SG71782A1 - Ultrasonic welding of copper foil - Google Patents
Ultrasonic welding of copper foilInfo
- Publication number
- SG71782A1 SG71782A1 SG1998000839A SG1998000839A SG71782A1 SG 71782 A1 SG71782 A1 SG 71782A1 SG 1998000839 A SG1998000839 A SG 1998000839A SG 1998000839 A SG1998000839 A SG 1998000839A SG 71782 A1 SG71782 A1 SG 71782A1
- Authority
- SG
- Singapore
- Prior art keywords
- copper foil
- ultrasonic welding
- strip
- panels
- edges
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 239000011889 copper foil Substances 0.000 title abstract 3
- 238000003466 welding Methods 0.000 title abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/227—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded with ferrous layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12639—Adjacent, identical composition, components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24826—Spot bonds connect components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/838,272 US5942314A (en) | 1997-04-17 | 1997-04-17 | Ultrasonic welding of copper foil |
Publications (1)
Publication Number | Publication Date |
---|---|
SG71782A1 true SG71782A1 (en) | 2000-04-18 |
Family
ID=25276695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998000839A SG71782A1 (en) | 1997-04-17 | 1998-04-16 | Ultrasonic welding of copper foil |
Country Status (10)
Country | Link |
---|---|
US (1) | US5942314A (ja) |
EP (1) | EP0872301B1 (ja) |
JP (1) | JP3661031B2 (ja) |
KR (1) | KR100315049B1 (ja) |
CN (1) | CN1104301C (ja) |
AT (1) | ATE220359T1 (ja) |
DE (1) | DE69806432T2 (ja) |
MY (1) | MY118405A (ja) |
SG (1) | SG71782A1 (ja) |
TW (1) | TW415864B (ja) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6129998A (en) * | 1998-04-10 | 2000-10-10 | R.E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6127051A (en) * | 1998-04-10 | 2000-10-03 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6355360B1 (en) | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
US6129990A (en) * | 1998-04-10 | 2000-10-10 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
EP1070443B1 (en) * | 1998-04-10 | 2004-06-16 | R.E. Service Company, Inc. | Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards |
IT1305116B1 (it) * | 1998-09-14 | 2001-04-10 | Zincocelere Spa | Componente per circuito stampato multistrato, metodo per la suafabbricazione e relativo circuito stampato multiuso. |
US6606792B1 (en) | 2000-05-25 | 2003-08-19 | Oak-Mitsui, Inc. | Process to manufacturing tight tolerance embedded elements for printed circuit boards |
US6783860B1 (en) | 2001-05-11 | 2004-08-31 | R. E. Service Company, Inc. | Laminated entry and exit material for drilling printed circuit boards |
US6955740B2 (en) | 2002-01-10 | 2005-10-18 | Polyclad Laminates, Inc. | Production of laminates for printed wiring boards using protective carrier |
US6770976B2 (en) | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
US20040253473A1 (en) * | 2003-06-13 | 2004-12-16 | Michael Weekes | Metal foil composite structure for producing clad laminate |
FR2893177B1 (fr) * | 2005-11-10 | 2008-09-05 | Nexans Sa | Cable electrique avec ecran ameliore |
