connection of base board

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee