SG55189A1 - Temporary semiconductor package having dense array external contacts - Google Patents

Temporary semiconductor package having dense array external contacts

Info

Publication number
SG55189A1
SG55189A1 SG1996009289A SG1996009289A SG55189A1 SG 55189 A1 SG55189 A1 SG 55189A1 SG 1996009289 A SG1996009289 A SG 1996009289A SG 1996009289 A SG1996009289 A SG 1996009289A SG 55189 A1 SG55189 A1 SG 55189A1
Authority
SG
Singapore
Prior art keywords
semiconductor package
external contacts
dense array
array external
temporary semiconductor
Prior art date
Application number
SG1996009289A
Other languages
English (en)
Inventor
David R Hembree
Warren M Farnworth
Alan G Wood
Salman Akram
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of SG55189A1 publication Critical patent/SG55189A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SG1996009289A 1996-01-11 1996-04-18 Temporary semiconductor package having dense array external contacts SG55189A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58462896A 1996-01-11 1996-01-11

Publications (1)

Publication Number Publication Date
SG55189A1 true SG55189A1 (en) 1998-12-21

Family

ID=24338163

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996009289A SG55189A1 (en) 1996-01-11 1996-04-18 Temporary semiconductor package having dense array external contacts

Country Status (4)

Country Link
JP (1) JP2979289B2 (ja)
KR (1) KR100227724B1 (ja)
SG (1) SG55189A1 (ja)
TW (1) TW303502B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100416658B1 (ko) * 2001-06-28 2004-01-31 동부전자 주식회사 플립 칩 방식의 반도체 패키지
KR100439934B1 (ko) * 2001-12-28 2004-07-12 동부전자 주식회사 스프링 세라믹 핀 그레이드 어레이 패키지
US7960210B2 (en) 2007-04-23 2011-06-14 Cufer Asset Ltd. L.L.C. Ultra-thin chip packaging

Also Published As

Publication number Publication date
TW303502B (en) 1997-04-21
KR100227724B1 (ko) 1999-11-01
JPH09199621A (ja) 1997-07-31
JP2979289B2 (ja) 1999-11-15
KR970060473A (ko) 1997-08-12

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