US20070295440A1 (en) * | 2006-05-24 | 2007-12-27 | Stucker Brent E | Surface roughness reduction for improving bonding in ultrasonic consolidation rapid manufacturing |
US8220696B2 (en) * | 2006-09-13 | 2012-07-17 | Ibiden Co., Ltd. | Manufacturing method of printed wiring board and a laminate jointing apparatus |
JP5306620B2 (ja) * | 2007-09-11 | 2013-10-02 | 古河電気工業株式会社 | 超音波溶接用銅箔、およびその表面処理方法 |
US8238114B2 (en) | 2007-09-20 | 2012-08-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing same |
US8375577B2 (en) * | 2008-06-04 | 2013-02-19 | National Semiconductor Corporation | Method of making foil based semiconductor package |
US20100084748A1 (en) * | 2008-06-04 | 2010-04-08 | National Semiconductor Corporation | Thin foil for use in packaging integrated circuits |
US7836586B2 (en) * | 2008-08-21 | 2010-11-23 | National Semiconductor Corporation | Thin foil semiconductor package |
JP2009143234A (ja) | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
JP2009143233A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
US8101470B2 (en) * | 2009-09-30 | 2012-01-24 | National Semiconductor Corporation | Foil based semiconductor package |
US8905291B2 (en) * | 2009-12-14 | 2014-12-09 | GM Global Technology Operations LLC | Coulomb damping features using ultrasonic welding |
SG173615A1 (en) | 2009-12-22 | 2011-09-29 | Jx Nippon Mining & Metals Corp | Method for producing laminate, and laminate |
JP5341784B2 (ja) * | 2010-01-12 | 2013-11-13 | プライムアースEvエナジー株式会社 | 超音波接合方法、超音波接合装置、及び電池用電極の製造方法 |
DE202010005770U1 (de) * | 2010-04-16 | 2010-09-02 | Ultrasonics Steckmann Gmbh | Ultraschall-Schweißmaschine |
US8210420B1 (en) * | 2011-02-03 | 2012-07-03 | Ut-Battelle, Llc | Composite biaxially textured substrates using ultrasonic consolidation |
CN102489866B (zh) * | 2011-12-09 | 2015-04-15 | 山东中大电力设备有限公司 | 铜铝冷压焊接工艺 |
US8844796B1 (en) | 2013-03-05 | 2014-09-30 | The Boeing Company | Superplastically formed ultrasonically welded metallic structure |
EP3013514B1 (en) * | 2013-06-26 | 2018-08-22 | Constellium Issoire | Improved structural elements obtained by linear friction welding |
KR101554361B1 (ko) * | 2013-07-09 | 2015-09-18 | 주식회사 엘지화학 | 이종 금속 용접 방법, 이에 의해 제조된 이종 금속 버스 바 및 이를 포함하는 이차전지 |
MX2016003933A (es) * | 2013-09-30 | 2016-06-17 | Jfe Steel Corp | Metodo de soldadura por friccion-agitacion para laminas de acero y metodo de fabricacion de junta. |
EP3053695B1 (en) * | 2013-09-30 | 2018-09-05 | JFE Steel Corporation | Friction stir welding method for steel sheets and method of manufacturing joint |
WO2015045299A1 (ja) * | 2013-09-30 | 2015-04-02 | Jfeスチール株式会社 | 構造用鋼の摩擦撹拌接合方法および構造用鋼の接合継手の製造方法 |
US9554472B2 (en) * | 2013-12-19 | 2017-01-24 | Intel Corporation | Panel with releasable core |
US9522514B2 (en) | 2013-12-19 | 2016-12-20 | Intel Corporation | Substrate or panel with releasable core |
JP6246857B2 (ja) * | 2016-05-24 | 2017-12-13 | Jx金属株式会社 | ロール状積層体、ロール状積層体の製造方法、積層体の製造方法、ビルドアップ基板の製造方法、プリント配線板の製造方法、電子機器の製造方法 |
CN106373743A (zh) * | 2016-10-28 | 2017-02-01 | 伊戈尔电气股份有限公司 | 一种6~15kva单相太阳能逆变器多股铝线高频电感的制作方法 |
CN110226247A (zh) * | 2017-01-31 | 2019-09-10 | 松下知识产权经营株式会社 | 电池模块及其制造方法 |
