SG65673A1 - Developing method - Google Patents

Developing method

Info

Publication number
SG65673A1
SG65673A1 SG1997002978A SG1997002978A SG65673A1 SG 65673 A1 SG65673 A1 SG 65673A1 SG 1997002978 A SG1997002978 A SG 1997002978A SG 1997002978 A SG1997002978 A SG 1997002978A SG 65673 A1 SG65673 A1 SG 65673A1
Authority
SG
Singapore
Prior art keywords
developing method
developing
Prior art date
Application number
SG1997002978A
Other languages
English (en)
Inventor
Kunie Ogata
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG65673A1 publication Critical patent/SG65673A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
SG1997002978A 1996-08-20 1997-08-19 Developing method SG65673A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23582996A JP3227595B2 (ja) 1996-08-20 1996-08-20 現像処理方法及び現像処理装置

Publications (1)

Publication Number Publication Date
SG65673A1 true SG65673A1 (en) 1999-06-22

Family

ID=16991884

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997002978A SG65673A1 (en) 1996-08-20 1997-08-19 Developing method

Country Status (5)

Country Link
US (1) US5845170A (ko)
JP (1) JP3227595B2 (ko)
KR (1) KR100387407B1 (ko)
SG (1) SG65673A1 (ko)
TW (1) TW350980B (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010034009A (ko) * 1998-01-09 2001-04-25 파스타 리미티드 선형 현상기
JP3445937B2 (ja) * 1998-06-24 2003-09-16 東京エレクトロン株式会社 多段スピン型基板処理システム
TW425598B (en) * 1998-10-30 2001-03-11 Tokyo Electron Ltd Processing system
US6092937A (en) * 1999-01-08 2000-07-25 Fastar, Ltd. Linear developer
US6376013B1 (en) 1999-10-06 2002-04-23 Advanced Micro Devices, Inc. Multiple nozzles for dispensing resist
US6796517B1 (en) 2000-03-09 2004-09-28 Advanced Micro Devices, Inc. Apparatus for the application of developing solution to a semiconductor wafer
JP3545676B2 (ja) 2000-05-10 2004-07-21 東京エレクトロン株式会社 現像処理装置及び現像処理方法
JP3824057B2 (ja) * 2000-09-13 2006-09-20 東京エレクトロン株式会社 液処理装置
US6708701B2 (en) 2001-10-16 2004-03-23 Applied Materials Inc. Capillary ring
US6786996B2 (en) 2001-10-16 2004-09-07 Applied Materials Inc. Apparatus and method for edge bead removal
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
EP1611486B1 (en) 2003-04-10 2016-03-16 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
KR101178754B1 (ko) 2003-04-10 2012-09-07 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
US7498124B2 (en) * 2003-09-30 2009-03-03 Tokyo Electron Limited Sacrificial surfactanated pre-wet for defect reduction in a semiconductor photolithography developing process
KR101707294B1 (ko) 2004-03-25 2017-02-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7031855B2 (en) * 2004-06-17 2006-04-18 Micrel, Incorporated Current sense resistor circuit with averaging Kelvin sense features
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7371022B2 (en) 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
JP5317504B2 (ja) * 2008-03-24 2013-10-16 株式会社Ｓｏｋｕｄｏ 現像装置および現像方法
JP4780808B2 (ja) * 2009-02-03 2011-09-28 東京エレクトロン株式会社 現像処理方法及び現像処理装置
JP2013115274A (ja) * 2011-11-29 2013-06-10 Sharp Corp 半導体装置の製造方法、現像装置、及び半導体装置
JP6142839B2 (ja) * 2014-04-24 2017-06-07 東京エレクトロン株式会社 液処理方法、液処理装置、記憶媒体
JP6449752B2 (ja) * 2014-12-01 2019-01-09 東京エレクトロン株式会社 現像処理方法、コンピュータ記憶媒体及び現像処理装置
JP7025872B2 (ja) * 2016-12-02 2022-02-25 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US10203606B1 (en) * 2017-11-22 2019-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for dispensing developer onto semiconductor substrate
KR102553224B1 (ko) 2020-07-20 2023-07-10 세메스 주식회사 기판 처리 장치, 그리고 기판 처리 방법
CN112965347B (zh) * 2020-11-12 2023-11-03 重庆康佳光电科技有限公司 晶圆显影装置、方法和晶圆

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2892476B2 (ja) * 1990-09-14 1999-05-17 東京エレクトロン株式会社 帯状液体ノズル及び液処理装置及び液処理方法
KR100230753B1 (ko) * 1991-01-23 1999-11-15 도꾜 일렉트론 큐슈리미티드 액도포 시스템
US5275658A (en) * 1991-12-13 1994-01-04 Tokyo Electron Limited Liquid supply apparatus
US5625433A (en) * 1994-09-29 1997-04-29 Tokyo Electron Limited Apparatus and method for developing resist coated on a substrate

Also Published As

Publication number Publication date
TW350980B (en) 1999-01-21
JPH1064802A (ja) 1998-03-06
US5845170A (en) 1998-12-01
KR100387407B1 (ko) 2003-10-04
KR19980018735A (ko) 1998-06-05
JP3227595B2 (ja) 2001-11-12

Similar Documents

Publication Publication Date Title
SG65673A1 (en) Developing method
GB9600464D0 (en) Novel method
SG50018A1 (en) Method for developing treatment
EP0705704A3 (en) Image production method
GB2289946B (en) Method
EP0707245A3 (en) Electrophotographic method
GB9619758D0 (en) Method
IL121534A0 (en) Immunoassay method
GB9605709D0 (en) Method
GB9624822D0 (en) Method
GB9609722D0 (en) Novel method
GB9605482D0 (en) Method
GB9604465D0 (en) Novel method
HUP9701386A3 (en) Immunoassay method
GB2309925B (en) Fixing method
GB9619759D0 (en) Method
GB9401566D0 (en) Method
GB9400830D0 (en) Fixing method
GB9611473D0 (en) Method
HU9601542D0 (en) Method
GB9621096D0 (en) Method
GB9617509D0 (en) Method
GB9612931D0 (en) Method
GB9612277D0 (en) Method
GB9610272D0 (en) Method