SG49143A1 - Film applying method and film applying apparatus - Google Patents

Film applying method and film applying apparatus

Info

Publication number
SG49143A1
SG49143A1 SG1996006769A SG1996006769A SG49143A1 SG 49143 A1 SG49143 A1 SG 49143A1 SG 1996006769 A SG1996006769 A SG 1996006769A SG 1996006769 A SG1996006769 A SG 1996006769A SG 49143 A1 SG49143 A1 SG 49143A1
Authority
SG
Singapore
Prior art keywords
film applying
film
applying apparatus
applying method
applying
Prior art date
Application number
SG1996006769A
Other languages
English (en)
Inventor
Hiroyoshi Nakano
Yoji Washizaki
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Publication of SG49143A1 publication Critical patent/SG49143A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • B32B38/185Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062Prior to assembly
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317Means feeding plural workpieces to be joined
    • Y10T156/1322Severing before bonding or assembling of parts
    • Y10T156/1339Delivering cut part in sequence to serially conveyed articles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1712Indefinite or running length work
    • Y10T156/1734Means bringing articles into association with web

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
SG1996006769A 1991-12-13 1992-10-15 Film applying method and film applying apparatus SG49143A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3352370A JPH0737071B2 (ja) 1991-12-13 1991-12-13 フィルム張付方法及び装置

Publications (1)

Publication Number Publication Date
SG49143A1 true SG49143A1 (en) 1998-05-18

Family

ID=18423602

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996006769A SG49143A1 (en) 1991-12-13 1992-10-15 Film applying method and film applying apparatus

Country Status (6)

Country Link
US (1) US5356501A (ja)
EP (1) EP0547327B1 (ja)
JP (1) JPH0737071B2 (ja)
KR (1) KR960007301B1 (ja)
DE (1) DE69230396T2 (ja)
SG (1) SG49143A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3061354B2 (ja) * 1995-05-23 2000-07-10 ソマール株式会社 フィルム張付方法及び装置
JP4567159B2 (ja) * 2000-07-31 2010-10-20 大成ラミネーター株式会社 フィルムのラミネート装置およびラミネート方法
FR2852553B1 (fr) * 2003-03-21 2005-06-17 Saint Gobain Procede pour deposer des films fonctionnels sur des substrats tels que des plaques de verres, et machine de pelliculage pour la mise en oeuvre de ce procede
KR200467074Y1 (ko) * 2010-10-12 2013-05-23 (주)엘지하우시스 프로파일 랩핑장치
CN104540324A (zh) * 2014-12-24 2015-04-22 昆山元茂电子科技有限公司 一种印刷电路板外层干膜的贴膜机
CN113942222A (zh) * 2021-10-19 2022-01-18 谈中秋 一种手机音孔及侧壁清理系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981406A (en) * 1975-10-31 1976-09-21 The United States Of America As Represented By The United States Energy Research And Development Administration Automatic box loader
US4322069A (en) * 1979-11-02 1982-03-30 Konishiroku Photo Industry Co., Ltd. Sheet sorting apparatus
US4659419A (en) * 1983-05-11 1987-04-21 Hakuto Co., Ltd. Laminator for sticking film sheet on panel surface
DE3787197T2 (de) * 1986-05-07 1993-12-16 Somar Corp Gerät zur Herstellung von Schichtpressstoffen.
JPH0798362B2 (ja) * 1987-02-24 1995-10-25 ソマ−ル株式会社 薄膜の張付方法
CA1281747C (en) * 1987-03-30 1991-03-19 Herbert E. Gladish Load accumulating system
JPH02191958A (ja) * 1988-09-22 1990-07-27 Somar Corp 薄膜の張付方法及びその実施装置
JPH0651360B2 (ja) * 1989-06-04 1994-07-06 ソマール株式会社 薄膜の張付方法及びその装置
JPH03147833A (ja) * 1989-11-04 1991-06-24 Somar Corp 薄膜張付方法及びその実施装置
JPH03205134A (ja) * 1989-12-31 1991-09-06 Somar Corp フイルム張付方法及びその実施装置
JPH0412849A (ja) * 1990-04-28 1992-01-17 Somar Corp ラミネータ

Also Published As

Publication number Publication date
JPH0737071B2 (ja) 1995-04-26
DE69230396T2 (de) 2000-08-31
EP0547327A1 (en) 1993-06-23
DE69230396D1 (de) 2000-01-13
EP0547327B1 (en) 1999-12-08
US5356501A (en) 1994-10-18
JPH05162212A (ja) 1993-06-29
KR930012255A (ko) 1993-07-20
KR960007301B1 (ko) 1996-05-30

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