SG82561A1 - Process for producing multilayer printed circuit boards - Google Patents

Process for producing multilayer printed circuit boards

Info

Publication number
SG82561A1
SG82561A1 SG9609923A SG1996009923A SG82561A1 SG 82561 A1 SG82561 A1 SG 82561A1 SG 9609923 A SG9609923 A SG 9609923A SG 1996009923 A SG1996009923 A SG 1996009923A SG 82561 A1 SG82561 A1 SG 82561A1
Authority
SG
Singapore
Prior art keywords
printed circuit
circuit boards
multilayer printed
producing multilayer
producing
Prior art date
Application number
SG9609923A
Other languages
English (en)
Inventor
Nakaso Akishi
Shimizu Hiroshi
Shibata Katsuji
Ogawa Nobuyuki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG82561A1 publication Critical patent/SG82561A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
SG9609923A 1995-06-01 1996-05-30 Process for producing multilayer printed circuit boards SG82561A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13508795A JP3624967B2 (ja) 1995-06-01 1995-06-01 多層プリント配線板の製造方法

Publications (1)

Publication Number Publication Date
SG82561A1 true SG82561A1 (en) 2001-08-21

Family

ID=15143533

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9609923A SG82561A1 (en) 1995-06-01 1996-05-30 Process for producing multilayer printed circuit boards

Country Status (8)

Country Link
US (1) US5945258A (ko)
EP (1) EP0746189B1 (ko)
JP (1) JP3624967B2 (ko)
KR (1) KR100250173B1 (ko)
CN (1) CN1074236C (ko)
DE (1) DE69634284D1 (ko)
SG (1) SG82561A1 (ko)
TW (1) TW318996B (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153359A (en) * 1995-06-01 2000-11-28 Hitachi Chemical Company, Ltd. Process for producing multilayer printed circuit boards
ID19337A (id) * 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini
WO2000018201A1 (de) * 1998-09-18 2000-03-30 Vantico Ag Verfahren zur herstellung von mehrlagenschaltungen
US6221568B1 (en) * 1999-10-20 2001-04-24 International Business Machines Corporation Developers for polychloroacrylate and polychloromethacrylate based resists
TW434664B (en) 1999-12-29 2001-05-16 Advanced Semiconductor Eng Lead-bond type chip package and method for making the same
US7061084B2 (en) 2000-02-29 2006-06-13 Advanced Semiconductor Engineering, Inc. Lead-bond type chip package and manufacturing method thereof
JP3765970B2 (ja) * 2000-07-12 2006-04-12 ソニーケミカル株式会社 エッチング液及びフレキシブル配線板の製造方法
KR100656635B1 (ko) * 2000-11-30 2006-12-12 두산인프라코어 주식회사 심압대의 위치이동장치
US6518096B2 (en) 2001-01-08 2003-02-11 Fujitsu Limited Interconnect assembly and Z-connection method for fine pitch substrates
JP5271467B2 (ja) * 2001-03-06 2013-08-21 日立化成株式会社 エポキシ接着フィルムによる仮接着方法
DE60232383D1 (de) * 2001-03-14 2009-06-25 Ibiden Co Ltd Mehrschichtige Leiterplatte
JP3690378B2 (ja) * 2002-07-26 2005-08-31 株式会社 日立ディスプレイズ 表示装置
US20040040651A1 (en) * 2002-08-28 2004-03-04 Kuraray Co., Ltd. Multi-layer circuit board and method of making the same
KR101083806B1 (ko) 2004-03-23 2011-11-18 다이요 아메리카 인코퍼레이티드 솔더 마스크 형성 방법, 그 장치 및 전기회로 패턴화된내부 절연층 형성 방법
CN103207524B (zh) * 2004-03-23 2014-08-20 太阳美国公司 形成焊接掩模的方法及其装置和形成电路构图的内部介电层的方法
JP2005347353A (ja) * 2004-05-31 2005-12-15 Sanyo Electric Co Ltd 回路装置およびその製造方法
CN101038263A (zh) * 2006-03-13 2007-09-19 华为技术有限公司 一种评估电路板腐蚀风险的方法和系统
KR101597478B1 (ko) * 2012-01-20 2016-02-24 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법
KR20130113376A (ko) * 2012-04-05 2013-10-15 타이코에이엠피(유) 인쇄회로기판 및 그 제조방법
CN104560459A (zh) * 2015-01-19 2015-04-29 通山瑞邦电子科技有限公司 一种多层板膨松剂及其制备方法
US10405421B2 (en) 2017-12-18 2019-09-03 International Business Machines Corporation Selective dielectric resin application on circuitized core layers
KR102002725B1 (ko) 2018-05-08 2019-10-01 에스팩 주식회사 중심국 터미널를 중심으로 루프 네트워크로 형성된 수동광가입자망 네트워크의 리모트노드 인식 구조
CN115976501A (zh) * 2022-12-27 2023-04-18 电子科技大学 绝缘基材表面金属图形及增材制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2203290A (en) * 1987-04-02 1988-10-12 Int Computers Ltd Manufacture of printed circuit boards
GB2259812A (en) * 1991-09-06 1993-03-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517604A (ja) * 1991-07-12 1993-01-26 Nissan Chem Ind Ltd ポリイミド樹脂のエツチング溶液
US5532105A (en) * 1992-08-07 1996-07-02 Hitachi Chemical Company, Ltd. Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board
CA2143833A1 (en) * 1993-07-07 1995-01-19 Walter Schmidt Structured printed circuit boards and foil printed circuit boards and process for the manufacture thereof
TW277204B (ko) * 1994-12-02 1996-06-01 Nippon Paint Co Ltd
US5761801A (en) * 1995-06-07 1998-06-09 The Dexter Corporation Method for making a conductive film composite
US5699613A (en) * 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2203290A (en) * 1987-04-02 1988-10-12 Int Computers Ltd Manufacture of printed circuit boards
GB2259812A (en) * 1991-09-06 1993-03-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method

