SG77192G - Adhesion promotion in photoresist lamination and processing - Google Patents
Adhesion promotion in photoresist lamination and processingInfo
- Publication number
- SG77192G SG77192G SG771/92A SG77192A SG77192G SG 77192 G SG77192 G SG 77192G SG 771/92 A SG771/92 A SG 771/92A SG 77192 A SG77192 A SG 77192A SG 77192 G SG77192 G SG 77192G
- Authority
- SG
- Singapore
- Prior art keywords
- processing
- adhesion promotion
- photoresist lamination
- photoresist
- lamination
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/837,389 US4693959A (en) | 1986-03-07 | 1986-03-07 | Adhesion promotion in photoresist lamination and processing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG77192G true SG77192G (en) | 1992-10-02 |
Family
ID=25274301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG771/92A SG77192G (en) | 1986-03-07 | 1992-07-28 | Adhesion promotion in photoresist lamination and processing |
Country Status (9)
Country | Link |
---|---|
US (1) | US4693959A (fr) |
EP (1) | EP0236950B1 (fr) |
JP (1) | JPS62240950A (fr) |
KR (1) | KR900006040B1 (fr) |
BR (1) | BR8700993A (fr) |
CA (1) | CA1295169C (fr) |
DE (1) | DE3779450T2 (fr) |
HK (1) | HK73592A (fr) |
SG (1) | SG77192G (fr) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4976817A (en) * | 1988-12-09 | 1990-12-11 | Morton International, Inc. | Wet lamination process and apparatus |
JPH02202570A (ja) * | 1989-01-30 | 1990-08-10 | Nitto Denko Corp | 感光材料固定用両面接着テープ |
US5047313A (en) * | 1989-08-21 | 1991-09-10 | E. I. Du Pont De Nemours And Company | Photosensitive semi-aqueous developable copper conductor composition |
JP2733143B2 (ja) * | 1991-03-14 | 1998-03-30 | 冨士薬品工業株式会社 | 蛍光面形成用感光性組成物 |
US5268260A (en) * | 1991-10-22 | 1993-12-07 | International Business Machines Corporation | Photoresist develop and strip solvent compositions and method for their use |
US5989689A (en) * | 1991-12-11 | 1999-11-23 | The Chromaline Corporation | Sandblast mask laminate with blastable pressure sensitive adhesive |
US5358825A (en) * | 1993-03-24 | 1994-10-25 | Amp-Akzo Corporation | Manufacture of printed circuit conductors by a partially additive process |
US6547974B1 (en) * | 1995-06-27 | 2003-04-15 | International Business Machines Corporation | Method of producing fine-line circuit boards using chemical polishing |
US6001893A (en) | 1996-05-17 | 1999-12-14 | Datacard Corporation | Curable topcoat composition and methods for use |
US6093335A (en) * | 1996-08-28 | 2000-07-25 | International Business Machines Corporation | Method of surface finishes for eliminating surface irregularities and defects |
US6268457B1 (en) | 1999-06-10 | 2001-07-31 | Allied Signal, Inc. | Spin-on glass anti-reflective coatings for photolithography |
US6824879B2 (en) | 1999-06-10 | 2004-11-30 | Honeywell International Inc. | Spin-on-glass anti-reflective coatings for photolithography |
KR100804873B1 (ko) | 1999-06-10 | 2008-02-20 | 얼라이드시그날 인코퍼레이티드 | 포토리소그래피용 sog 반사방지 코팅 |
US6297294B1 (en) * | 1999-10-07 | 2001-10-02 | E. I. Du Pont De Nemours And Company | Method for improving the adhesion of a photopolymerizable composition to copper |
JP4381143B2 (ja) | 2001-11-15 | 2009-12-09 | ハネウェル・インターナショナル・インコーポレーテッド | フォトリソグラフィー用スピンオン反射防止膜 |
US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
TWI257189B (en) * | 2004-12-08 | 2006-06-21 | Nan Ya Printed Circuit Board C | Electrode plate of a flat panel direct methanol fuel cell and manufacturing method thereof |
JP2006330193A (ja) * | 2005-05-24 | 2006-12-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント及びこれらを用いたプリント配線板の製造方法 |
US20080156346A1 (en) * | 2006-12-28 | 2008-07-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for cleaning a substrate |
US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
GB201223064D0 (en) * | 2012-12-20 | 2013-02-06 | Rainbow Technology Systems Ltd | Curable coatings for photoimaging |
JP6803842B2 (ja) | 2015-04-13 | 2020-12-23 | ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. | オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
US3645722A (en) * | 1969-09-04 | 1972-02-29 | Carpenter Technology Corp | Free machining stainless steel alloy |
US3622234A (en) * | 1969-12-29 | 1971-11-23 | Gen Electric | Hot corrosion resistant superalloys |
US4056453A (en) * | 1973-11-27 | 1977-11-01 | Basf Aktiengesellschaft | Uv-curing printing inks |
US4312934A (en) * | 1976-10-21 | 1982-01-26 | Bard Laboratories, Inc. | Photosensitive compositions |
US4293635A (en) * | 1980-05-27 | 1981-10-06 | E. I. Du Pont De Nemours And Company | Photopolymerizable composition with polymeric binder |
DE3045516A1 (de) * | 1980-12-03 | 1982-07-08 | Basf Ag, 6700 Ludwigshafen | Lichtempfindliches mehrschichtenmaterial und verfahren zur herstellung von haftschichten dafuer |
US4442198A (en) * | 1981-01-16 | 1984-04-10 | W. R. Grace & Co. | Polymer composition having terminal alkene and terminal carboxyl groups |
US4528261A (en) * | 1983-03-28 | 1985-07-09 | E. I. Du Pont De Nemours And Company | Prelamination, imagewise exposure of photohardenable layer in process for sensitizing, registering and exposing circuit boards |
-
1986
- 1986-03-07 US US06/837,389 patent/US4693959A/en not_active Expired - Fee Related
-
1987
- 1987-02-27 BR BR8700993A patent/BR8700993A/pt unknown
- 1987-03-03 CA CA000531062A patent/CA1295169C/fr not_active Expired - Lifetime
- 1987-03-05 EP EP87103129A patent/EP0236950B1/fr not_active Expired - Lifetime
- 1987-03-05 DE DE8787103129T patent/DE3779450T2/de not_active Expired - Fee Related
- 1987-03-06 JP JP62050420A patent/JPS62240950A/ja active Granted
- 1987-03-07 KR KR878702061A patent/KR900006040B1/ko not_active IP Right Cessation
-
1992
- 1992-07-28 SG SG771/92A patent/SG77192G/en unknown
- 1992-09-24 HK HK735/92A patent/HK73592A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
BR8700993A (pt) | 1987-12-22 |
KR900006040B1 (en) | 1990-08-20 |
JPH0415464B2 (fr) | 1992-03-18 |
EP0236950A2 (fr) | 1987-09-16 |
DE3779450D1 (de) | 1992-07-09 |
EP0236950B1 (fr) | 1992-06-03 |
EP0236950A3 (en) | 1989-03-22 |
DE3779450T2 (de) | 1993-01-28 |
CA1295169C (fr) | 1992-02-04 |
US4693959A (en) | 1987-09-15 |
KR870009617A (ko) | 1987-10-27 |
JPS62240950A (ja) | 1987-10-21 |
HK73592A (en) | 1992-10-02 |
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