SG78318A1 - Photoelectric conversion apparatus and image sensor - Google Patents

Photoelectric conversion apparatus and image sensor

Info

Publication number
SG78318A1
SG78318A1 SG1998003950A SG1998003950A SG78318A1 SG 78318 A1 SG78318 A1 SG 78318A1 SG 1998003950 A SG1998003950 A SG 1998003950A SG 1998003950 A SG1998003950 A SG 1998003950A SG 78318 A1 SG78318 A1 SG 78318A1
Authority
SG
Singapore
Prior art keywords
image sensor
photoelectric conversion
conversion apparatus
photoelectric
sensor
Prior art date
Application number
SG1998003950A
Other languages
English (en)
Inventor
Hiraku Kozuka
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG78318A1 publication Critical patent/SG78318A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14636Interconnect structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/03529Shape of the potential jump barrier or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/103Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN homojunction type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Facsimile Heads (AREA)
SG1998003950A 1997-10-06 1998-10-01 Photoelectric conversion apparatus and image sensor SG78318A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27257797A JP3413078B2 (ja) 1997-10-06 1997-10-06 光電変換装置と密着型イメージセンサ

Publications (1)

Publication Number Publication Date
SG78318A1 true SG78318A1 (en) 2001-02-20

Family

ID=17515862

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998003950A SG78318A1 (en) 1997-10-06 1998-10-01 Photoelectric conversion apparatus and image sensor

Country Status (8)

Country Link
US (1) US6150704A (zh)
EP (2) EP1688998A3 (zh)
JP (1) JP3413078B2 (zh)
KR (1) KR100312279B1 (zh)
CN (1) CN1146051C (zh)
DE (1) DE69838743T2 (zh)
SG (1) SG78318A1 (zh)
TW (1) TW427036B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000022677A1 (en) * 1998-10-09 2000-04-20 Polaroid Corporation Method for improving the yield of an image sensor
US6657665B1 (en) * 1998-12-31 2003-12-02 Eastman Kodak Company Active Pixel Sensor with wired floating diffusions and shared amplifier
EP1032049B1 (en) * 1999-02-25 2011-07-13 Canon Kabushiki Kaisha Photoelectric converting element
JP3467013B2 (ja) 1999-12-06 2003-11-17 キヤノン株式会社 固体撮像装置
US6960817B2 (en) 2000-04-21 2005-11-01 Canon Kabushiki Kaisha Solid-state imaging device
JP2002057312A (ja) * 2000-08-08 2002-02-22 Denso Corp 光検出センサおよびその製造方法
US6597025B2 (en) * 2001-03-15 2003-07-22 Koninklijke Philips Electronics N.V. Light sensitive semiconductor component
JP4534412B2 (ja) * 2002-06-26 2010-09-01 株式会社ニコン 固体撮像装置
US7470944B2 (en) 2002-06-26 2008-12-30 Nikon Corporation Solid-state image sensor
JP4434991B2 (ja) 2005-03-01 2010-03-17 キヤノン株式会社 イメージセンサ
US8018015B2 (en) 2005-06-29 2011-09-13 Micron Technology, Inc. Buried conductor for imagers
GB0621040D0 (en) * 2006-10-23 2006-11-29 Melexis Nv CMOS photodiode
JP5271104B2 (ja) * 2009-02-13 2013-08-21 浜松ホトニクス株式会社 リニアイメージセンサ
JP5091886B2 (ja) 2009-02-13 2012-12-05 浜松ホトニクス株式会社 イメージセンサ
WO2011096549A1 (ja) * 2010-02-05 2011-08-11 国立大学法人静岡大学 光情報取得素子、光情報取得素子アレイ及びハイブリッド型固体撮像装置
US8816190B2 (en) * 2011-04-18 2014-08-26 First Solar, Inc. Photovoltaic devices and method of making
US8836626B2 (en) 2011-07-15 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
JP5474220B2 (ja) * 2013-01-15 2014-04-16 キヤノン株式会社 光電変換装置及びマルチチップイメージセンサ
JP6381135B2 (ja) * 2015-04-21 2018-08-29 マイクロシグナル株式会社 光電変換素子
JP2017208501A (ja) 2016-05-20 2017-11-24 マイクロシグナル株式会社 光電変換素子
CN106935667A (zh) * 2017-05-05 2017-07-07 京东方科技集团股份有限公司 光电传感器、显示面板及显示装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3860956A (en) * 1972-03-17 1975-01-14 Matsushita Electric Ind Co Ltd Color target and method of manufacturing same
JPS55154784A (en) * 1979-05-22 1980-12-02 Nec Corp Photoreceptor
GB2095905B (en) * 1981-03-27 1985-01-16 Philips Electronic Associated Infra-red radiation imaging devices and methods for their manufacture
JPH065729B2 (ja) * 1984-09-21 1994-01-19 松下電子工業株式会社 一次元密着型イメ−ジセンサ
JPS622575A (ja) * 1985-06-28 1987-01-08 Oki Electric Ind Co Ltd 半導体光検出装置
JPS6489569A (en) * 1987-09-30 1989-04-04 Sharp Kk Solar cell element
US5136355A (en) * 1987-11-25 1992-08-04 Marconi Electronic Devices Limited Interconnecting layer on a semiconductor substrate
JP2521789B2 (ja) * 1988-05-31 1996-08-07 沖電気工業株式会社 固体撮像装置の感光部構造
KR930004295B1 (ko) * 1988-12-24 1993-05-22 삼성전자 주식회사 Vlsi 장치의 n+ 및 p+ 저항영역에 저저항 접속방법
JPH043473A (ja) * 1990-04-20 1992-01-08 Canon Inc 光電変換装置
JP3026395B2 (ja) * 1992-09-18 2000-03-27 沖電気工業株式会社 受光素子
US5528081A (en) * 1993-06-25 1996-06-18 Hall; John H. High temperature refractory metal contact in silicon integrated circuits
JP2621767B2 (ja) * 1993-07-30 1997-06-18 日本電気株式会社 固体撮像素子
US5360987A (en) * 1993-11-17 1994-11-01 At&T Bell Laboratories Semiconductor photodiode device with isolation region
US5594236A (en) * 1993-12-14 1997-01-14 Nippondenso Co., Ltd. Sunlight sensor
KR0136933B1 (ko) * 1994-05-21 1998-04-24 문정환 씨씨디(ccd) 영상소자 및 제조방법
JP2601231B2 (ja) * 1994-12-22 1997-04-16 日本電気株式会社 超格子アバランシェフォトダイオード
JP3590158B2 (ja) * 1995-08-29 2004-11-17 オリンパス株式会社 Mos増幅型撮像装置

Also Published As

Publication number Publication date
KR100312279B1 (ko) 2001-12-12
JPH11112006A (ja) 1999-04-23
EP1688998A3 (en) 2006-11-15
US6150704A (en) 2000-11-21
CN1146051C (zh) 2004-04-14
EP0908956A3 (en) 2000-02-02
TW427036B (en) 2001-03-21
DE69838743T2 (de) 2008-10-23
CN1217580A (zh) 1999-05-26
DE69838743D1 (de) 2008-01-03
EP0908956A2 (en) 1999-04-14
EP1688998A2 (en) 2006-08-09
JP3413078B2 (ja) 2003-06-03
KR19990036842A (ko) 1999-05-25
EP0908956B1 (en) 2007-11-21

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