Also Published As

Publication number Publication date
CN1074236C (zh) 2001-10-31
DE69634284D1 (de) 2005-03-10
EP0746189B1 (en) 2005-02-02
TW318996B (ko) 1997-11-01
JP3624967B2 (ja) 2005-03-02
JPH08330741A (ja) 1996-12-13
CN1140973A (zh) 1997-01-22
KR100250173B1 (ko) 2000-04-01
US5945258A (en) 1999-08-31
EP0746189A1 (en) 1996-12-04
KR970004993A (ko) 1997-01-29

Similar Documents

Publication Publication Date Title
SG46967A1 (en) Process for producing multilayer printed circuit board
SG82561A1 (en) Process for producing multilayer printed circuit boards
SG72743A1 (en) Process for producing multilayer printed circuit board for wire bonding
GB2324860B (en) Method and apparatus for manufacturing a multilayer printed circuit board
GB2300827B (en) Method for the preparation of waste from printed circuit boards
KR970700988A (ko) 다층 프린트 배선판 및 그 제조방법(multilayer printed wiring board and process for producing the same)
EP0591761A3 (en) A two-sided printed circuit board, a multi-layered printed circuit board, and a method for producing the same
EP0763562A3 (en) Prepreg for printed circuit board
EP1699279B8 (en) Multilayer printed wiring board and method for producing the same
EP0566043A3 (en) Method of producing boards for printed wiring
SG65717A1 (en) Printed circuit boards
EP0351034A3 (en) Process for producing printed wiring boards
GB9615001D0 (en) Printed circuit board
EP0678918A3 (en) Multi-layer circuit board.
EP0545328A3 (en) Printed circuit board manufacturing process
EP0519175A3 (en) Method for making multilayer electronic circuits
SG71716A1 (en) Multilayer printed circuit boards
EP0478320A3 (en) Method for manufacturing printed circuit board
TW452317U (en) Printed circuit boards
GB8800685D0 (en) Multilayer printed wiring boards & method for making same
GB9207285D0 (en) Method of manufacturing printed wiring boards
AU4237197A (en) Pattern plating method for fabricating printed circuit boards
EP0584780A3 (en) Process for the production of printed circuit boards.
EP0472158A3 (en) Process for producing a printed wiring board
EP0751700A3 (en) Copper-clad laminate, process for its manufacture, printed circuit board and process for its manufacture