SG83221A1 - Alloy composition and plating method - Google Patents

Alloy composition and plating method

Info

Publication number
SG83221A1
SG83221A1 SG200005770A SG200005770A SG83221A1 SG 83221 A1 SG83221 A1 SG 83221A1 SG 200005770 A SG200005770 A SG 200005770A SG 200005770 A SG200005770 A SG 200005770A SG 83221 A1 SG83221 A1 SG 83221A1
Authority
SG
Singapore
Prior art keywords
plating method
alloy composition
alloy
composition
plating
Prior art date
Application number
SG200005770A
Other languages
English (en)
Inventor
A Schetty Robert Iii
P Toben Michael
L Martin James
D Brown Neil
N Crosby Jeffrey
J Whitlaw Keith
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Publication of SG83221A1 publication Critical patent/SG83221A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
SG200005770A 1999-10-08 2000-10-09 Alloy composition and plating method SG83221A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15829799P 1999-10-08 1999-10-08
US46032799A 1999-12-10 1999-12-10

Publications (1)

Publication Number Publication Date
SG83221A1 true SG83221A1 (en) 2001-09-18

Family

ID=26854910

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200005770A SG83221A1 (en) 1999-10-08 2000-10-09 Alloy composition and plating method

Country Status (5)

Country Link
EP (1) EP1091023A3 (zh)
JP (1) JP2001158990A (zh)
KR (1) KR20010040038A (zh)
SG (1) SG83221A1 (zh)
TW (1) TW573071B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001172791A (ja) * 1999-12-16 2001-06-26 Ishihara Chem Co Ltd スズ−銅系合金メッキ浴、並びに当該メッキ浴によりスズ−銅系合金皮膜を形成した電子部品
JP2001262391A (ja) * 2000-03-14 2001-09-26 Ishihara Chem Co Ltd スズ−銅系合金メッキ浴並びに当該皮膜を形成した電子部品
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US7239747B2 (en) 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4817166B2 (ja) * 2004-04-16 2011-11-16 奥野製薬工業株式会社 スズ−銅合金めっき液
EP1930478B1 (en) * 2006-12-06 2013-06-19 Enthone, Inc. Electrolyte composition and method for the deposition of quaternary copper alloys
DE202007018616U1 (de) * 2007-09-14 2008-12-24 Zollern Bhw Gleitlager Gmbh & Co. Kg Gleitelement
JP5574912B2 (ja) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 スズめっき液
CN103215624B (zh) * 2013-04-18 2016-03-23 江门市瑞期精细化学工程有限公司 一种酸性无氰铜锡合金电镀液
IT202000011203A1 (it) * 2020-05-15 2021-11-15 Bluclad S P A Lega di bronzo inossidabile e suo impiego in prodotti galvanizzati

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565608A (en) * 1983-11-02 1986-01-21 Degussa Aktiengesellschaft Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings
US5534129A (en) * 1993-07-26 1996-07-09 Degussa Aktiengesellschaft Cyanidic-alkaline baths for the galvanic deposition of copper-tin alloy coatings, uses thereof, and metallic bases coated with said copper-tin alloy coating

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015716B2 (ja) * 1977-10-21 1985-04-20 デイツプソ−ル株式会社 錫または錫合金電気めつき用浴の安定化方法
GB2013241B (en) * 1977-11-16 1982-03-24 Dipsol Chem Electroplating bath for depositing tin or tin alloy with brightness
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
US4381228A (en) * 1981-06-16 1983-04-26 Occidental Chemical Corporation Process and composition for the electrodeposition of tin and tin alloys
US4879096A (en) * 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
JP3274766B2 (ja) * 1994-06-28 2002-04-15 荏原ユージライト株式会社 低融点錫合金めっき浴
JP3481020B2 (ja) * 1995-09-07 2003-12-22 ディップソール株式会社 Ｓｎ−Ｂｉ系合金めっき浴
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565608A (en) * 1983-11-02 1986-01-21 Degussa Aktiengesellschaft Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings
US5534129A (en) * 1993-07-26 1996-07-09 Degussa Aktiengesellschaft Cyanidic-alkaline baths for the galvanic deposition of copper-tin alloy coatings, uses thereof, and metallic bases coated with said copper-tin alloy coating

Also Published As

Publication number Publication date
EP1091023A2 (en) 2001-04-11
JP2001158990A (ja) 2001-06-12
KR20010040038A (ko) 2001-05-15
TW573071B (en) 2004-01-21
EP1091023A3 (en) 2003-05-14

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