JP2019005776A (ja) * | 2017-06-22 | 2019-01-17 | イーグル工業株式会社 | 超音波接合方法、超音波接合冶具及び接合構造 |
US10870166B2 (en) * | 2018-02-01 | 2020-12-22 | Honda Motor Co., Ltd. | UAM transition for fusion welding of dissimilar metal parts |
CN208539000U (zh) * | 2018-03-15 | 2019-02-22 | 宁德时代新能源科技股份有限公司 | 二次电池集流体的焊接装置及加工设备 |
CN108637449B (zh) * | 2018-04-12 | 2020-10-02 | 苏州和林微纳科技股份有限公司 | 一种Cu-Slug超声波焊接工艺 |
CN109822206A (zh) * | 2019-03-26 | 2019-05-31 | 上海工程技术大学 | 一种超薄铝-铜超声波焊接工艺 |
KR102221010B1 (ko) | 2019-12-20 | 2021-02-26 | 성균관대학교 산학협력단 | 초음파접합 신뢰성 평가 장치 및 방법 |
US11465390B2 (en) | 2020-03-02 | 2022-10-11 | Honda Motor Co., Ltd. | Post-process interface development for metal-matrix composites |
US11701736B2 (en) * | 2021-09-30 | 2023-07-18 | Wiegel Tool Works, Inc. | Systems and methods for making a composite thickness metal part |
CN113954461A (zh) * | 2021-10-29 | 2022-01-21 | 松山湖材料实验室 | 石墨烯增强铜铝层状复合材料及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1385473A (en) * | 1966-09-01 | 1975-02-26 | Luc Penelope Jane Vesey | Bonding |
DE1765048A1 (de) * | 1968-03-26 | 1971-07-01 | Siemens Ag | Verfahren zum Kontaktieren von Stromtraegern aus Aluminium |
DE3147255C2 (de) * | 1981-11-28 | 1986-08-28 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Vorrichtung zum Verschweißen von Bauteilen unter Verwendung von Ultraschall, insbesondere von Solarzellenkontakten und Solarzellenverbindern |
JPH0615212B2 (ja) * | 1987-09-18 | 1994-03-02 | 富士写真フイルム株式会社 | 熱可塑性樹脂部材の積層方法 |
US5120590A (en) * | 1989-05-05 | 1992-06-09 | Gould Inc. | Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing |
US5082160A (en) * | 1990-01-10 | 1992-01-21 | Gas Research Institute | Apparatus and process for ultrasonic seam welding stainless steel foils |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
-
1997
- 1997-04-17 US US08/838,272 patent/US5942314A/en not_active Expired - Lifetime
-
1998
- 1998-04-16 EP EP98106907A patent/EP0872301B1/en not_active Expired - Lifetime
- 1998-04-16 DE DE69806432T patent/DE69806432T2/de not_active Expired - Lifetime
- 1998-04-16 AT AT98106907T patent/ATE220359T1/de not_active IP Right Cessation
- 1998-04-16 SG SG1998000839A patent/SG71782A1/en unknown
- 1998-04-17 TW TW087105854A patent/TW415864B/zh not_active IP Right Cessation
- 1998-04-17 JP JP12278198A patent/JP3661031B2/ja not_active Expired - Fee Related
- 1998-04-17 MY MYPI98001713A patent/MY118405A/en unknown
- 1998-04-17 CN CN98106400A patent/CN1104301C/zh not_active Expired - Lifetime
- 1998-04-17 KR KR1019980013732A patent/KR100315049B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0872301A1 (en) | 1998-10-21 |
JP3661031B2 (ja) | 2005-06-15 |
ATE220359T1 (de) | 2002-07-15 |
JPH10291080A (ja) | 1998-11-04 |
KR19980081495A (ko) | 1998-11-25 |
CN1104301C (zh) | 2003-04-02 |
KR100315049B1 (ko) | 2002-11-18 |
CN1217964A (zh) | 1999-06-02 |
TW415864B (en) | 2000-12-21 |
DE69806432T2 (de) | 2003-01-30 |
EP0872301B1 (en) | 2002-07-10 |
US5942314A (en) | 1999-08-24 |
DE69806432D1 (de) | 2002-08-14 |
MY118405A (en) | 2004-10-30 |
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