SG73599A1 - Semiconductor device and method of manufacturing the same and electronic apparatus - Google Patents

Semiconductor device and method of manufacturing the same and electronic apparatus

Info

Publication number
SG73599A1
SG73599A1 SG1999000017A SG1999000017A SG73599A1 SG 73599 A1 SG73599 A1 SG 73599A1 SG 1999000017 A SG1999000017 A SG 1999000017A SG 1999000017 A SG1999000017 A SG 1999000017A SG 73599 A1 SG73599 A1 SG 73599A1
Authority
SG
Singapore
Prior art keywords
manufacturing
semiconductor device
same
electronic apparatus
electronic
Prior art date
Application number
SG1999000017A
Other languages
English (en)
Inventor
Hayato Takeuchi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of SG73599A1 publication Critical patent/SG73599A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73269—Layer and TAB connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SG1999000017A 1998-01-09 1999-01-05 Semiconductor device and method of manufacturing the same and electronic apparatus SG73599A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10002714A JPH11204699A (ja) 1998-01-09 1998-01-09 半導体装置とその製造方法と電子装置

Publications (1)

Publication Number Publication Date
SG73599A1 true SG73599A1 (en) 2000-06-20

Family

ID=11536984

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1999000017A SG73599A1 (en) 1998-01-09 1999-01-05 Semiconductor device and method of manufacturing the same and electronic apparatus

Country Status (5)

Country Link
US (1) US6118178A (ko)
JP (1) JPH11204699A (ko)
KR (1) KR19990067806A (ko)
SG (1) SG73599A1 (ko)
TW (1) TW398047B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6110761A (en) * 1997-08-05 2000-08-29 Micron Technology, Inc. Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements
US6300168B1 (en) * 1999-01-07 2001-10-09 Sony Corp Method of manufacturing a semiconductor device
US6368894B1 (en) * 1999-09-08 2002-04-09 Ming-Tung Shen Multi-chip semiconductor module and manufacturing process thereof
JP3973340B2 (ja) * 1999-10-05 2007-09-12 Ｎｅｃエレクトロニクス株式会社 半導体装置、配線基板、及び、それらの製造方法
US6731012B1 (en) * 1999-12-23 2004-05-04 International Business Machines Corporation Non-planar surface for semiconductor chips
JP3531733B2 (ja) * 2000-08-08 2004-05-31 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体集積回路装置、電気回路装置、電子機器及び制御機器
KR100535181B1 (ko) * 2003-11-18 2005-12-09 삼성전자주식회사 디커플링 커패시터를 갖는 반도체 칩 패키지와 그 제조 방법
TWI239617B (en) * 2004-11-03 2005-09-11 Advanced Semiconductor Eng Cavity-down thermally enhanced package
US20100283124A1 (en) * 2008-02-01 2010-11-11 Renesas Electronics Corporation Semiconductor device
TWI523587B (zh) * 2012-12-14 2016-02-21 相互股份有限公司 封裝基板與電子組裝體
US11557489B2 (en) * 2018-08-27 2023-01-17 Intel Corporation Cavity structures in integrated circuit package supports

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583378A (en) * 1994-05-16 1996-12-10 Amkor Electronics, Inc. Ball grid array integrated circuit package with thermal conductor
JP2595909B2 (ja) * 1994-09-14 1997-04-02 日本電気株式会社 半導体装置
US5945741A (en) * 1995-11-21 1999-08-31 Sony Corporation Semiconductor chip housing having a reinforcing plate
DE19522971A1 (de) * 1995-06-28 1997-01-02 Bosch Gmbh Robert Heckenschere
JP3549294B2 (ja) * 1995-08-23 2004-08-04 新光電気工業株式会社 半導体装置及びその実装構造
JP2970491B2 (ja) * 1995-09-20 1999-11-02 ソニー株式会社 半導体パッケージ及びその製造方法
JP2814966B2 (ja) * 1995-09-29 1998-10-27 日本電気株式会社 半導体装置
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
JPH09232368A (ja) * 1996-02-20 1997-09-05 Fujitsu Ltd 半導体装置
JPH1098072A (ja) * 1996-09-20 1998-04-14 Hitachi Ltd 半導体装置及びその製造方法
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
JPH1197573A (ja) * 1997-09-19 1999-04-09 Sony Corp 半導体パッケージ
JP3087709B2 (ja) * 1997-12-08 2000-09-11 日本電気株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
TW398047B (en) 2000-07-11
KR19990067806A (ko) 1999-08-25
US6118178A (en) 2000-09-12
JPH11204699A (ja) 1999-07-30

Similar Documents

Publication Publication Date Title
EP0991126A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPARATUS USING THE SAME
GB2304231B (en) Semiconductor integrated circuit device and method of manufacturing the same
GB2359191B (en) Semiconductor device and method of manufacturing the same
GB9511567D0 (en) Wiring structure of semiconductor device and method for manufacturing the same
EP0700087A3 (en) Semiconductor device and manufacturing method
SG54456A1 (en) Semconductor integrated circuit device and method for manufacturing the same
SG75953A1 (en) Process for producing semiconductor integrated circuit device and semiconductor integrated circuit device
EP1122769A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
SG44315A1 (en) Semiconductor device and method manufacturing thereof
SG76592A1 (en) Semiconductor integrated circuit device and process for manufacturing the same
SG74115A1 (en) Semiconductor device and its manufacturing method
GB2344464B (en) Semiconductor device and manufacturing method thereof
GB2336469B (en) Semiconductor device and manufacturing method of the same
EP1120822A4 (en) PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE
SG77707A1 (en) Semiconductor device and method for manufacturing the same
GB2322005B (en) Semiconductor device and manufacturing method of the same
GB2340305B (en) Electronic device and method for producing the same
GB2334621B (en) Method of manufacturing semiconductor device
SG54398A1 (en) Semiconductor integrated circuit device and method for manufacturing the same
SG60044A1 (en) Semiconductor integrated circuit device and method for manufacturing the same
GB9907854D0 (en) Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
SG73599A1 (en) Semiconductor device and method of manufacturing the same and electronic apparatus
IL122937A0 (en) Semiconductor etching process and apparatus
SG53055A1 (en) Method and apparatus for manufacturing semiconductor devices
SG68032A1 (en) Semiconductor device and method of manufacturing the same