SG54501A1 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
SG54501A1
SG54501A1 SG1997001363A SG1997001363A SG54501A1 SG 54501 A1 SG54501 A1 SG 54501A1 SG 1997001363 A SG1997001363 A SG 1997001363A SG 1997001363 A SG1997001363 A SG 1997001363A SG 54501 A1 SG54501 A1 SG 54501A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
SG1997001363A
Other languages
English (en)
Inventor
Shigeru Tanaka
Yasuhiro Nakamura
Hitoshi Miwa
Kazuyuki Miyazawa
Original Assignee
Hitachi Ulsi Eng Corp
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ulsi Eng Corp, Hitachi Ltd filed Critical Hitachi Ulsi Eng Corp
Publication of SG54501A1 publication Critical patent/SG54501A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • H05K5/0265—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of PCMCIA type
    • H05K5/0269—Card housings therefor, e.g. covers, frames, PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
SG1997001363A 1996-05-14 1997-05-02 Semiconductor device SG54501A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8118899A JPH09307058A (ja) 1996-05-14 1996-05-14 半導体装置及びそれを用いた電子装置

Publications (1)

Publication Number Publication Date
SG54501A1 true SG54501A1 (en) 1998-11-16

Family

ID=14747932

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001363A SG54501A1 (en) 1996-05-14 1997-05-02 Semiconductor device

Country Status (5)

Country Link
US (1) US6121681A (OSRAM)
JP (1) JPH09307058A (OSRAM)
KR (1) KR100435978B1 (OSRAM)
SG (1) SG54501A1 (OSRAM)
TW (1) TW321791B (OSRAM)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315776A (ja) 1999-05-06 2000-11-14 Hitachi Ltd 半導体装置
US6634561B1 (en) * 1999-06-24 2003-10-21 Sandisk Corporation Memory card electrical contact structure
KR100309161B1 (ko) 1999-10-11 2001-11-02 윤종용 메모리 카드 및 그 제조방법
JP3645172B2 (ja) * 2000-10-27 2005-05-11 シャープ株式会社 半導体集積回路装置搭載用基板
DE10109344C1 (de) * 2001-02-27 2002-10-10 Siemens Ag Schaltungsanordnung mit Halbbrücken
JP3839267B2 (ja) * 2001-03-08 2006-11-01 株式会社ルネサステクノロジ 半導体装置及びそれを用いた通信端末装置
US7092256B1 (en) * 2002-04-26 2006-08-15 Sandisk Corporation Retractable card adapter
KR100475740B1 (ko) * 2003-02-25 2005-03-10 삼성전자주식회사 신호 완결성 개선 및 칩 사이즈 감소를 위한 패드배치구조를 갖는 반도체 집적 회로장치
US7152801B2 (en) * 2004-04-16 2006-12-26 Sandisk Corporation Memory cards having two standard sets of contacts
US7487265B2 (en) * 2004-04-16 2009-02-03 Sandisk Corporation Memory card with two standard sets of contacts and a hinged contact covering mechanism
ITMI20050139A1 (it) * 2005-01-31 2006-08-01 St Microelectronics Srl Dispositivo di memorizzazione dati rimovibile e relativo metodo di assemblaggio
US7710736B2 (en) * 2005-08-02 2010-05-04 Sandisk Corporation Memory card with latching mechanism for hinged cover
JP2008091722A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体集積回路
US8058099B2 (en) * 2007-06-28 2011-11-15 Sandisk Technologies Inc. Method of fabricating a two-sided die in a four-sided leadframe based package
US8395246B2 (en) * 2007-06-28 2013-03-12 Sandisk Technologies Inc. Two-sided die in a four-sided leadframe based package
CN114661099B (zh) * 2022-03-31 2023-08-04 苏州浪潮智能科技有限公司 一种主板、处理器板卡及计算系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR489643A (fr) * 1917-12-03 1919-02-25 Felice Gilardini Courroie pour transmissions, et procédé pour sa fabrication
JPH04259365A (ja) * 1991-02-12 1992-09-14 Mitsubishi Heavy Ind Ltd 加振溶射方法
US5469333A (en) * 1993-05-05 1995-11-21 International Business Machines Corporation Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus

Also Published As

Publication number Publication date
KR970077398A (ko) 1997-12-12
TW321791B (OSRAM) 1997-12-01
JPH09307058A (ja) 1997-11-28
US6121681A (en) 2000-09-19
KR100435978B1 (ko) 2004-08-25

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