SG64947A1 - Electrostatically attracting electrode and a method of manufacture thereof - Google Patents

Electrostatically attracting electrode and a method of manufacture thereof

Info

Publication number
SG64947A1
SG64947A1 SG1996010736A SG1996010736A SG64947A1 SG 64947 A1 SG64947 A1 SG 64947A1 SG 1996010736 A SG1996010736 A SG 1996010736A SG 1996010736 A SG1996010736 A SG 1996010736A SG 64947 A1 SG64947 A1 SG 64947A1
Authority
SG
Singapore
Prior art keywords
manufacture
electrostatically attracting
attracting electrode
electrode
electrostatically
Prior art date
Application number
SG1996010736A
Other languages
English (en)
Inventor
Kazue Takahasi
Saburo Kanai
Seiichiro Kanno
Youichi Itou
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG64947A1 publication Critical patent/SG64947A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
SG1996010736A 1995-09-20 1996-09-19 Electrostatically attracting electrode and a method of manufacture thereof SG64947A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24126195 1995-09-20
JP24126895 1995-09-20

Publications (1)

Publication Number Publication Date
SG64947A1 true SG64947A1 (en) 1999-05-25

Family

ID=26535166

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010736A SG64947A1 (en) 1995-09-20 1996-09-19 Electrostatically attracting electrode and a method of manufacture thereof

Country Status (3)

Country Link
US (2) US5781400A (de)
EP (1) EP0764979A3 (de)
SG (1) SG64947A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6370007B2 (en) * 1995-09-20 2002-04-09 Hitachi, Ltd. Electrostatic chuck
TW334609B (en) * 1996-09-19 1998-06-21 Hitachi Ltd Electrostatic chuck, method and device for processing sanyle use the same
JP3790000B2 (ja) * 1997-01-27 2006-06-28 日本碍子株式会社 セラミックス部材と電力供給用コネクターとの接合構造
US6104596A (en) * 1998-04-21 2000-08-15 Applied Materials, Inc. Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
US6219219B1 (en) * 1998-09-30 2001-04-17 Applied Materials, Inc. Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
US6268994B1 (en) * 1999-07-09 2001-07-31 Dorsey Gage, Inc. Electrostatic chuck and method of manufacture
JP2001144168A (ja) * 1999-11-16 2001-05-25 Nikon Corp 静電チャック、それを有する荷電粒子線露光装置、ウエハ保持方法及びそれを用いたデバイス製造方法
DE10062011B4 (de) * 2000-12-13 2005-02-24 Infineon Technologies Ag Halteeinrichtung
US6664738B2 (en) * 2002-02-27 2003-12-16 Hitachi, Ltd. Plasma processing apparatus
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
CN100365795C (zh) * 2003-06-17 2008-01-30 创意科技股份有限公司 双极型静电卡盘
JP3992018B2 (ja) * 2003-07-23 2007-10-17 松下電器産業株式会社 プラズマ処理装置
CN100383951C (zh) * 2003-07-23 2008-04-23 松下电器产业株式会社 等离子加工设备
US6906508B1 (en) * 2003-12-11 2005-06-14 Ceramic Component Technologies, Inc. Component testing system vacuum ring and test plate construction
US7595972B2 (en) * 2004-04-09 2009-09-29 Varian Semiconductor Equipment Associates, Inc. Clamp for use in processing semiconductor workpieces
TWI297908B (en) * 2005-03-16 2008-06-11 Ngk Insulators Ltd Processing device
JP4508054B2 (ja) * 2005-09-12 2010-07-21 パナソニック株式会社 電極部材の製造方法
CN100362644C (zh) * 2005-12-07 2008-01-16 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘
US20070233313A1 (en) 2006-03-28 2007-10-04 Tokyo Electron Limited Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method
JP2008311351A (ja) * 2007-06-13 2008-12-25 Hitachi High-Technologies Corp 荷電粒子線装置
WO2009113317A1 (ja) * 2008-03-13 2009-09-17 株式会社ニコン 基板ホルダ、基板ホルダユニット、基板搬送装置および基板貼り合わせ装置
JP4897030B2 (ja) * 2009-11-09 2012-03-14 東京エレクトロン株式会社 搬送アームの洗浄方法及び基板処理装置
CN102387655B (zh) * 2010-09-06 2015-10-21 北京北方微电子基地设备工艺研究中心有限责任公司 用于等离子体设备的下电极及等离子体设备
US9117867B2 (en) * 2011-07-01 2015-08-25 Applied Materials, Inc. Electrostatic chuck assembly
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板
JPS5929435A (ja) * 1982-08-11 1984-02-16 Hitachi Ltd 試料支持装置
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
US5099571A (en) * 1990-09-07 1992-03-31 International Business Machines Corporation Method for fabricating a split-ring electrostatic chuck
US5055964A (en) * 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
JPH04122046A (ja) * 1990-09-13 1992-04-22 Canon Inc 静電吸着装置
US5191506A (en) * 1991-05-02 1993-03-02 International Business Machines Corporation Ceramic electrostatic chuck
US5345999A (en) * 1993-03-17 1994-09-13 Applied Materials, Inc. Method and apparatus for cooling semiconductor wafers
US5625526A (en) * 1993-06-01 1997-04-29 Tokyo Electron Limited Electrostatic chuck
JPH07153825A (ja) * 1993-11-29 1995-06-16 Toto Ltd 静電チャック及びこの静電チャックを用いた被吸着体の処理方法
US5535507A (en) * 1993-12-20 1996-07-16 International Business Machines Corporation Method of making electrostatic chuck with oxide insulator
US5535090A (en) * 1994-03-03 1996-07-09 Sherman; Arthur Electrostatic chuck
US5572398A (en) * 1994-11-14 1996-11-05 Hewlett-Packard Co. Tri-polar electrostatic chuck
US5886863A (en) * 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
JP2971369B2 (ja) * 1995-08-31 1999-11-02 トーカロ株式会社 静電チャック部材およびその製造方法

Also Published As

Publication number Publication date
EP0764979A3 (de) 1998-07-15
EP0764979A2 (de) 1997-03-26
US6583979B1 (en) 2003-06-24
US5781400A (en) 1998-07-14

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