SG48711A1 - Reusable fixture for carrier tape - Google Patents
Reusable fixture for carrier tapeInfo
- Publication number
- SG48711A1 SG48711A1 SG1996000199A SG1996000199A SG48711A1 SG 48711 A1 SG48711 A1 SG 48711A1 SG 1996000199 A SG1996000199 A SG 1996000199A SG 1996000199 A SG1996000199 A SG 1996000199A SG 48711 A1 SG48711 A1 SG 48711A1
- Authority
- SG
- Singapore
- Prior art keywords
- carrier tape
- reusable fixture
- reusable
- fixture
- tape
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5327—Means to fasten by deforming
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19417092 | 1992-07-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG48711A1 true SG48711A1 (en) | 1998-05-18 |
Family
ID=16320096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996000199A SG48711A1 (en) | 1992-07-21 | 1993-07-20 | Reusable fixture for carrier tape |
Country Status (6)
Country | Link |
---|---|
US (1) | US5349236A (de) |
EP (1) | EP0580410B1 (de) |
KR (1) | KR960015925B1 (de) |
DE (1) | DE69306683T2 (de) |
MY (1) | MY109013A (de) |
SG (1) | SG48711A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883866A (ja) * | 1994-07-15 | 1996-03-26 | Shinko Electric Ind Co Ltd | 片面樹脂封止型半導体装置の製造方法及びこれに用いるキャリアフレーム |
US5578870A (en) * | 1995-08-03 | 1996-11-26 | Precision Connector Designs, Inc. | Top loading test socket for ball grid arrays |
EP0793904B1 (de) | 1995-09-22 | 2003-01-29 | Matsushita Electric Industrial Co., Ltd. | Bauteilbehaelter und verfahren zu dessen herstellung sowie diesen bauteilbehaelter verwendende bauteilzufuhreinrichtung |
US5706082A (en) * | 1996-05-14 | 1998-01-06 | Alimenterics Inc. | Optogalvanic spectroscopy with phase independent detection |
US5758776A (en) * | 1996-09-12 | 1998-06-02 | Kinetrix, Inc. | Integrated circuit tray with flexural bearings |
US6687980B1 (en) * | 1997-03-04 | 2004-02-10 | Tessera, Inc. | Apparatus for processing flexible tape for microelectronic assemblies |
US6048744A (en) | 1997-09-15 | 2000-04-11 | Micron Technology, Inc. | Integrated circuit package alignment feature |
US5949137A (en) * | 1997-09-26 | 1999-09-07 | Lsi Logic Corporation | Stiffener ring and heat spreader for use with flip chip packaging assemblies |
US7023087B1 (en) * | 1998-08-05 | 2006-04-04 | Agere Systems Inc. | Integrated circuit carrier and method of manufacturing and integrated circuit |
US6991960B2 (en) * | 2001-08-30 | 2006-01-31 | Micron Technology, Inc. | Method of semiconductor device package alignment and method of testing |
US6867983B2 (en) * | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
US20070126445A1 (en) * | 2005-11-30 | 2007-06-07 | Micron Technology, Inc. | Integrated circuit package testing devices and methods of making and using same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4007479A (en) * | 1976-03-29 | 1977-02-08 | Honeywell Information Systems, Inc. | Fixture for an integrated circuit chip |
US4069496A (en) * | 1976-12-30 | 1978-01-17 | Honeywell Information Systems Inc. | Reusable fixture for an integrated circuit chip |
US4547794A (en) * | 1984-10-17 | 1985-10-15 | Amdahl Corporation | Reusable fixture for holding a segment of a flexible strip |
US4696526A (en) * | 1985-07-26 | 1987-09-29 | Intel Corporation | Carrier for tape automated bonded semiconductor device |
JPH0628273B2 (ja) * | 1987-10-05 | 1994-04-13 | 富士通株式会社 | Ic支持フィルムとそれを塔載したキャリア |
US4949159A (en) * | 1988-08-03 | 1990-08-14 | Byers Photo Equipment Company | Carrier for film-mounted integrated circuit |
US5101975A (en) * | 1990-10-31 | 1992-04-07 | Novapak, Inc. | Electronic component carrier |
DE69114217T2 (de) * | 1990-08-22 | 1996-04-11 | Nippon Electric Co | Träger für filmmontierte Halbleiter-Vorrichtung. |
-
1993
- 1993-07-16 US US08/092,524 patent/US5349236A/en not_active Expired - Fee Related
- 1993-07-19 KR KR1019930013599A patent/KR960015925B1/ko not_active IP Right Cessation
- 1993-07-20 MY MYPI93001418A patent/MY109013A/en unknown
- 1993-07-20 SG SG1996000199A patent/SG48711A1/en unknown
- 1993-07-20 EP EP93305703A patent/EP0580410B1/de not_active Expired - Lifetime
- 1993-07-20 DE DE69306683T patent/DE69306683T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR940006227A (ko) | 1994-03-23 |
US5349236A (en) | 1994-09-20 |
EP0580410A2 (de) | 1994-01-26 |
EP0580410A3 (de) | 1994-03-23 |
KR960015925B1 (ko) | 1996-11-23 |
EP0580410B1 (de) | 1996-12-18 |
DE69306683T2 (de) | 1997-07-03 |
DE69306683D1 (de) | 1997-01-30 |
MY109013A (en) | 1996-11-30 |
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