SG71724A1 - Bump bonder - Google Patents

Bump bonder

Info

Publication number
SG71724A1
SG71724A1 SG1997003555A SG1997003555A SG71724A1 SG 71724 A1 SG71724 A1 SG 71724A1 SG 1997003555 A SG1997003555 A SG 1997003555A SG 1997003555 A SG1997003555 A SG 1997003555A SG 71724 A1 SG71724 A1 SG 71724A1
Authority
SG
Singapore
Prior art keywords
bonding
discard
bump
chip
bump formation
Prior art date
Application number
SG1997003555A
Other languages
English (en)
Inventor
Koichi Yoshida
Akihiro Yamamoto
Makoto Imanishi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG71724A1 publication Critical patent/SG71724A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
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    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG1997003555A 1996-09-27 1997-09-25 Bump bonder SG71724A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25522096A JP3425510B2 (ja) 1996-09-27 1996-09-27 バンプボンダー形成方法

Publications (1)

Publication Number Publication Date
SG71724A1 true SG71724A1 (en) 2000-04-18

Family

ID=17275700

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003555A SG71724A1 (en) 1996-09-27 1997-09-25 Bump bonder

Country Status (5)

Country Link
US (1) US5899375A (ja)
JP (1) JP3425510B2 (ja)
KR (1) KR100459602B1 (ja)
SG (1) SG71724A1 (ja)
TW (1) TW392259B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
TWI343611B (en) * 2007-06-08 2011-06-11 Orient Semiconductor Elect Ltd Semiconductor package and method for discharging electronic devices on a substrate
US7918378B1 (en) * 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
JP5734236B2 (ja) * 2011-05-17 2015-06-17 株式会社新川 ワイヤボンディング装置及びボンディング方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
US5172851A (en) * 1990-09-20 1992-12-22 Matsushita Electronics Corporation Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
JP2852134B2 (ja) * 1991-02-20 1999-01-27 日本電気株式会社 バンプ形成方法
FR2696279B1 (fr) * 1992-09-25 1994-11-18 Thomson Csf Procédé pour permettre le montage d'une puce sur un substrat et puce préparée selon le procédé.
US5601740A (en) * 1993-11-16 1997-02-11 Formfactor, Inc. Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires
US5813115A (en) * 1994-08-03 1998-09-29 Matsushita Electric Industrial Co., Ltd. Method of mounting a semiconductor chip on a wiring substrate

Also Published As

Publication number Publication date
US5899375A (en) 1999-05-04
TW392259B (en) 2000-06-01
KR100459602B1 (ko) 2005-02-05
JPH10107074A (ja) 1998-04-24
KR19980025053A (ko) 1998-07-06
JP3425510B2 (ja) 2003-07-14

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