SG83695A1 - Apparatus and method for processing - Google Patents

Apparatus and method for processing

Info

Publication number
SG83695A1
SG83695A1 SG9805868A SG1998005868A SG83695A1 SG 83695 A1 SG83695 A1 SG 83695A1 SG 9805868 A SG9805868 A SG 9805868A SG 1998005868 A SG1998005868 A SG 1998005868A SG 83695 A1 SG83695 A1 SG 83695A1
Authority
SG
Singapore
Prior art keywords
processing
Prior art date
Application number
SG9805868A
Other languages
English (en)
Inventor
Nakai Izuru
Muneyuki Ken
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG83695A1 publication Critical patent/SG83695A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B23K26/037—Aligning the laser beam by pressing on the workpiece, e.g. pressing roller foot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
SG9805868A 1997-12-25 1998-12-19 Apparatus and method for processing SG83695A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35685297 1997-12-25

Publications (1)

Publication Number Publication Date
SG83695A1 true SG83695A1 (en) 2001-10-16

Family

ID=18451090

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9805868A SG83695A1 (en) 1997-12-25 1998-12-19 Apparatus and method for processing

Country Status (4)

Country Link
US (1) US6303902B1 (de)
DE (1) DE19859064B4 (de)
GB (1) GB2332637B (de)
SG (1) SG83695A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19831558C1 (de) * 1998-07-14 2000-03-30 Siemens Ag Vorrichtung zum Laserbearbeiten von flachen Werkstücken
AU2002953443A0 (en) * 2002-12-19 2003-01-09 Modra Family Trust A laser cutting apparatus
WO2009009187A1 (en) * 2007-06-15 2009-01-15 Johnson Controls - Saft Advanced Power Solutions Llc Laser cutting system
DE102008001499B4 (de) * 2008-04-30 2022-01-27 manroland sheetfed GmbH Schneideinrichtung für eine Bogendruckmaschine
WO2012035721A1 (ja) * 2010-09-16 2012-03-22 パナソニック株式会社 レーザ加工装置およびレーザ加工方法
CN203910868U (zh) * 2014-06-25 2014-10-29 京东方科技集团股份有限公司 一种激光剥离设备
CN105750737B (zh) * 2014-12-18 2018-01-09 泰科电子(上海)有限公司 切割系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517436A (en) * 1982-09-20 1985-05-14 Automated Industrial Systems Laser marker for articles of manufacture
EP0200089A1 (de) * 1985-04-24 1986-11-05 Siemens Aktiengesellschaft Verfahren zur Bildung von schmalen, metallfreien Streifen in der Metallschicht von Kunststoffolien
EP0557942A1 (de) * 1992-02-26 1993-09-01 U.S. Amada Ltd. Verfahren und Vorrichtung zum Laserschneiden paketierter Metallfolien
WO1997011841A1 (en) * 1995-09-26 1997-04-03 Timothy Platt White Cutting of labels

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583561A (en) * 1968-12-19 1971-06-08 Transistor Automation Corp Die sorting system
GB1528451A (en) * 1974-10-03 1978-10-11 Atomic Energy Authority Uk Manufacture of bags
DE3110341C2 (de) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
JPS5916344A (ja) * 1982-07-19 1984-01-27 Toshiba Corp ウエハのレ−ザスクライブ装置
US4607167A (en) * 1982-10-19 1986-08-19 Varian Associates, Inc. Charged particle beam lithography machine incorporating localized vacuum envelope
US4584479A (en) * 1982-10-19 1986-04-22 Varian Associates, Inc. Envelope apparatus for localized vacuum processing
DE3811748A1 (de) * 1988-04-08 1989-10-19 Messerschmitt Boelkow Blohm Mikrobauelement
EP1122174A3 (de) * 1992-12-23 2001-09-12 Greydon Wesley Nedblake, Jr. System zur Herstellung von Etiketten von einem Band
JPH09136180A (ja) 1995-11-10 1997-05-27 Amada Co Ltd レーザ加工方法およびその装置
JP3571519B2 (ja) 1997-02-06 2004-09-29 松下電器産業株式会社 レーザ加工装置およびレーザ加工方法
US6090330A (en) * 1997-02-06 2000-07-18 Matsushita Electric Industrial Co., Ltd. Laser processing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517436A (en) * 1982-09-20 1985-05-14 Automated Industrial Systems Laser marker for articles of manufacture
EP0200089A1 (de) * 1985-04-24 1986-11-05 Siemens Aktiengesellschaft Verfahren zur Bildung von schmalen, metallfreien Streifen in der Metallschicht von Kunststoffolien
EP0557942A1 (de) * 1992-02-26 1993-09-01 U.S. Amada Ltd. Verfahren und Vorrichtung zum Laserschneiden paketierter Metallfolien
WO1997011841A1 (en) * 1995-09-26 1997-04-03 Timothy Platt White Cutting of labels

Also Published As

Publication number Publication date
DE19859064A1 (de) 1999-08-12
GB9828026D0 (en) 1999-02-10
DE19859064B4 (de) 2005-08-04
GB2332637A (en) 1999-06-30
GB2332637B (en) 2000-03-08
US6303902B1 (en) 2001-10-16

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